TW201634164A - Laser processing system and laser processing method - Google Patents

Abstract

This invention discloses a laser processing system, including a laser, a beam splitter, a first reflecting mirror element, a second reflecting mirror element, a first focusing lens, a second focusing lens, a first displacement adjusting mechanism, a second displacement adjusting mechanism, and a processing platform. The laser emits a single laser beam to the beam splitter, which outputs a first laser beam and a second laser beam. The first laser beam and the second laser beam respectively travel to the first focusing lens and the second focusing lens through the first reflecting mirror element and the second reflecting mirror element. The first displacement adjusting mechanism and the second displacement adjusting mechanism respectively control the movements of the first focusing lens and the second focusing lens so as to adjust a distance between two points on the processing platform, on which the first laser beam and the second laser beam focus in parallel. This invention also discloses a laser processing method. This invention improves the processing efficiency through light splitting, and meanwhile enhances the precision of the product through the displacement adjusting mechanism.

Description

Laser processing system and laser processing method

The invention belongs to the technical field of laser processing, and in particular relates to a laser processing system and a laser processing method.

With the rapid development of laser technology, laser processing technology is also constantly improving. Due to the high efficiency, high quality and high precision of laser processing technology, laser processing technology has gradually replaced the traditional in many processing fields. Machining technology. At present, the cutting technology of wafers in the semiconductor industry has also been converted from mechanical grinding wheel cutting technology to non-consumable, high-precision laser cutting technology.

However, when the wafer is cut by the existing laser cutting technology, a single beam of laser source is used for focusing. Therefore, there are the following problems: First, the product to be processed may need to be processed multiple times, so that the processing efficiency is not high; Second, since there is only a single beam of laser beam, the product to be processed requires multiple cutting operations, so that the size of the processed product is not accurate.

In summary, how to improve the processing efficiency and improve the accuracy of the processed product size is a technical problem that needs to be solved urgently.

The main object of the present invention is to provide a laser processing system and a laser processing method, which solves the technical problem that the existing laser cutting technology cannot improve the processing efficiency and the accuracy of the processed product.

To achieve the above object, the present invention provides a laser processing system including a laser, a beam splitter, a first mirror element, a second mirror element, a first focusing mirror, a second focusing mirror, a first displacement adjusting mechanism, a second displacement adjusting mechanism and a processing platform, the beam splitter being disposed adjacent to an output end of the laser, wherein the first focusing mirror and the second focusing mirror are both for a processing platform The first focusing mirror and the second focusing mirror are respectively disposed on the first displacement adjusting mechanism and the second displacement adjusting mechanism; a single beam of the laser beam emitted by the laser is incident on the beam splitting In the mirror, the beam splitter outputs a first laser beam and a second laser beam, the first laser beam being incident into the first focusing mirror via the first mirror element, the second laser beam passing through The two mirror elements are incident into the second focusing mirror, and the first displacement adjusting mechanism and the second displacement adjusting mechanism respectively control movement of the first focusing mirror and the second focusing mirror for adjusting the Said first laser beam, Said second parallel laser beam is focused on the distance between two points on the processing platform.

Preferably, the laser processing system further includes a beam expander mirror and a full mirror, the beam expander is disposed between the laser and the beam splitter, and the full mirror is disposed at the expander Between the beam mirror and the beam splitter, a single beam of laser light emitted by the laser is incident on the beam expander, A single beam of the laser beam of the beam expander is incident on the beam splitter through the full mirror.

Preferably, the laser processing system further includes an attenuator, the first mirror element includes a first pre-mirror group and a first rear mirror group, and the second mirror element includes a second front a mirror group and a second post-beam group, the spectroscope outputting a first laser beam and a second laser beam, the first laser beam being incident on the attenuation through the first pre-mirror group The first laser beam transmitted through the attenuator is incident on the first rear mirror group, and the first laser beam transmitted through the first rear mirror group is incident on the a first focusing mirror; the second laser beam is incident into the attenuator via the second pre-mirror group, and the second laser beam transmitted through the attenuator is incident on the second rear a mirror group, the second laser beam transmitted through the second rear mirror group being incident into the second focusing mirror.

Preferably, the laser processing system further includes a platform driving mechanism, the product to be processed is disposed on the processing platform, and the platform driving mechanism is configured to control movement of the processing platform for adjustment according to The spacing of the processed product is cut to form a processing trajectory that is the distance between the first laser beam and the second laser beam that are simultaneously focused on the processing platform.

Preferably, the distance between the two points on the processing platform in which the first laser beam and the second laser beam are simultaneously focused is 1 um~1 cm, and the radial width of the processing trajectory is 1 um~ 30um.

Preferably, the beam splitter is a DOE diffraction beam splitter, and the DOE diffraction beam splitter splits a single beam of laser light emitted by the laser into a The first laser beam and the second laser beam, the angle between the first laser beam and the second laser beam is 1 ° ~ 80 °; the first displacement adjustment mechanism and the The two displacement adjusting mechanism is a piezoelectric ceramic displacement driving mechanism, a linear motor driving mechanism or a servo motor driving mechanism; the laser device is a solid laser, a gas laser or a quasi-molecular laser, and the laser emits a laser having a wavelength of 10640 nm, 1064 nm, 532 nm, 355 nm or 266 nm; the first mirror element comprising at least two first angle mirrors, the second mirror element comprising at least two second angle mirrors, The reflectance of the first angle mirror and the second angle mirror to the laser wavelength emitted by the laser is 0-100%, and the reflection angle is 0-180.

In addition, in order to achieve the above object, the present invention also provides a laser processing method, the laser processing method comprising the following steps: a beam splitter splits a single beam of laser light emitted by a laser into a first laser beam and a second laser beam; the first laser beam is introduced into the first focusing mirror via the first mirror element, and the second laser beam is introduced into the second focusing mirror via the second mirror element, the a laser beam and the second laser beam are respectively focused on the processing platform through the first focusing mirror and the second focusing mirror; the first displacement adjusting mechanism and the second displacement adjusting mechanism respectively Controlling movement of the first focusing mirror and the second focusing mirror such that the first laser beam and the second laser beam transmitted through the first focusing mirror and the second focusing mirror are adjusted in parallel Focusing on the distance between two points on the processing platform.

Preferably, the step of splitting the single beam of laser light emitted by the laser into the first laser beam and the second laser beam comprises: a single beam of the laser beam emitted by the laser Injecting into the beam expander, a single beam of laser beam transmitted through the beam expander is incident on the beam splitter through the full mirror; the beam splitter splits the single beam of laser light into a first laser beam and a second beam Shoot the beam.

Preferably, the first laser beam is introduced into the first focusing mirror via the first mirror element, and the second laser beam is introduced into the second focusing mirror via the second mirror element. The first laser beam is incident into the attenuator via the first pre-mirror group, the second laser beam is incident into the attenuator via the second pre-mirror group; a laser beam is incident on the first rear mirror group, the second laser beam passing through the attenuator is incident on the second rear mirror group; and the first rear mirror group is transmitted through The first laser beam is incident into the first focusing mirror, and the second laser beam transmitted through the second rear mirror group is incident into the second focusing mirror.

Preferably, the first displacement adjustment mechanism and the second displacement adjustment mechanism respectively control movement of the first focusing mirror and the second focusing mirror so as to adjust the transmission through the first focusing mirror, the first The step of focusing the first laser beam and the second laser beam of the two focusing mirrors in parallel on the distance between two points on the processing platform includes: The platform driving mechanism controls the movement of the processing platform such that the processed product is cut according to the adjusted spacing to form a processing trajectory, wherein the spacing is the first focusing mirror and the first focusing mirror The beam of light, the second laser beam, is focused in parallel on a distance between two points on the processing platform.

The single beam laser beam emitted by the laser device is spectrally processed outside the cavity by the beam splitter to become the first laser beam and the second laser beam, and the first laser beam and the second laser beam are used. The first focusing mirror and the second focusing mirror are respectively focused on the processing platform in parallel, and the first laser beam and the second laser beam are used to process the processed product at the same time, thereby improving the processing efficiency.

At the same time, the first laser beam and the second laser beam of the present invention are simultaneously focused on the processing platform, and the first focusing mirror and the second focusing mirror are respectively controlled by the first displacement adjusting mechanism and the second displacement adjusting mechanism to adjust and adjust. The first laser beam and the second laser beam are simultaneously focused on a distance between two points on the processing platform. On the one hand, the first laser beam can be adjusted at any time according to production or user needs. The second laser beam is focused in parallel on the distance between two points on the processing platform. On the other hand, the product to be processed is cut according to the adjusted pitch, and the processed one is improved compared to the existing single beam laser beam cutting method. The accuracy of the size of the product.

1‧‧‧Laser

2‧‧‧beam splitter

3‧‧‧First focusing mirror

4‧‧‧First displacement adjustment mechanism

5‧‧‧Second focusing mirror

6‧‧‧Second displacement adjustment mechanism

7‧‧‧Working platform

8‧‧‧beam expander

9‧‧‧Full mirror

10‧‧‧First front mirror group

11‧‧‧First rear mirror set

12‧‧‧Second pre-mirror group

13‧‧‧Second rear mirror set

14‧‧‧Attenuator

1 is a schematic diagram of the principle of splitting light of Embodiment 1 of the laser processing system of the present invention; 2 is a schematic diagram of a light splitting principle of a laser processing system according to a second embodiment of the present invention; FIG. 3 is a schematic diagram of a light splitting principle of a laser processing system according to a third embodiment of the present invention; FIG. 5 is a schematic flow chart of Embodiment 5 of the laser processing method of the present invention; FIG. 6 is a schematic flow chart of Embodiment 6 of the laser processing method of the present invention.

The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Example 1

Referring to FIG. 1, FIG. 1 is a schematic diagram of a splitting principle of Embodiment 1 of a laser processing system according to the present invention.

In Embodiment 1, the present invention provides a laser processing system including a laser 1, a beam splitter 2, a first mirror element, a second mirror element, a first focusing mirror 3, and a second focusing mirror 5. a first displacement adjusting mechanism 4, a second displacement adjusting mechanism 6 and a processing platform 7, the beam splitter 2 being disposed adjacent to an output end of the laser 1, the first focusing mirror 3 and the second focusing mirror 5 is for the processing platform 7, the first focusing mirror 3, the second focusing mirror 5 are respectively disposed in the first displacement adjusting mechanism 4, the a second displacement adjustment mechanism 6; a single beam of laser light emitted by the laser 1 is incident into the beam splitter 2, and the beam splitter 2 outputs a first laser beam and a second laser beam. The first laser beam is incident into the first focusing mirror 3 via the first mirror element, and the second laser beam is incident into the second focusing mirror 5 via the second mirror element, the first displacement adjusting mechanism 4. The second displacement adjusting mechanism 6 controls the movement of the first focusing mirror 3 and the second focusing mirror 5, respectively, for adjusting the first laser beam and the second laser beam in parallel. Focusing on the distance between two points on the processing platform 7.

The first focusing mirror 3 is disposed on the first displacement adjusting mechanism 4, the first displacement adjusting mechanism 4 is configured to control the movement of the first focusing mirror 3; the second focusing mirror 5 is disposed in the first On the second displacement adjusting mechanism 6, the second displacement adjusting mechanism 6 is for controlling the movement of the second focusing mirror 5.

It should be noted that the present invention can divide the single beam of laser light generated by the laser 1 into a plurality of laser beams according to the needs of the production or the user, for example, three laser beams are simultaneously focused on the processing platform. Therefore, the two products are processed in one time, so that the processing efficiency is higher. Therefore, the technical problem of the present invention can be solved by using the spectroscopic principle of the present invention to divide the single beam of the laser beam into a plurality of laser beams by the spectroscope 2, thereby achieving a more technical effect. The technical solutions are all within the scope of protection of the present invention.

The single beam laser beam emitted by the laser device 1 is split and processed outside the cavity by the beam splitter 2 to become the first laser beam and The second laser beam, the first laser beam and the second laser beam are respectively focused on the processing platform through the first focusing mirror 3 and the second focusing mirror 5, respectively, using the first laser beam and the second laser beam simultaneously The processed product is processed, thus improving the processing efficiency.

At the same time, the first laser beam and the second laser beam of the present invention are simultaneously focused on the processing platform 7, and the first focusing mirror 3 and the second focusing mirror are controlled by the first displacement adjusting mechanism 4 and the second displacement adjusting mechanism 6, respectively. 5, adjusting and adjusting the distance between the first laser beam and the second laser beam to be focused on the processing platform 7 in parallel, on the one hand, can be adjusted at any time according to production or user needs The first laser beam and the second laser beam are simultaneously focused on the distance between two points on the processing platform 7, and on the other hand, the product to be processed is cut according to the adjusted pitch, compared to the existing single beam laser beam cutting The method improves the accuracy of the size of the processed product and the like.

Example 2

Referring to FIG. 2, FIG. 2 is a schematic diagram of the principle of splitting light of Embodiment 2 of the laser processing system of the present invention.

In Embodiment 2, the structure is substantially the same as that of Embodiment 1 described above, except that the laser processing system further includes a beam expander 8 and a full mirror 9, and the beam expander 8 is disposed in the mine Between the emitter 1 and the beam splitter 2, the full mirror 9 is disposed between the beam expander 8 and the beam splitter 2, and a single beam of laser light emitted by the laser 1 is incident. To the beam expander 8, a single beam of laser light transmitted through the beam expander 8 is incident on the beam splitter 2 through the full-reflector 9.

The beam expander 8 of the present invention has a magnification adjustment function of 8 to 15 times. It is known from the Gaussian optical principle that the beam expansion ratio of the beam expander 8 and the waist diameter of the focus spot are formed for the laser processing system having the beam expanding function. In contrast, the adjustable magnification beam expander 8 can effectively control the energy distribution of the laser beam focusing spot of the laser processing system. At the same time, the full-mirror 9 of the present invention has a two-dimensional angle adjustment and a one-dimensional translation adjustment function along the exit optical axis.

Example 3

Referring to FIG. 3, FIG. 3 is a schematic diagram of the optical splitting principle of Embodiment 3 of the laser processing system of the present invention.

In Embodiment 3, the structure is substantially the same as that of Embodiment 1 or 2 described above, except that the laser processing system further includes an attenuator 14 including the first pre-mirror group 10 and a first rear mirror group 11, the second mirror element comprising a second front mirror group 12 and a second rear mirror group 13, the beam splitter 2 outputting a first laser beam and a a second laser beam incident on the attenuator 14 via the first pre-mirror group 10, the first laser beam passing through the attenuator 14 being incident on the first a rear mirror group 11, the first laser beam transmitted through the first rear mirror group 11 is incident into the first focusing mirror 3; the second laser beam passes through the second front The mirror group 12 is incident on the attenuator 14, and the second laser beam transmitted through the attenuator 14 is incident on the second rear mirror group 13 and transmitted through the second rear mirror group 13 The second laser beam is incident into the second focusing mirror 5.

It is worth noting that the first pre-mirror group 10 of the present invention And the first rear mirror group 11 , one or more angle mirrors can be set as the first front mirror group or the first rear mirror group according to the needs of production or user or other reasons, the first in the present invention A front mirror group 10 includes an angle mirror, and the first rear mirror group 11 includes two angle mirrors. The second pre-mirror group 12 and the second rear mirror group 13 are explained in the same manner. As long as the technical problem of the present invention can be solved, the first pre-mirror group 10 and the first rear mirror group can be provided with a plurality of angle mirrors as needed.

It should be noted that the present invention only gives an optimal embodiment. The front end is not provided with the beam expander 8 and the full mirror 9 to solve the technical problem of the present invention. Therefore, between the laser 1 and the beam splitter 2 The technical solution in which the beam expander 8 and the full mirror 9 are not provided is also within the scope of the present invention.

The attenuator 14 of the invention has good repeatability, is adapted to the attenuation of higher power lasers, and can set laser power attenuation with different attenuation degrees, and can quickly meet the laser power adjustment for laser processing requirements of different requirements, and Effectively reduce costs.

Further, the laser processing system further includes a platform driving mechanism (not shown in the drawing), the product to be processed is disposed on the processing platform 7, and the platform driving mechanism is used to control the processing platform Movement of 7 for cutting the processed product according to the adjusted spacing to form a processing trajectory, wherein the spacing is that the first laser beam and the second laser beam are simultaneously focused on the processing platform 7 The distance between the two points.

It should be noted that the platform driving mechanism of the present invention may be disposed at the bottom of the processing platform 7 or other components of the processing platform 7. As long as the platform can stably drive the processing platform 7 and ensure that the product to be processed on the processing platform 7 can move smoothly, the technical problems of the present invention can be solved within the scope of the present invention.

Further, the distance between the two points on the processing platform 7 in which the first laser beam and the second laser beam are simultaneously focused is 1 um~1 cm, and the radial width of the processing trajectory is 1 um~ 30um.

The pitch adjustment range of the present invention is wide, and the radial width of the processing track is wide. Therefore, the laser processing system provided by the present invention has a wide range of technical effects.

Further, the beam splitter 2 is a DOE diffraction beam splitter, and the DOE diffraction beam splitter splits a single beam of laser beams emitted by the laser into the first laser beam and the second laser beam. The angle between the first laser beam and the second laser beam is between 1 and 80 degrees.

The beam splitter 2 of the present invention is a DOE diffraction beam splitter, and a single beam of laser beam emitted by the laser 1 passes through the DOE diffraction beam splitter to split a plurality of laser beams: 0, +1, +2, +3. ..equal beam, in which +1 two beams account for more than 80% of the total energy, the remaining beam energy is very small, and the angle between the two beams of +1 level is about 36mard (2deg), thus ensuring the mode of the laser beam after splitting. Uniformity of power.

To this end, the applicant of the present invention used the Spiricon M 2-200S beam analyzer manufactured by OPHIR to test the beam directivity and beam quality before and after the splitting. The test result is that the beam directivity before and after the splitting is better than 10 urad. The overall difference in beam quality before and after splitting is small, and the consistency is greatly improved compared to the existing spectroscopic scheme.

The first displacement adjusting mechanism 4 and the second displacement adjusting mechanism 6 are piezoelectric ceramic displacement driving mechanisms, linear motor driving mechanisms or servo motor driving mechanisms.

The first displacement adjusting mechanism 4 and the second displacement adjusting mechanism 6 in the present invention are both XY-axis moving platforms, and the first displacement adjusting mechanism 4 and the second displacement adjusting mechanism 6 in the present invention have high control resolution and repetition. The high precision and the like, so that the accuracy of the pitch adjusted by the first displacement adjusting mechanism 4 and the second displacement adjusting mechanism 6 is higher than that of the existing adjusting mechanism.

The laser is a solid laser, a gas laser or a quasi-molecular laser, and the laser emits a laser having a wavelength of 10640 nm, 1064 nm, 532 nm, 355 nm or 266 nm.

The first mirror element includes at least two first angle mirrors, the second mirror element includes at least two second angle mirrors, the first angle mirror and the second angle mirror facing the laser The reflectance of the laser emitted by the device is 0~100%, and the reflection angle is 0°~180°.

Example 4

Referring to FIG. 4, FIG. 4 is a schematic flow chart of Embodiment 4 of a laser processing method according to the present invention.

In order to achieve the above object, Embodiment 4 of the present invention further provides a laser processing method, the laser processing method comprising the following steps: Step S10, the beam splitter splits a single beam of laser beam emitted by the laser into a first a laser beam and a second laser beam; the laser emits a single beam of laser light, the single beam of laser beam incident on In the beam splitter, the beam splitter splits the single beam of laser light into a first laser beam and a second laser beam.

Step S11, the first laser beam is introduced into the first focusing mirror through the first mirror element, and the second laser beam is introduced into the second focusing mirror through the second mirror element, the first laser beam The light beam and the second laser beam are respectively focused on the processing platform through the first focusing mirror and the second focusing mirror; the first laser beam is focused on the processing platform through the first focusing mirror, and the second laser beam The beam of light is focused onto the processing platform through a second focusing mirror.

Step S12, the first displacement adjustment mechanism and the second displacement adjustment mechanism respectively control movement of the first focusing mirror and the second focusing mirror, so as to adjust the transmission through the first focusing mirror, the second The first laser beam and the second laser beam of the focusing mirror are in parallel focused on a distance between two points on the processing platform.

The single beam laser beam emitted by the laser device is spectrally processed outside the cavity by the beam splitter to become the first laser beam and the second laser beam, and the first laser beam and the second laser beam are used. The first focusing mirror and the second focusing mirror are respectively focused on the processing platform in parallel, and the first laser beam and the second laser beam are used to process the processed product at the same time, thereby improving the processing efficiency.

At the same time, the first laser beam and the second laser beam of the present invention are simultaneously focused on the processing platform, and the first focusing mirror and the second focusing mirror are respectively controlled by the first displacement adjusting mechanism and the second displacement adjusting mechanism to adjust and adjust. The first laser beam and the second laser beam are simultaneously focused on the The distance between two points on the processing platform, on the one hand, the distance between the first laser beam and the second laser beam in parallel on the processing platform can be adjusted at any time according to the needs of the production or the user, and On the one hand, the product to be processed is cut according to the adjusted pitch, and the precision of the size of the processed product is improved compared to the existing single beam laser beam cutting method.

Example 5

Referring to FIG. 5, FIG. 5 is a schematic flow chart of Embodiment 5 of a laser processing method according to the present invention.

In the embodiment 5, the structural steps are the same as those in the fourth embodiment, except that the step S10 includes: in step S20, the single beam of the laser beam emitted by the laser is incident on the beam expander. A single beam of laser light transmitted through the beam expander is incident on the beam splitter through the full mirror; in step S21, the beam splitter splits the single beam of laser light into a first laser beam and a second laser beam.

The beam expander of the present invention has a magnification adjustment function of 8 to 15 times. It is known from the Gaussian optical principle that the beam expansion ratio of the beam expander is inversely proportional to the beam waist diameter of the focused spot for a laser processing system having a beam expanding function. Therefore, the adjustable magnification beam expander can effectively control the energy distribution of the laser beam focusing spot of the laser processing system. At the same time, the full mirror in the present invention has a two-dimensional angle adjustment and a one-dimensional translation adjustment function along the exit optical axis.

Example 6

Referring to FIG. 6, FIG. 6 is a schematic flow chart of Embodiment 6 of a laser processing method according to the present invention.

In Embodiment 6, the structural steps are the same as those of Embodiment 4 or 5 above, except that the first laser beam is introduced into the first focusing mirror via the first mirror element, and the second laser The step of introducing the light beam into the second focusing mirror through the second mirror element includes: in step S30, the first laser beam is incident into the attenuator through the first pre-mirror group, and the second laser beam passes through The second pre-mirror group is incident into the attenuator; in step S31, the first laser beam transmitted through the attenuator is incident on the first post-mirror group, and the second in the attenuator is transmitted through The laser beam is incident on the second rear mirror group; in step S32, the first laser beam transmitted through the first rear mirror group is incident into the first focusing mirror, and the second focusing mirror is transmitted through the second focusing mirror. The second laser beam of the set of mirrors is incident into the second focusing mirror.

It should be noted that the present invention only provides a preferred embodiment, and the technical problem of the present invention can be solved without the technical solutions of step S20 and step S21. Therefore, the technical solution of step S20 and step S21 is not included. Within the scope of protection of the present invention.

The attenuator of the invention has good repeatability, is adapted to the attenuation of higher power lasers, and can set laser power attenuation with different attenuation degrees, can quickly meet the laser power adjustment for different requirements of laser processing, and is effective cut costs.

Further, the first displacement adjustment mechanism and the second displacement adjustment mechanism respectively control movement of the first focusing mirror and the second focusing mirror, so as to adjust the transmission through the first focusing mirror, the second Focusing mirror The step of the first laser beam and the second laser beam being simultaneously focused on a distance between two points on the processing platform includes: the platform driving mechanism controls movement of the processing platform so as to be adjusted according to a good spacing to cut the processed product to form a processing trajectory, wherein the first focusing mirror, the first laser beam of the second focusing mirror, and the second laser beam are simultaneously focused on The distance between two points on the processing platform.

It should be noted that the platform driving mechanism of the present invention may be disposed at the bottom of the processing platform or at other parts of the processing platform, as long as the processing platform can be stably driven to ensure smooth movement of the products to be processed on the processing platform. The platform driving mechanism can solve the technical problems of the present invention, and all of them are within the protection scope of the present invention.

The embodiments of the invention have been described in detail above, but are merely exemplary, and the invention is not limited to the specific embodiments described above. All equivalent modifications and alterations to the invention are also within the scope of the invention, and the equivalents and modifications and improvements may be made without departing from the spirit and scope of the invention. And the like should be covered within the scope of the present invention.

1‧‧‧Laser

2‧‧‧beam splitter

3‧‧‧First focusing mirror

4‧‧‧First displacement adjustment mechanism

5‧‧‧Second focusing mirror

6‧‧‧Second displacement adjustment mechanism

7‧‧‧Working platform

Claims (10)

A laser processing system, characterized in that the laser processing system comprises a laser, a beam splitter, a first mirror element, a second mirror element, a first focusing mirror, a second focusing mirror, and a first displacement adjustment a mechanism, a second displacement adjustment mechanism and a processing platform, the beam splitter being disposed adjacent to an output end of the laser, the first focusing mirror and the second focusing mirror being both for a processing platform, the first focusing The mirror and the second focusing mirror are respectively disposed on the first displacement adjusting mechanism and the second displacement adjusting mechanism; a single beam of the laser beam emitted by the laser is incident on the beam splitter, The splitting mirror outputs a first laser beam and a second laser beam, the first laser beam being incident into the first focusing mirror via the first mirror element, the second laser beam passing through The second mirror element is incident on the second focusing mirror, and the first displacement adjusting mechanism and the second displacement adjusting mechanism respectively control movement of the first focusing mirror and the second focusing mirror to For adjusting the first laser beam The second parallel laser beam is focused on the distance between two points on the processing platform. A laser processing system according to claim 1, characterized in that the laser processing system further comprises a beam expander mirror and a full mirror, the beam expander being disposed at the laser and the beam splitter The full mirror is disposed between the beam expander and the beam splitter, and a single beam of laser light emitted by the laser is incident into the beam expander and transmitted through the beam expander A single beam of laser light is incident into the beam splitter through the full mirror. A laser processing system according to claim 1 or 2, wherein the laser processing system further comprises an attenuator, the first mirror element comprising a first pre-mirror group and a first rear reflection a second mirror element comprising a second pre-mirror group and a second post-mirror group, the spectroscope outputting a first laser beam and a second laser beam, the first laser a light beam is incident into the attenuator through the first pre-mirror group, and the first laser beam transmitted through the attenuator is incident on the first rear mirror group, after transmitting the first rear mirror group The first laser beam of the set of mirrors is incident into the first focusing mirror; the second laser beam is incident into the attenuator via the second pre-mirror group, The second laser beam of the attenuator is incident on the second rear mirror group, and the second laser beam transmitted through the second rear mirror group is incident into the second focusing mirror. The laser processing system according to claim 3, wherein the laser processing system further comprises a platform driving mechanism, the product to be processed is disposed on the processing platform, and the platform driving mechanism is used for controlling the The movement of the processing platform for cutting the processed product according to the adjusted spacing to form a processing trajectory, wherein the spacing is that the first laser beam and the second laser beam are simultaneously focused on the processing platform The distance between the two points above. The laser processing system of claim 4, wherein the first laser beam and the second laser beam are simultaneously focused on a distance between the two points on the processing platform by 1 um to 1 cm. The radial width of the processing track is 1 um to 30 um. A laser processing system according to claim 1, wherein the beam splitter is a DOE diffraction beam splitter, and the DOE diffraction beam splitter splits a single beam of laser light emitted by the laser into the first a laser beam and the second laser beam, an angle between the first laser beam and the second laser beam is 1° to 80°; the first displacement adjusting mechanism and the second The displacement adjusting mechanism is a piezoelectric ceramic displacement driving mechanism, a linear motor driving mechanism or a servo motor driving mechanism; the laser device is a solid laser, a gas laser or a quasi-molecular laser, and the laser emits a laser having a wavelength of 10640 nm, 1064 nm, 532 nm, 355 nm or 266 nm; the first mirror element comprising at least two first angle mirrors, the second mirror element comprising at least two second angle mirrors, the The angle of reflection of the laser beam emitted by the laser beam by the angle mirror and the second angle mirror is 0-100%, and the reflection angle is 0°-180°. A laser processing method for a laser processing system according to any one of claims 1 to 6, characterized in that the laser processing method comprises the following steps: a single beam laser emitted by a laser beam by a beam splitter The beam is split into a first laser beam and a second laser beam; the first laser beam is introduced into the first focusing mirror via the first mirror element, and the second laser beam is introduced through the second mirror element Going to the second focusing mirror, the first laser beam and the second laser beam are respectively focused on the processing platform through the first focusing mirror and the second focusing mirror; The first displacement adjustment mechanism and the second displacement adjustment mechanism respectively control movement of the first focusing mirror and the second focusing mirror to adjust the first through the first focusing mirror and the second focusing mirror The laser beam, the second laser beam, is focused in parallel on a distance between two points on the processing platform. The laser processing method according to claim 7, characterized in that the spectroscope splits a single laser beam emitted from the laser into the first laser beam and the second laser The step of beaming includes: a single beam of laser beam emitted by the laser is incident into a beam expander, and a single beam of laser beam transmitted through the beam expander is incident on the beam splitter through a full mirror; The beam splitter splits the single beam of laser light into the first laser beam and the second laser beam. The laser processing method according to claim 7 or 8, wherein the first laser beam is introduced into the first focusing mirror via the first mirror element, the second laser beam The step of introducing the second mirror element into the second focusing mirror comprises: the first laser beam being incident into the attenuator via the first pre-mirror group, the second laser beam passing through a second pre-mirror group is incident into the attenuator; the first laser beam transmitted through the attenuator is incident on a first post-mirror group, and the second thunder is transmitted through the attenuator The light beam is incident on the second rear mirror group; the first laser beam transmitted through the first rear mirror group is incident In the first focusing mirror, the second laser beam transmitted through the second rear mirror group is incident into the second focusing mirror. The laser processing method according to claim 9, wherein the first displacement adjustment mechanism and the second displacement adjustment mechanism respectively control movement of the first focusing mirror and the second focusing mirror, so that Adjusting the distance between the two points passing through the first focusing mirror, the second focusing mirror, and the second laser beam in parallel focusing on the processing platform includes : a platform driving mechanism controls movement of the processing platform such that the processed product is cut according to the adjusted spacing to form a processing track, the spacing being the first of the first focusing mirror and the second focusing mirror The laser beam, the second laser beam, is focused in parallel on a distance between two points on the processing platform.