CN205650938U - Laser beam machining device based on two coaxial CCD carry out vision positioning - Google Patents
Laser beam machining device based on two coaxial CCD carry out vision positioning Download PDFInfo
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- CN205650938U CN205650938U CN201620247085.8U CN201620247085U CN205650938U CN 205650938 U CN205650938 U CN 205650938U CN 201620247085 U CN201620247085 U CN 201620247085U CN 205650938 U CN205650938 U CN 205650938U
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- ccd module
- ccd
- galvanometer
- mirror
- laser
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Abstract
The utility model discloses a laser beam machining device based on two coaxial CCD carry out vision positioning, its including be used for placing the processing platform of waiting to process the work piece, source of illumination, highly pass through speculum, a CCD module, control computer, laser instrument, shake the mirror and set up in the income light side of the mirror that shakes just with mirror the 2nd coaxial CCD module that shakes. Control computer is respectively with laser instrument, a CCD module, the 2nd CCD module, mirror electric connection shakes. The laser of laser instrument transmission shines to waiting to process the work piece through the 2nd CCD module, the mirror that shakes, the high speculum that passes through. Wait that the light of processing the work piece reflection is divided into first light path and second light path through the high speculum that passes through, the high speculum that passes through of first light path warp incides a CCD module, and the second light path incides the 2nd CCD module through high speculum, the mirror that shakes thoroughly. The combination of a CCD module and the 2nd CCD module had both enlarged the vision positioning breadth, had promoted positioning accuracy, had solved the severe precision problem that the mirror drift of shaking led to the fact simultaneously.
Description
Technical field
This utility model relates to technical field of laser processing, particularly relates to one and carries out vision calmly based on two coaxial CCD
The laser processing device of position.
Background technology
Laser Processing has become as the important processing method of modern manufacturing, particularly in Precision Machining, micro Process field, and bag
Include cutting, marking, spray printing, hole, carve, scanning etc..Laser Processing has been widely used in microelectronics, liquid crystal, separation film, survey
The fields such as amount, medical treatment, automobile, nano material, space flight.
Along with science and technology development, modern precision manufacture to Laser Processing the accuracy of form and position, flexible adaptation, intellectuality
More and more higher with efficiency requirements.The laser-processing system of low requirement does not has vision localization function, the laser-processing system of high request
Generally with visual system, including paraxonic CCD system and coaxial CCD system etc..
The sight path of paraxonic CCD system and laser optical path are structurally branches, add that man-hour requirement is rigid is divided into bat
Take the photograph, position, move three actions of galvanometer, therefore can cause the vibration of small workpiece, displacement and machining deviation, process speed simultaneously
Degree is slow, affect machining accuracy.
The coaxial CCD system that vision breadth is little exists image the problems such as distortion and aberration, therefore limits its application model
Enclose and positioning precision.The coaxial CCD system that vision breadth is big is usually present the location that the drift of galvanometer self cannot be overcome to cause
Deviation, need to affect service efficiency and convenience to being frequently corrected visual system and galvanometer system during use.
In view of this, it is necessary in fact to provide a kind of positioning precision and deviations that galvanometer drift can be overcome to cause of promoting
Laser processing device is to solve the defect of prior art.
Utility model content
Technical problem to be solved in the utility model be to provide a kind of based on two coaxial CCD carry out vision localization swash
Optical machining device, it carries out being accurately positioned to promote picture quality and positioning precision by the coaxial CCD module that vision breadth is big,
Meanwhile, detect whether galvanometer occurs that skew and appearance are carried out after offseting in time in real time by the coaxial CCD module that vision breadth is little
Correct the defect caused to overcome galvanometer to drift about.
In order to solve the problems referred to above, this utility model provide a kind of based on two coaxial CCD carry out vision localization swash
Optical machining device, including the processing platform for placing workpiece to be processed, is arranged at the lighting source above processing platform, height thoroughly
Reflecting mirror, a CCD module, control computer, laser instrument, galvanometer and be arranged at the incident side of galvanometer and coaxial with galvanometer
2nd CCD module.Control computer to be electrically connected with laser instrument, a CCD module, the 2nd CCD module, galvanometer respectively.Laser
The laser that device is launched exposes to workpiece to be processed through the 2nd CCD module, galvanometer, high transflector mirror.The light of workpiece to be processed reflection
Line is divided into the first light path and the second light path through high transflector mirror, and the first light path incides a CCD module through high transflector mirror, the
Two light paths incide the 2nd CCD module through high transflector mirror, galvanometer.
Preferably, it is provided with between laser instrument and the 2nd CCD module and coaxially expands for the laser that laser instrument is sent
Beam expanding lens.
Preferably, the light emission side of galvanometer is provided with the field lens for being focused laser.
Compared with prior art, this utility model by the coaxial CCD module that vision breadth is big carry out location improve fixed
Position precision, meanwhile, by the coaxial CCD module that vision breadth is little detect in real time galvanometer whether occur skew and occur skew after and
Time be corrected overcoming galvanometer and drift about the defect caused, thus improve process velocity and widened range of application.
Accompanying drawing explanation
Fig. 1 is a kind of embodiment of laser processing device that this utility model carries out vision localization based on two coaxial CCD
Frame structure schematic diagram.
Fig. 2 is the laser processing of the laser processing device enforcement carrying out vision localization based on two coaxial CCD of Fig. 1
A kind of schematic flow sheet of embodiment.
Detailed description of the invention
For making the purpose of this utility model, technical scheme and advantage clearer, new to this practicality below in conjunction with accompanying drawing
Type embodiment is described in further detail.
The one that Fig. 1 illustrates the laser processing device that this utility model carries out vision localization based on two coaxial CCD is real
Execute example.In the present embodiment, should include for placing to be added based on the laser processing device that two coaxial CCD carry out vision localization
The processing platform 1 of work workpiece, the lighting source 2 above processing platform 1, high transflector mirror the 3, the oneth CCD module 4 are set, control
Computer 5, laser instrument 7, galvanometer 6 and be arranged at the incident side of galvanometer 6 and the twoth CCD module 10 coaxial with galvanometer 6.Its
In, the 2nd CCD module 10 includes high transflector mirror 9.Control computer 5 respectively with laser instrument the 7, the oneth CCD module the 4, the 2nd CCD
Module 10, galvanometer 6 are electrically connected with.Workpiece to be processed is provided with original position point.Workpiece to be processed or processing platform 1 are fixedly installed
Identification point.
Lighting source 2 sends illuminating bundle and irradiates workpiece to be processed, and the light of illuminating bundle is on the surface of workpiece to be processed
Occurring reflection to be incident to a CCD module 4 through high transflector mirror 3, a CCD module 4 gathers the first image of workpiece to be processed
First image information is also sent to controlling computer 5 by information, and optical axis and a CCD module 4 of illuminating bundle gather the first figure
Light shaft coaxle as information.After control computer 5 receives this first image information, obtain the galvanometer origin position letter of galvanometer 6
Initial Working position information corresponding with original position point in breath and the first image information.Control computer 5 former according to galvanometer
Dot position information, initial Working position information and preset coordinate system generate control command and control galvanometer 6 by control command
The galvanometer initial point causing galvanometer 6 overlaps with original position point.What the oneth CCD module 4 of the present embodiment gathered is workpiece to be processed
Surface reflection and through whole light of high transflector mirror 3 transmission, therefore, the vision breadth of a CCD module 4 is big, therefore, the
The first image information ratio that one CCD module 4 obtains is more visible, therefore carries out the positioning precision positioned based on the first image information
High.
The laser that laser instrument 7 sends forms machining beams expose to workpiece to be processed with logical through high transflector mirror 9, galvanometer 6
Cross machining beams and realize the process operation to workpiece to be processed.2nd CCD module 10 gathers work to be processed by high transflector mirror 3
Second image information is also sent to controlling computer 5, the optical axis of machining beams and the 2nd CCD module by the second image information of part
10 light shaft coaxles gathering the second image information.Control the computer 5 identification point position according to the identification point in the second image information
Confidence breath and preset standard dot position information judge whether galvanometer 6 drift occurs.If skew occurs in galvanometer 6, control 5, computer
Generate control command according to identification point positional information, preset standard dot position information and preset coordinate system and adjusted by control command
Whole galvanometer 6.The 2nd CCD module 10 of the present embodiment is arranged at the incident side of galvanometer 6 and coaxial with galvanometer 6.2nd CCD module 10
Coaxial with galvanometer 6 and be same light beam by the 2nd CCD module 10 and galvanometer 6, therefore, the 2nd CCD module 10 can essence
Really and timely detect whether galvanometer drift occurs.
In other examples, it is provided with between laser instrument 7 and the 2nd CCD module 10 for swashing that laser instrument 7 is sent
The beam expanding lens 8 that light coaxially expands.The present embodiment uses beam expanding lens 8 coaxially to expand laser, improves beam propagation
The angle of divergence so that beam path alignment.
In other examples, the light emission side of galvanometer 6 is provided with the field lens 11 for being focused laser.This enforcement
Example is focused operation by field lens 11 to laser, causes at workpiece to be processed less at the hot spot formed, and meets more essence
The higher precision machined demand of density.
Fig. 2 illustrate this utility model based on two coaxial CCD carry out vision localization laser processing device implement swash
A kind of embodiment of light processing method.In the present embodiment, the Laser Processing side of vision localization should be carried out based on two coaxial CCD
Method comprises the steps:
Step S1, workpiece to be processed is placed on processing platform, and workpiece to be processed is provided with original position point, workpiece to be processed or
Processing platform is fixedly installed identification point.
Step S2, lighting source sends illuminating bundle and irradiates workpiece to be processed.
Step S3, a CCD module gathers the first image information of workpiece to be processed and by first by high transflector mirror
Image information sends to controlling computer.
Step S4, with start bit in the galvanometer origin position information of control computer acquisition galvanometer and the first image information
Put a corresponding initial Working position information.
Step S5, controls computer according to galvanometer origin position information, initial Working position information and preset coordinate system
Generate control command and cause the galvanometer initial point of galvanometer to overlap with original position point by control command control galvanometer.
Step S6, the laser that laser instrument sends transmits to galvanometer after beam expanding lens coaxially expands.
Step S7, field lens forms machining beams after being focused the laser that galvanometer exports processing and irradiates through high transflector mirror
To workpiece to be processed to be realized the process operation to workpiece to be processed by machining beams.
Step S8, the 2nd CCD module gathers the second image information of workpiece to be processed and by second by high transflector mirror
Image information sends to controlling computer, and the optical axis that the optical axis of machining beams and the 2nd CCD module gather the second image information is same
Axle.
Step S9, controls computer according to the identification point positional information of the identification point in the second image information and preset standard
Dot position information judges whether galvanometer drift occurs.If skew occurs in galvanometer, perform step S10, if skew does not occurs in galvanometer, hold
Row step S7.
Step S10, controls computer according to identification point positional information, preset standard dot position information and preset coordinate system
Generate control command and adjust galvanometer by control command, performing step S1.
Above the detailed description of the invention of utility model is described in detail, but it has been only used as example, this utility model
It is not limiting as and specific embodiments described above.For a person skilled in the art, any this utility model is entered
The equivalent modifications of row or substitute the most all among category of the present utility model, therefore, without departing from spirit of the present utility model and
The impartial conversion made under spirit and amendment, improvement etc., all should contain in the range of this utility model.
Claims (3)
1. the laser processing device carrying out vision localization based on two coaxial CCD, it is characterised in that include treating for placement
Process the processing platform of workpiece, be arranged at the lighting source above processing platform, high transflector mirror, a CCD module, control meter
Calculation machine, laser instrument, galvanometer and be arranged at the incident side of described galvanometer and the twoth CCD module coaxial with described galvanometer；Described
Control computer to be electrically connected with described laser instrument, a described CCD module, described 2nd CCD module, described galvanometer respectively；
The laser that described laser instrument is launched exposes to described to be processed through described 2nd CCD module, described galvanometer, described high transflector mirror
Workpiece；The light of described workpiece to be processed reflection is divided into the first light path and the second light path through described high transflector mirror, and described first
Light path incides a described CCD module through described high transflector mirror, described second light path through described high transflector mirror, described in shake
Mirror incides described 2nd CCD module.
The laser processing device carrying out vision localization based on two coaxial CCD the most according to claim 1, its feature exists
In, it is provided with between described laser instrument and described 2nd CCD module and coaxially expands for the laser that described laser instrument is sent
Beam expanding lens.
The laser processing device carrying out vision localization based on two coaxial CCD the most according to claim 1, its feature exists
In, the light emission side of described galvanometer is provided with the field lens for being focused laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620247085.8U CN205650938U (en) | 2016-03-29 | 2016-03-29 | Laser beam machining device based on two coaxial CCD carry out vision positioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620247085.8U CN205650938U (en) | 2016-03-29 | 2016-03-29 | Laser beam machining device based on two coaxial CCD carry out vision positioning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205650938U true CN205650938U (en) | 2016-10-19 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620247085.8U Withdrawn - After Issue CN205650938U (en) | 2016-03-29 | 2016-03-29 | Laser beam machining device based on two coaxial CCD carry out vision positioning |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105598579A (en) * | 2016-03-29 | 2016-05-25 | 深圳英诺激光科技有限公司 | Laser processing device and method for carrying out vision positioning based on two coaxial CCDs |
| CN106454048A (en) * | 2016-07-29 | 2017-02-22 | 大族激光科技产业集团股份有限公司 | Pseudo coaxial CCD shooting system and laser processing device employing the system |
| CN107953028A (en) * | 2017-12-28 | 2018-04-24 | 东莞市盛雄激光设备有限公司 | A kind of monitoring device of bessel beam |
| CN109877319A (en) * | 2018-12-29 | 2019-06-14 | 西安铂力特增材技术股份有限公司 | A kind of more galvanometer laser precision splicing calibration methods |
| CN109926736A (en) * | 2019-04-10 | 2019-06-25 | 英诺激光科技股份有限公司 | A kind of device and method using high frequency nanosecond optical-fiber laser cutting battery pole piece |
-
2016
- 2016-03-29 CN CN201620247085.8U patent/CN205650938U/en not_active Withdrawn - After Issue
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105598579A (en) * | 2016-03-29 | 2016-05-25 | 深圳英诺激光科技有限公司 | Laser processing device and method for carrying out vision positioning based on two coaxial CCDs |
| CN106454048A (en) * | 2016-07-29 | 2017-02-22 | 大族激光科技产业集团股份有限公司 | Pseudo coaxial CCD shooting system and laser processing device employing the system |
| CN106454048B (en) * | 2016-07-29 | 2019-12-24 | 大族激光科技产业集团股份有限公司 | Pseudo-coaxial CCD shooting system and laser processing device adopting same |
| CN107953028A (en) * | 2017-12-28 | 2018-04-24 | 东莞市盛雄激光设备有限公司 | A kind of monitoring device of bessel beam |
| CN107953028B (en) * | 2017-12-28 | 2019-11-26 | 东莞市盛雄激光先进装备股份有限公司 | A kind of monitoring device of bessel beam |
| CN109877319A (en) * | 2018-12-29 | 2019-06-14 | 西安铂力特增材技术股份有限公司 | A kind of more galvanometer laser precision splicing calibration methods |
| CN109877319B (en) * | 2018-12-29 | 2021-11-23 | 西安铂力特增材技术股份有限公司 | Multi-galvanometer laser precision splicing calibration method |
| CN109926736A (en) * | 2019-04-10 | 2019-06-25 | 英诺激光科技股份有限公司 | A kind of device and method using high frequency nanosecond optical-fiber laser cutting battery pole piece |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Shenzhen, Nanshan District science and Technology Park, North District, Long Hill Road, No. two, No. 8, Qing Guang photoelectric building, the Office (305) Patentee after: Innovo laser Polytron Technologies Inc Patentee after: CHANGZHOU YINGWEI LASER TECHNOLOGY CO., LTD. Address before: 518000 Shenzhen, Nanshan District science and Technology Park, North District, Long Hill Road, No. two, No. 8, Qing Guang photoelectric building, the Office (305) Patentee before: Shenzhen Inno Laser Technology Co., Ltd. Patentee before: CHANGZHOU YINGWEI LASER TECHNOLOGY CO., LTD. |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20161019 Effective date of abandoning: 20170801 |