CN101856773B - Focusing positioning method based on initial laser processing position and laser processing device - Google Patents
Focusing positioning method based on initial laser processing position and laser processing device Download PDFInfo
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Abstract
The invention discloses a focusing positioning method based on an initial laser processing position. In the method, a beam emitted by a laser is projected on the surface of a work piece to be processed to form a light spot through the optical system of the laser processing head, light spot images are promptly collected through moving the laser processing head and using a camera, the properties of the light spot images are then compared with a computer to find out a light spot image on a focal plane, and then the laser processing head is moved according to the moving distance of the laser processing head corresponding to the light spot image, thereby completing the focusing; and the position relationship between the center of the initial processing point and the center of the light spot is determined by the computer, and the laser processing head is moved according to the position relationship, thereby obtaining the accurate positioning of the initial processing position. Compared with the prior art, the invention has high accuracy in focusing and positioning of the initial processing position, and can satisfy finishing requirements. Simultaneously, the invention also discloses a laser processing device, which has the functions of auxiliary focusing and positioning, thereby facilitating the laser processing operation.
Description
Technical field
The present invention relates to laser processing technology, the focusing localization method and the laser processing device of initial position in particularly a kind of Laser Processing.
Background technology
At present, laser process equipment is widely used in fields such as semiconductor and microelectronic industry, auto industry, shipping industry, aerospace industries.Since laser be cut through after focusing on, weld, processing such as punching, so laser beam foucing also seems important unusually with the surperficial relative position of workpiece to be machined.Conventional laser focusing method mainly contains: burned spot method, infrared photography method, aperture scanning method etc.Wherein the burned spot method is the most commonly used, only need get a l Water Paper and be attached to surface of the work and get final product, and is simple.But this method can only provide the profile of focus roughly to people, and because the transverse heat transfer effect of material makes and burns the focus pattern distortion of getting, smudgy sometimes, it is inaccurate to focus.And, when confirming initial processing position, adopt the not high ocular estimate of accuracy at present, can not satisfy accurately machined requirement.
Summary of the invention
One of the object of the invention is to provide the focusing localization method of the high based on initial laser processing position of a kind of focusing and setting accuracy.
To achieve these goals, the technical scheme of the present invention's employing is: a kind of focusing localization method of based on initial laser processing position comprises the steps:
(a) workpiece to be machined is placed on the processing platform, opens laser instrument, the light beam that laser instrument sends is incident upon the surface of workpiece to be machined through the light path system of laser Machining head, forms hot spot;
(b) along moving laser Machining head with the perpendicular direction in processing platform surface; And use the camera that is synchronized with the movement with this laser Machining head to gather light spot image in real time; And transfer to Computer Processing; Computer compares the attribute of the light spot image that obtains, and confirms to be positioned at the light spot image of focal plane, and regulates the position of laser Machining head in processing platform surface vertical direction on this basis;
(c) move the processing initial point D of laser Machining head to workpiece to be machined along the direction that parallels with the processing platform surface near; Camera collection is processed the image D1 of initial point D and is gone out the light spot image D2 under the light state at laser instrument; Obtain the center of D1 and D2 respectively, and serve as according to regulating the position of laser Machining head in processing platform surface parallel direction with this.
Utilization of the present invention is positioned at the different principle of attribute of attribute (like brightness, definition, area) with the light spot image of other position of the light spot image of focal plane; Earlier along moving laser Machining head with the perpendicular direction in processing platform surface; Gather light spot image in real time with camera simultaneously; Find out the light spot image that is positioned at the focal plane through the attribute of computer contrast light spot image again, according to the displacement of the pairing laser Machining head of this light spot image, move laser Machining head then in processing platform surface vertical direction; Focusing work is accomplished, and the accuracy height can reach 0.05mm.After focusing is accomplished; Confirm the center and the relation of the position between the spot center of processing initial point through computer; Parallel direction moves laser Machining head along the processing platform surface according to this position relation, thereby obtains the accurate location of initial processing position, and the setting accuracy height can reach 0.05mm.
In the step (b) of said method, the attribute of the light spot image that computer obtains is preferably one or more in brightness, definition and the area.The brightness of light spot image that is positioned at the focal plane is maximum, definition is the highest, area is minimum.
Preferred embodiment as said method; Also be provided with the light path system aligning step before in step (a): the nozzle with said laser Machining head unloads earlier; On said processing platform, draw the reference circle that a center has cross wire then, move laser Machining head, make the sleeve of laser Machining head coaxial with this reference circle; Adjust said camera again, the cross wire of camera and the cross wire of this reference circle are coincided; Open laser instrument then, adjust the deflection angle of the speculum of said laser Machining head, spot center is overlapped with the cross wire of camera; At last said nozzle is loaded onto, the position of fine setting nozzle makes nozzle aperture center overlap with the cross wire crosspoint of camera.This light path system bearing calibration has advantage fast and accurately.
Another preferred embodiment as said method; The light path system of said laser Machining head comprises semi-permeable and semi-reflecting mirror; The light beam that said laser instrument sends forms hot spot through the surface at workpiece to be machined after the reflection of this semi-permeable and semi-reflecting mirror, and this light spot image sees through semi-permeable and semi-reflecting mirror and gets into said camera.
Another object of the present invention is to provide a kind of laser processing device; The driving mechanism that comprises processing platform, laser instrument, laser Machining head and be used to regulate laser instrument, laser Machining head and processing platform relative position; Also comprise camera and computer; This camera is installed on the said laser Machining head and with said computer and links to each other, and said computer links to each other with said driving mechanism; Said laser Machining head comprises semi-permeable and semi-reflecting mirror, and the light beam that said laser instrument sends forms hot spot through the surface at workpiece to be machined after the reflection of this semi-permeable and semi-reflecting mirror, and this light spot image sees through semi-permeable and semi-reflecting mirror and gets into said camera.
Through setting up parts such as camera and computer, make laser processing device not only can be used for conventional Laser Processing, also have the function of auxiliary focusing and location, made things convenient for laser processing operation.
In the said apparatus, said camera preferably adopts the CCD camera, to obtain the light spot image of high-res.In addition, also comprise the HDMI capture card, said camera links to each other with said computer through this HDMI capture card, utilizes the HDMI capture card to gather high-definition image.
Compared with prior art, the invention has the advantages that: method of the present invention is high to the focusing and the location accuracy of initial processing position, can satisfy finishing requirements, and can proofread and correct light path system rapidly and accurately; Laser aid of the present invention not only can Laser Processing, also has the function of auxiliary focusing and location, has made things convenient for laser processing operation.
Description of drawings
Fig. 1 is the structural representation of embodiment of the invention laser processing device;
Fig. 2 is the focusing and the Positioning Principle figure of embodiment of the invention initial position;
Fig. 3 is the location diagram between the center of circle D2 of center of circle D1 and light spot image of initial position D.
Description of reference numerals:
1-processing platform, 2-workpiece to be machined, 3-nozzle, 4-sleeve, 5-focus lamp group, 6-laser beam, 7-semi-permeable and semi-reflecting mirror, 8-camera, 9-support, 10-laser Machining head, 11-laser instrument, 12-HDMI capture card, 13-computer.
The specific embodiment
Below in conjunction with accompanying drawing embodiments of the invention are elaborated:
See Fig. 1; The laser processing device of the embodiment of the invention mainly is made up of processing platform 1, laser instrument 11, laser Machining head 10, camera 8, HDMI capture card 12 and computer 13; Wherein laser Machining head 10 be vertical at processing platform 1 directly over, be provided with laser instrument 11 at the side of this laser Machining head 10, and install through support 9 at its top and to be equipped with camera 8; This camera 8 links to each other with computer 13 through HDMI capture card 12, and computer 13 links to each other with driving mechanism again.Camera 8 is the CCD camera.Laser instrument 11 and camera and laser Machining head 10 synchronous interactions can be unified to be focused with moved further and located by the driving mechanism drive.The driving mechanism of present embodiment adopts mechanical hand, and its repetitive positioning accuracy reaches 0.05mm.Also the screw mandrel driving mechanism can be set on processing platform 1, drive processing platform 1 through the screw mandrel driving mechanism and move with respect to laser Machining head 10 and focus and locate.
Laser Machining head 10 is laser cutting head or laser welding system, selects according to the processing needs.Present embodiment laser Machining head 10 mainly is made up of semi-permeable and semi-reflecting mirror 7, nozzle 3, sleeve 4 and focus lamp group 5.The light beam 6 that laser instrument 11 sends forms hot spot through the surface at workpiece to be machined after the reflection of semi-permeable and semi-reflecting mirror 7, and this light spot image sees through semi-permeable and semi-reflecting mirror 7 and gets into camera 8.Other structure of laser Machining head 10 is identical with prior art.
See Fig. 2, the focusing and the localization method of the based on initial laser processing position of present embodiment are following:
(a), at first carry out the correction of light path system.
Earlier nozzle 3 is unloaded, draw the reference circle that the identical and center of sleeve 4 diameter with laser Machining head 10 has cross wire then, be attached on the workbench, move laser Machining head 10, assurance sleeve 4 is coaxial with this reference circle.Access the cross hairs window of camera 8 screens again, the deflection of adjustment camera 8 coincides the cross hairs of reference circle on its cross wire and the workbench.Open laser instrument 11 then, the deflection angle going out the whole semi-permeable and semi-reflecting mirror 7 of light state downward modulation makes the laser facula center overlap with the cross wire of camera 8; Then laser Machining head 10 terminal nozzles 3 are loaded onto, the position all around of fine setting nozzle 3 makes nozzle 3 aperture centers overlap with the cross hairs crosspoint of camera 8.The whole optical path system calibration finishes.
(b), then, carry out the focusing work of laser processing device.
Workpiece to be machined 2 is placed on the processing platform 1; Open the indication light source (ruddiness) of laser instrument 11; The light beam 6 that laser instrument 11 sends is incident upon the surface of workpiece to be machined 2 through the light path system of laser Machining head 10; Form red some shaped laser spot, the shape of hot spot can be circle, square or regular polygon, and being easy to convert gets final product; At this moment, manipulator drives laser Machining head 10 and moves up and down, and light spot image is real-time transmitted in the computer 13 through camera 8, HDMI capture card 12, computer 13 carry out light spot image attribute to recently confirming the focal plane.Detailed process is: the area of light spot image of focal plane is minimum, brightness is maximum and definition is the highest owing to be positioned at, therefore, and through to one in specific area, brightness and the definition or multinomially can find out the light spot image that is positioned at the focal plane.Present embodiment is an example with the definition, sees Fig. 2, when the focus of laser beam drops on position B or C place; The definition of light spot image is minimum, and through moving up and down laser Machining head 10, the focus of laser beam drops on the somewhere between B and the C; Computer 13 compares the definition of the light spot image between this, finds out the highest clear light spot image, i.e. the light spot image of A position; That is to say the position at place, focal plane, then, computer 13 is according to the displacement of the pairing laser Machining head 10 of this light spot image; Control laser Machining head 10 upwards or move down makes laser beam just in time drop on A place, and promptly the laser beam that sends of laser instrument 11 passes through the reflection of semi-permeable and semi-reflecting mirror 7; And after being focused on by focus lamp group 5, the laser spot after coming out from nozzle 3 just in time drops on the workpiece to be machined 2, and this moment, focusing work was accomplished.
(c), at last, carry out the location work of initial position.
The direction that will parallel along processing platform 1 surface defocused laser Machining head 10; Move near the processing initial point D of workpiece to be machined 2; The image D1 that gathers processing initial point D through camera 8 in advance is stored in the computer 13; After passing through image preliminary treatment, removal noise and interference then, the center of circle that obtains image D1 again through center of circle location algorithm; Open the indication light source of laser instrument 11; Gather the light spot image D2 of this position through camera 8, then through after the image preliminary treatment, removing noise and interference, the center of circle that obtains image D2 again through center of circle location algorithm; Owing to be pre-determined bit; The center of circle of D2 does not overlap (see figure 3) with the center of circle of D1, obtains the positional information between the center of circle of the center of circle and D1 of D2 through calculating, all around moves according to this positional information control laser Machining head 10.This kind method is simple to operate, and positioning accuracy can reach 0.05mm.
This moment, the work of whole focusing location was accomplished, and regulated laser instrument 11 then to light source for processing, can carry out Laser Processing.
More than be merely specific embodiment of the present invention, do not limit protection scope of the present invention with this; Any replacement and the improvement on the basis of not violating the present invention's design, done all belong to protection scope of the present invention.
Claims (4)
1. the focusing localization method of a based on initial laser processing position is characterized in that comprising the steps:
(a) workpiece to be machined is placed on the processing platform, opens laser instrument, the light beam that laser instrument sends is incident upon the surface of workpiece to be machined through the light path system of laser Machining head, forms hot spot;
(b) along moving laser Machining head with the perpendicular direction in processing platform surface; And use the camera that is synchronized with the movement with this laser Machining head to gather light spot image in real time; And transfer to Computer Processing; Computer compares the attribute of the light spot image that obtains, and confirms to be positioned at the light spot image of focal plane, and regulates the position of laser Machining head in processing platform surface vertical direction on this basis;
(c) move the processing initial point D of laser Machining head to workpiece to be machined along the direction that parallels with the processing platform surface near; Camera collection is processed the image D1 of initial point D and is gone out the light spot image D2 under the light state at laser instrument; Obtain the center of D1 and D2 respectively, and regulate the position of laser Machining head on this basis in processing platform surface parallel direction;
Also be provided with the light path system aligning step before in step (a): the nozzle with said laser Machining head unloads earlier; The reference circle that a center has cross wire is set on said processing platform then; Move laser Machining head; Make the sleeve of laser Machining head coaxial, adjust said camera again, the cross wire of camera and the cross wire of this reference circle are coincided with this reference circle; Open laser instrument then, adjust the deflection angle of the speculum of said laser Machining head, spot center is overlapped with the cross wire of camera; At last said nozzle is loaded onto, the position of fine setting nozzle makes nozzle aperture center overlap with the cross wire crosspoint of camera.
2. the focusing localization method of based on initial laser processing position according to claim 1, it is characterized in that: in the step (b), the attribute of the light spot image that computer obtains is one or more in brightness, definition and the area.
3. the focusing localization method of based on initial laser processing position according to claim 1; It is characterized in that: the speculum of said laser Machining head is a semi-permeable and semi-reflecting mirror; The light beam that said laser instrument sends forms hot spot through the surface at workpiece to be machined after the reflection of this semi-permeable and semi-reflecting mirror, and this light spot image sees through this semi-permeable and semi-reflecting mirror and gets into said camera.
4. the focusing localization method of based on initial laser processing position according to claim 3, it is characterized in that: said laser Machining head is laser cutting head or laser welding system.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2535180Y (en) * | 2002-02-07 | 2003-02-12 | 武汉楚天激光（集团）股份有限公司 | Optical zoom apparatus of coaxial display and location measurement for laser processing |
| CN1990154A (en) * | 2005-12-28 | 2007-07-04 | 山崎马扎克公司 | Optical path axis aligning device of laser beam machine |
| CN201693290U (en) * | 2010-04-22 | 2011-01-05 | 广州中国科学院工业技术研究院 | Laser processing device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01218788A (en) * | 1988-02-26 | 1989-08-31 | Mitsubishi Electric Corp | Laser beam machine |
| JP2000042775A (en) * | 1998-07-28 | 2000-02-15 | Amada Co Ltd | Laser beam machining method and its device |
| JP2001150171A (en) * | 1999-11-26 | 2001-06-05 | Nippon Sharyo Seizo Kaisha Ltd | Focus adjustment method and apparatus for laser beam machine |
-
2010
- 2010-04-22 CN CN2010101590474A patent/CN101856773B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2535180Y (en) * | 2002-02-07 | 2003-02-12 | 武汉楚天激光（集团）股份有限公司 | Optical zoom apparatus of coaxial display and location measurement for laser processing |
| CN1990154A (en) * | 2005-12-28 | 2007-07-04 | 山崎马扎克公司 | Optical path axis aligning device of laser beam machine |
| CN201693290U (en) * | 2010-04-22 | 2011-01-05 | 广州中国科学院工业技术研究院 | Laser processing device |
Non-Patent Citations (3)
| Title |
|---|
| JP平1-218788A 1989.08.31 |
| JP特开2000-42775A 2000.02.15 |
| JP特开2001-150171A 2001.06.05 |
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