CN202126514U - Optical element used for laser processing and laser processing equipment - Google Patents
Optical element used for laser processing and laser processing equipment Download PDFInfo
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- CN202126514U CN202126514U CN 201120206288 CN201120206288U CN202126514U CN 202126514 U CN202126514 U CN 202126514U CN 201120206288 CN201120206288 CN 201120206288 CN 201120206288 U CN201120206288 U CN 201120206288U CN 202126514 U CN202126514 U CN 202126514U
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Abstract
The utility model discloses an optical element and a piece of laser processing equipment; the optical element is provided with at least two focusing parts for focusing laser beams to focus points at different axial positions on a same axis of a optical axis; the optical element is a non-spherical reflecting mirror and acquires focus points at different positions by adopting the focusing parts with different curvature radiuses; the number of the focusing parts is two; and the reflecting surfaces of the focusing parts are tangent. The utility model further provides the piece of laser processing equipment; and the laser processing equipment comprises a laser and the optical element. Through the optical element provided by the utility model, laser energy can be distributed at the central position and the edge position of an optical field, so that energy in the optical field is distributed uniformly, during a welding process, splashing caused by stirring to a molten pool can be avoided, and meanwhile, the phenomena that plasma appears due to gasification of material can be reduced effectively, metal material is prevented from splashing or pitting, and the optical system of a laser is protected from being polluted by gasified metal material or damaged by splashing.
Description
Technical field
The utility model relates to optical element, is meant a kind of optical element and laser process equipment that is used for Laser Processing especially.
Background technology
The equipment that is used for Materialbearbeitung mit Laserlicht comprises fiber laser, semiconductor laser etc.Fiber laser since remarkable advantage such as good beam quality, efficient are high, the life-span is long, volume is little, operating cost is low obtained using widely in industry, medical science and military field.
When adopting fiber laser that material is carried out welding processing; Because the light beam of fiber laser output presents the uneven Gaussian distribution of light distribution as shown in Figure 1 through after focusing on, the concentration of energy of laser is at the peak value place; And the hot spot that focuses on is little, and energy density is too high.
Because energy too concentrates on peak value; Form in the welding process stirring in molten bath produced and splash; Make simultaneously the material gasification plasma occur easily; The instability that welding process occurs as producing splashing or pitfall occurring of metal material, and causes the pollution and the damage of splashing of the metal material that the optical system of laser instrument gasified in welding process.
Because the beam quality of the light beam fast and slow axis of semiconductor laser is widely different, cutting apart rearrangement back hot spot is rectangle.The light beam that adopts this semiconductor device output is through after focusing on, and when material was carried out welding processing, the light distribution of output was inhomogeneous, also can cause the instability of welding process.
The utility model content
In view of this, the utility model is to provide a kind of optical element and laser process equipment that is used for Laser Processing, and when adopting laser instrument to carry out materials processing to solve, the light intensity of output is inhomogeneous, causes welding process instable problem to occur.
For addressing the above problem; The utility model provides a kind of optical element that is used for Laser Processing; Said optical element is a non-spherical reflector; And have the focus portion that different curvature radius and optical axis coincide by at least two and constitute, said focus portion focuses on laser beam on the diverse location of optical axis respectively.
Preferably, the quantity of said focus portion is two, and the reflecting surface of said focus portion is tangent.
Preferably, the corresponding region area that obtains 40% energy of said laser beam of the area of the focus portion of inboard, the center of said optical element; The corresponding region area that obtains 60% energy of said laser beam of area of the focus portion in the outside, center of said optical element.
The embodiment of the utility model also provides a kind of laser process equipment, comprises laser instrument and the optical element that is used for Laser Processing; Said optical element is a non-spherical reflector, and has the focus portion that different curvature radius and optical axis coincide by at least two and constitute, and said focus portion focuses on laser beam on the diverse location of optical axis respectively.
Preferably, the quantity of said focus portion is two, and the reflecting surface of said focus portion is tangent;
The corresponding region area that obtains 40% energy of said laser beam of the area of the focus portion that the center of said optical element is inboard; The corresponding region area that obtains 60% energy of said laser beam of area of the focus portion in the outside, center of said optical element.
Preferably, said laser instrument is semiconductor laser or fiber laser.
Preferably, said laser beam incident also covers the zone of the zone of said optical element greater than the inboard focus portion in the center of said optical element, less than the zone of the focus portion outside the center of said optical element.
Through the optical element among the utility model embodiment; Can laser energy be distributed in the center and the marginal position of light field; In welding process, can not form the stirring in molten bath produced and splash, effectively reduce the material gasification simultaneously and plasma occurs; Avoid splashing or pitfall occurring of metal material, and the pollution and the damage of splashing of the metal material that in welding process, do not gasified of the optical system of protection laser instrument.
Description of drawings
The light beam that Fig. 1 shows the output of existing laser instrument passes through the light distribution synoptic diagram after focusing on;
Synoptic diagram after Fig. 2 shows and through optical element the light beam of fiber laser focused on;
Fig. 3 show among Fig. 2 that light spot energy distributes and the shaping homogenize after the light spot energy distribution schematic diagram;
Synoptic diagram after Fig. 4 shows and through optical element the light beam of semiconductor laser focused on;
Fig. 5 show among Fig. 4 that light spot energy distributes and the shaping homogenize after the light spot energy distribution schematic diagram;
Fig. 6 shows the structured flowchart of process equipment.
Embodiment
For clearly demonstrating the scheme in the utility model, provide preferred embodiment below and be described with reference to the accompanying drawings.
Have a plurality of different curvature radii on the optical element of the utility model; These different curvature radii can reflect the light that laser instrument sends the coaxial focus of a plurality of different focal; Many focuses can be effectively be dispersed in the energy of laser on each focus of same optical axis; Thereby between any two focuses, obtain the focus energy of appropriate materials processing.Be example below with the bifocus, specify the embodiment of the utility model.
Focus lamp referring to embodiment shown in Figure 2; Comprise: have first curvature radius first focus portion 11, have second focus portion 12 of second curvature radius; And first curvature radius is less than second curvature radius, and the focus after the focus portion of two different curvature radius focuses on is on same optical axis.Focus portion can adopt parabolical shape to realize, confirms the suitable curve that processes focus portion through the focal length of each focus portion.
The laser beam that fiber laser sends incides the first surperficial focus portion 11 of focus lamp, focuses on the first focal beam spot a1 that obtains the place, focal position; Incide second focus portion 12 on focus lamp surface, focus on the second focal beam spot b1 that obtains the place, focal position.Because the radius-of-curvature of first focus portion 11 is less than the radius-of-curvature of second focus portion 12, therefore at the first focal beam spot a1 at place, focal position separately above the second focal beam spot b1.Machined surface is between two focal beam spots.In material processing, the focal length between two focuses preferably differs 5 to 10mm, to obtain preferable materials processing effect.
The light beam that fiber laser sends obtains two focuses through the focus lamp among Fig. 2; The energy distribution of the light beam that fiber laser sends is on these two focuses; Synoptic diagram in that the light spot energy of these two along distributes can be referring to Fig. 3, and curve 21 focuses on afterwards the light distribution in along for laser beam through first focus portion 11; Curve 22 focuses on the light distribution of back in along for laser beam through second focus portion 12; Curve 23 is the light distribution of the position of machined surface between two focal beam spots on the optical axis.Light intensity energy distributions through shown in Fig. 3 can draw, and three peak energies of curve 23 have peak value of curve 21 and two peak values of curve 22, and the difference between two peak values of curve 21 and curve 22 is less.Peak value in the middle of the curve 23 is a laser focusing light field zone line energy, and its place, left and right sides peak value is the energy in light field edge, and the energy that edge distributes is a little less than the energy of intermediate distribution.Because the energy distribution of laser is at the center and the marginal position of light field, the also corresponding increase of spot diameter, energy density is by homogenising.The concentration of energy of having avoided laser shown in Figure 1 is at the peak value place, and the hot spot that focuses on is little, the phenomenon that energy density is too high.
Preferably, in an embodiment, focus lamp adopts the optical aspherical surface catoptron, and the reflecting surface of first focus portion 11 and second focus portion 12 is tangent.The laser beam region covered of incident preferably is not less than the zone of first focus portion 11, is not more than the zone of second focus portion 12.Avoiding in material processing, laser beam surpasses the zone of second focus portion 12, other parts of damage equipment.
After the light beam that adopts the focus lamp among Fig. 2 that fiber laser is sent focuses on; Process stabilization through process equipment carries out materials processing particularly in cutting or welding process, is distributed in the center and the marginal position of light field owing to laser energy; The power density of laser energy is more even; In welding process, can not form the stirring in molten bath produced and splash, effectively reduce the material gasification simultaneously and plasma occurs; Avoid splashing or pitfall occurring of metal material, and the pollution and the damage of splashing of the metal material that in welding process, do not gasified of the optical system of protection laser instrument.
The utility model also provides a kind of optical element, specifies through embodiment two below.Referring to Fig. 4; Comprise: have the 3rd radius-of-curvature the 3rd focus portion 31, have the 4th focus portion 32 of the 4th radius-of-curvature; And the 3rd radius-of-curvature is greater than the 4th radius-of-curvature, and the focus after the focus portion of two different curvature radius focuses on is on same optical axis.
The laser beam that semiconductor laser sends incides the 3rd surperficial focus portion 31 of focus lamp, focuses on the 3rd focusing hot spot a2 that obtains the place, focal position; Incide the 4th focus portion 32 on focus lamp surface, focus on the 4th focal beam spot b2 that obtains the place, focal position.Because the radius-of-curvature of the 3rd focus portion 31 is greater than the radius-of-curvature of the 4th focus portion 32, therefore focus on hot spot a2 below the 4th focal beam spot b2 at the 3rd of place, focal position separately.Machined surface is between two focal beam spots.
Obtain two focuses through the focus lamp among Fig. 4; The energy distribution of the light beam that semiconductor laser sends is on these two focuses; Synoptic diagram in that the light spot energy of these two along distributes can be referring to Fig. 5, and curve 41 is for focusing on the light distribution of back in along through the 3rd focus portion 31; Curve 42 is for focusing on the light distribution of back in along through the 4th focus portion 42; Curve 43 is the position laser focusing light distribution of machined surface between two focal beam spots on the optical axis.
Light intensity energy distributions through shown in Fig. 5 can draw, and curve 41 shows the laser focusing light distribution that the 3rd focus portion 31 forms, and in the central area of light field, forms a crest of energy; Curve 42 shows the laser focusing light distribution that the 4th focus portion 32 forms, and at the fringe region of light field, forms two crests of energy; The position of machined surface shown in Figure 4; Be on the optical axis position between two focuses; The energy distribution of hot spot is shown in curve 43 here, at the trough place energy of the center position of light field a little less than two the crest energy of its left and right sides at light field marginal position place.
Because the energy distribution of laser is at the center and the marginal position of light field, the also corresponding increase of spot diameter, and the energy at marginal position place is a little less than the energy of center position, and energy is by homogenising.The concentration of energy of having avoided laser shown in Figure 1 is at the peak value place, and the hot spot that focuses on is little, the phenomenon that energy density is too high.
Preferably, in an embodiment, focus lamp adopts the optical aspherical surface catoptron, and the reflecting surface of the 3rd focus portion 31 and the 4th focus portion 32 is tangent.The laser facula region covered of incident is preferably greater than the zone of the 3rd focus portion 31, less than the zone of the 4th focus portion 32.Avoiding in material processing, laser beam surpasses the zone of the 4th focus portion 32, other parts of damage equipment.
Adopt the focus lamp among Fig. 4, semiconductor laser is cut apart the rectangular light spot that obtains after the rearrangement and is carried out the shaping homogenize, after the light beam that noise spectra of semiconductor lasers is sent focuses on; Carry out the process stabilization of materials processing through process equipment; Particularly in cutting or welding process, because laser energy is distributed in the center and the marginal position of light field, in welding process; Can not form the stirring in molten bath and produce and splash; Reduce simultaneously effectively the material gasification and plasma occurs, avoid splashing or pitfall occurring of metal material, and the pollution and the damage of splashing of the metal material that in welding process, do not gasified of the optical system of protection laser instrument.
Preferably, when adopting two focus portion in the foregoing description, focus portion shared area ratio in focus lamp can influence the distribution that focuses on the back distribution of light intensity.Therefore, the corresponding region area that obtains 40% energy of said laser beam of area of the focus portion of inboard, preferred focus lamp center; The corresponding region area that obtains 60% energy of said laser beam of area of the focus portion in the outside, center of said focus lamp.Thereby make between two focuses after the focusing, the power density of laser energy is more even, with the central area of reduction hot spot and the energy density difference between the fringe region.
Focus lamp among the utility model embodiment; Can also have a plurality of focus portion; On same optical axis, form a plurality of focuses, thereby the laser beam of incident is focused on out a plurality of focuses, between the focus on the optical axis; Obtain the laser facula of light distribution homogenising, make the process of material stable.
Focus lamp among each embodiment of the utility model, all applicable all kinds of laser instruments are like fiber laser, semiconductor laser etc.Can be used for the various types of materials process equipment, like multi-shaft interlocked laser process equipment of numerical control etc.
Specify a kind of laser process equipment of using the optical element among the utility model embodiment through embodiment three below, referring to Fig. 6, comprising: bed piece, optical fiber or semiconductor laser, optical element; Said optical element has at least two focus portion on the diverse location that laser beam is focused on optical axis.This optical element specifies in the above embodiments, does not give unnecessary details one by one at this.
The machined surface of material to be processed is placed on the worktable of bed piece, and using a computer connects the control system of lathe, and control optical fiber or semiconductor laser send laser, and the position of machined surface is placed between the focus of focus lamp reflection.
For the optical element and the process equipment of being set forth among each embodiment of the utility model, all within the spirit and principle of the utility model, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection domain of the utility model.
Claims (7)
1. an optical element is characterized in that, said optical element is a non-spherical reflector, and has the focus portion that different curvature radius and optical axis coincide by at least two and constitute, and laser beam is positioned on the diverse location of optical axis by the focus that said focus portion focuses on.
2. optical element according to claim 1 is characterized in that, the quantity of said focus portion is two, and the reflecting surface of said focus portion is tangent.
3. optical element according to claim 1 and 2 is characterized in that, the corresponding region area that obtains 40% energy of said laser beam of the area of the focus portion that the center of said optical element is inboard; The corresponding region area that obtains 60% energy of said laser beam of area of the focus portion in the outside, center of said optical element.
4. a laser process equipment comprises laser instrument and optical element, it is characterized in that,
Said optical element is a non-spherical reflector, and has the focus portion that different curvature radius and optical axis coincide by at least two and constitute, and laser beam is positioned on the diverse location of optical axis by the focus that said focus portion focuses on.
5. equipment according to claim 4 is characterized in that, the quantity of said focus portion is two, and the reflecting surface of said focus portion is tangent;
The corresponding region area that obtains 40% energy of said laser beam of the area of the focus portion that the center of said optical element is inboard; The corresponding region area that obtains 60% energy of said laser beam of area of the focus portion in the outside, center of said optical element.
6. according to claim 4 or 5 described equipment; It is characterized in that; Said laser beam incident also covers the zone of the zone of said optical element greater than the inboard focus portion in the center of said optical element, less than the zone of the focus portion outside the center of said optical element.
7. equipment according to claim 6 is characterized in that, said laser instrument is semiconductor laser or fiber laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120206288 CN202126514U (en) | 2011-06-17 | 2011-06-17 | Optical element used for laser processing and laser processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120206288 CN202126514U (en) | 2011-06-17 | 2011-06-17 | Optical element used for laser processing and laser processing equipment |
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| Publication Number | Publication Date |
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| CN202126514U true CN202126514U (en) | 2012-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201120206288 Expired - Lifetime CN202126514U (en) | 2011-06-17 | 2011-06-17 | Optical element used for laser processing and laser processing equipment |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102230983A (en) * | 2011-06-17 | 2011-11-02 | 山西飞虹激光科技有限公司 | Optical element for laser processing and laser processing equipment |
| CN105983780A (en) * | 2015-03-06 | 2016-10-05 | 中国兵器装备研究院 | Method for heating metal material in additive manufacturing |
| GB2566615A (en) * | 2017-09-14 | 2019-03-20 | Futaba Ind Co Ltd | Laser welding apparatus and manufacturing method of component |
| CN110293326A (en) * | 2019-07-30 | 2019-10-01 | 长沙理工大学 | A kind of method of double light beam laser cutting slab |
| JP2020127056A (en) * | 2020-05-27 | 2020-08-20 | 日亜化学工業株式会社 | Light-emitting device |
| CN113001015A (en) * | 2021-03-25 | 2021-06-22 | 连云港倍特超微粉有限公司 | Thick metal plate laser welding head based on double-focus reflector and welding method |
-
2011
- 2011-06-17 CN CN 201120206288 patent/CN202126514U/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102230983A (en) * | 2011-06-17 | 2011-11-02 | 山西飞虹激光科技有限公司 | Optical element for laser processing and laser processing equipment |
| CN105983780A (en) * | 2015-03-06 | 2016-10-05 | 中国兵器装备研究院 | Method for heating metal material in additive manufacturing |
| GB2566615A (en) * | 2017-09-14 | 2019-03-20 | Futaba Ind Co Ltd | Laser welding apparatus and manufacturing method of component |
| US11235420B2 (en) | 2017-09-14 | 2022-02-01 | Futaba Industrial Co., Ltd. | Laser welding apparatus and manufacturing method of component |
| GB2566615B (en) * | 2017-09-14 | 2022-03-30 | Futaba Ind Co Ltd | Laser Welding Apparatus and Manufacturing Method of Component |
| CN110293326A (en) * | 2019-07-30 | 2019-10-01 | 长沙理工大学 | A kind of method of double light beam laser cutting slab |
| CN110293326B (en) * | 2019-07-30 | 2021-04-13 | 长沙理工大学 | Method for cutting thick plate by double-beam laser |
| JP2020127056A (en) * | 2020-05-27 | 2020-08-20 | 日亜化学工業株式会社 | Light-emitting device |
| JP7041372B2 (en) | 2020-05-27 | 2022-03-24 | 日亜化学工業株式会社 | Light emitting device |
| CN113001015A (en) * | 2021-03-25 | 2021-06-22 | 连云港倍特超微粉有限公司 | Thick metal plate laser welding head based on double-focus reflector and welding method |
| CN113001015B (en) * | 2021-03-25 | 2024-05-28 | 连云港倍特超微粉有限公司 | Thick metal plate laser welding head based on double-focus reflector and welding method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120125 |
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| CX01 | Expiry of patent term |