CN112475638B - Laser micropore machining system and method based on axicon lens - Google Patents
Laser micropore machining system and method based on axicon lens Download PDFInfo
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- CN112475638B CN112475638B CN202011103526.4A CN202011103526A CN112475638B CN 112475638 B CN112475638 B CN 112475638B CN 202011103526 A CN202011103526 A CN 202011103526A CN 112475638 B CN112475638 B CN 112475638B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention discloses a laser micropore processing system and method based on an axicon lens, wherein the system comprises a laser for emitting laser beams, a two-dimensional beam deflection device is arranged at the output end of the laser at a preset angle, and the two-dimensional beam deflection device can rotate to enable the incident laser beams to generate micro deflection; the two-dimensional light beam deflection device is characterized in that a first axial cone lens, a second axial cone lens and a focusing lens are coaxially arranged in sequence in the reflection direction of the two-dimensional light beam deflection device, the vertex angles of the first axial cone lens and the second axial cone lens are opposite to each other, the distance between the first axial cone lens and the second axial cone lens is adjustable, and the focusing lens faces the processing platform. The laser micropore processing system utilizes the rotational symmetry characteristic of the axicon lens, does not need mechanical rotation of an optical element in the processing process, increases the mechanical stability of the system and improves the micropore processing precision.
Description
Technical Field
The invention belongs to the technical field of laser processing, and particularly relates to a laser micropore processing system and method based on axicon lenses.
Background
The temperature of the working environment of the aviation turbine blade is generally above 2000k, and according to measurement and calculation, the thrust-weight ratio of the aviation engine is correspondingly improved by 10% when the inlet temperature of the aviation turbine is improved by 100 ℃, so that the working temperature born by the engine blade directly influences the performance of the engine. With the development of material technology, the temperature which an aviation blade can bear is greatly improved, but the improvement of the temperature which the aviation blade can bear by only depending on the material is not enough to meet the urgent requirements of people on a high-thrust engine, so that the aviation blade mostly adopts a film hole cooling method to improve the temperature which the aviation blade can bear. The general film hole is a small hole with the diameter of 300-.
With the gradual maturity of the ultrashort laser technology, the application of the femtosecond laser is more and more extensive, the performance of the laser is greatly improved, the output power is continuously improved, and the ultrafast and ultrashort characteristics thereof enable the laser processing technology to have qualitative changes, so that the laser processing technology becomes an indispensable processing means in the field of hyperfine machining. Ultrafast laser process is mainly with laser beam focus in order to reach higher energy density at minimum within range, under high energy intensity and ultrashort pulse duration, the interact of laser and material can be with the very fast very little scope of energy injection, high energy accumulation in the twinkling of an eye, make the absorption and the motion mode of electron change, can avoid the linear absorption of laser energy and the transfer diffusion influence of energy, avoid the heat effect of processing man-hour, thereby do not have the production of crazing line and recasting layer. Therefore, the ultrashort pulse used for the hyperfine cutting and punching can obtain good processing quality.
At present, laser processing mostly adopts light beam scanning to realize micropore processing, mainly drives the displacement optical wedge through high-speed motor and reaches the purpose of light beam translation, accomplishes different tapering micropore processing through the change of light beam incident gesture, changes the aperture of processing hole and the tapering in hole through the position of changing the optical wedge, or adopts translation module plus light beam scanning module to realize the processing in different tapering holes. The method mainly aims to realize high-speed scanning of the light beam by mechanical rotation, the machinable hole pattern is single and mainly is a round hole, and the displacement of two optical wedges is required to be changed when the taper and the aperture are changed, so that the requirement on mechanical stability is high.
Disclosure of Invention
In order to solve the above problems in the prior art, the present invention provides a laser micro-hole machining system and method based on axicon lens. The technical problem to be solved by the invention is realized by the following technical scheme:
one aspect of the present invention provides an axicon lens-based laser micro-via machining system comprising a laser that emits a laser beam, wherein,
a two-dimensional light beam deflection device is arranged at the output end of the laser at a preset angle, and can rotate to deflect an incident laser beam;
the two-dimensional light beam deflection device is characterized in that a first axial cone lens, a second axial cone lens and a focusing lens are sequentially and coaxially arranged in the reflection direction of the two-dimensional light beam deflection device, the vertex angles of the first axial cone lens and the second axial cone lens are opposite to each other, the distance between the first axial cone lens and the second axial cone lens is adjustable, and the focusing lens faces the processing platform.
In one embodiment of the present invention, the base angle of the first axicon lens is greater than the base angle of the second axicon lens.
In one embodiment of the present invention, the laser micro-hole machining system further includes a first driver configured to drive the two-dimensional beam deflecting device to rotate to adjust a deflection angle of the reflected laser beam.
In one embodiment of the present invention, the laser micro-hole machining system further includes a second driver configured to adjust a distance between the first axicon lens and the second axicon lens when machining a reverse tapered micro-hole or a shaped micro-hole.
In one embodiment of the present invention, the laser micro-hole machining system further includes a controller electrically connected to the first driver and the second driver, the controller is configured to generate an actual machining trajectory parameter according to the size and taper data of the inverted cone-shaped micro-hole or the special-shaped micro-hole when machining the inverted cone-shaped micro-hole or the special-shaped micro-hole, and generate a control signal based on the actual machining trajectory parameter to control the operation of the first driver and the second driver.
In one embodiment of the invention, the laser micro-hole machining system further comprises a beam shaping device arranged on the optical axis between the laser and the two-dimensional beam deflection device and configured to shape the circular laser spot emitted by the laser into a linear laser spot rotating around the optical axis.
In one embodiment of the present invention, the beam shaping device includes a first cylindrical mirror and a second cylindrical mirror disposed orthogonally to each other along an optical axis, wherein the first cylindrical mirror and the second cylindrical mirror are respectively rotatable around the optical axis.
In one embodiment of the present invention, the laser micro-hole machining system further includes a third driver configured to drive the first cylindrical mirror and the second cylindrical mirror to rotate.
Another aspect of the present invention provides a laser micro-hole machining method based on an axicon lens, the method being performed by using the laser micro-hole machining system according to any one of the above embodiments, the method comprising:
performing vector analysis according to the size and the taper data of the micropore to be processed to generate an actual processing track parameter;
generating a control signal based on the actual processing track parameter, controlling the deflection of the two-dimensional light beam deflection device and adjusting the distance between the first axicon lens and the second axicon lens, so that the position of the light beam after passing through the two-dimensional light beam deflection device and the position of the light beam after passing through the second axicon lens are respectively positioned at two sides of a reflection optical axis;
and controlling a laser to emit laser beams, and enabling the laser beams to sequentially pass through the two-dimensional beam deflection device, the first axicon lens, the second axicon lens and the focusing lens so as to carry out layer-by-layer micropore machining.
In an embodiment of the present invention, before controlling the laser to emit a laser beam and making the laser beam sequentially pass through the two-dimensional beam deflection device, the first axicon lens, the second axicon lens and the focusing lens to perform the layer-by-layer micro-hole machining, the method further includes:
and shaping the circular laser spot emitted by the laser into a linear laser spot rotating around the optical axis by using a beam shaping device.
Compared with the prior art, the invention has the beneficial effects that:
1. the laser micropore processing system provided by the invention utilizes the rotational symmetry characteristic of the axicon lens, does not need mechanical rotation of an optical element in the processing process, avoids mechanical abrasion caused by mechanical rotation, increases the mechanical stability of the laser micropore processing system and improves the punching precision.
2. The laser scanning speed of the laser micropore processing system and method is only related to the two-dimensional light beam deflection device, the two-dimensional light beam deflection device which is matched with a high speed can reach a very high scanning speed, and the one-time processing of a special-shaped hole can be realized by controlling the deflection angle of the two-dimensional light beam, compared with the traditional mode of separately processing, the processing efficiency is greatly improved.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is a schematic diagram of an optical path of an axicon lens-based laser micro-hole machining system according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a laser micro-hole machining system based on an axicon lens according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of another laser micro-hole machining system based on axicon lens according to an embodiment of the present invention;
fig. 4 is a schematic diagram illustrating an operation principle of a beam shaping apparatus according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating exemplary hole size analysis for via processing using an axicon lens based laser via processing system according to an embodiment of the present invention;
fig. 6 is a flowchart of a laser micro-hole processing method based on an axicon lens according to an embodiment of the present invention.
Description of reference numerals:
1-a laser; 2-two-dimensional beam deflection means; 3-a first axicon lens; 4-second axicon lens; 5-a focusing lens; 6-processing the platform; 7-a first driver; 8-a second driver; 9-a controller; 10-beam shaping means; 101-a first cylindrical mirror; 102-a second cylindrical mirror; 11-third driver.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description is given of the laser micro-hole machining system and method based on axicon lens according to the present invention with reference to the accompanying drawings and the detailed description.
The foregoing and other technical matters, features and effects of the present invention will be apparent from the following detailed description of the embodiments, which is to be read in connection with the accompanying drawings. The technical means and effects of the present invention adopted to achieve the predetermined purpose can be more deeply and specifically understood through the description of the specific embodiments, however, the attached drawings are provided for reference and description only and are not used for limiting the technical scheme of the present invention.
It is noted that, herein, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or device comprising the element.
Example one
Referring to fig. 1, fig. 1 is a schematic diagram of an optical path of a laser micro-hole machining system based on an axicon lens according to an embodiment of the present invention. The laser micropore processing system comprises a laser 1 for emitting laser beams, wherein a two-dimensional beam deflection device 2 is arranged at the output end of the laser 1 at a preset angle, the two-dimensional beam deflection device 2 can be a device capable of realizing two-dimensional reflection deflection of the beams, such as a scanning galvanometer, and the like, and the laser beams emitted from the laser 1 are reflected and rotated by the two-dimensional beam deflection device 2 to be subjected to two-dimensional deflection in the direction vertical to the emitting direction of the laser 1; the two-dimensional light beam deflection device 2 is provided with a first axial conical lens 3, a second axial conical lens 4 and a focusing lens 5 in sequence in the reflection direction, wherein the vertex angles of the first axial conical lens 3 and the second axial conical lens 4 are opposite to each other, the distance between the first axial conical lens 3 and the second axial conical lens 4 is adjustable, and the focusing lens 5 is right opposite to the processing platform 6.
Specifically, the optical axis of the laser beam emitted by the laser 1 is disposed at a preset angle, preferably 45 °, to the reflection surface of the two-dimensional beam deflecting device 2. Thus, the laser beam from the laser 1 is reflected by the two-dimensional beam deflecting device 2, deflected by 90 °, and forms a reflection optical axis at the center position of the reflection point of the laser beam, on which the first axicon lens 3, the second axicon lens 4, and the focus lens 5 are arranged in this order. In the present embodiment, the two-dimensional beam deflecting device 2 is a two-dimensional beam deflecting mirror.
The two-dimensional beam deflection device 2 can rotate by a preset angle to give a small deflection angle to the laser beam, so that the laser beam reflected by the two-dimensional beam deflection device 2 in the machining process always needs to be deflected to the other side of the reflection optical axis. That is, as shown in fig. 1, during the processing, the laser beam reflected by the two-dimensional beam deflecting device 2 forms an angle β with the reflection optical axis, and it is ensured that the reflected laser beam is always incident on the cone surface of the first axicon lens 3. It should be noted that the size of the included angle β is related to the size of the hole to be processed, and can be adjusted by the rotation of the two-dimensional beam deflecting device 2. The laser scanning speed of the laser micropore processing system is only related to the two-dimensional light beam deflection device, and the two-dimensional light beam deflection device which is matched with a high speed can reach a very high scanning speed, improve the utilization rate of a laser, realize higher punching efficiency, and is not limited by the movement of an optical wedge or flat glass with larger inertia in the prior art.
The first axicon lens 3 and the second axicon lens 4 can provide the same deflection direction for the laser beam in all directions through special rotational symmetry structures of the first axicon lens and the second axicon lens, so that the laser beam can be controlled to scan through the rotation of the two-dimensional beam deflection device 2. After the laser beam reflected by the two-dimensional beam deflection device 2 is deflected by the first axicon lens 3 and the second axicon lens 4, an included angle theta between the laser beam and a reflection optical axis is fixed and unchanged in all directions. It should be noted that the distance between the first axicon lens 3 and the second axicon lens 4 determines the offset of the laser beam from the reflection optical axis, so that the processing of holes with different tapers can be completed by adjusting the distance between the two axicon lenses.
Further, since the deflection of the light beam by the axicon lenses with different base angles is different, it is preferable that the base angle α of the first axicon lens 3 is different in order to reduce the length of the system1Greater than the base angle alpha of the second axicon lens 42Therefore, the laser beam has a larger deflection angle, so that the first axicon lens can be shortened as much as possible under the condition that the laser beam has enough offset on the second axicon lens 43 and a second axicon lens 4, thereby shortening the overall length of the whole laser micropore machining system. Through the base angle alpha of the first axicon lens 31Base angle alpha with second axicon lens 42The mutual matching is proper, and the deflection angle and the offset displacement of the emergent light beam reaching the processing platform 6 can be ensured to meet the processing requirements.
Further, as shown in fig. 1, according to the formula for calculating the refraction angle of the first axicon lens 3 and the second axicon lens 4, the following angular relationship can be obtained:
r＝f*θ，
where n denotes a refractive index of the axicon lens, f denotes a focal length of the focusing lens 5, and r denotes a radius of the machining hole. The value of the scanning radius of the laser can be controlled by controlling the deflection angle β, that is, a variable radius of the processed hole can be obtained by controlling the rotation of the two-dimensional beam deflecting device 2.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a laser micro-hole machining system based on an axicon lens according to an embodiment of the present invention. The laser micro-hole machining system further comprises a first driver 7, and the first driver 7 is configured to drive the two-dimensional beam deflection device 2 to rotate so as to adjust the deflection angle of the reflected laser beam.
The laser micro-hole processing system also comprises a second driver 8, wherein the second driver 8 is configured to drive the first axicon lens 3 and/or the second axicon lens 4 to move when processing the inverted cone-shaped micro-hole or the special-shaped micro-hole so as to adjust the distance between the first axicon lens 3 and the second axicon lens 4. The distance between the first axicon lens 3 and the second axicon lens 4 determines the taper of the hole to be processed, and particularly, when an inverted taper type micropore or a special-shaped micropore is processed, micropores with different tapers can be processed by controlling the distance between the first axicon lens 3 and the second axicon lens 4. Preferably, in the present embodiment, the first axicon lens 3 is fixed, and the second driver 8 can drive the second axicon lens 4 to move, so as to adjust the distance between the first axicon lens 3 and the second axicon lens 4.
Further, the laser micro-hole machining system further comprises a controller 9 electrically connected with the first driver 7 and the second driver 8, the controller 9 is configured to generate an actual machining track parameter and a beam offset according to the size and the taper data of the inverted cone-shaped micro-hole or the special-shaped micro-hole when machining the inverted cone-shaped micro-hole or the special-shaped micro-hole, generate a control signal based on the actual machining track parameter and the beam offset, control the second driver 8 to adjust the distance between the first axicon lens 3 and the second axicon lens 4, change the machining beam offset to meet the taper requirement of the hole to be machined, and control the first driver 7 to rotate the two-dimensional beam deflection device 2 to a relative beta angle according to the machining aperture value r of each layer, so that the laser beam completes the track control of inputting the hole to be machined.
In addition, the laser micro-hole machining system of the present embodiment further includes a host control display system (not shown in the drawings). The controller 9 can receive real-time feedback signals of the first driver 7 and the second driver 8 so as to acquire the real-time processing state of the whole device; receiving a control instruction from an upper control display system, calling a high-speed track algorithm of the device, generating a real-time scanning track control signal according to a vector analysis method, forming closed-loop control with state signals of a first driver 7 and a second driver 8, finally outputting the control signal to each driver, and uploading the state of the device to the upper control display system in real time.
Because axicon lens is the rotation symmetry body, the laser beam that laser instrument 1 sent forms for circular facula, consequently can take place to warp when the beam incides axicon lens surface, when the base angle of two axicon lenses is unequal, the facula quality after the beam focus after being refracted by two axicon lenses is relatively poor, can have certain influence to processing. Referring to fig. 3 and 4, fig. 3 is a schematic structural diagram of another laser micro-hole machining system based on axicon lens according to an embodiment of the present invention; fig. 4 is a schematic diagram illustrating an operation principle of a beam shaping apparatus according to an embodiment of the present invention. In order to solve this problem, the laser micro-hole machining system of the present embodiment further includes a beam shaping device 10, and the beam shaping device 10 is disposed on the optical axis between the laser 1 and the two-dimensional beam deflection device 2, and is configured to shape the circular laser spot emitted by the laser 1 into a linear laser spot rotating around the optical axis. Specifically, the beam shaping device 10 includes a first cylindrical mirror 101 and a second cylindrical mirror 102 disposed orthogonally to each other in the optical axis direction, wherein the first cylindrical mirror 101 and the second cylindrical mirror 102 are respectively rotatable about the optical axis direction, and the linear light spot is rotated along the optical axis by rotating both the cylindrical mirrors. By controlling the rotation of the first cylindrical mirror 101 and the second cylindrical mirror 102 to be synchronized with the rotational position of the two-dimensional beam deflecting device 2, the beam distortion can be minimized, and the processing quality can be optimized. In other embodiments, the beam shaping device 10 may also have other suitable configurations, such as a Powell prism.
In addition, the laser micro-hole machining system further includes a third driver 11, and the third driver 11 is configured to drive the first cylindrical mirror 101 and the second cylindrical mirror 102 to rotate under the control of the controller 9. The first cylindrical mirror 101 and the second cylindrical mirror 102 are always orthogonal to each other and synchronized with the two-dimensional beam deflector position during the rotation.
The working process of the laser micro-hole machining system based on the axicon lens is further described by taking the machining of the special-shaped hole as an example.
The specific flow of the special-shaped hole machining is as follows:
1) and (3) introducing a special-shaped hole model to be processed into the controller 9, analyzing the model coordinates by the controller 9, and recording the shape parameters of each layer of the special-shaped hole.
2) The controller 9 performs vector analysis according to the shape parameters of each layer of the hole to be processed to generate actual processing trajectory parameters.
Since the laser micro-hole machining system is used for machining the micro-holes layer by layer in the micro-hole machining process, before machining, the controller 9 is used for layering holes to be machined, and performing vector analysis according to shape parameters of each layer to generate actual machining track parameters, as shown in fig. 5.
3) The controller 9 controls the first driver 7 to operate according to the actual processing track parameter, and the first driver 7 further drives the two-dimensional beam deflection device 2 to rotate so as to adjust the deflection angle of the reflected laser beam; and meanwhile, the second driver 8 is controlled to operate, the second driver 8 further drives the second axicon lens 4 to move so as to adjust the distance between the first axicon lens 3 and the second axicon lens 4, vertical feeding is realized, and the special-shaped holes are processed layer by layer until the processing is finished.
The laser micropore machining system of this embodiment utilizes the rotational symmetry characteristic of axicon lens, need not optical element's mechanical rotation in the course of working, avoids because mechanical wear that mechanical rotation caused, has increased this laser micropore machining system's mechanical stability simultaneously, has improved the precision of punching. This laser micropore processing system's laser scanning speed only is relevant with two-dimensional light beam deflection device, and the two-dimensional light beam deflection device that the cooperation is fast-speed can reach very high scanning rate, and can realize the one-shot processing in dysmorphism hole through controlling two-dimensional light beam deflection angle, compares the mode that the tradition separately processed, and machining efficiency promotes greatly.
Example two
On the basis of the first embodiment, the present embodiment provides a laser micro-hole machining method based on an axicon lens, which is performed by using the laser micro-hole machining system of the first embodiment. Referring to fig. 6, fig. 6 is a flowchart of a laser micro-hole machining method based on an axicon lens according to an embodiment of the present invention. The method comprises the following steps:
s1: and carrying out vector analysis according to the size and the taper data of the micropore to be processed to generate an actual processing track parameter.
Specifically, a to-be-machined hole model is led into the controller through the upper control display system, the controller analyzes the model coordinates, and shape parameters of each layer of the to-be-machined hole are recorded. And then, the controller carries out vector analysis according to the shape parameters of each layer of the hole to be processed to generate actual processing track parameters.
S2: generating a control signal based on the actual processing track parameter, controlling the deflection of the two-dimensional light beam deflection device and adjusting the distance between the first axicon lens and the second axicon lens, so that the position of the light beam after passing through the two-dimensional light beam deflection device and the position of the light beam after passing through the second axicon lens are respectively positioned at two sides of a reflection optical axis;
s3: and controlling a laser to emit laser beams, and enabling the laser beams to sequentially pass through the two-dimensional beam deflection device, the first axicon lens, the second axicon lens and the focusing lens so as to carry out layer-by-layer micropore machining.
Specifically, the controller controls a first driver to operate according to the actual processing track parameter, and the first driver further drives a two-dimensional beam deflection device to rotate so as to adjust the reflection angle of the laser beam; and simultaneously controlling the second driver to operate, and then driving the second axicon lens to move by the second driver so as to adjust the distance between the first axicon lens and the second axicon lens, realize vertical feeding, and further perform layer-by-layer machining on the inverted cone micropores or the special-shaped holes until the machining is finished.
Further, before step S3, the method further includes:
and shaping the circular laser spot emitted by the laser into a linear laser spot rotating around the optical axis by using a beam shaping device.
Specifically, the beam shaping device is disposed on the optical axes of the laser and the two-dimensional beam deflecting device. The beam shaping device of this embodiment includes a first cylindrical mirror and a second cylindrical mirror that are disposed orthogonal to each other in the optical axis direction, where the first cylindrical mirror and the second cylindrical mirror are capable of rotating around the optical axis direction, respectively, and the linear light spot is rotated along the optical axis by rotating the two cylindrical mirrors. The rotation of the first cylindrical mirror and the second cylindrical mirror and the rotation speed of the two-dimensional light beam deflection device are cooperatively controlled, so that the light beam deformation can be minimized, and the focusing process of the light beam is not influenced.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (7)
1. A laser micro-hole machining system based on axicon lens is characterized by comprising a laser (1) emitting a laser beam, wherein,
a two-dimensional light beam deflection device (2) is arranged at the output end of the laser (1) at a preset angle, and the two-dimensional light beam deflection device (2) can rotate to deflect an incident laser beam;
a first axial conical lens (3), a second axial conical lens (4) and a focusing lens (5) are coaxially arranged in sequence in the reflection direction of the two-dimensional light beam deflection device (2), the vertex angles of the first axial conical lens (3) and the second axial conical lens (4) are opposite to each other, the distance between the vertex angles is adjustable, and the focusing lens (5) is right opposite to the processing platform (6);
the laser micropore machining system further comprises a beam shaping device (10) which is arranged on an optical axis between the laser (1) and the two-dimensional beam deflection device (2) and is configured to shape a circular laser spot emitted by the laser (1) into a linear laser spot rotating around the optical axis;
the beam shaping device (10) comprises a first cylindrical mirror (101) and a second cylindrical mirror (102) which are arranged along an optical axis and are mutually orthogonal, wherein the first cylindrical mirror (101) and the second cylindrical mirror (102) can respectively rotate around the optical axis;
the laser micro-hole machining system further comprises a third driver (11) configured to drive the first cylindrical mirror (101) and the second cylindrical mirror (102) to rotate.
2. The axicon lens-based laser micro-via processing system of claim 1 wherein the base angle of the first axicon lens (3) is greater than the base angle of the second axicon lens (4).
3. The axicon lens-based laser micro-aperture machining system of claim 1 further comprising a first driver (7) configured to drive the two-dimensional beam deflection device (2) in rotation to adjust the deflection angle of the reflected laser beam.
4. The axicon lens based laser micro-aperture machining system of claim 3 further comprising a second driver (8) configured to adjust the spacing of the first axicon lens (3) from the second axicon lens (4) when machining inverted cone type micro-apertures or shaped micro-apertures.
5. The axicon lens based laser micro-hole machining system of claim 4, further comprising a controller (9) electrically connecting the first driver (7) and the second driver (8), wherein the controller (9) is configured to generate an actual machining trajectory parameter according to the size and taper data of the inverted tapered micro-hole or the shaped micro-hole when machining the inverted tapered micro-hole or the shaped micro-hole, and generate a control signal based on the actual machining trajectory parameter to control the operation of the first driver (7) and the second driver (8).
6. A method of laser micro-via machining based on axicon lens, the method being performed using the laser micro-via machining system of any one of claims 1-5, the method comprising:
performing vector analysis according to the size and taper data of the micropore to be processed to generate an actual processing track parameter;
generating a control signal based on the actual processing track parameter, controlling the deflection of the two-dimensional light beam deflection device and adjusting the distance between the first axicon lens and the second axicon lens, so that the position of the light beam after passing through the two-dimensional light beam deflection device and the position of the light beam after passing through the second axicon lens are respectively positioned at two sides of a reflection optical axis;
and controlling a laser to emit laser beams, and enabling the laser beams to sequentially pass through the two-dimensional beam deflection device, the first axicon lens, the second axicon lens and the focusing lens so as to carry out layer-by-layer micropore machining.
7. The method for laser micro-hole machining based on the axicon lens as claimed in claim 6, further comprising before controlling the laser to emit a laser beam and making the laser beam pass through the two-dimensional beam deflection device, the first axicon lens, the second axicon lens and the focusing lens in sequence for micro-hole machining layer by layer:
and shaping the circular laser spot emitted by the laser into a linear laser spot rotating around the optical axis by using a beam shaping device.
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| CN113634926B (en) * | 2021-07-27 | 2023-07-25 | 江苏先河激光研究院有限公司 | Square hole machining method and system based on laser rotary cutting |
| CN114769845A (en) * | 2022-04-20 | 2022-07-22 | 华东师范大学 | Laser rotary cutting drill device based on burst mode and drilling method |
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