CN109407479B - Laser direct-writing focusing device and laser direct-writing focusing method - Google Patents
Laser direct-writing focusing device and laser direct-writing focusing method Download PDFInfo
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- CN109407479B CN109407479B CN201710713385.XA CN201710713385A CN109407479B CN 109407479 B CN109407479 B CN 109407479B CN 201710713385 A CN201710713385 A CN 201710713385A CN 109407479 B CN109407479 B CN 109407479B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7026—Focusing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
A laser direct-writing focusing device comprises a fine adjustment mechanism, a bearing platform and an imaging system, wherein the fine adjustment mechanism and the bearing platform are arranged oppositely, the fine adjustment mechanism comprises a fine adjustment driver, a movable frame and a displacement sensor, the imaging system comprises a direct-writing lens, and the fine adjustment driver, the displacement sensor and the direct-writing lens are connected with the movable frame respectively. The laser direct writing focusing device can ensure that the distance between the direct writing lens and the photoetching plate is within the focal depth range of the direct writing lens, and can solve the problem that the automatic focusing cannot be realized under the condition that the thickness of the photoetching plate is greatly changed. The invention also relates to a laser direct writing focusing method.
Description
Technical Field
The invention relates to the technical field of projection lithography, in particular to a laser direct-writing focusing device and a laser direct-writing focusing method.
Background
Photolithography is a technique used to print a pattern of features on a substrate surface. Such substrates can be used in the manufacture of semiconductor devices, various integrated circuits, flat panel displays (e.g., liquid crystal displays), circuit boards, biochips, micromechanical electronic chips, optoelectronic circuit chips, and the like.
In a lithography system of a direct-write lithography machine, a characteristic pattern is generated by a spatial light modulator micromirror array, and these tiny mirrors can independently address individually controlled light beams reflected and irradiated in different oblique directions to generate spatial light intensity modulation, and finally the characteristic pattern is projected on a substrate through a direct-write lens.
In practical applications, the direct-writing lens can automatically focus according to the thickness of the substrate to be exposed. However, when the thickness of the substrate changes beyond the depth of focus of the direct-writing lens, the moving direction of the lens at the initial stage cannot be confirmed by judging focusing simply by means of the imaging definition of the lens, so that full-automatic focusing of substrates with different thicknesses cannot be realized.
Disclosure of Invention
The invention aims to provide a laser direct-writing focusing device which can ensure that the distance between a direct-writing lens and a photoetching plate is within the focal depth range of the direct-writing lens and can solve the problem that the laser direct-writing focusing device cannot automatically focus under the condition that the thickness of the photoetching plate is greatly changed.
The technical problem to be solved by the invention is realized by adopting the following technical scheme.
A laser direct-writing focusing device comprises a fine adjustment mechanism, a bearing platform and an imaging system, wherein the fine adjustment mechanism and the bearing platform are arranged oppositely, the fine adjustment mechanism comprises a fine adjustment driver, a movable frame and a displacement sensor, the imaging system comprises a direct-writing lens, and the fine adjustment driver, the displacement sensor and the direct-writing lens are connected with the movable frame respectively.
In a preferred embodiment of the present invention, the movable frame is disposed opposite to the carrying platform, and a displacement sensor and a direct writing lens are connected to one side of the movable frame close to the carrying platform.
In a preferred embodiment of the present invention, the fine adjustment mechanism further includes a fixed frame, the fixed frame is disposed above the bearing platform, the fine adjustment driver is connected to the fixed frame, and a driving end of the fine adjustment driver is connected to the movable frame.
In a preferred embodiment of the present invention, the supporting platform includes a base and a supporting plate for supporting the photolithography plate, and the supporting plate is movably connected to the base in a horizontal plane.
In a preferred embodiment of the present invention, the imaging system further includes a light source, a spatial light modulator, a lens assembly and a monitor, the light source is used for illuminating the spatial light modulator, the lens assembly is disposed above the direct writing lens, the pattern light emitted from the spatial light modulator passes through the lens assembly and the direct writing lens and is imaged on the photolithography mask, and the monitor is disposed above the lens assembly.
Another objective of the present invention is to provide a laser direct writing focusing method, which can ensure that the distance between the direct writing lens and the photolithography mask is within the focal depth range of the direct writing lens, and can solve the problem that the photolithography mask cannot be automatically focused when the thickness of the photolithography mask changes greatly.
A laser direct writing focusing method utilizes the laser direct writing focusing device and comprises the following steps:
placing a photoetching plate on a bearing platform, and moving the photoetching plate to the position below a direct-writing lens; and
and carrying out position compensation on the direct-writing lens.
In a preferred embodiment of the present invention, the step of performing position compensation on the direct writing lens comprises:
measuring the distance between the direct writing lens and the photoetching plate by using a displacement sensor;
calculating the distance deviation between the distance and the direct-writing lens focusing distance;
and driving the direct writing lens to move close to or far away from the photoetching plate by utilizing the fine adjustment driver according to the distance deviation.
In a preferred embodiment of the present invention, the step of performing coarse position adjustment on the direct writing lens comprises:
taking the current position of the direct-writing lens as a first reference position;
using the first reference bit as a starting point, driving the direct writing lens to move a first preset distance towards the direction close to the photoetching plate by using the fine tuning driver;
driving the direct-writing lens to move towards the direction far away from the photoetching plate, and acquiring a pair of patterns and positions of the direct-writing lens corresponding to the recorded patterns at intervals of a first interval by using a monitor until the direct-writing lens moves to a first preset distance above a first reference position;
and determining the pattern with the highest definition and the corresponding position of the direct-writing lens, and driving the direct-writing lens to move to the corresponding position by using the fine adjustment driver.
In a preferred embodiment of the present invention, the step of performing coarse position adjustment on the direct writing lens comprises:
taking the current position of the direct-writing lens as a first reference position;
using the first reference bit as a starting point, driving the direct writing lens to move a first preset distance in a direction away from the photoetching plate by using the fine tuning driver;
driving the direct-writing lens to move towards the direction close to the photoetching plate, and acquiring a pair of patterns and positions of the direct-writing lens corresponding to the recorded patterns at intervals of a first interval by using a monitor until the direct-writing lens moves to a first preset distance below a first reference position;
and determining the pattern with the highest definition and the corresponding position of the direct-writing lens, and driving the direct-writing lens to move to the corresponding position by using the fine adjustment driver.
In a preferred embodiment of the present invention, the step of fine-tuning the position of the direct writing lens includes:
taking the position of the direct-writing lens determined during coarse adjustment as a second reference position;
using the second reference bit as a starting point, using the fine tuning driver to drive the direct writing lens to move a second preset distance towards the direction close to the photolithography plate;
driving the direct-writing lens to move towards the direction far away from the photoetching plate, and acquiring a pair of patterns and the positions of the direct-writing lens corresponding to the recorded patterns by using a monitor at intervals of a second interval until the direct-writing lens moves to a second preset distance above a second reference position;
and determining the pattern with the highest definition and the corresponding position of the direct-writing lens, and driving the direct-writing lens to move to the corresponding position by using the fine adjustment driver.
In a preferred embodiment of the present invention, the step of fine-tuning the position of the direct writing lens includes:
taking the position of the direct-writing lens determined during coarse adjustment as a second reference position;
using the second reference bit as a starting point, using the fine tuning driver to drive the direct writing lens to move a second preset distance in a direction away from the photolithography plate;
driving the direct-writing lens to move towards the direction close to the photoetching plate, and acquiring a pair of patterns and recording the positions of the direct-writing lens corresponding to the patterns by using a monitor at intervals of a second interval until the direct-writing lens moves to a second preset distance above a second reference position;
and determining the pattern with the highest definition and the corresponding position of the direct-writing lens, and driving the direct-writing lens to move to the corresponding position by using the fine adjustment driver.
The fine adjustment mechanism of the laser direct-writing focusing device is arranged opposite to the bearing platform, the fine adjustment mechanism comprises a fine adjustment driver, a movable frame and a displacement sensor, the imaging system comprises a direct-writing lens, and the fine adjustment driver, the displacement sensor and the direct-writing lens are respectively connected with the movable frame. The laser direct-writing focusing device measures the distance between the laser direct-writing focusing device and the photoetching plate through the displacement sensor, calculates the distance of the direct-writing lens needing to be roughly adjusted, can ensure that the distance between the direct-writing lens and the photoetching plate is within the focal depth range of the direct-writing lens, and can well solve the problem that the laser direct-writing focusing device cannot automatically focus under the condition that the thickness of the photoetching plate is greatly changed.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are specifically described in detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic structural diagram of a laser direct writing focusing device of the present invention.
Fig. 2 is a schematic front view of the fine adjustment mechanism of the present invention.
Fig. 3a is a schematic flow chart of a laser direct writing focusing method according to the present invention.
Fig. 3b is a schematic flow chart of the position compensation of the direct lens according to the present invention.
Fig. 4a is a schematic flow chart of coarse position adjustment of the direct-writing lens according to an embodiment of the present invention.
Fig. 4b is a schematic flow chart illustrating a coarse position adjustment of a direct-writing lens according to another embodiment of the present invention.
Fig. 5a is a schematic flow chart illustrating the fine adjustment of the position of the direct-writing lens according to an embodiment of the present invention.
Fig. 5b is a schematic flow chart of fine position adjustment of the direct-writing lens according to another embodiment of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description will be made on the specific implementation, structure, features and effects of the laser direct writing focusing device and the laser direct writing focusing method according to the present invention with reference to the accompanying drawings and preferred embodiments as follows:
the foregoing and other technical contents, features and effects of the present invention will be apparent from the following detailed description of preferred embodiments, which is to be read in connection with the accompanying drawings. While the present invention has been described in connection with the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but is intended to cover various modifications, equivalent arrangements, and specific embodiments thereof.
Fig. 1 is a schematic structural diagram of a laser direct writing focusing device of the present invention. As shown in fig. 1, the laser direct writing focusing apparatus 100 includes a fine adjustment mechanism 10, a carrying platform 20 and an imaging system 30.
Fig. 2 is a schematic front view of the fine adjustment mechanism of the present invention. As shown in fig. 1 and fig. 2, the fine adjustment mechanism 10 is disposed opposite to the carrying platform 20, and the fine adjustment mechanism 10 is disposed above the carrying platform 20, but not limited thereto. The fine adjustment mechanism 10 comprises a fixed frame 12, a fine adjustment driver 13, a movable frame 14 and a displacement sensor 15; the fixed frame 12 is fixed above the bearing platform 20, the fine tuning driver 13 is connected to the fixed frame 12, and a driving shaft of the fine tuning driver 13 is connected with the movable frame 14, that is, the fine tuning driver 13 can drive the movable frame 14 to move back and forth towards or away from the bearing platform 20; a displacement sensor 15 is attached to the movable frame 14, and the displacement sensor 15 is used for measuring the distance between the displacement sensor 15 and the bearing platform 20. In the present embodiment, the adjustment range of the fine actuator 13 is ± 5mm, and preferably, the fine actuator 13 is a high-precision voice coil motor or a linear motor, but not limited thereto.
The supporting platform 20 includes a base 22 and a supporting plate 23 for supporting the photolithography plate 100a, and the supporting plate 23 is movably attached to the base 22 in a horizontal plane. In this embodiment, the carrier plate 23 can move along two directions perpendicular to each other in a horizontal plane, so that the lithography spot and the lithography plate 100a move relatively, and a pattern with a certain breadth is depicted.
As shown in FIG. 1, imaging system 30 includes a direct-write lens 32, a light source 33, a spatial light modulator 34, a lens assembly 35, and a monitor 36. The direct-writing lens 32 is connected to the movable frame 14 and located on one side of the displacement sensor 15, the movable frame 14 is arranged opposite to the bearing platform 20, and the displacement sensor 15 and the direct-writing lens 32 are connected to one side of the movable frame 14 close to the bearing platform 20, that is, the displacement sensor 15 and the direct-writing lens 32 are located above the bearing platform 20. The light source 33 is used to generate a laser light source 33 that illuminates the spatial light modulator 34; the spatial light modulator 34 is used to display a focus pattern; the lens assembly 35 is arranged above the direct-writing lens 32, and the pattern light emitted by the spatial light modulator 34 passes through the lens assembly 35 and the direct-writing lens 32 and then is imaged on the photoetching plate 100 a; a monitor 36 is disposed above the lens assembly 35, and the monitor 36 is used for monitoring the imaging pattern on the reticle 100 a. In the present embodiment, the monitor 36 employs a CCD for collecting and monitoring the lithography pattern, but not limited thereto.
The laser direct writing focusing device 100 of the present invention can perform full automatic focusing during photolithography, and especially can realize automatic focusing for a photolithography mask 100a with a large thickness variation, for example, when the thickness variation of the position to be lithographed of the photolithography mask 100a is larger than the focal depth of the direct writing lens 32, the distance between the photolithography mask 100a and the displacement sensor 15 is measured by the displacement sensor 15, and the distance deviation between the current distance and the distance when the direct writing lens 32 is in focus is calculated; the fine actuator 13 drives the direct-write lens 32 to move toward or away from the reticle 100a according to the calculated distance deviation until the direct-write lens 32 stops when the auto-focusing is achieved.
Fig. 3a is a schematic flow chart of a laser direct writing focusing method according to the present invention. As shown in fig. 1 and fig. 3, the laser direct-writing focusing method of the present invention utilizes the above-mentioned laser direct-writing focusing device 100, and the steps of the laser direct-writing focusing method include:
step S1, placing a photoetching plate 100a on a bearing platform 20, and moving the photoetching plate to a position below a direct writing lens 32; and
step S2, position compensation is performed on the direct writing lens 32.
Fig. 3b is a schematic flow chart of the position compensation of the direct lens according to the present invention. As shown in fig. 1, 3a and 3b, the step of performing position compensation on the write lens 32 includes:
step S1', measuring the distance between the direct-writing lens 32 and the reticle 100a by using the displacement sensor 15;
step S2', calculating the distance deviation between the distance and the in-focus distance of the direct-writing lens 32; specifically, the thickness of the photolithography mask 100a changes greatly, and the distance between the minimum thickness position and the maximum thickness position of the photolithography mask 100a is greater than the focal depth of the direct-writing lens 32, at this time, the distance between the displacement sensor 15 and the photolithography mask 100a is measured by using the displacement sensor 15, and the distance deviation between the current distance and the focal depth of the direct-writing lens 32 is calculated; if the current distance is smaller than the distance when the direct writing lens 32 is in focus, the distance deviation is a positive value, which indicates that the position of the photolithography plate 100a is a protrusion protruding from the surface of the photolithography plate 100 a; when the current distance is larger than the distance when the direct-writing lens 32 is in focus, the distance deviation is negative, indicating that the position of the optical writing plate 100a is a groove recessed below the surface of the optical writing plate 100 a.
Step S3', the fine adjustment driver 13 is used to drive the direct writing lens 32 to move closer to or away from the photolithography plate 100a according to the distance deviation; specifically, when the distance deviation is positive, the fine actuator 13 is used to drive the direct-writing lens 32 to move away from the photolithography board 100 a; when the distance deviation is negative, the direct-write lens 32 is driven by the fine actuator 13 to move toward the direction of approaching the reticle 100 a.
Fig. 4a is a schematic flow chart of coarse position adjustment of the direct-writing lens according to an embodiment of the present invention. As shown in fig. 1 and 4a, the step of performing coarse position adjustment on the direct writing lens 32 includes:
in step M1, the current position of the direct writing lens 32 is used as a first reference position.
Step M2, using the first reference bit as a starting point, using the fine tuning driver 13 to drive the direct writing lens 32 to move a first predetermined distance toward the direction close to the photolithography plate 100 a; specifically, the light source 33 is turned on to make the laser light illuminate the focus pattern displayed by the spatial light modulator 34, the pattern light emitted from the spatial light modulator 34 sequentially passes through the lens assembly 35 and the direct-writing lens 32 and then is imaged on the reticle 100a, and then the fine tuning driver 13 drives the direct-writing lens 32 to move a first preset distance (the first preset distance is, for example, 100um, but not limited thereto) toward the reticle 100a with the first reference position as a starting point.
Step M3, driving the direct writing lens 32 to move towards a direction away from the photolithography plate 100a, and collecting a sub pattern and recording the position of the direct writing lens 32 corresponding to the sub pattern by using the monitor 36 at every other first interval until the direct writing lens moves to a first preset distance above the first reference position; specifically, the fine actuator 13 drives the direct-write lens 32 to move in a direction away from the reticle 100a until the direct-write lens moves a first predetermined distance (the first predetermined distance is, for example, 100um, but not limited thereto) above a first reference position, and during the moving process, the monitor 36 is used to capture a sub-pattern and a position of the direct-write lens 32 corresponding to the recorded pattern at every other first interval (the first interval is, for example, 5um, but not limited thereto).
And step M4, determining the pattern with the highest definition and the corresponding position of the direct-writing lens 32, and driving the direct-writing lens 32 to move to the corresponding position by using the fine adjustment driver 13.
Fig. 4b is a schematic flow chart of coarse position adjustment of the direct-writing lens according to another embodiment of the present invention. As shown in fig. 1 and 4b, the step of performing coarse position adjustment on the direct writing lens 32 includes:
in step M1', the current position of the direct writing lens 32 is used as the first reference position.
Step M2', using the first reference bit as a starting point, using the fine tuning driver 13 to drive the direct writing lens 32 to move a first predetermined distance in a direction away from the reticle 100 a; specifically, the light source 33 is turned on to enable the laser to illuminate the focusing pattern displayed by the spatial light modulator 34, the pattern light emitted by the spatial light modulator 34 sequentially passes through the lens assembly 35 and the direct-writing lens 32 and is then imaged on the reticle 100a, and then the fine tuning driver 13 is used to drive the direct-writing lens 32 to move a first preset distance (the first preset distance is, for example, 100um, but not limited thereto) in a direction away from the reticle 100a with the first reference position as a starting point.
Step M3', the direct-writing lens 32 is driven to move towards the direction close to the reticle 100a, a sub-pattern is collected by the monitor 36 every other first interval and the position of the direct-writing lens 32 corresponding to the sub-pattern is recorded until the direct-writing lens moves to a first preset distance below the first reference position; specifically, the fine actuator 13 drives the direct-write lens 32 to move toward the direction close to the reticle 100a to a first predetermined distance (the first predetermined distance is, for example, 100um, but not limited thereto) below the first reference level, and during the moving process, the monitor 36 collects a pair of patterns and positions of the direct-write lens 32 corresponding to the recorded patterns at intervals of a first interval (the first interval is, for example, 5um, but not limited thereto).
And step M4', determining the pattern with the highest definition and the corresponding position of the direct-writing lens 32, and driving the direct-writing lens 32 to move to the corresponding position by using the fine adjustment driver 13.
Fig. 5a is a schematic flow chart illustrating a process of fine-tuning a position of a direct-writing lens according to an embodiment of the invention. As shown in fig. 1, 4a, 4b and 5a, the step of fine-adjusting the position of the direct writing lens 32 includes:
step N1, the position of the direct writing lens 32 determined during coarse adjustment is used as a second reference position; specifically, after the pattern with the highest definition and the position corresponding to the direct-writing lens 32 are determined, the fine actuator 13 is used to drive the direct-writing lens 32 to move to the position, and the position is used as the second reference position.
Step N2, using the second reference bit as a starting point, using the fine tuning driver 13 to drive the direct writing lens 32 to move a second predetermined distance toward the direction close to the photolithography plate 100 a; specifically, the fine actuator 13 drives the direct-write lens 32 to move a second predetermined distance (the second predetermined distance is, for example, 5um, but not limited thereto) toward the direction of the reticle 100a starting from the second reference position.
Step N3, driving the direct-writing lens 32 to move towards a direction away from the photolithography mask, collecting a pair of patterns at intervals of a second distance by using the monitor 36, and recording the positions of the direct-writing lens 32 corresponding to the patterns until the direct-writing lens 32 moves to a second preset distance above a second reference position; specifically, the moving speed of the direct-write lens 32 is controlled to be less than 2um/s, the moving distance of the direct-write lens 32 is controlled to be 2 times of the second preset distance, that is, the direct-write lens 32 is moved to the second preset distance above the second reference position, the acquisition frequency of the monitor 36 is controlled to be 100Hz, and the monitor 36 is used for acquiring a pair of patterns and recording the positions of the direct-write lens 32 corresponding to the patterns at intervals in the moving process of the direct-write lens 32.
And step N4, determining the pattern with the highest definition and the corresponding position of the direct-writing lens 32, and driving the direct-writing lens 32 to move to the corresponding position by using the fine adjustment driver 13.
Fig. 5b is a schematic flow chart of fine position adjustment of the direct-writing lens according to another embodiment of the present invention. As shown in fig. 1, 4a, 4b and 5b, the step of fine-tuning the position of the direct writing lens 32 includes:
step N1', the position of the direct writing lens 32 determined during coarse adjustment is used as a second reference position; specifically, after the pattern with the highest definition and the position corresponding to the direct-writing lens 32 are determined, the fine actuator 13 is used to drive the direct-writing lens 32 to move to the position, and the position is used as the second reference position.
Step N2', using the second reference position as a starting point, the fine tuning driver 13 drives the direct writing lens 32 to move a second predetermined distance in a direction away from the reticle 100 a; specifically, the fine tuning driver 13 drives the direct-writing lens 32 to move a second predetermined distance (for example, the second predetermined distance is 5um, but not limited thereto) away from the reticle 100a by using the second reference position as a starting point.
Step N3', the direct writing lens 32 is driven to move towards the direction close to the photolithography mask, and a monitor 36 is used to collect a pair of patterns at intervals of a second distance and record the position of the direct writing lens 32 corresponding to the patterns until the direct writing lens moves to a second preset distance below a second reference position; specifically, the moving speed of the direct-writing lens 32 is controlled to be less than 2um/s, the distance of the direct-writing lens 32 is controlled to be 2 times of the second preset distance, that is, the direct-writing lens 32 is moved to the second preset distance below the second reference position, the acquisition frequency of the monitor 36 is controlled to be 100Hz, and the monitor 36 is used for acquiring one pattern and recording the position of the direct-writing lens 32 corresponding to the pattern at intervals in the moving process of the direct-writing lens 32.
And step N4', determining the pattern with the highest definition and the corresponding position of the direct-writing lens 32, and driving the direct-writing lens 32 to move to the corresponding position by using the fine adjustment driver 13.
The fine adjustment mechanism 10 of the laser direct writing focusing device 100 of the present invention is disposed opposite to the carrying platform 20, the fine adjustment mechanism 10 includes a fine adjustment driver 13, a movable frame 14 and a displacement sensor 15, the imaging system 30 includes a direct writing lens 32, and the fine adjustment driver 13, the displacement sensor 15 and the direct writing lens 32 are respectively connected to the movable frame 14. The laser direct writing focusing device 100 of the invention measures the distance between the laser direct writing focusing device and the photoetching plate 100a through the displacement sensor 15, calculates the distance of the direct writing lens 32 to be adjusted, can ensure that the distance between the direct writing lens 32 and the photoetching plate 100a is within the focal depth range of the direct writing lens 32, and can well solve the problem that the automatic focusing cannot be realized under the condition that the thickness of the photoetching plate 100a is greatly changed.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention. The various features described in the foregoing detailed description may be combined in any suitable manner without departing from the scope of the invention. The invention is not described in detail in order to avoid unnecessary repetition.
Claims (9)
1. A laser direct writing focusing device is characterized by comprising a fine adjustment mechanism (10), a bearing platform (20) and an imaging system (30), wherein the fine adjustment mechanism (10) is arranged opposite to the bearing platform (20), the fine adjustment mechanism (10) comprises a fine adjustment driver (13), a movable frame (14) and a displacement sensor (15), the imaging system (30) comprises a direct writing lens (32), the fine adjustment driver (13), the displacement sensor (15) and the direct writing lens (32) are respectively connected with the movable frame (14), the bearing platform (20) comprises a base (22) and a bearing plate (23) used for bearing a photoetching plate, the bearing plate (23) is movably connected to the base (22) in a horizontal plane, when the thickness change of a position to be photoetched of the photoetching plate is larger than the focal depth of the direct writing lens (32), the distance between the photoetching plate and the displacement sensor (15) is measured through the displacement sensor (15), and the deviation between the current distance and the distance when the direct writing lens (32) is aligned is calculated; the fine adjustment driver (13) drives the direct writing lens (32) to move towards a direction close to or away from the photoetching plate according to the calculated distance deviation until the direct writing lens (32) stops when the imaging system (30) can realize automatic focusing, the imaging system (30) further comprises a light source (33), a spatial light modulator (34), a lens assembly (35) and a monitor (36), the light source (33) is used for illuminating the spatial light modulator (34), the lens assembly (35) is arranged above the direct writing lens (32), pattern light emitted by the spatial light modulator (34) passes through the lens assembly (35) and the direct writing lens (32) and is imaged on the photoetching plate, the monitor (36) is arranged above the lens assembly (35), the fine adjustment driver (13) drives the direct writing lens (32) to move, the monitor (36) collects a sub-pattern at every other first interval and records the position of the direct writing lens (32) corresponding to the pattern, and when the determined pattern with the highest definition and the corresponding position of the direct writing lens (32) are determined, the fine adjustment driver (13) drives the direct writing lens (32) to move to the position corresponding to the position of the direct writing lens (32).
2. The laser direct-writing focusing device according to claim 1, wherein the movable frame (14) is disposed opposite to the carrying platform (20), and one side of the movable frame (14) close to the carrying platform (20) is connected to the displacement sensor (15) and the direct-writing lens (32).
3. The laser direct-writing focusing device according to claim 1, wherein the fine adjustment mechanism (10) further comprises a fixed frame (12), the fixed frame (12) is disposed above the carrying platform (20), the fine adjustment driver (13) is connected to the fixed frame (12), and a driving end of the fine adjustment driver (13) is connected to the movable frame (14).
4. A laser direct-writing focusing method, wherein the laser direct-writing focusing method utilizes the laser direct-writing focusing device of any one of claims 1 to 3, and the steps of the laser direct-writing focusing method comprise:
placing the photoetching plate on a bearing platform (20) and moving the photoetching plate to the position below a direct writing lens (32); and
the position of the direct-write lens (32) is compensated.
5. The laser direct-write focusing method according to claim 4, wherein the step of performing position compensation on the direct-write lens (32) comprises:
measuring the distance between the direct writing lens (32) and the photoetching plate by using a displacement sensor (15);
calculating the distance deviation between the distance and the in-focus distance of the direct writing lens (32);
and driving the direct-writing lens (32) to move close to or away from the photoetching plate by using a fine adjustment driver (13) according to the distance deviation.
6. The laser direct-write focusing method according to claim 4, wherein the step of coarsely adjusting the position of the direct-write lens (32) comprises:
using the current position of the direct-writing lens (32) as a first reference position;
using the first reference bit as a starting point, using a fine tuning driver (13) to drive the direct writing lens (32) to move a first preset distance towards a direction close to the photolithography plate;
driving the direct-writing lens (32) to move towards a direction far away from the photoetching plate, and acquiring a pair of patterns at intervals of a first interval by using a monitor (36) and recording the positions of the direct-writing lens (32) corresponding to the patterns until the direct-writing lens moves to a first preset distance above a first reference position;
determining the pattern with the highest definition and the corresponding position of the direct-writing lens (32), and driving the direct-writing lens (32) to move to the corresponding position by using the fine adjustment driver (13).
7. The laser direct-write focusing method according to claim 4, wherein the step of coarsely adjusting the position of the direct-write lens (32) comprises:
using the current position of the direct-writing lens (32) as a first reference position;
using the first reference bit as a starting point, using a fine tuning driver (13) to drive the direct writing lens (32) to move a first preset distance in a direction away from the photolithography plate;
driving the direct-write lens (32) to move towards the direction close to the photoetching plate, and acquiring a pair of patterns at intervals of a first interval by using a monitor (36) and recording the positions of the direct-write lens (32) corresponding to the patterns until the direct-write lens moves to a first preset distance below a first reference position;
determining the pattern with the highest definition and the corresponding position of the direct-writing lens (32), and driving the direct-writing lens (32) to move to the corresponding position by using the fine adjustment driver (13).
8. The laser direct-write focusing method according to claim 6 or 7, wherein the step of finely adjusting the position of the direct-write lens (32) comprises:
using the position of the direct-writing lens (32) determined during the coarse adjustment as a second reference position;
using the second reference bit as a starting point, using the fine tuning driver (13) to drive the direct-writing lens (32) to move a second preset distance toward the direction close to the photolithography plate;
driving the direct-writing lens (32) to move towards a direction far away from the photoetching plate, and acquiring a pair of patterns at intervals of a second interval by using the monitor (36) and recording the positions of the direct-writing lens (32) corresponding to the patterns until the direct-writing lens moves to a second preset distance above a second reference position;
determining the pattern with the highest definition and the corresponding position of the direct-writing lens (32), and driving the direct-writing lens (32) to move to the corresponding position by using the fine adjustment driver (13).
9. The laser direct-writing focusing method according to claim 6 or 7, wherein the step of finely adjusting the position of the direct-writing lens (32) comprises:
using the position of the direct-writing lens (32) determined during the coarse adjustment as a second reference position;
using the second reference bit as a starting point, using the fine tuning driver (13) to drive the direct writing lens (32) to move a second preset distance in a direction away from the photolithography plate;
driving the direct-writing lens (32) to move towards the direction close to the photoetching plate, and acquiring a pair of patterns at intervals of a second interval by using the monitor (36) and recording the positions of the direct-writing lens (32) corresponding to the patterns until the direct-writing lens moves to a second preset distance above a second reference position;
determining the pattern with the highest definition and the corresponding position of the direct-writing lens (32), and driving the direct-writing lens (32) to move to the corresponding position by using the fine adjustment driver (13).
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| CN116068848A (en) | 2021-11-03 | 2023-05-05 | 长鑫存储技术有限公司 | Photomask detection system and method |
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| KR20110087401A (en) * | 2010-01-26 | 2011-08-03 | 삼성전자주식회사 | Auto focusing device and method of maskless exposure apparatus |
| CN101856773B (en) * | 2010-04-22 | 2012-08-22 | 广州中国科学院工业技术研究院 | Focusing positioning method based on initial laser processing position and laser processing device |
| CN102231051A (en) * | 2011-05-20 | 2011-11-02 | 合肥芯硕半导体有限公司 | Pneumatic automatic focusing device and method of photoetching machine |
| CN102248284B (en) * | 2011-06-03 | 2014-04-09 | 中国科学院上海光学精密机械研究所 | High-speed direct writing device for grating |
| CN102967983A (en) * | 2012-11-07 | 2013-03-13 | 苏州科达科技股份有限公司 | Automatic focusing method of camera |
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