KR101728876B1 - An Apparatus Having a Structure of Automatic Focus Regulation and a Method for Marking with the Same - Google Patents

An Apparatus Having a Structure of Automatic Focus Regulation and a Method for Marking with the Same Download PDF

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Publication number
KR101728876B1
KR101728876B1 KR1020150050541A KR20150050541A KR101728876B1 KR 101728876 B1 KR101728876 B1 KR 101728876B1 KR 1020150050541 A KR1020150050541 A KR 1020150050541A KR 20150050541 A KR20150050541 A KR 20150050541A KR 101728876 B1 KR101728876 B1 KR 101728876B1
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focus
laser
marking
lens
unit
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KR1020150050541A
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Korean (ko)
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KR20160121071A (en
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김해용
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제일엠텍(주)
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention relates to a laser marking apparatus of an automatic focus adjustment structure and a laser marking method therefor, and more particularly to a laser marking apparatus of an automatic focus adjustment structure capable of automatically adjusting a focal point of a workpiece The laser marking apparatus includes a laser generator 12; A focus adjusting unit 15 for adjusting a focal length of the laser beam transmitted from the laser generator 12; And a processing lens L3 for irradiating the workpiece W with the laser beam transmitted to the focus adjusting unit 15. The focus adjusting unit 15 changes the focal distance by adjusting the magnetic field or electric field size , The adjustment of the magnetic field or the electric field size is carried out by the focus adjusting unit 15, which includes temperature compensation according to changes in the magnetic field or electric field or transmission of the laser beam.

Description

1. Field of the Invention The present invention relates to a laser marking apparatus and a laser marking method using the same,

The present invention relates to a laser marking apparatus of an automatic focus adjustment structure and a laser marking method therefor, and more particularly to a laser marking apparatus of an automatic focus adjustment structure capable of automatically adjusting a focal point of a workpiece To a laser marking method.

A laser marking device is a device that engraves characters, symbols, patterns or pictures on a surface of a material such as wood, plastic, metal, coated metal, stone, or glass with a laser beam. Generally, the laser marking apparatus can include a control device for controlling such things as a laser for generating a beam for the imprint, a direction, intensity, moving speed and distribution of the laser beam. In such a laser marking apparatus, a working material is fixed on an X-Y table, and a laser optical apparatus moves in an X-Y direction to imprint on a working material. On the other hand, the laser marking apparatus moves in the Y direction and can be imprinted while the laser moves in the X direction.

As a prior art related to laser marking, Patent Registration No. 0520899 discloses a marking correction method of a laser marking system. The prior art is a marking correction method for a laser marking system having a laser marker for performing marking while observing chips mounted in each cell of a tray with at least one vision camera and a post-vision camera for detecting a marked error, Assigning observation target chips to each of the vision cameras, matching the coordinates of the vision cameras and the laser markers, marking a predetermined first symbol at a position corresponding to each chip or each chip, Observing the selected first symbol and teaching one point of the symbol as a reference point; observing a first symbol and a reference point of the chip with the vision camera and marking a second symbol on the basis of the reference point on each chip; Observing a second symbol on the chip and teaching a comparison point of the symbol; And detecting the position of the comparison point and detecting a marking error in each cell.

Another prior art related to laser marking is the patent apparatus No. 0771496, a correction device and method of a laser marking system. In the prior art, if a gap occurs in a height of a chip in a tray when the tray moves, if the size of the gap is within a certain range, the mark is corrected by correcting the gap, A laser beam oscillator for projecting a laser beam on a side of chips mounted on the tray to measure the height of the chips in the tray; And a vision camera for picking up the X and Y positions of the chips and detecting the laser beam projected from the laser beam oscillator to the sides of the chips.

In the process of forming markers on a workpiece, the focal length may vary for various reasons. The change in focal length according to the structure of the workpiece can be measured in advance, and thus the focal length can be corrected or corrected in an appropriate manner. The focal length can be input in advance to the control unit, and the focal length of the laser beam can thereby be adjusted. In this case, the change of the focal length in the known art is made by a mechanical method. On the other hand, focal lengths can occur, for example, in vibrations, mechanical errors or process steps, and such changes in focal length are difficult to measure in advance and must be measured in real time. Precise control can be difficult and time-consuming if the focal length changes caused by various causes and thus the adjustment of the focal length is mechanically performed.

The prior art does not disclose a structure capable of efficiently adjusting such a pre-measured focal length and a method capable of correcting errors in real time.

The present invention has been made to solve the problems of the prior art and has the following purpose.

Prior Art 1: Patent Registration No. 0520899 Prior Art 2: Patent Registration No. 0771496

An object of the present invention is to provide a laser marking apparatus of an automatic focus adjustment structure capable of effectively reducing a real time process error by measuring a focal distance in real time and a focal distance can be efficiently controlled by applying a magnetic field or an electric field, And to provide a laser marking method.

According to a preferred embodiment of the present invention, the laser marking apparatus comprises a laser generator; A focus adjusting unit for adjusting a focal distance of the laser beam transmitted from the laser generator; And a processing lens for irradiating the workpiece with the laser beam transmitted to the focusing unit, wherein the focusing unit changes the focal distance by adjusting a magnetic field or an electric field size, and the adjustment of the magnetic field or electric field size is performed by a focus adjusting unit Includes a change in a magnetic field or an electric field or a temperature compensation according to the transmission of the laser beam.

According to another preferred embodiment of the present invention, the focusing unit includes a barrel in which the laser beam is guided; An adjustment lens and a fixed lens separately disposed inside the lens barrel; A flow unit for adjusting the focus of the adjustment lens; And a conductive wire disposed around the flow unit.

According to another preferred embodiment of the present invention, a distance sensor is further provided on the side surface of the processing lens.

According to another preferred embodiment of the present invention, there is provided a laser marking method by autofocusing, comprising: preparing focus data of a focus adjustment unit whose focal distance is changed by a shape change of a fluid depending on a magnetic field or an electric field and temperature; Marking the workpiece based on the focal distance between the machining lens to which the laser beam is irradiated and the marking position is input or measured in advance; Changing a focal distance in the marking process; Measuring a temperature while generating a magnetic field or an electric field around the fluid in accordance with the change; And adjusting the current for generating the magnetic field or the electric field according to the focus data.

According to another preferred embodiment of the present invention, the focus adjustment unit is composed of an adjustment lens and a fixed lens which are separated from each other, and the focus of the adjustment lens is adjustable.

The marking apparatus according to the present invention allows the focal distance to be adjusted quickly and precisely, thereby improving the efficiency of laser marking. The laser marking apparatus according to the present invention reduces the marking error by measuring the focal distance in real time.

1 shows an embodiment of a laser marking apparatus according to the present invention.
2 shows an embodiment of a focusing unit applied to a laser marking apparatus according to the present invention.
Fig. 3 shows an embodiment of a laser marking method according to the present invention.
Fig. 4 shows another embodiment of the laser marking method according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the accompanying drawings, but the present invention is not limited thereto. In the following description, components having the same reference numerals in different drawings have similar functions, so that they will not be described repeatedly unless necessary for an understanding of the invention, and the known components will be briefly described or omitted. However, It should not be understood as being excluded from the embodiment of Fig.

1 shows an embodiment of a laser marking apparatus according to the present invention.

1, the laser marking apparatus 10 includes a laser generator 12; A focus adjusting unit 15 for adjusting a focal length of the laser beam transmitted from the laser generator 12; And a processing lens L3 for irradiating the workpiece W with the laser beam transmitted to the focus adjusting unit 15. The focus adjusting unit 15 changes the focal distance by adjusting the magnetic field or electric field size , The adjustment of the magnetic field or the electric field size is performed by the focus adjustment unit 15, which includes temperature compensation according to changes in the magnetic field or electric field or transmission of the laser beam.

The generator 12 for generating the laser beam can be any laser beam generator known in the art and can be, for example, a carbon dioxide laser, a fiber laser or a Q-switched YAG laser But not limited to, any laser known in the art.

The operation of the generator 12 can be controlled by the control unit 11, for example, the data on the marking position can be stored in advance and thereby control the generation time of the laser. Also, as described below, it is possible to control the magnitude of the current for the magnetic field or electric field generation based on the temperature measured in the focus adjustment unit 15. [

The focus adjusting unit 15 may have a function of automatically adjusting the focal distance between the surface of the workpiece W and the working lens L3. When a magnetic field or an electric field is applied to the inside of the focus adjustment unit 15, a fluid whose shape changes according to the magnetic field or the electric field can be accommodated, and the laser passing through the fluid changes the focus position according to the shape change of the fluid. And the shape change of the fluid depending on the magnitude of the magnetic field or the electric field and accordingly the data on the focus position can be prepared and stored in the control unit 11 in advance. The magnitude of the magnetic field or the electric field can be changed by adjusting the amount of the electric current according to a pre-measured focal distance or a focal distance measured from the distance sensor 18 in real time. Accordingly, the shape of the fluid is deformed and the focus can be automatically adjusted. The current adjustment unit 16 may be provided in the focus adjustment unit 15 and the current adjustment unit 16 may detect the magnitude of the current flowing around the focus adjustment unit 15 and control it through the transmission cable W11 Unit 11 as shown in FIG. And in accordance with the command transmitted from the control unit 11, the current flowing around the focus adjusting unit 15 can be adjusted, so that the magnetic field or electric field formed around the focus adjusting unit 15 can be adjusted.

The laser beam generated through the generator 12 may be introduced into the focusing unit 15 via an isolator 13. [ The laser beam introduced into the focus adjusting unit 15 can be changed in focus while passing through the focus adjusting unit 15. [ The change of the focal point means a focus which is generated by the lens disposed inside the focus adjustment unit 15 but is finally formed on the surface of the work W by the working lens L3. The focus can be adjusted in various ways and the focus can be adjusted by the focus adjustment unit 15 in this specification. However, in this specification, the focus adjustment need not be performed only by the focus adjustment unit 15. [ For example, when the position of the workpiece W itself is changed, the focus can be readjusted by the working lens L3. Therefore, in this specification, focus adjustment should not be limited to being performed by the focus adjustment unit 15. [

Depending on the application of a magnetic field or an electric field, the focus is adjusted by a lens arranged inside the focus adjustment unit 15 and at the same time, by the change of the temperature of the focus adjustment unit 15 according to the application of the electric field or the magnetic field, The focus of the focus adjustment unit 15 may be changed. Different focuses can be created depending on the magnitude of the temperature change. Therefore, data on the focus change according to the temperature change of the focus adjustment unit 15 must be made in advance and stored in the control unit 11. [ And the temperature of the focus adjustment unit 15 can be measured by the temperature detection unit 17 and transmitted to the control unit 11 through the transmission cable W12. The control unit 11 adjusts the flow of the electric current based on the measured temperature and the magnitude of the current magnetic field or electric field so that the focus is adjusted by the focus adjusting unit 15. [

The focused laser beam passing through the focus adjusting unit 15 can be transmitted to the working lens L3 via the direction mirrors L1 and L2. The processing lens L3 may be, for example, an F-theta lens. Thereafter, the laser beam LB is focused on the surface of the work W to form a marker according to a predetermined method. The distance or focal length between the processing lens L3 and the surface of the workpiece W may be changed during the formation of the marker. The change of the focal length can be predetermined according to the marking position of the workpiece W and input to the control unit 11 or can be measured in real time and transmitted to the control unit 11. [

The measurement of the focal length may be performed by a distance sensor 18 such as an ultrasonic sensor, for example. The distance sensor 18 may be provided independently on the side of the processing lens L3 or may be movably installed with the processing lens L3 and may be an ultrasonic sensor, an optical sensor or a laser sensor, It can be an ultrasonic sensor. The ultrasonic waves transmitted from the transmission transducer of the ultrasonic sensor may be incident in a direction perpendicular to the surface of the workpiece W. [ And the distance between the working lens L3 and the workpiece W can be measured by the reflected ultrasonic wave SR received by the receiving transducer. And the measured distance may be transmitted to the control unit 11. [

The distance sensor 18 may be provided behind the processing lens L3 along the movement direction M of the workpiece W and may measure the focal distance immediately before the marker process proceeds and transmit it to the control unit 11 . The inclination of the workpiece W can be measured by measuring the positions of two different adjacent points as necessary. Specifically, a plurality of transmitting transducers can be disposed in the ultrasonic transducer, and the inclination can be measured by transmitting them at different positions at different time intervals and receiving them from different positions. Alternatively, the tilt can be measured by analyzing the harmonic components of the received wave. For example, the inclination of the workpiece W can be measured by analyzing the disappearance of the fundamental wave due to the interference between the incident wave and the reflected wave and thus the harmonic components received.

If the focal distance measured by the distance sensor 18 is transmitted to the control unit 11 or if the focal length should be adjusted according to the previously input data, the control unit 11 must be applied to the focus adjustment unit 15 It is possible to calculate the magnitude of the magnetic field or the electric field to make the current flow. The temperature detection unit 17 detects the temperature change due to the transmission of the laser beam and corrects the current value. This allows the focus to be automatically adjusted as the focal length changes.

An embodiment of the focus adjusting unit 15 which enables such automatic focus adjustment is described below.

2 shows an embodiment of a focusing unit applied to a laser marking apparatus according to the present invention.

Referring to Fig. 2, the focusing unit 15 includes a barrel 21a, 21b to which a laser beam is guided; An adjusting lens 231 and a fixed lens 232 separately disposed inside the lens barrel 21a and 21b; A flow unit 24 for adjusting the focus of the adjustment lens 231; And a conductive wire 25 disposed around the flow unit 24.

The barrels 21a and 21b may be hollow cylinders and may consist of a fixed barrel 21a and a movable barrel 21b movable with respect to the fixed barrel 21a. The fixed barrel 21a and the moving barrel 21b may be connected by a slider 22. The slider 22 may have a structure such as a rack gear, for example, and a driving gear connected to a driving device such as a motor may be connected to the slider 22. [ The moving barrel 21b can be moved in accordance with the movement of the slider 22 by the rotation of the driving gear in the first direction or the second direction. The lens barrels 21a and 21b may be integrally formed or may be composed of a plurality of parts, and when the lens barrels 21a and 21b are composed of a plurality of parts, they may be composed of a fixed lens barrel 21a and a moving lens barrel 21b. The lens barrel 21a, 21b can be made in various structures, and the present invention is not limited to the embodiments shown.

An adjustment lens 231 whose focal point is adjusted and a fixed lens 232 whose focal point is fixed can be disposed inside the lens barrel 21a and 21b and the focal length can be adjusted by adjusting the focal point of the adjustment lens 231. [ . The adjusting lens 231 and the fixed lens 232 may be disposed separately in the lens barrel 21a and 21b and may be disposed in the concave lens 21a or 21b depending on the incident incident laser beam LI and the transmitted laser beam LT, Or a convex lens. Also, although the adjustment lens 231 is disposed in front of the path and the fixed lens 232 is disposed behind the path in the illustrated embodiment, the arrangement position of the adjustment lens 231 or the fixed lens 232 is not particularly limited. The adjustment lens 231 may be combined with the flow unit 24 and the flow unit 24 may have the function of adjusting the focus of the incident laser beam LI. Specifically, the adjustment lens 231 and the flow unit 24 can have the function of a lens for focus adjustment. For example, the flow unit 24 may have a structure similar to that of an electro-wetting lens in which the surface tension changes as the magnetic field or electric field is applied inside, thereby deforming the shape of the surface.

Specifically, the flow unit 24 may be an isolated chamber shape surrounded by the wall surface of the insulating material, and the front surface 241 and the rear surface 242 may be made of a transparent insulating material wall. And may be filled with a conductive fluid 243 and a hydrophobic or insulating fluid. According to the structure of the flow unit 24, the front surface 241 and the rear surface 242 may be a transparent electrode plate coated with an insulating material. And the conductive wire 25 around the flow unit 24 can be arranged in a coil form or in a solenoid form. Alternately, a side wall facing each other may be formed to apply a voltage. For example, opposite half-cylindrically shaped electrode walls may be formed, and the electrode walls may be coated with an insulating material. And a voltage may be applied to the electrode wall.

The surface tension of the conductive fluid 243 may be changed by flowing a current to the conductive wire 25 or by applying a voltage to the electrode wall and thus the shape of the conductive fluid 243 may be changed. And the focal point of the incident laser beam LI passing through the conductive fluid 243 can be changed. The change in focus varies depending on the change in the surface tension or the expansion level of the conductive fluid 243, so that the conductive fluid 243 may have a different shape depending on the internal temperature. Therefore, compensation can be made according to changes in the internal temperature.

The current flowing along the conductive wire 25 is detected by the detection circuit 251 and transmitted to the control unit while the temperature inside the flow unit 24 is measured by the temperature detection unit 17 and transmitted to the control unit . The control unit can adjust the shape of the conductive fluid 243 disposed in the flow unit 24 based on the data transmitted from the detection circuit 251 and the temperature detection unit 17. [ The shape data of the flow unit according to the magnitude of the temperature and the electric field or the magnetic field can be stored in the control unit and the control unit can control the current flowing along the conductive wire 25 based on the shape data. And the focal length can be adjusted accordingly, and a marker can be formed at a predetermined position of the workpiece.

As described above, the focus can be adjusted according to the change in the shape of the flow unit 24 due to changes in electric field, magnetic field or temperature. Alternatively, the flow unit 24 can be made to change shape, such as by temperature or pressure, so that the focus can be adjusted accordingly. Thus, the flow unit 24 may have the function of a lens whose shape is changed by a controllable factor.

The focus adjustment unit 15 can be made in various structures and the present invention is not limited to the embodiments shown.

Fig. 3 shows an embodiment of a laser marking method according to the present invention.

Referring to FIG. 3, the automatic marking laser marking method according to the present invention includes a step (P31) of preparing focus data of a focus adjusting unit whose focal distance is changed according to a shape of a fluid according to a magnetic field or an electric field and temperature, ; (P32) the focal distance between the machining lens to which the laser beam is irradiated and the marking position is pre-inputted or measured and marking the workpiece based thereon; A step (P33) of changing the focal length in the marking process; Measuring a temperature (P34) while generating a magnetic field or an electric field around the fluid in accordance with the change; And adjusting a current for generating the magnetic field or electric field according to the focus data (P35).

The workpiece for marking can be of various materials, such as metal, synthetic resin or wood, and the laser beam can be generated by any laser generator known in the art. The shape change of the fluid can be controlled by a regulating factor such as a magnetic field, an electric field, a temperature or a pressure, as described above, and can have a structure similar to, for example, an electrowetting lens. Since the temperature of the fluid changes as the application of the electric current or the laser beam passes through the focus adjustment unit, temperature compensation data according to application of current or permeation of fluid must be prepared. The focus data and the temperature compensation data according to the adjustment factors may be prepared in advance and stored in the control unit (P31). As described above, the focal length can be inputted in advance or measured in real time, and the generator can be controlled by the control unit according to the focal distance, so that marking for the workpiece can be started (P32).

The focal length may be changed depending on the marking position for the material, or the focal length may be changed depending on the internal or external cause during the operation. When a change in the focal distance occurs, the current flow can be controlled to change the focal distance of the focus adjustment unit (P34). The temperature of the focus adjusting unit can be changed at the same time as the lens shape is changed by the change of the current flow. The changed temperature is measured and the current can be regulated accordingly (P35). Alternatively, data on the temperature change due to the current regulation may be prepared in advance, and a change in the current flow in the process of changing the lens shape by the current flow may be made based on the prepared data.

Once the focal length is adjusted, the marking process can proceed accordingly.

The change of the lens shape according to the current flow can be made on the basis of the real time measurement.

Fig. 4 shows another embodiment of the laser marking method according to the present invention.

Referring to FIG. 4, a laser marking method according to the present invention includes: (P41) preparing focus data of a focus adjustment unit whose focal distance is changed according to a shape of a fluid according to temperature; Measuring a focal length between the machining lens to which the laser is irradiated and the marking position and marking the workpiece (P42); Detecting whether an error is generated in the marking process (P43); Measuring a temperature while generating a magnetic field or an electric field around the fluid according to the detection result (P44); And compensating the current flow of the focusing unit according to the measured temperature (P45).

The embodiment shown in Fig. 4 is to correct focal length errors based on real-time measurements by a distance sensor as compared to the embodiment shown in Fig. Even if the focal length of the workpiece is pre-input, an error may be caused by an external cause. Such an error can be detected by real-time distance measurement. If no error has occurred (NO), the marking can be made according to the previously inputted data (P42). If an error is generated (YES), the lens shape can be changed by controlling the current flow (P44). The temperature can be compensated by measuring the temperature change due to the current application or the transmission of the laser beam and regulating the current again (P45). Alternatively, temperature compensation can be performed in advance in the process of controlling the current flow due to the occurrence of the error.

The automatic focus adjustment according to the focal length according to the present invention can be performed by various methods, and the present invention is not limited to the embodiments shown.

The marking apparatus according to the present invention allows the focal distance to be adjusted quickly and precisely, thereby improving the efficiency of laser marking. The laser marking apparatus according to the present invention reduces the marking error by measuring the focal distance in real time.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention . The invention is not limited by these variations and modifications, but is limited only by the claims appended hereto.

11: control unit 12: laser generator
13: Separation unit 15: Focus adjustment unit
16: current regulation unit 17: temperature detection unit
18: Distance sensor
21a, 21b: barrel 22: slider
24: flow unit 25: conductive wire
231: Adjusting lens 232: Fixing lens

Claims (5)

delete delete delete A laser marking method by automatic focus adjustment,
Preparing focus data of a focus adjustment unit whose focal distance is changed by a shape change of a fluid depending on a magnetic field or an electric field and temperature;
Measuring a focal distance in real time by disposing a distance sensor capable of measuring a real time focal distance between the machining lens and the marking position of the workpiece;
Determining whether an error occurs between the real-time focal distance and a predetermined focal distance;
Measuring a change in temperature due to current application or transmission of a laser beam while applying an electric current to the periphery of the fluid if an error occurs;
Adjusting a flow of a current according to the temperature change to compensate for a temperature change; And
And wherein the workpiece is marked by the adjusted focal length in accordance with the compensation of the temperature change.
5. The method of claim 4, wherein the distance sensor measures a real time focal distance before the step of marking is performed and transmits the measurement result to the control unit.

KR1020150050541A 2015-04-10 2015-04-10 An Apparatus Having a Structure of Automatic Focus Regulation and a Method for Marking with the Same KR101728876B1 (en)

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CN110076451B (en) * 2019-06-04 2021-01-05 华霆(合肥)动力技术有限公司 Laser processing device and laser focal length compensation method
CN112276339B (en) * 2020-10-19 2022-02-15 温州大学 Intelligent conformal laser scanning machining method and device for curved surface workpiece
CN114226988B (en) * 2021-12-14 2024-03-26 武汉联思光电科技有限公司 Automatic focusing device and automatic focusing method for laser marking machine

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JP2007222902A (en) * 2006-02-23 2007-09-06 Seiko Epson Corp Laser machining apparatus and laser machining method
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JP2008501140A (en) * 2004-06-01 2008-01-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Variable focus lens
JP5558629B2 (en) * 2011-04-08 2014-07-23 三菱電機株式会社 Laser processing equipment

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Publication number Priority date Publication date Assignee Title
JP2008501140A (en) * 2004-06-01 2008-01-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Variable focus lens
KR100597906B1 (en) * 2005-06-15 2006-07-06 한국기계연구원 Apparatus for laser processing for machine tool
JP2007222902A (en) * 2006-02-23 2007-09-06 Seiko Epson Corp Laser machining apparatus and laser machining method
JP2007289992A (en) * 2006-04-24 2007-11-08 Denso Corp Laser beam machining apparatus
JP5558629B2 (en) * 2011-04-08 2014-07-23 三菱電機株式会社 Laser processing equipment

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