CN110293326A - A kind of method of double light beam laser cutting slab - Google Patents
A kind of method of double light beam laser cutting slab Download PDFInfo
- Publication number
- CN110293326A CN110293326A CN201910693785.8A CN201910693785A CN110293326A CN 110293326 A CN110293326 A CN 110293326A CN 201910693785 A CN201910693785 A CN 201910693785A CN 110293326 A CN110293326 A CN 110293326A
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- Prior art keywords
- laser
- cutting
- light beam
- double light
- auxiliary gas
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000005520 cutting process Methods 0.000 claims abstract description 63
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 5
- 239000010935 stainless steel Substances 0.000 claims abstract description 5
- 239000012535 impurity Substances 0.000 claims abstract description 4
- 239000013307 optical fiber Substances 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 11
- 239000000835 fiber Substances 0.000 claims description 9
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of methods of double light beam laser cutting slab, it is characterised in that: step 1 provides incisory thick stainless steel plate；Step 2 removes the impurity in workpiece upper and lower surface to be cut and uses clamp；Step 3 provides double light beam laser diced system；Step 4 defines cutting introducing section in turning in laser cutting track and draws section；Step 5, starting double light beam laser diced system, open auxiliary gas supply system, provide the first auxiliary gas, implement double light beam laser and cut slab；Step 6, when laser compound cuts head be moved to turning cutting introduce section starting point when, increase by second auxiliary gas supply, start slab corner region cutting；Step 7, when laser compound cuts head be moved to turning cutting draw section terminating point when, close second auxiliary gas；Step 8 when reaching incision tip point, closes laser generator, completes cutting process.Compared with the existing technology, the present invention has good cutting effect, adaptable.
Description
Technical field
The present invention relates to a kind of laser cutting method more particularly to a kind of methods for being cut by laser slab corner.
Background technique
Currently, laser cutting technique is on a large scale in panel beating, metallurgical equipment, engineering machinery, accurate accessory, technique gift
The numerous areas application such as product, household electrical appliance.Laser cut metal traditional at present is mainly using the light utilized in cutting head
System, which converges to material surface, makes its thawing, and realizes cutting by providing auxiliary gas blasting's melted material.But in benefit
When being cut by laser thick stainless steel plate with optical fiber, is intensively being accumulated in corner's laser energy, be easy to causeing corner " inverse
Spray " phenomenon, causes cutting that can not carry out.
Disclosed on May 13rd, 2015, Publication No. " 104607805 A of CN ", a kind of entitled " corner
The patent of invention of laser cutting method " discloses a kind of corner's laser cutting method, when laser cutting track reaches corner regions
Domain, presets cutting power and cutting speed exports percentage, and control system is written by control instruction, adjusts cutting power and cuts
Speed is cut, completes cutting, finishing control instruction, cutting is restored to normal cut state, but the technical solution there is a problem:
In order to alleviate cutting area surface temperature, it is cooled down by increasing auxiliary gas.
Disclosed on August 10th, 2016, Publication No. " 105834595 A of CN ", entitled " a kind of wedge angle is sharp
The patent of invention of light cutting method " discloses a kind of wedge angle laser cutting method, and the laser cutting method is by adjusting cutting function
Rate is 250 W, collects in cutting head laser beam to metal material surface, and blow the auxiliary gas of 3 MPa, and in metal material
Lower surface provides the negative pressure for being less than atmospheric pressure, according to the mobile cutting head of the speed of 800 mm/min；Improving laser cutting machine again
Power is 500 W, and the negative pressure for being less than atmospheric pressure is provided in metal material lower surface, is moved according to the speed of 1500 mm/min
Dynamic cutting head, the present invention can effectively be cut into good wedge angle, and there are still problems for the technical solution: cutting process medium temperature is spent
Height is difficult to disperse in practical applications.
Summary of the invention
There is molten metal present invention aim to address laser cutting slab corner and " inverse spray " phenomenon occurs upwards, causes
The problem of continuing cutting can not.
The technical solution of the present invention is to provide a kind of methods of double light beam laser cutting slab, it is characterised in that.
Step 1 provides incisory thick stainless steel plate.
Step 2 removes the impurity in workpiece upper and lower surface to be cut and uses clamp.
Step 3 provides double light beam laser diced system.
Step 4 defines cutting introducing section in turning in laser cutting track and draws section.
Step 5, starting double light beam laser diced system, open auxiliary gas supply system, provide the first auxiliary gas, real
Apply double light beam laser cutting slab.
Step 6, when laser compound cuts head be moved to turning cutting introduce section starting point when, increase by second auxiliary gas supply
It gives, starts the cutting of slab corner region double light beam laser.
Step 7, when laser compound cuts head be moved to turning cutting draw section terminating point when, close second auxiliary gas,
Terminate corner region cutting.
Step 8 when reaching incision tip point, closes laser generator, completes cutting process.
Further, in step 2, thickness of workpiece to be cut is 20 ~ 50 mm.
Further, in step 3, double light beam laser diced system includes CO2Laser, single mode fiber laser, CO2
Laser delivery optics, optical-fiber laser transmission fiber, laser compound cuts head and auxiliary gas supply system.
Further, CO2Laser output power is 8 ~ 10 kW.
Further, single mode fiber laser output power is 8 ~ 10 kW.
Further, auxiliary gas supply system includes the first gas cylinder, the second gas cylinder, the first transmission pipeline, the second transmission
Pipeline and gas assist nozzle.
Further, gas assist nozzle connect and fixes with laser compound cuts head.
Further, gas assist nozzle includes the first air cavity and the second air cavity, and the first air cavity and the second air cavity are equipped with
The circular hole of several annular spreads.
Further, in step 4, workpiece turning to be cut form is circular arc or linear corner.
Further, in step 4, it is cut by laser turning cutting in track and introduces section d1For 10 ~ 30 mm.
Further, in step 4, it is cut by laser turning cutting in track and draws segment length d2For 10 ~ 20 mm.
Further, in steps of 5, CO2The focal position of laser is apart from workpiece surface δ1For 0 ~ 5 mm.
Further, in steps of 5, the focal position of single mode optical fiber laser is apart from workpiece surface δ2For 5 ~ 10 mm.
Further, CO2The focal position of laser and single mode optical fiber laser is 5 ~ 10 mm at a distance of Δ.
Further, in steps of 5, provide cutting the first auxiliary to the first air cavity of gas assist nozzle by the first gas cylinder
Gas.
Further, the first auxiliary gas is N2, pressure is 15 ~ 30 MPa.
Further, in step 6, provide cutting the second auxiliary to the second air cavity of gas assist nozzle by the second gas cylinder
Gas.
Further, the second auxiliary gas is Ar, and pressure is 20 ~ 35 MPa.
The beneficial effects of the invention are as follows.
1) in the present invention, using coaxial dual wavelength CO2Laser and single mode optical fiber laser implement thick plates cutting, effective land productivity
With CO2Laser cutting process is stablized, and single mode optical fiber laser has many advantages, such as that focusing capability is strong, and material absorptivity is high, passes through
The spatial position of two kinds of laser beams of preferred arrangement realizes that material to the efficient absorption of two laser energy, avoids photic plasma
The generation of body obtains and stablizes cutting effect.
2) in the present invention, in coaxial dual wavelength CO2On the basis of laser and single mode optical fiber laser, cut using binary channels
Gas is assisted, realizes the double-deck secondary air synchronous effect in slab corner region；In addition, outer layer secondary air is high pressure Ar, tool
Have density big, impact force is strong, effectively inhibit be easy to produce in corner region cutting process energy concentrate and cause it is photic it is equal from
Daughter shields laser beam, and then the problem of the unordered flowing of cutting region molten metal, and slab corner region stabilization may be implemented and cut
It cuts.
3) method of a kind of double light beam laser cutting slab provided by the invention, it is crosscutting, vertical can to promote the use of slab
Cut with all positon cutting etc. during, it is adaptable.
Detailed description of the invention
Fig. 1 is laser cutting process cut deal corner schematic diagram.
Fig. 2 is the inverse spray phenomenon schematic diagram of conventional laser cutting slab corner.
Fig. 3 is embodiment of the present invention schematic diagram.
Fig. 4 is gas assist nozzle top view.
Fig. 5 is gas assist nozzle main view.
Wherein: 1, CO2Laser beam, 2, single mode optical fiber laser beam, the 3, first reflecting mirror, the 4, second reflecting mirror, 5, focus it is saturating
Mirror, 6, gas assist nozzle, the 601, first air cavity, the 602, second air cavity, 7, slot, 8, molten bath, 9, workpiece to be cut, 10, inverse
Spray molten metal, 11, photo plasma, the 12, first transmission pipeline, the 13, second transmission pipeline, the 14, first gas cylinder, 15, the
Two gas cylinders, 16, turning cutting introducing section starting point, 17, turning starting point, 18, turning terminating point, 19, turning cutting extraction section
Terminating point.
Specific embodiment
Technical solution of the present invention is described in detail below in conjunction with attached drawing 1 ~ 5 and specific embodiment.
As shown in Fig. 1 ~ 5, in the embodiment of the present invention, a kind of method of double light beam laser cutting slab includes the following steps.
Step 1 provides incisory thick stainless steel plate.
Step 2 removes the impurity in 9 upper and lower surface of workpiece to be cut and uses clamp.
In the present embodiment, workpiece 9 to be cut is with a thickness of 20 ~ 50 mm.
Step 3 provides double light beam laser diced system.
In the present embodiment, double light beam laser diced system includes CO2Laser, single mode fiber laser, CO2Laser transmission
Optical path, optical-fiber laser transmission fiber, laser compound cuts head and auxiliary gas supply system.
In the present embodiment, CO2Laser output power is 8 ~ 10 kW.
In the present embodiment, single mode fiber laser output power is 8 ~ 10 kW.
As shown in figure 3, auxiliary gas supply system includes the first gas cylinder 14, the second gas cylinder 15, first biography in the present embodiment
Defeated pipeline 12, the second transmission pipeline 13 and gas assist nozzle 6, gas assist nozzle 6 connect and consolidate with laser compound cuts head
It is fixed.
As shown in figure 4, gas assist nozzle 6 includes the first air cavity 601 and the second air cavity 602, the first gas in the present embodiment
Chamber 601 and the second air cavity 602 are equipped with the circular hole of several annular spreads.
Step 4 defines cutting introducing section in workpiece turning to be cut in laser cutting track and draws section.
As shown in Figure 1,9 turning form of workpiece to be cut is circular arc or linear corner in the present embodiment.
As shown in Figure 1, it is one section of straight cuts apart from turning starting point 17 that turning cutting, which introduces section, in the present embodiment
Area, turning cutting introduce segment length d1For 10 ~ 30 mm.
As shown in Figure 1, it is one section of straight cuts that turning terminating point 18 starts that section is drawn in turning cutting in the present embodiment
Segment length d is drawn in area, turning cutting2For 10 ~ 20 mm.
Step 5, starting double light beam laser diced system, open auxiliary gas supply system, provide the first auxiliary gas, real
Apply double light beam laser cutting slab.
In the present embodiment, CO2The focal position of laser beam 1 is apart from workpiece surface δ1For 0 ~ 5 mm.
In the present embodiment, the focal position of single mode optical fiber laser beam 2 is apart from workpiece surface δ2For 5 ~ 10 mm.
In the present embodiment, CO2The focal position of laser beam 1 and single mode optical fiber laser beam 2 is 5 ~ 10 mm at a distance of Δ.
In the present embodiment, cutting the first auxiliary gas is provided to 6 first air cavity 601 of gas assist nozzle by the first gas cylinder 14
Body, the first auxiliary gas is N2, pressure is 15 ~ 30 MPa.
Step 6, when laser compound cuts head be moved to turning cutting introduce section starting point 16 when, increase by second auxiliary gas
Supply starts the cutting of slab corner region double light beam laser, and the second auxiliary gas is Ar, and pressure is 20 ~ 35 MPa.
In the present embodiment, cutting the second auxiliary gas is provided to 6 second air cavity 602 of gas assist nozzle by the second gas cylinder 15
Body.
Step 7, when laser compound cuts head be moved to turning cutting draw section terminating point 18 when, close second auxiliary gas
Body terminates corner region cutting.
Step 8 when reaching incision tip point, closes laser generator, completes cutting process.
Above-described embodiment is one of embodiments of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation.Other any changes, modifications, substitutions, combinations, simplifications done without departing from spirit of the invention and principle, should all regard
It include within that scope of the present invention for equivalent replacement mode.
Claims (9)
1. a kind of method of double light beam laser cutting slab, which comprises the steps of:
Step 1 provides incisory thick stainless steel plate；
Step 2 removes the impurity in workpiece (9) upper and lower surface to be cut and uses clamp；
Step 3 provides double light beam laser diced system；
Step 4 defines cutting introducing section in turning in laser cutting track and draws section；
Step 5, starting double light beam laser diced system, open auxiliary gas supply system, provide the first auxiliary gas, implement double
Beam laser cuts slab；
Step 6, when laser compound cuts head be moved to turning cutting introduce section starting point (16) when, increase by second auxiliary gas supply
It gives, starts the cutting of slab corner region double light beam laser；
Step 7, when laser compound cuts head be moved to turning cutting draw section terminating point (19) when, close second auxiliary gas,
Terminate corner region cutting；
Step 8 when reaching incision tip point, closes laser generator, completes cutting process.
2. the method for double light beam laser cutting slab according to claim 1, it is characterised in that: in step 2, work to be cut
Part (9) is with a thickness of 20 ~ 30 mm.
3. the method for double light beam laser cutting slab according to claim 1, it is characterised in that: in step 3, dual-beam swashs
Light diced system includes CO2Laser, single mode fiber laser, CO2Laser delivery optics, optical-fiber laser transmission fiber, laser are multiple
Close cutting head and auxiliary gas supply system, CO2Laser output power is 8 ~ 10 kW, single mode fiber laser output power
For 8 ~ 10 kW.
4. the method for double light beam laser cutting slab according to claim 1, it is characterised in that: in step 3, assist gas
Feed system includes the first gas cylinder (14), the second gas cylinder (15), the first transmission pipeline (12), the second transmission pipeline (13) and auxiliary
Gas nozzle (6), gas assist nozzle (6) connect and fix with laser compound cuts head.
5. the method for double light beam laser cutting slab according to claim 1, it is characterised in that: in step 3, assist gas
Nozzle (6) includes the first air cavity (601) and the second air cavity (602), and the first air cavity (601) and the second air cavity (602) are if be equipped with
The circular hole of dry annular spread.
6. the method for double light beam laser cutting slab according to claim 1, it is characterised in that: in step 4, work to be cut
Part (9) turning form is circular arc or linear corner, is cut by laser turning cutting in track and introduces section d1For 10~30 mm, laser
Segment length d is drawn in turning cutting in cutting track2For 10 ~ 20 mm.
7. the method for double light beam laser cutting slab according to claim 1, it is characterised in that: in step 5, CO2Laser beam
(1) focal position is apart from workpiece surface δ1For 0 ~ 5 mm, the focal position of single mode optical fiber laser beam (2) table on workpiece
Face δ2For 5 ~ 10 mm, CO2The focal position of laser beam (1) and single mode optical fiber laser beam (2) is 5 ~ 10 mm at a distance of Δ.
8. the method for double light beam laser cutting slab according to claim 1, it is characterised in that: in step 5, pass through first
Gas cylinder (14) provides cutting the first auxiliary gas to (6) first air cavity (601) of gas assist nozzle, and the first auxiliary gas is N2,
Pressure is 15 ~ 30 MPa.
9. the method for double light beam laser cutting slab according to claim 1, it is characterised in that: in step 6, pass through second
Gas cylinder (15) provides cutting the second auxiliary gas to (6) second air cavity (602) of gas assist nozzle, and the second auxiliary gas is Ar,
Pressure is 20 ~ 35 MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910693785.8A CN110293326B (en) | 2019-07-30 | 2019-07-30 | Method for cutting thick plate by double-beam laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910693785.8A CN110293326B (en) | 2019-07-30 | 2019-07-30 | Method for cutting thick plate by double-beam laser |
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| Publication Number | Publication Date |
|---|---|
| CN110293326A true CN110293326A (en) | 2019-10-01 |
| CN110293326B CN110293326B (en) | 2021-04-13 |
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| CN201910693785.8A Active CN110293326B (en) | 2019-07-30 | 2019-07-30 | Method for cutting thick plate by double-beam laser |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114871593A (en) * | 2022-06-16 | 2022-08-09 | 西北工业大学太仓长三角研究院 | Thick plate myriawatt-level optical fiber laser double-component gas-assisted cutting method |
| CN115673569A (en) * | 2022-11-21 | 2023-02-03 | 长沙大科激光科技有限公司 | Medium plate swinging laser cutting method |
| CN116673618A (en) * | 2023-07-07 | 2023-09-01 | 珠海市申科谱工业科技有限公司 | Laser drilling process for medical plastic catheter |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2175737A (en) * | 1985-05-09 | 1986-12-03 | Control Laser Limited | Laser material processing |
| CN1112866A (en) * | 1994-02-24 | 1995-12-06 | 三菱电机株式会社 | Laser cutting method eliminating defects in regions where cutting conditrons are changed |
| US20070235418A1 (en) * | 2006-03-28 | 2007-10-11 | Samsung Electronics Co., Ltd. | Method for cutting substrate and substrate cutting apparatus using the same |
| CN101468429A (en) * | 2007-12-27 | 2009-07-01 | 深圳市大族激光科技股份有限公司 | Method for controlling speed of laser cutting |
| CN101474724A (en) * | 2009-01-06 | 2009-07-08 | 深圳市大族激光科技股份有限公司 | Laser cutting method for angle of rotation |
| US20110049764A1 (en) * | 2009-09-02 | 2011-03-03 | Lee Hyun-Chul | Substrate cutting apparatus and method for cutting substrate using the same |
| CN102069304A (en) * | 2011-01-25 | 2011-05-25 | 哈尔滨工业大学 | Protective device for laser welding |
| CN102145412A (en) * | 2011-03-24 | 2011-08-10 | 湖南泰嘉新材料科技股份有限公司 | Grinding-free method for forming double-metal band sawtooth at one time through laser cutting |
| CN202126514U (en) * | 2011-06-17 | 2012-01-25 | 山西飞虹激光科技有限公司 | Optical element used for laser processing and laser processing equipment |
| CN102896419A (en) * | 2012-10-23 | 2013-01-30 | 华南师范大学 | Double-laser beam compound welding device and use method thereof |
| CN103189160A (en) * | 2010-11-01 | 2013-07-03 | 住友电气工业株式会社 | Cutting tool, production method for same, and production device |
| CN104368911A (en) * | 2014-10-28 | 2015-02-25 | 中国科学院宁波材料技术与工程研究所 | Laser processing head, application of laser processing head and laser processing system and method |
| CN106346141A (en) * | 2016-09-07 | 2017-01-25 | 华中科技大学 | Metal cutting device based on composite laser beams |
-
2019
- 2019-07-30 CN CN201910693785.8A patent/CN110293326B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2175737A (en) * | 1985-05-09 | 1986-12-03 | Control Laser Limited | Laser material processing |
| CN1112866A (en) * | 1994-02-24 | 1995-12-06 | 三菱电机株式会社 | Laser cutting method eliminating defects in regions where cutting conditrons are changed |
| US20070235418A1 (en) * | 2006-03-28 | 2007-10-11 | Samsung Electronics Co., Ltd. | Method for cutting substrate and substrate cutting apparatus using the same |
| CN101468429A (en) * | 2007-12-27 | 2009-07-01 | 深圳市大族激光科技股份有限公司 | Method for controlling speed of laser cutting |
| CN101474724A (en) * | 2009-01-06 | 2009-07-08 | 深圳市大族激光科技股份有限公司 | Laser cutting method for angle of rotation |
| US20110049764A1 (en) * | 2009-09-02 | 2011-03-03 | Lee Hyun-Chul | Substrate cutting apparatus and method for cutting substrate using the same |
| CN103189160A (en) * | 2010-11-01 | 2013-07-03 | 住友电气工业株式会社 | Cutting tool, production method for same, and production device |
| CN102069304A (en) * | 2011-01-25 | 2011-05-25 | 哈尔滨工业大学 | Protective device for laser welding |
| CN102145412A (en) * | 2011-03-24 | 2011-08-10 | 湖南泰嘉新材料科技股份有限公司 | Grinding-free method for forming double-metal band sawtooth at one time through laser cutting |
| CN202126514U (en) * | 2011-06-17 | 2012-01-25 | 山西飞虹激光科技有限公司 | Optical element used for laser processing and laser processing equipment |
| CN102896419A (en) * | 2012-10-23 | 2013-01-30 | 华南师范大学 | Double-laser beam compound welding device and use method thereof |
| CN104368911A (en) * | 2014-10-28 | 2015-02-25 | 中国科学院宁波材料技术与工程研究所 | Laser processing head, application of laser processing head and laser processing system and method |
| CN106346141A (en) * | 2016-09-07 | 2017-01-25 | 华中科技大学 | Metal cutting device based on composite laser beams |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114871593A (en) * | 2022-06-16 | 2022-08-09 | 西北工业大学太仓长三角研究院 | Thick plate myriawatt-level optical fiber laser double-component gas-assisted cutting method |
| CN115673569A (en) * | 2022-11-21 | 2023-02-03 | 长沙大科激光科技有限公司 | Medium plate swinging laser cutting method |
| CN116673618A (en) * | 2023-07-07 | 2023-09-01 | 珠海市申科谱工业科技有限公司 | Laser drilling process for medical plastic catheter |
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| CN110293326B (en) | 2021-04-13 |
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