CN102718398A - Device and method for carrying out special-shaped cutting on glass by utilizing ultrashort-pulse double-light-path laser - Google Patents
Device and method for carrying out special-shaped cutting on glass by utilizing ultrashort-pulse double-light-path laser Download PDFInfo
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- CN102718398A CN102718398A CN2012101858595A CN201210185859A CN102718398A CN 102718398 A CN102718398 A CN 102718398A CN 2012101858595 A CN2012101858595 A CN 2012101858595A CN 201210185859 A CN201210185859 A CN 201210185859A CN 102718398 A CN102718398 A CN 102718398A
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Abstract
The invention relates to a device for carrying out special-shaped cutting on glass by utilizing an ultrashort-pulse double-light-path laser. The device comprises a laser (1), wherein laser lights emitted by the laser (1) are incident to surface of a semi-transmission and semi-reflection mirror (4) after passing through an optical shutter (2) and a beam expander (3), the laser lights reflected by the semi-transmission and semi-reflection mirror (4) are vertically incident to a platform (9) by virtue of an optical scanning system, the laser lights transmitted by the semi-transmission and semi-reflection mirror (4) are reflected by a total-reflection mirror (5) and then are vertically incident to the platform (9) by virtue of the optical scanning system, the optical scanning system comprises a galvanometer system (6) and a focus lens (7), and the laser lights which enter into the optical scanning system pass through the galvanometer system (6) and then are focused and emergent by virtue of the focus lens (7). The device for carrying out the special-shaped cutting on the glass by utilizing the ultrashort-pulse double-light-path laser disclosed by the invention has high processing efficiency and good processing effect.
Description
Technical field
The present invention relates to device and cutting method that a kind of ultra-short pulse laser that utilizes the double light path form cuts glass; Especially relate to device and the cutting method that to carry out the abnormity cutting to Gorilla (gorilla glass), Sodalime (soda-lime glass) and Dragontrail glass (imperial mark glass) to a kind of, belong to cover-plate glass, touch-screen with glass micro-processing technology field.
Background technology
Gorilla (gorilla glass), Sodalime (soda-lime glass) and Dragontrail (imperial mark glass) toughened glass is because its passing through property of height and HS are widely used in the image display device.The traditional glass cutting mainly is the break bar cutting, frotton grinds and the carbon dioxide laser cutting.Break bar cutting can only be carried out straight cuts and the bigger curvilinear cut of radius of profile to toughened glass not, and cutting also need be carried out sliver afterwards just can obtain complete profile.And for the Gorilla behind the tempering (gorilla glass), Sodalime (soda-lime glass) and Dragontrail (imperial mark glass) glass, break bar then is difficult to cutting.For the cutting in glass enclose inside zone, can only change the size that different frottons is ground to requirement more earlier with a bit drills aperture, the frotton loss is very big, and efficient is very low.The carbon dioxide laser cutting also can only be cut simple glass and the lower glass of toughening degree, also needs the sliver operation after the cutting, also can't process for the enclose inside zone.For Gorilla (gorilla glass), Sodalime (soda-lime glass) and Dragontrail (imperial mark glass) toughened glass; Present various working methods all can not effectively be carried out stable abnormity cutting; Still need handle carrying out tempering again after the glass cutting of tempering is not ground, efficient is extremely low.
The definition of laser cutting technique is thermal source with the laser beam, the material sepd technology that adopts the heat abstraction method to carry out, thereby the material processing method of formation street.Laser beam is focused at material surface, makes the material surface temperature sharply raise and reaches the evaporation vaporized state of material, thereby realize the removal of material.Here comprised material to the absorption of beam energy and the heat transfer process in the material.In this process, material is heated the sharply process of gasification takes place, and depends primarily on laser and material effects time and laser beam peak power;
Show the sustainable growth of industry along with electronics such as mobile phone, panel computers; Gorilla (gorilla glass), Sodalime (soda-lime glass) and Dragontrail (imperial mark glass) glass is as high-end applications; Therefore the tradition processing mode can't satisfy the demands; Need a kind of breakthrough traditional G orilla (gorilla glass), Sodalime (soda-lime glass) and Dragontrail (imperial mark glass) glass abnormity processing method and device especially; And laser is as processing means advanced in the modern industry; Receive the attention of industry-by-industry all the more; Through coming laser to realize that the feasibility of glass cutting and practicality also obtain increasing checking, the equipment and the process method that still also do not have a kind of ability high-level efficiency, high quality and high precision to carry out the cutting of Gorilla (gorilla glass), Sodalime (soda-lime glass) and Dragontrail (imperial mark glass) toughened glass abnormity at present.
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, the device and method of a kind of ultrashort pulse double light path laser abnormity glass-cutting that a kind of working (machining) efficiency is high, processing effect is good is provided.
The objective of the invention is to realize like this: a kind of device of ultrashort pulse double light path laser abnormity glass-cutting; Said device includes laser apparatus; Said laser apparatus emitted laser incides the surface of semi-transparent semi-reflecting lens behind optical gate and beam expanding lens; Through semi-transparent semi-reflecting lens laser light reflected vertical directive platform after optical scanning system, through the vertical directive platform after optical scanning system again after the completely reflecting mirror reflection of the laser after the semi-transparent semi-reflecting lens transmission.
The device of a kind of ultrashort pulse double light path laser abnormity of the present invention glass-cutting, said optical scanning system includes galvanometer system and condensing lens, gets into laser line focus mirror focusing outgoing again behind galvanometer system of optical scanning system.
The device of a kind of ultrashort pulse double light path laser abnormity of the present invention glass-cutting, the light path of said semi-transparent semi-reflecting lens and incident laser is 45 °, and said completely reflecting mirror is 45 ° with the light path that incides its surperficial laser.
The device of a kind of ultrashort pulse double light path laser abnormity of the present invention glass-cutting, said platform top is provided with the CCD imaging system, and the left and right sides of said platform top is provided with blowing device, and the below of said platform is provided with particle collector.
The method of a kind of ultrashort pulse double light path laser abnormity of the present invention glass-cutting, said method includes following steps:
Step 1: start a kind of device of ultrashort pulse double light path laser abnormity glass-cutting, the glass to be cut on the two-way laser while directive platform; And through optical scanning system two-way laser is focused on the lower surface of glass respectively;
Step 2: laser is walked by required figure at the lower surface of glass; Make focal point place, focal point adjacent domain or while gasify at the glass of focal point place and focal point adjacent domain, melt or generating gasification and thawing simultaneously; Thereby on the lower surface of glass, form initial heat abstraction district; And thereby the predefined paths continuous distribution forms initial heat abstraction line in said lower glass surface upper edge to make initial heat abstraction district, and many initial heat abstraction lines laterally superpose and form initial heat abstraction road;
Near step 3: the optically focused initial heat abstraction road of laser new formation in step 2; Make focal point place, focal point adjacent domain or while gasify at the glass of focal point place and focal point adjacent domain, melt or generating gasification and thawing simultaneously; Thereby form subsequent thermal and remove the district; Thereby and make subsequent thermal remove the district to form subsequent thermal along the predefined paths continuous distribution and remove line, many subsequent thermal are removed lines and are laterally superposeed and form subsequent thermal and remove the road;
Step 4: every layer glass moves the laser spot that focuses on after removing and accomplishing gradually from lower to upper, and repeating step two and step 3 are removed the middle part of glass to glass until successively subsequently;
Step 5: the laser spot that focuses on is moved to the upper surface of glass, carry out step 2 and step 3;
Step 6:, repeat step 2 and step 3 and successively remove glass until the glass middle part subsequently with the laser spot that focuses on motion from top to bottom gradually;
Step 7: the glass at glass middle part is removed, and cutting of glass of realization worn.
When carrying out step 2 and step 3, the blowing device (8) that is positioned at platform top cools off to prevent that the remaining thin layer in surface on glass is owing to heat accumulation breaks the upper surface of glass; Glass residue in the course of processing falls under gravity into the particle collector that is arranged in the platform below simultaneously.
Compared with prior art, the invention has the beneficial effects as follows:
(1) work range does not receive the restriction of Material Physics, mechanical property, can process any hard, soft, crisp, heat-resisting or refractory metal and non-metallic material;
(2) be easy to processed complex profile, fine surface;
(3) be prone to obtain good cutting section quality, the cutting debris contamination, thermal stresses, unrelieved stress, peening, heat affected zone etc. are all smaller;
The abnormity that (4) can carry out toughened glass in the closed region cuts, and each hemisect can keep the stress equilibrium on toughened glass two sides up and down, prevents unbalance the breaking of causing of toughened glass two sides stress in the course of processing, and high stability is arranged.
(5) dynamic surface sweeping condensing lens of 3D and double beam system can significantly promote working (machining) efficiency;
(6) various working methods are prone to be compounded to form new process, and are easy to utilize;
(7) use the laser of the wavelength that glass can see through, focus on lower surface and begin processing, can form the cutting section of vertical smooth; The cutting back is removed part and is dropped automatically, need not carry out the moulding of secondary sliver.
This shows and use the device of a kind of ultrashort pulse double light path laser abnormity of the present invention glass-cutting not only to increase substantially the working (machining) efficiency of glass cutting, and the effect of cutting is provided greatly.
Description of drawings
Fig. 1 is the structural representation of the device of a kind of ultrashort pulse double light path laser abnormity of the present invention glass-cutting.
Wherein:
Laser apparatus 1, optical gate 2, beam expanding lens 3, semi-transparent semi-reflecting lens 4, completely reflecting mirror 5, galvanometer system 6, condensing lens 7, blowing device 8, platform 9, particle collector 10, CCD imaging system 11.
Embodiment
Referring to Fig. 1; The device of a kind of ultrashort pulse double light path laser abnormity glass-cutting that the present invention relates to; Said device includes laser apparatus 1; Said laser apparatus 1 emitted laser incides the surface (semi-transparent semi-reflecting lens 4 is 45 ° with the light path of incident laser) of semi-transparent semi-reflecting lens 4 behind optical gate 2 and beam expanding lens 3; Through semi-transparent semi-reflecting lens 4 laser light reflected vertical directive platform 9 after optical scanning system; Through the vertical directive platform 9 (completely reflecting mirror 5 is 45 ° with the light path that incides its surperficial laser) after optical scanning system again after completely reflecting mirror 5 reflection of the laser after semi-transparent semi-reflecting lens 4 transmissions, said optical scanning system includes galvanometer system 6 and condensing lens 7, the laser that gets into optical scanning system behind galvanometer system 6 dynamic scans again line focus mirror 7 focus on outgoing; Said platform 9 tops are provided with CCD imaging system 11, and the left and right sides of said platform 9 tops is provided with blowing device 8, and the below of said platform 9 is provided with particle collector 10.
The method of a kind of ultrashort pulse double light path laser abnormity glass-cutting that the present invention relates to includes following steps:
Step 1: start the device of a kind of ultrashort pulse double light path laser abnormity glass-cutting as claimed in claim 1, the glass to be cut on the two-way laser while directive platform 9; And through optical scanning system two-way laser is focused on the lower surface of glass respectively;
Step 2: laser is walked by required figure at the lower surface of glass; Make focal point place, focal point adjacent domain or while gasify at the glass of focal point place and focal point adjacent domain, melt or generating gasification and thawing simultaneously; Thereby on the lower surface of glass, form initial heat abstraction district; And thereby the predefined paths continuous distribution forms initial heat abstraction line in said lower glass surface upper edge to make initial heat abstraction district, and many initial heat abstraction lines laterally superpose and form initial heat abstraction road;
Near step 3: the optically focused initial heat abstraction road of laser new formation in step 2; Make focal point place, focal point adjacent domain or while gasify at the glass of focal point place and focal point adjacent domain, melt or generating gasification and thawing simultaneously; Thereby form subsequent thermal and remove the district; Thereby and make subsequent thermal remove the district to form subsequent thermal along the predefined paths continuous distribution and remove line, many subsequent thermal are removed lines and are laterally superposeed and form subsequent thermal and remove the road; The purpose that subsequent thermal is removed the road is to increase cutting width, and the residue after the cutting can in time be discharged, can be attached to the follow-up processing of influence on the glass inwall, thus guarantee the stability of technology, and cutting need not to carry out sliver after accomplishing again;
Step 4: (thickness of at every turn removing glass was guaranteed by processing parameter after every layer glass was removed and accomplished; One deck glass will be removed fully after it is generally acknowledged completing steps two and step 3); The laser spot that focuses on is moved gradually from lower to upper; Repeating step two and step 3 are removed the middle part of glass to glass until successively subsequently;
Step 5: the laser spot that focuses on is moved to the upper surface of glass, carry out step 2 and step 3;
Step 6:, repeat step 2 and step 3 and successively remove glass until the glass middle part subsequently with the laser spot that focuses on motion from top to bottom gradually;
Step 7: the glass at glass middle part is removed, and cutting of glass of realization worn.
(in the above-mentioned steps, on refer to the upper surface of glass; The lower surface that refers to glass down);
Simultaneously, when carrying out step 2 and step 3, the upper surface that is positioned at 8 pairs of glass of blowing device of platform 9 tops cools off to prevent that the remaining thin layer in surface on glass is owing to heat accumulation breaks; Glass residue in the course of processing falls under gravity into the particle collector 10 that is arranged in platform 9 belows simultaneously.
Claims (6)
1. the device of ultrashort pulse double light path laser abnormity glass-cutting; It is characterized in that: said device includes laser apparatus (1); Said laser apparatus (1) emitted laser incides the surface of semi-transparent semi-reflecting lens (4) behind optical gate (2) and beam expanding lens (3); Through semi-transparent semi-reflecting lens (4) laser light reflected vertical directive platform (9) after optical scanning system, through the vertical directive platform (9) after optical scanning system again after completely reflecting mirror (5) reflection of the laser after semi-transparent semi-reflecting lens (4) transmission.
2. a kind of according to claim 1 device of ultrashort pulse double light path laser abnormity glass-cutting; It is characterized in that: said optical scanning system includes galvanometer system (6) and condensing lens (7), gets into laser line focus mirror (7) focusing outgoing again behind galvanometer system (6) of optical scanning system.
3. a kind of according to claim 1 or claim 2 device of ultrashort pulse double light path laser abnormity glass-cutting; It is characterized in that: said semi-transparent semi-reflecting lens (4) is 45 ° with the light path of incident laser, and said completely reflecting mirror (5) is 45 ° with the light path that incides its surperficial laser.
4. a kind of according to claim 1 or claim 2 device of ultrashort pulse double light path laser abnormity glass-cutting; It is characterized in that: said platform (9) top is provided with CCD imaging system (11); The left and right sides of said platform (9) top is provided with blowing device (8), and the below of said platform (9) is provided with particle collector (10).
5. the method for ultrashort pulse double light path laser abnormity glass-cutting, it is characterized in that: said method includes following steps:
Step 1: start the device of a kind of ultrashort pulse double light path laser abnormity glass-cutting as claimed in claim 1, the glass to be cut on the two-way laser while directive platform (9); And through optical scanning system two-way laser is focused on the lower surface of glass respectively;
Step 2: laser is walked by required figure at the lower surface of glass; Make focal point place, focal point adjacent domain or while gasify at the glass of focal point place and focal point adjacent domain, melt or generating gasification and thawing simultaneously; Thereby on the lower surface of glass, form initial heat abstraction district; And thereby the predefined paths continuous distribution forms initial heat abstraction line in said lower glass surface upper edge to make initial heat abstraction district, and many initial heat abstraction lines laterally superpose and form initial heat abstraction road;
Near step 3: the optically focused initial heat abstraction road of laser new formation in step 2; Make focal point place, focal point adjacent domain or while gasify at the glass of focal point place and focal point adjacent domain, melt or generating gasification and thawing simultaneously; Thereby form subsequent thermal and remove the district; Thereby and make subsequent thermal remove the district to form subsequent thermal along the predefined paths continuous distribution and remove line, many subsequent thermal are removed lines and are laterally superposeed and form subsequent thermal and remove the road;
Step 4: every layer glass moves the laser spot that focuses on after removing and accomplishing gradually from lower to upper, and repeating step two and step 3 are removed the middle part of glass to glass until successively subsequently;
Step 5: the laser spot that focuses on is moved to the upper surface of glass, carry out step 2 and step 3;
Step 6:, repeat step 2 and step 3 and successively remove glass until the glass middle part subsequently with the laser spot that focuses on motion from top to bottom gradually;
Step 7: the glass at glass middle part is removed, and cutting of glass of realization worn.
6. like the method for the said a kind of ultrashort pulse double light path laser abnormity of claim 5 glass-cutting; It is characterized in that: when carrying out step 2 and step 3, the blowing device (8) that is positioned at platform (9) top cools off to prevent that the remaining thin layer in surface on glass is owing to heat accumulation breaks the upper surface of glass; Glass residue in the course of processing falls under gravity into the particle collector (10) that is arranged in platform (9) below simultaneously.
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| CN201210185859.5A CN102718398B (en) | 2012-06-07 | 2012-06-07 | Method for carrying out special-shaped cutting on glass by utilizing ultrashort-pulse double-light-path laser |
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| CN201210185859.5A CN102718398B (en) | 2012-06-07 | 2012-06-07 | Method for carrying out special-shaped cutting on glass by utilizing ultrashort-pulse double-light-path laser |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103056530A (en) * | 2012-12-28 | 2013-04-24 | 苏州德龙激光股份有限公司 | Device and method for processing one glass solution (OGS) touch screens |
| CN104741799A (en) * | 2015-04-21 | 2015-07-01 | 大族激光科技产业集团股份有限公司 | Laser hole drilling method of hard and brittle material |
| CN104759763A (en) * | 2015-04-08 | 2015-07-08 | 天津滨海雷克斯激光科技发展有限公司 | Method for cutting cigarette and filter through laser |
| CN108698774A (en) * | 2016-02-25 | 2018-10-23 | 康宁股份有限公司 | The method and apparatus that edge surface inspection is carried out to movable glass coiled material |
| CN108817697A (en) * | 2018-07-23 | 2018-11-16 | 重庆两江联创电子有限公司 | Special-shaped glass laser cutting method |
| CN109396659A (en) * | 2018-09-19 | 2019-03-01 | 力成科技（苏州）有限公司 | Micro SD card abnormity frame cutting technique |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103056530A (en) * | 2012-12-28 | 2013-04-24 | 苏州德龙激光股份有限公司 | Device and method for processing one glass solution (OGS) touch screens |
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| CN109396659A (en) * | 2018-09-19 | 2019-03-01 | 力成科技（苏州）有限公司 | Micro SD card abnormity frame cutting technique |
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