CN111872548A - Laser processing device with controllable light beam incident angle and laser processing method - Google Patents
Laser processing device with controllable light beam incident angle and laser processing method Download PDFInfo
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- CN111872548A CN111872548A CN202010754864.8A CN202010754864A CN111872548A CN 111872548 A CN111872548 A CN 111872548A CN 202010754864 A CN202010754864 A CN 202010754864A CN 111872548 A CN111872548 A CN 111872548A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
Abstract
The invention provides a laser processing device with controllable light beam incident angle and a laser processing method, comprising a laser generating unit and a hollow unit, wherein the laser generating unit emits light beams with focal length F and axial direction E, and the light beams are incident on the surface of a workpiece after passing through the hollow unit; the hollow unit is provided with a first reflecting mirror and a second reflecting mirror, the light beam emitted by the laser generating unit irradiates on the first reflecting mirror, irradiates on the second reflecting mirror after being reflected by the first reflecting mirror, and irradiates on the surface of a workpiece after being reflected by the second reflecting mirror; the light beam incidence angle can be regulated and controlled by adjusting the inclination angle of the first reflecting mirror surface and/or the inclination angle of the second reflecting mirror surface, so that laser processing of any light beam incidence angle can be realized, large-angle light beam incidence can be particularly obtained, taper-controllable laser rotary processing can be obtained when the hollow unit rotates, and the laser rotary processing device has good application prospects in processing such as laser drilling, laser milling, laser polishing, laser cutting and laser welding.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a laser processing device with a controllable light beam incident angle and a laser processing method.
Background
Laser processing is a processing method that combines a laser beam with a workpiece to achieve multiple purposes, such as punching, cutting, scribing, welding, heat treatment, and the like.
In many occasions, the workpiece needs to be processed at an inclined angle, that is, a laser beam forms a certain included angle with the surface of the workpiece during processing. For example, laser drilling generally requires focusing a parallel laser beam, and processing is performed by utilizing the interaction between a laser pulse and a material through the relative movement between the laser and the material, and when laser drilling is performed, a hole with a certain taper can be obtained by forming a certain included angle between the laser beam and the surface of a workpiece, and the processing of a micro hole (the diameter is less than 0.5 mm, particularly less than 0.2 mm) with controllable taper (a positive taper, a zero taper or a negative taper) and a large depth-diameter ratio (more than 5:1, particularly more than 20: 1) faces a series of difficulties because laser energy vertical irradiation can naturally form a certain positive taper, laser energy is scattered on an inclined plane, the continuous processing capability is lost, and the depth-diameter ratio of laser hole processing is limited finally. In addition, the processing of complex shapes can be realized by utilizing the change of the included angle between the laser and the surface of the workpiece.
At present, in order to realize the inclination angle machining of the workpiece, one method is to realize the inclination angle machining of the workpiece by using mechanical motion, but the method needs relatively complicated coaxial centering operation and is mainly suitable for small parts, such as the ultrafast laser taper hole drilling device and the drilling process disclosed in CN 109434288A. Another approach is to use multiple wedge-shaped optical assemblies to produce a predetermined tilt angle and radius, and then to rotate the optical assemblies by a motor to achieve a controlled range of tilt angles for hole machining, for example US2009045176a1, CN102218605A, CN104400222A, etc. The advantage of this type of technique is that it is possible to achieve machining with high roundness and predetermined conicity by rotation of the wedge-shaped module, but the disadvantage is that this type of device is generally expensive due to the combination of the precise movements required of the motors, the diameter of the holes that can be directly machined is small, typically less than 2 mm, and the angle of inclination that can be controlled is typically within 15 °. In addition, such devices are primarily suited for circular hole machining, complex shapes requiring very complex external mechanical movements to assist in implementation, or limited implementation by very complex multi-motor controls.
Disclosure of Invention
The invention provides a laser processing device which is simple in structure and low in cost, and can be used for realizing laser processing with controllable incidence angle of laser on the surface of a workpiece.
The technical scheme provided by the invention is as follows: the utility model provides a controllable laser beam machining device of beam incident angle, includes laser generating element, characterized by: also comprises a hollow unit;
the laser generating unit emits a light beam with a focal length F, the central axis direction of the light beam is an axial direction E, and the light beam enters the surface of a workpiece after passing through the hollow unit;
the hollow unit is provided with a first reflecting mirror and a second reflecting mirror, and the light beam emitted by the laser generating unit irradiates on the first reflecting mirror, irradiates on the second reflecting mirror after being reflected by the first reflecting mirror and irradiates on the surface of a workpiece after being reflected by the second reflecting mirror;
an included angle th1 between the axial direction E and the first mirror surface is a tilt angle of the first mirror surface, that is, an angle that the axial direction E rotates counterclockwise to coincide with the first mirror surface for the first time is th 1;
the included angle th2 between the axial direction E and the second reflecting mirror surface is the inclination angle of the second reflecting mirror surface, that is, the rotation angle of the axial direction E when rotating anticlockwise to the first time to coincide with the second reflecting mirror surface is th 2;
an angle th3 between the central axis of the light beam and the axial direction E when the light beam is irradiated on the surface of the workpiece is a light beam incident angle, and an angle th4 between the light beam irradiated on the second reflecting mirror surface and the second reflecting mirror surface.
As shown in fig. 1, the th4 is 2 × th1-th2 and the th3 is 2 × (th1-th2) according to geometric calculation, i.e. the incident angle of the light beam is equal to twice the difference value between the first mirror surface inclination angle and the second mirror surface inclination angle; therefore, the light beam incidence angle can be adjusted and controlled by adjusting the inclination angle of the first reflection mirror surface and/or the inclination angle of the second reflection mirror surface, so as to achieve the specified laser processing inclination angle, for example, the light beam incidence angle th3 may be greater than 0 °, greater than 5 °, greater than 15 °, greater than 30 °, greater than 45 °, greater than 60 °, and the like, and especially, the large inclination processing may be achieved, for example, greater than 30 °, greater than 45 °, greater than 60 °, and the like.
In addition, in the present invention, the adjustment enables the angles th1 and th2 to be kept large, which is advantageous for the systematic error control, because the laser spot is not too far off the central axis, for example, 15 °
Th1 is not more than 60 degrees, th2 is not more than 30 degrees and not more than 70 degrees, preferably, th4 is not more than 30 degrees and not more than 80 degrees.
Preferably, the first mirror surface inclination th1 is greater than or equal to 15 °, and the desired laser processing incident angle is obtained by adjusting the second mirror surface inclination th 2.
As another preferable mode, the first mirror surface inclination th1 is greater than or equal to 45 °, and the desired laser processing incident angle is obtained by adjusting the second mirror surface inclination th 2.
The beam incident angle refers to an incident angle of the laser beam to the workpiece, i.e., a laser processing incident angle.
The distance between the light beam emitted from the laser generating unit and the center of the reflection point of the first reflecting mirror surface is L1, the distance between the first reflecting mirror surface and the second reflecting mirror surface is L2, the distance between the second reflecting mirror surface and the convergence point is L3, and F is more than L1+ L2, and F is L1+ L2+ L3.
Preferably, the distance between the hollow unit and the laser generating unit is adjustable, so that L1 can be adjusted. In one embodiment, the hollow unit is connected to a displacement unit, and is movable by the displacement unit to adjust L1.
Preferably, the distance between the first reflector and the second reflector is adjustable.
Preferably, the distance between the workpiece and the laser generating unit is adjustable, so that the position relation between the position of the converging point of the light beam reflected by the second reflecting mirror and the workpiece can be adjusted. And when the position of the convergence point is above the workpiece, the positive taper machining is performed, and when the position of the convergence point is below the workpiece, the negative taper machining is performed.
Preferably, the hollow unit further comprises a displacement sensor for detecting the distance between the laser generating unit and the workpiece and the detection of one or more of the distances L1, L2 and L3.
In the invention, the first reflector and the second reflector can be made into an integrated structure and are conveniently arranged in the hollow unit without excessive adjustment. Preferably, the first reflector and the second reflector structure can be made into a modular integrated device, and the parameters such as the inclination angle, the spacing and the like form a sequence, so that the first reflector and the second reflector can be conveniently replaced when in use. For example, at timings F, L1 and th1, adjusting L2 and th2 results in a series of device combinations where th3 has discrete values of 1 °, 2 °, 3 °, 5 °, 15 °, 22.5 °, 30 °, 40 °, 45 °, 60 °, 75 °, and the like.
In the present invention, laser light includes pulsed laser light and continuous laser light, and wavelengths include, but are not limited to, DUV, UV, VIS, NIR, IR, and the like.
In the invention, the first reflector and the second reflector have the light reflection function and can be prism reflectors, common circular reflectors and the like.
In the invention, the laser generating unit comprises a functional device for generating laser and a functional device for focusing the laser, and can also comprise a functional device for optical modulation.
Functional devices for optical modulation include, but are not limited to, beam expanding and speckle control optics.
The functional devices for laser focusing include, but are not limited to, various scanning galvanometers and various fixed focusing optical systems, such as spherical convex lenses, combined lenses, cylindrical lenses, and the like.
In the invention, the laser processing unit can be also provided with a pneumatic interface and a bottom nozzle, and the gas forms airflow after passing through the bottom nozzle and is used for blowing away splashes generated in the laser processing process and reducing the temperature of a laser processing area.
Preferably, the hollow unit is rotatable about an axial direction E, during which the first mirror and the second mirror are in a relatively fixed state and participate in a rotational movement, so as to perform a rotational laser machining, such as laser drilling, laser milling, laser polishing, laser cutting, laser welding, etc. When laser drilling is carried out, when the position of a light beam convergence point is above or below a workpiece, positive taper machining or negative taper machining is formed, and machining of a round hole, a circular ring or a cylinder with controllable taper is realized. The distance of the central axis of the light beam deviating from the rotating shaft when the light beam irradiates on the workpiece is the processing radius R, the processing taper can be controlled by controlling the light beam incidence angle th3, and the processing taper is controlled in a large range because the laser incidence angle th3 is controllable in a large range.
The rotation method of the hollow unit is not limited, and rotation driven by a motor, rotation driven by compressed gas, and rotation driven by a transmission belt may be employed.
The rotation of the hollow unit includes continuous rotation and fixed point rotation. The fixed-point rotation means that the hollow unit stops rotating after rotating to a specified angle, a laser processing task is carried out at the angle, then the hollow unit can continue to rotate, and the mode is convenient for matching with a scanning galvanometer.
In the invention, when the first reflector and the second reflector are relatively fixed and rotate around the axial direction E, a dynamic balance block is arranged in the hollow unit in consideration of the rotation dynamic balance, and the whole body formed by the first reflector and the second reflector and the dynamic balance block form dynamic balance with a rotation shaft when rotating.
When F, L2 and th3 are fixed, the machining radius R can be regulated by adjusting L1. The regulation and control method is particularly suitable for high-precision micropore processing, such as zero taper hole processing realized by using smaller taper compensation, and the range of the light beam incidence angle th3 is generally between 1 DEG and th3 and 10 DEG, preferably between 2 DEG and th3 and 7 DEG, and most preferably between 3 DEG and th3 and 5 deg. When high-precision micropore machining is carried out, the aperture is required to be controlled within a certain tolerance range. When the radius of the micropore is less than 0.25mm, especially less than 0.1 mm, the conventional scanning galvanometer punching or workbench moving punching faces the challenge in the aspect of precision control, and when the regulation and control method is used, when L1 is changed greatly, the radius of the circular hole can be changed slightly, and the following results can be obtained by calculation: the ratio of the change in L1 to the change in the radius of the circular hole is 1/sin (th 3). Therefore, the small-range accurate control of the radius of the circular hole can be realized by moving the L1 in a large range, and thus, when the moving accuracy of the L1 is controlled to be in the order of 10 microns, the control accuracy of the radius of the circular hole can reach the order of 1 micron, so that the L1 can be conveniently moved by a displacement device with conventional accuracy, and the control of the radius of the circular hole with higher accuracy is realized.
In addition, when the above change occurs in L1, the focal position Z of the laser light changes little with respect to the laser unit, and such a focus drift can be ignored during processing, facilitating accurate control of the processing radius by adjusting L1 without frequently compensating for the focal position. Therefore, compared with the prior art, the invention has outstanding advantages in the aspect of controlling the radius of the circular hole.
According to the principle, when the laser generating unit and/or the first reflecting mirror surface are translated along the axial direction E, the distance L1 is changed, the change of the radius of a circle drawn at the focal point of the laser can be realized, and when the translation is reciprocating motion in a certain range, the continuous scanning processing of a circular ring or a whole circle can be realized, so that the laser generating unit and/or the first reflecting mirror surface can be used for processing a micropore or a micro-ring or a non-penetrable micro-cylinder or a micro-cone with controllable taper.
The scanning galvanometer is preferably a focusing device. The scanning galvanometer uses an F-theta field lens, so that light beams in a large range are approximately parallel to the central axis, and light rays deviating from the central axis can maintain approximate focusing property in a small range. Under the action of the scanning galvanometer, the incident light rays can continuously deviate from the central axis, such as linear reciprocating scanning or other track scanning, and are combined with the rotating hollow unit, and the final composite laser scanning track is a spiral line. When the scanning track of the galvanometer is circular, the compound superposition of revolution and rotation occurs, as shown in fig. 2, which is very helpful for realizing higher laser scanning linear velocity in small hole processing, because the improvement of the absolute linear velocity can help to better spread the laser energy, thereby reducing the heat accumulation effect of laser processing. On the other hand, a lower motor speed can be used to realize a higher linear speed similar to the conventional rotating optical modulation, which is beneficial to improving the long-term reliability of the motor system.
Furthermore, the laser processing device can realize the controllable taper processing of local complex shapes by combining the scanning galvanometer. The specific processing method comprises the following steps: when the hollow unit rotates, a fixed-point inclination mode is combined with scanning of the scanning galvanometer, namely, the hollow unit rotates to a certain position and is static, the incident angle of a light beam is adjusted to be a certain value, and the scanning galvanometer is used for scanning, so that the capability of processing complex patterns at a specified inclination angle at a specified position is realized.
The invention can realize laser processing of appointed beam incident angle by using only two reflecting mirror surfaces and utilizing differential effect, and has the following beneficial effects compared with the prior art:
(1) the device has simple structure, can control the light beam incidence angle by controlling the inclination angle difference of the two reflecting mirror surfaces, has simple and easy control algorithm, can realize large-range inclination angle laser processing, particularly can realize large-angle light beam incidence, such as light beam incidence of more than 45 degrees, and skillfully solves the technical problem that the incidence inclination angle of more than 15 degrees is difficult to generate in the existing laser processing;
in addition, the invention can meet the requirements of large-angle incidence to the first reflecting mirror surface and the second reflecting mirror surface and large-inclination-angle light beam incidence, namely, the included angle between the light beam and the first reflecting mirror surface is larger when the light beam is incident to the first reflecting mirror surface, the included angle between the light beam and the second reflecting mirror surface is larger when the light beam is incident to the second reflecting mirror surface, and the light beam incidence angle is larger, thereby ensuring that the laser facula does not excessively deviate from the central axis.
(2) In combination with the rotation of the hollow unit, the invention can realize laser rotation processing, such as laser drilling, laser milling, laser polishing, laser cutting, laser welding and the like, and can realize the laser rotation processing with controllable taper by adjusting the incident angle th3 of the light beam; in addition, positive taper machining or negative taper machining can be formed by adjusting the position relation between the light beam convergence point position and the workpiece, so that machining of round holes, circular rings, cylinders or cones with controllable tapers can be realized.
When F, L2 and th3 are fixed, the machining radius R can be regulated and controlled by adjusting L1. Especially when the incident angle of the light beam is small, the laser processing radius can be accurately regulated and controlled by adjusting the L1, scanning processing of micropores, miniature rings, miniature cylinders or cones is realized, the depth-diameter ratio can be more than 5:1, especially more than 20: 1, the invention solves the technical problem that the radius of the circular hole is difficult to accurately control when the circular hole with the small diameter is processed in the prior art through a simple control method.
(3) In the invention, the laser focusing functional device is preferably a scanning galvanometer, and a fixed point inclination mode is combined with the scanning galvanometer when the hollow unit rotates, namely, the hollow unit rotates to a certain position and is static, the difference value of the first reflecting mirror and the second reflecting mirror is adjusted to be incident at a certain light beam incidence angle, and the scanning galvanometer is used for scanning, so that the controllable taper processing of local complex shapes can be realized.
(4) The optical scheme of the invention is obviously different from the scanning galvanometer, the first reflecting mirror and the second reflecting mirror are mainly rotated for realizing the laser processing with the preset inclination angle, once the angle and the position are adjusted, the two reflecting mirrors are in a relatively fixed state and participate in the rotation motion together, and the reflecting mirrors do not carry out independent high-speed and high-frequency motion like the scanning galvanometer.
Drawings
FIG. 1 is a schematic structural diagram of a dual reflector laser device according to the present invention.
Fig. 2 is a schematic diagram of the movement of the laser processing apparatus of the present invention in combination with a scanning galvanometer.
Fig. 3 is a schematic structural view of a laser processing apparatus in embodiment 1 of the present invention.
Fig. 4 is a schematic diagram of a laser processing apparatus combined with a scanning galvanometer for processing a complex shape in embodiment 3 of the present invention.
Fig. 5 is a schematic view of an integrated structure of a first reflecting mirror and a second reflecting mirror in embodiment 4 of the present invention.
The laser 1, the optical modulator 2, the focusing device 3, the hollow unit 5, the first mirror 6A, the second mirror 6B, the displacement unit 7, the workpiece 8, the control unit 9.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, which are intended to facilitate the understanding of the present invention and are not intended to limit the present invention in any way.
Example 1:
as shown in fig. 3, the laser processing apparatus includes a laser generating unit including a laser 1, an optical modulator 2, and a focusing device 3, and a hollow unit 5. The light beam emitted by the laser 1 is coupled into the focusing unit 3 through the optical modulator 2, and is focused to emit a light beam with a focal length of F, the central axis direction of the light beam is the axial direction E, and the light beam enters the surface of the workpiece 8 after passing through the hollow unit.
The hollow unit 5 is provided with a first reflecting mirror 6A and a second reflecting mirror 6B, and the light beam emitted by the laser generating unit irradiates on the first reflecting mirror surface, irradiates on the second reflecting mirror surface after being reflected by the first reflecting mirror surface, and irradiates on the surface of a workpiece 8 after being reflected by the second reflecting mirror surface.
As shown in FIG. 2, the included angle th1 between the axis E and the first mirror surface is the first mirror surface tilt angle, i.e. the angle that the axis E rotates counterclockwise to the first time of coinciding with the first mirror surface is th 1.
The angle th2 between the axial direction E and the second reflecting surface is the second reflecting surface inclination angle, i.e. the angle th2 is rotated when the axial direction E rotates anticlockwise to the first time to coincide with the second reflecting surface.
An angle th3 between the central axis of the light beam and the axial direction E when the light beam is irradiated on the surface of the workpiece 8 is a light beam incident angle, and an angle th4 between the light beam irradiated on the second reflecting mirror surface and the second reflecting mirror surface.
From the geometrical calculations, th4 is 2 × th1-th2, and th3 is 2 × (th1-th2), i.e. the beam incidence angle is equal to twice the difference between the first mirror surface tilt angle and the second mirror surface tilt angle. Therefore, the incidence angle of the light beam can be regulated by adjusting the inclination angle of the first reflecting mirror surface and/or the inclination angle of the second reflecting mirror surface, and the specified laser processing inclination angle can be realized.
The distance between the light beam emitted from the laser generating unit and the center of the reflecting point of the first reflecting mirror surface is L1, the distance between the first reflecting mirror surface and the second reflecting mirror surface is L2, the distance between the second reflecting mirror surface and the converging point is L3, and F is more than L1+ L2, and F is L1+ L2+ L3.
In this embodiment, the hollow unit is connected to the displacement unit 7, and the displacement unit can be displaced in the axial direction E, thereby adjusting the distance L1.
In this embodiment, the entire apparatus is controlled by the control unit 9.
The light beams are converged after being reflected from the second reflecting mirror surface, and positive taper processing is performed when the position of the convergence point is above the workpiece, and negative taper processing is performed when the position of the convergence point is below the workpiece.
In this embodiment, the hollow unit rotates around the axial direction E, and the first reflecting mirror and the second reflecting mirror are in a relatively fixed state and participate in the rotation movement during the rotation process, so as to implement the rotary laser processing, such as laser drilling. In this case, positive taper processing is performed when the position of the light beam converging point is above the workpiece, and negative taper processing is performed when it is below the workpiece.
The machining taper can be controlled by controlling the incident beam angle th3, the difference between the first mirror inclination angle th1 and the second mirror inclination angle th2 is related to th3, so the incident beam angle th3 can be controlled by controlling the difference between the first mirror inclination angle th1 and the second mirror inclination angle th2, for example, table 1 shows the parameters of the laser machining device when the focal length F is 300 mm, for example:
when the inclination angle of the first reflecting mirror surface is 45 degrees, in order to realize the reverse cone processing with the light beam incidence angle of 1 degree, the difference is used, and the inclination angle of the second reflecting mirror surface is adjusted to be 44.5 degrees;
when the inclination angle of the first reflecting mirror surface is 45 degrees, in order to realize reverse taper processing with an incidence angle of 60 degrees, the inclination angle of the second reflecting mirror surface is adjusted to be 15 degrees by using difference.
Table 1: optical system with focal length of 300 mm and light incidence angle of 1-60 degrees
When F, L2 and th3 are fixed, the machining radius R can be regulated by adjusting L1. Particularly when high-precision micropore machining is carried out, the small th3 is selected, and high-precision regulation and control of the machining radius R can be realized by regulating the L1. As shown in Table 2, taking the reverse taper compensation perforation with a beam incidence angle of 5 ° as an example, the distance L2 traveled by the beam between the first and second mirror surfaces is set to 18mm, and the negative taper radius R3 varies from 0 to 0.25mm when the L1 value varies from 75.473 to 72.605mm, for example, the reverse taper perforation radius is 0mm when the L1 value is 75.473 mm; when the L1 value is 75.358mm, the radius of the reverse taper punch is 0.01 mm; the radius of the reverse taper punch was 0.25mm when the L1 value was 72.605mm, see Table 2. When the radius of the round hole of the end laser processing is changed from 0 to 0.25mm, the ratio of the change of L1 to the change of the radius of the round hole is 1/sin (2 × th1-2 × th2), that is, the change of L1 is about 11 times of 0.25 mm. That is to say, when the movement precision of L1 is controlled at 10 microns, the control precision of round hole radius can reach 1 micron, namely can realize super high round hole radius control precision through the electronic or manual displacement platform of 10 microns precision.
When the value of L1 is changed, the focal position Z of the laser beam is changed by only 0.011 mm, and such a focus shift is negligible during processing.
Table 2: optical system with focal length of 300 mm and light incidence angle of 1-60 degrees
Therefore, when the laser generating unit and/or the first reflecting mirror surface are translated along the axial direction E, the distance L1 between the laser generating unit and the center of the reflecting point of the first reflecting mirror surface is changed, the change of the radius of the circle drawn at the position of the laser focal point can be realized, and when the translation is a reciprocating motion in a certain range, the continuous scanning of the controllable taper of the circular ring or the whole circle can be realized, and the continuous scanning is used for processing a micropore or a micro-ring or a non-penetrable micro cylinder/cone.
Example 2:
in this embodiment, the structure of the laser processing apparatus is basically the same as that of embodiment 1, except that: the focusing device is a long-focus lens, and the focal length of a focused light beam is 1000 mm; the hollow rotating head is arranged on an electric translation table, the hollow unit is connected with a displacement unit, the displacement unit is the electric translation table, the hollow unit can perform axial displacement in the E direction on the electric translation table, and the displacement stroke is +/-200 mm, so that L1 is adjusted.
Table 3 shows the parameters of the laser processing apparatus when the focal length F is 1000mm, for example:
when the inclination angle of the first reflecting mirror surface is 45 degrees, in order to realize the reverse cone processing with the incident angle of 3 degrees, the difference is used, and the inclination angle of the second reflecting mirror surface is adjusted to be 43.5 degrees;
when the inclination angle of the first reflecting mirror surface is 45 degrees, in order to realize the reverse taper processing with the incident angle of 30 degrees, the inclination angle of the second reflecting mirror surface is adjusted to be 30 degrees by using difference.
Table 3: optical system with focal length of 1000mm and light incidence angle of 1-60 degree
When F, L2 and th3 are fixed, the machining radius R can be regulated by adjusting L1. Particularly when high-precision micropore machining is carried out, the small th3 is selected, and high-precision regulation and control of the machining radius R can be realized by regulating the L1. As shown in Table 4, taking the reverse taper punch with an incident angle of 3 ° as an example, the distance L2 that the light beam travels between the first and second mirror surfaces is set to 40mm, and the negative taper radius R3 varies between 0-0.25mm when the L1 value varies between 195.707 and 190.930mm, for example, the reverse taper punch radius is 0mm when the L1 value is 195.707 mm; when the L1 value is 195.516mm, the radius of the reverse taper punch is 0.01 mm; the radius of the reverse taper punch is 0.25mm … … when the value of L1 is 190.930mm, i.e., the L1 axis input motion is about 19 times 0.25mm when the radius of the end laser machined round hole is changed from 0 to 0.25 mm. That is to say, when the moving precision of the L1 is controlled to be 10 micrometers, the control precision of the circular hole radius can reach 1 micrometer, that is, the ultrahigh control precision of the circular hole radius is realized.
Table 4: the focal length F is 1000mm, and the parameters of the laser processing device are as follows:
when the L1 is changed, the focal position Z of the laser beam as a whole is changed by only 0.007 mm, and such a focus shift is negligible during processing.
During actual processing, the translation table is driven according to an algorithm shown in the table, and the rotating head is driven to move so as to realize laser processing with a preset inclination angle and a preset diameter. When the taper needs to be changed, the proper L1 zero radius position is obtained mainly by adjusting the angle (th2) and the offset position (R20) of the second mirror, and then the L1 is changed to realize the scanning of the preset diameter at the inclination angle.
Example 3:
in this embodiment, the structure of the laser processing apparatus is basically the same as that of embodiment 2, except that: the focusing device is a scanning galvanometer. When the hollow unit rotates, a fixed-point inclination mode is used, namely, the hollow unit rotates to a certain position, the difference value of the first reflecting mirror and the second reflecting mirror is adjusted to be incident at a certain light beam incident angle, and the scanning galvanometer is combined, so that the controllable taper processing of local complex shapes can be realized.
For example, as shown in fig. 4, the hollow unit is stationary and positioned when rotated to the system θ of 0 °, 90 °, 180 °, and 270 °, the beam incident angle th3 is adjusted to the desired machining tilt angle, and the mirror system is scanned, so that the shape shown in fig. 4 having a certain taper angle at θ of 0 °, 90 °, 180 °, and 270 ° is obtained.
Example 4:
in this embodiment, the structure of the laser processing apparatus is basically the same as that of embodiment 2.
In this embodiment, the first reflector and the second reflector are integrated and can be conveniently disposed in the hollow unit without requiring excessive adjustment. For example, th3 can be obtained by adjusting L2 and th2 at timings F, L1 and th1, and as shown in fig. 5, th3 is a device having 15 °, 45 ° and 60 °.
The embodiments described above are intended to illustrate the technical solutions of the present invention in detail, and it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modification, supplement or similar substitution made within the scope of the principles of the present invention should be included in the protection scope of the present invention.
Claims (29)
1. The utility model provides a controllable laser beam machining device of beam incident angle, includes laser generating element, characterized by: also comprises a hollow unit;
the laser generating unit emits a light beam with a focal length F, the central axis direction of the light beam is an axial direction E, and the light beam enters the surface of a workpiece after passing through the hollow unit;
the hollow unit is provided with a first reflecting mirror and a second reflecting mirror, and the light beam emitted by the laser generating unit irradiates on the first reflecting mirror, irradiates on the second reflecting mirror after being reflected by the first reflecting mirror and irradiates on the surface of a workpiece after being reflected by the second reflecting mirror;
an included angle th1 between the axial direction E and the first mirror surface is a tilt angle of the first mirror surface, that is, an angle that the axial direction E rotates counterclockwise to coincide with the first mirror surface for the first time is th 1;
the included angle th2 between the axial direction E and the second reflecting mirror surface is the inclination angle of the second reflecting mirror surface, that is, the rotation angle of the axial direction E when rotating anticlockwise to the first time to coincide with the second reflecting mirror surface is th 2;
when the light beam irradiates on the surface of the workpiece, the included angle th3 between the central axis of the light beam and the axial direction E is the light beam incident angle, and the included angle th4 between the light beam irradiating on the second reflecting mirror surface and the second reflecting mirror surface;
the distance between the light beam emitted from the laser generating unit and the center of the reflection point of the first reflecting mirror surface is L1, the distance between the first reflecting mirror surface and the second reflecting mirror surface is L2, the distance between the second reflecting mirror surface and the convergence point is L3, and F is more than L1+ L2, and F is L1+ L2+ L3;
the incident angle of the light beam to the workpiece is regulated by adjusting the inclination angle of the first reflecting mirror surface and/or the inclination angle of the second reflecting mirror surface.
2. The laser processing apparatus according to claim 1, wherein: the light beam incidence angle is larger than 0 °, preferably larger than 5 °, further preferred larger than 15 °, further preferred larger than 30 °, further preferred larger than 45 °, most preferred larger than 60 °.
3. The laser processing apparatus according to claim 1, wherein: th1 is more than or equal to 15 degrees and less than or equal to 60 degrees, and th2 is more than or equal to 30 degrees and less than or equal to 70 degrees;
preferably, 30 DEG-th 4-80 deg.
4. The laser processing apparatus according to claim 1, wherein: the inclination angle of the first reflecting mirror surface is greater than or equal to 15 degrees, and the required laser processing incidence angle is obtained by adjusting the inclination angle of the second reflecting mirror surface.
5. The laser processing apparatus according to claim 1, wherein: the inclination angle of the first reflecting mirror surface is greater than or equal to 45 degrees, and the required laser processing incidence angle is obtained by adjusting the inclination angle of the second reflecting mirror surface.
6. The laser processing apparatus according to claim 1, wherein: the distance between the hollow unit and the laser generating unit is adjustable, and the L1 is adjusted.
7. The laser processing apparatus according to claim 1, wherein: the distance between the first reflector and the second reflector is adjustable.
8. The laser processing apparatus according to claim 1, wherein: the distance between the workpiece and the laser generating unit is adjustable.
9. The laser processing apparatus according to claim 1, wherein: the hollow unit is connected with the displacement unit and can displace the displacement unit.
10. The laser processing apparatus according to claim 1, wherein: the hollow unit further comprises a displacement sensor for detecting one or more of L1, L2, L3 and the distance between the laser generating unit and the workpiece.
11. The laser processing apparatus according to claim 1, wherein: the hollow unit rotates around the axial direction E, and the first reflector and the second reflector are in a relatively fixed state to participate in the rotation movement in the rotation process.
12. A laser processing apparatus according to claim 11, wherein: the laser processing comprises one of laser drilling, laser milling, laser polishing, laser cutting and laser welding.
13. The laser processing apparatus according to claim 1, wherein: the first reflector and the second reflector are of an integrated structure and form a reflector structural unit.
14. A laser processing apparatus according to claim 11, wherein: the rotation of the hollow unit is driven by a motor, a compressed gas, or a belt.
15. A laser processing apparatus according to claim 11, wherein: a dynamic balance block is arranged in the hollow unit, and when the hollow unit rotates, the whole formed by the first reflecting mirror and the second reflecting mirror forms dynamic balance with the dynamic balance block through a rotating shaft.
16. The laser processing apparatus according to claim 1, wherein: the laser comprises pulse laser and continuous laser;
preferably, the laser wavelength comprises one of DUV, UV, VIS, NIR, IR.
17. The laser processing apparatus according to claim 1, wherein: the first reflector is a prism reflector or a common circular reflector;
the second mirror is a prismatic mirror or a generally circular mirror.
18. The laser processing apparatus according to claim 1, wherein: the laser generating unit includes a functional device for generating laser light and a functional device for focusing the laser light.
19. A laser processing apparatus according to claim 18, wherein: the laser generating unit also comprises a functional device for optical modulation.
20. A laser processing apparatus according to claim 18, wherein: the laser focusing functional device comprises a scanning galvanometer and a fixed focusing optical system;
preferably, the fixed focusing optical system comprises one or more of a spherical convex lens, a combined lens and a cylindrical lens.
21. A laser processing apparatus according to claim 19, wherein: the optical modulation function device comprises a beam expanding control optical device and a speckle control optical device.
22. A laser processing apparatus according to claim 19, wherein: the laser processing unit is provided with a pneumatic interface and a bottom nozzle, and gas forms airflow after passing through the bottom nozzle.
23. A laser processing method of a round hole, a circular ring or a cylinder with controllable taper is characterized in that: the laser processing device of claim 11 is used for laser drilling, positive taper processing is formed when the position of the light beam convergence point Z is above the workpiece, negative taper processing is formed when the position of the light beam convergence point Z is below the workpiece, and processing of a round hole, a circular ring or a cylinder with controllable taper is realized;
the distance of the central axis of the light beam deviating from the rotating shaft when the light beam irradiates on the workpiece is a processing radius R;
the machining taper is controlled by controlling the light beam incident angle th 3.
24. A laser processing method with adjustable processing radius is characterized in that: performing laser drilling by using the laser processing apparatus according to claim 11, wherein positive taper processing is performed when the position of the light beam convergence point Z is located above the workpiece, and negative taper processing is performed when the position of the light beam convergence point Z is located below the workpiece;
the distance of the central axis of the light beam deviating from the rotating shaft when the light beam irradiates on the workpiece is a processing radius R;
when F, L2 and th3 are fixed, the machining radius R is regulated and controlled by adjusting L1.
25. A laser processing method of high-precision micropores is characterized in that: performing laser drilling by using the laser processing apparatus according to claim 11, wherein positive taper processing is performed when the position of the light beam convergence point Z is located above the workpiece, and negative taper processing is performed when the position of the light beam convergence point Z is located below the workpiece;
the distance of the central axis of the light beam deviating from the rotating shaft when the light beam irradiates on the workpiece is a processing radius R;
when F, L2 and th3 are fixed, the machining radius R is regulated and controlled by adjusting L1;
th3 is more than or equal to 1 degree and less than or equal to 10 degrees, and the radius of the micropore is less than 0.25 mm.
26. A laser machining method according to claim 25, wherein: th3 is not less than 2 degrees and not more than 7 degrees, preferably, th3 is not less than 3 degrees and not more than 5 degrees.
27. A laser machining method according to claim 25, wherein: the radius of the micropores is less than 0.1 mm.
28. A laser machining method according to claim 25, wherein: when the moving precision of the L1 is controlled to be 10 microns, the control precision of the radius of the circular hole reaches 1 micron.
29. A controllable taper processing method for complex shapes is characterized in that: performing laser processing using the laser processing apparatus according to claim 11;
the hollow unit rotates to a certain position and is static, the incident angle of the light beam is adjusted to a certain value, and the scanning galvanometer is used for scanning.
Priority Applications (2)
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| CN202010754864.8A CN111872548A (en) | 2020-07-30 | 2020-07-30 | Laser processing device with controllable light beam incident angle and laser processing method |
| PCT/CN2021/098782 WO2022022067A1 (en) | 2020-07-30 | 2021-06-08 | Laser processing device capable of controlling light beam incident angle, and laser processing method |
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| CN202010754864.8A CN111872548A (en) | 2020-07-30 | 2020-07-30 | Laser processing device with controllable light beam incident angle and laser processing method |
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| WO (1) | WO2022022067A1 (en) |
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| WO2022022067A1 (en) * | 2020-07-30 | 2022-02-03 | 中国科学院宁波材料技术与工程研究所 | Laser processing device capable of controlling light beam incident angle, and laser processing method |
| CN114393301A (en) * | 2022-01-19 | 2022-04-26 | 湘潭大学 | Real-time deflection laser welding method based on double MEMS (micro-electromechanical systems) measuring instruments |
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| CN114833472A (en) * | 2022-05-26 | 2022-08-02 | 苏州思萃声光微纳技术研究所有限公司 | Laser processing method for non-taper cooling air film hole of aero-engine flame tube |
| CN114905168A (en) * | 2022-05-31 | 2022-08-16 | 中国科学院西安光学精密机械研究所 | Machining system and machining method for micropores with large depth-diameter ratio |
| WO2023284702A1 (en) * | 2021-07-12 | 2023-01-19 | 清华大学 | Rotary three-dimensional light excitation apparatus |
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| CN114749811B (en) * | 2022-03-29 | 2023-06-09 | 华中科技大学 | System and method for machining carbon fiber composite material holes based on laser double-beam rotary cutting |
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| US4822974A (en) * | 1988-02-18 | 1989-04-18 | United Technologies Corporation | Laser hold drilling system with lens and two wedge prisms including axial displacement of at least one prism |
| DE19745280A1 (en) * | 1997-10-15 | 1999-04-22 | Daimler Chrysler Ag | Method for fine or micro-machining of workpieces using laser beams |
| US6362454B1 (en) * | 1999-10-01 | 2002-03-26 | Matsushita Electric Industrial Co., Ltd. | Method for drilling circular holes with a laser beam |
| JP2003117008A (en) * | 2001-10-12 | 2003-04-22 | Ya Man Ltd | Treatment device and method using laser |
| CN109702330B (en) * | 2019-02-01 | 2021-05-25 | 西北核技术研究所 | Laser incident angle adjusting device |
| CN111872548A (en) * | 2020-07-30 | 2020-11-03 | 中国科学院宁波材料技术与工程研究所 | Laser processing device with controllable light beam incident angle and laser processing method |
| CN213318327U (en) * | 2020-07-30 | 2021-06-01 | 中国科学院宁波材料技术与工程研究所 | Laser processing device with controllable light beam incident angle |
-
2020
- 2020-07-30 CN CN202010754864.8A patent/CN111872548A/en active Pending
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2021
- 2021-06-08 WO PCT/CN2021/098782 patent/WO2022022067A1/en active Application Filing
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| WO2022022067A1 (en) * | 2020-07-30 | 2022-02-03 | 中国科学院宁波材料技术与工程研究所 | Laser processing device capable of controlling light beam incident angle, and laser processing method |
| WO2023284702A1 (en) * | 2021-07-12 | 2023-01-19 | 清华大学 | Rotary three-dimensional light excitation apparatus |
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| CN114769875A (en) * | 2022-04-25 | 2022-07-22 | 中国航空制造技术研究院 | Laser rotation scanning coaxial fuse powder melting device and deposition method |
| CN114833472A (en) * | 2022-05-26 | 2022-08-02 | 苏州思萃声光微纳技术研究所有限公司 | Laser processing method for non-taper cooling air film hole of aero-engine flame tube |
| CN114905168A (en) * | 2022-05-31 | 2022-08-16 | 中国科学院西安光学精密机械研究所 | Machining system and machining method for micropores with large depth-diameter ratio |
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