CN110560890A - Imaging system of laser processing head and laser processing equipment with same - Google Patents
Imaging system of laser processing head and laser processing equipment with same Download PDFInfo
- Publication number
- CN110560890A CN110560890A CN201910844448.4A CN201910844448A CN110560890A CN 110560890 A CN110560890 A CN 110560890A CN 201910844448 A CN201910844448 A CN 201910844448A CN 110560890 A CN110560890 A CN 110560890A
- Authority
- CN
- China
- Prior art keywords
- imaging
- light
- laser
- imaging system
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 226
- 238000012545 processing Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 claims description 9
- 238000003754 machining Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides an imaging system of a laser processing head and a laser processing device with the same. The imaging system includes: the beam combining mirror and the surface of the workpiece to be processed form an included angle alpha; the field lens and the beam combining lens are arranged from top to bottom; the light source emitting part is positioned between the workpiece to be processed and the beam combining mirror; and the imaging part is used for reflecting the light emitted by the light source emitting part along the surface vertical to the workpiece to be processed to form imaging light, and the imaging light reaches the imaging part after being reflected by the beam combining mirror. The technical scheme of the invention solves the problem of inaccurate laser processing caused by poor imaging quality in the prior art.
Description
Technical Field
The invention relates to the field of laser processing, in particular to an imaging system of a laser processing head and laser processing equipment with the imaging system.
Background
the laser processing technology is a one-step processing technology for cutting, welding, surface processing, punching, micromachining, and the like of a material by utilizing the interaction characteristic of a laser beam and a substance. The laser processing equipment generally comprises a light path system, an imaging system, a motion system and the like, wherein the imaging system can image the surface of a workpiece to be engraved in the processing process, the calculation of the positions of characteristic points in the image is realized through a software algorithm, and the visual positioning of the workpiece and the online monitoring of the surface quality of the workpiece are achieved.
In the prior art, an imaging system of a laser processing head is a rear coaxial imaging system. In the rear coaxial imaging system, imaging light rays need to sequentially pass through a field lens, a beam combiner and an imaging objective lens and finally reach a camera for imaging. The method has the defects that the image is easily influenced by field lens design parameters, the image is easily distorted, and the authenticity of the image and the accuracy of laser processing are further influenced. In other words, the imaging system of the prior art has the problem that the laser processing is not accurate enough due to poor imaging quality.
Disclosure of Invention
The invention mainly aims to provide an imaging system of a laser processing head and laser processing equipment with the imaging system, so as to solve the problem that laser processing is not accurate enough due to poor imaging quality in the prior art.
In order to achieve the above object, according to one aspect of the present invention, there is provided an imaging system of a laser processing head, the imaging system including: the beam combining mirror and the surface of the workpiece to be processed form an included angle alpha; the field lens and the beam combining lens are arranged from top to bottom; the light source emitting part is positioned between the workpiece to be processed and the beam combining mirror; and the imaging part is used for reflecting the light emitted by the light source emitting part along the surface vertical to the workpiece to be processed to form imaging light, and the imaging light reaches the imaging part after being reflected by the beam combining mirror.
Furthermore, the beam combining mirror is provided with a first surface and a second surface which are oppositely arranged, the first surface faces the field lens, the second surface faces the workpiece to be processed, and the first surface is provided with a laser antireflection film; or a laser antireflection film is arranged on the second surface; or the first surface and the second surface are both provided with laser antireflection films; the second surface is provided with an imaging light reflection increasing film so that the beam combining mirror reflects the imaging light.
further, the included angle α is greater than 0 ° and equal to or less than 90 °.
Further, the light source emitting portion is provided with a through hole for transmitting the laser light and the imaging light.
Further, the imaging part comprises an imaging lens and a camera connected with the imaging lens, and imaging light reflected by the beam combiner passes through the imaging lens to form an image at the camera.
Furthermore, the imaging system also comprises a shell, the shell is provided with an inner cavity and a first opening communicated with the inner cavity, the field lens and the beam combining lens are both positioned in the inner cavity, and the imaging part and the light source emitting part are both positioned outside the shell.
Further, the imaging system also comprises a transparent plate arranged at the first opening, and the transparent plate is positioned between the beam combiner and the light source emitting part.
the light source transmitting part is arranged on the first surface of the transparent plate, and the light source transmitting part is arranged on the second surface of the transparent plate; or a laser antireflection film and/or an imaging light antireflection film are/is arranged on the second surface of the transparent plate; or the first surface of the transparent plate and the second surface of the transparent plate are both provided with a laser antireflection film and/or an imaging light antireflection film.
Furthermore, the imaging system also comprises a galvanometer, the galvanometer and the field lens are sequentially arranged along the propagation direction of the laser, and the galvanometer is positioned outside the shell.
Furthermore, the shell is also provided with a second opening communicated with the inner cavity, the second opening is formed in the side wall of the shell corresponding to the beam combiner, the imaging system further comprises a first cover plate located at the second opening, and the first cover plate is detachably connected with the shell.
Furthermore, the shell is also provided with a third opening communicated with the inner cavity, the third opening is formed in the side wall of the shell corresponding to the beam combiner, the imaging system further comprises a second cover plate located at the third opening, and the second cover plate is detachably connected with the shell.
Further, the second opening and the third opening are symmetrically disposed with respect to a center line of the housing.
According to another aspect of the present invention, there is provided a laser processing apparatus including a laser processing head and a laser emitting portion for emitting laser light, the laser light emitted by the laser emitting portion laser-processing a workpiece to be processed by the laser processing head, the laser processing head including the above-described imaging system.
Furthermore, the laser sequentially penetrates through the field lens and the beam combining lens, passes through the light source emitting part and then irradiates the surface of the workpiece to be processed.
by applying the technical scheme of the invention, the imaging light can reach the imaging part after being reflected by the beam combiner without sequentially passing through a field lens, the beam combiner and other components as in the prior art, so that the middle link of the imaging light reaching the imaging part is less, the reflection of the beam combiner only changes the light path direction of the imaging light, and the imaging influence on the imaging light is less, therefore, a real image with small distortion can be formed on the imaging part, the imaging quality is higher, the observation of an imaging system on a workpiece to be processed and the capture of the image are facilitated, and the accuracy of laser processing is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
Fig. 1 shows a schematic optical path diagram of an embodiment of an imaging system of a laser processing head according to the invention;
Figure 2 shows a front view structural schematic of an embodiment of an imaging system of a laser processing head according to the invention; and
Fig. 3 shows a rear view of an embodiment of the imaging system of the laser processing head according to the invention.
Wherein the figures include the following reference numerals:
10. laser; 20. a workpiece to be processed; 30. a beam combining mirror; 40. a light source emitting section; 41. imaging light; 50. an imaging section; 51. an imaging lens; 52. a camera; 60. a field lens; 70. a galvanometer; 80. a transparent plate; 90. a housing; 100. a first cover plate; 110. and a second cover plate.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
It is noted that, unless otherwise indicated, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
In the present invention, unless specified to the contrary, use of the terms of orientation such as "upper, lower, top, bottom" or the like, generally refer to the orientation as shown in the drawings, or to the component itself in a vertical, perpendicular, or gravitational orientation; likewise, for ease of understanding and description, "inner and outer" refer to the inner and outer relative to the profile of the components themselves, but the above directional words are not intended to limit the invention.
In order to solve the problems of large image distortion and low image authenticity of an imaging system of a laser processing head in the prior art, the invention and the embodiment of the invention provide the imaging system of the laser processing head.
As shown in fig. 1, in an embodiment of the present invention, an imaging system of a laser processing head includes a beam combiner 30, a field lens 60, a light source emitting portion 40, and an imaging portion 50, where an included angle α is formed between the beam combiner 30 and a surface of a workpiece 20 to be processed, the field lens 60 and the beam combiner 30 are sequentially disposed along a propagation direction of laser light 10, the field lens 60 is used to focus the laser light 10, the light source emitting portion 40 is located between the workpiece 20 to be processed and the beam combiner 30, the laser light 10 sequentially penetrates through the field lens 60 and the beam combiner 30 and passes through the light source emitting portion 40 to irradiate on the surface of the workpiece 20 to be processed, light emitted by the light source emitting portion 40 is reflected along a direction perpendicular to the surface of the workpiece 20 to be processed to form imaging light 41, and the imaging light 41 is reflected by the beam combiner 30 to reach the imaging portion 50.
In the above technical solution, the light emitted by the light source emitting portion 40 is irradiated onto the surface of the workpiece 20 to be processed and reflected by the surface of the workpiece 20 to be processed, a part of the light reflected by the surface of the workpiece 20 to be processed forms an imaging light 41, the imaging light 41 is perpendicular to the surface of the workpiece 20 to be processed and propagates in a direction away from the surface of the workpiece 20 to be processed, the imaging light 41 propagates to the beam combining mirror 30, the propagation direction of the light path of the imaging light is changed after being reflected by the beam combining mirror 30, the imaging portion 50 is used for capturing the imaging light 41 reflected by the beam combining mirror 30, and the imaging light 41 reflected by the beam combining mirror 30 forms an image at the imaging portion 50. In other words, the imaging light 41 perpendicular to the surface of the workpiece 20 to be processed is reflected by the beam combiner 30 and reaches the imaging unit 50 to be imaged.
Specifically, the imaging portion 50 directly captures the imaging light 41 reflected from the surface of the workpiece 20 to be processed, the reflection of the beam combining mirror 30 only changes the optical path direction of the imaging light 41, the imaging influence on the imaging light 41 is small, and the imaging light 41 does not need to pass through a field lens as in the prior art, the number of intermediate links when the imaging light 41 reaches the imaging portion 50 is small, the influence on the imaging light 41 in the process of reaching the imaging portion 50 is small, which is beneficial for the imaging portion 50 to capture the image, therefore, the imaging light 41 is not affected by the field lens design parameters, the image formed by the imaging light 41 at the imaging portion 50 can truly reflect the processing condition of the surface of the workpiece 20 to be processed, the image distortion is small, the imaging quality is high, and the imaging system is beneficial for the observation and the capture of the workpiece 20 to be processed, thereby improving the laser processing accuracy.
In other words, unlike the rear coaxial imaging system in the prior art, in the imaging system of the present application, the imaging light 41 reflected from the surface of the workpiece 20 to be processed sequentially passes through the beam combiner 30 and the imaging lens 51 to reach the camera 52, and the imaging light 41 does not pass through the field lens 60 and is not affected by the design parameters of the field lens 60, so that the imaging quality is not affected by replacing the field lens 60, which is different from the rear coaxial imaging system in the prior art, the imaging system of the present application can be referred to as a front imaging system.
In the prior art, there is also a paraxial imaging system, in which an included angle between an imaging ray and a surface of a workpiece to be processed is smaller than 90 °, and an imaging portion is obliquely arranged with respect to the workpiece to be processed, so that a formed image is an oblique surface and a surface condition of the workpiece cannot be truly reflected. In the present application, as shown in fig. 1, the imaging light 41 is perpendicular to the workpiece 20 to be processed, and the optical path of the imaging light 41 before being reflected by the beam combiner 30 is parallel to the propagation path of the laser light 10, and the imaging portion 50 captures the imaging light 41 perpendicular to the workpiece 20 to be processed, so that the image formed at the imaging portion 50 can accurately present the processing condition of the surface of the workpiece 20 to be processed, which is beneficial for the imaging system to observe the workpiece 20 to be processed, thereby being beneficial to improving the laser processing precision.
Optionally, in the embodiment of the present invention, the beam combining mirror 30 has a first surface and a second surface that are disposed opposite to each other, the first surface faces the field lens 60, the second surface faces the workpiece 20 to be processed, wherein the first surface and the second surface are both coated with a laser antireflection film, and the second surface is further coated with an imaging light reflection increasing film so that the beam combining mirror 30 reflects the imaging light 41.
Through the arrangement, the first surface and the second surface of the beam combiner 30 are both plated with the laser antireflection film, so that the transmission effect of the first surface and the second surface of the beam combiner 30 on the laser 10 can be increased, and the laser 10 can more easily penetrate through the beam combiner 30; meanwhile, the second surface of the beam combining mirror 30 is further coated with an imaging light reflection increasing film, so that the reflection effect of the second surface of the beam combining mirror 30 on the imaging light 41 can be increased, the reflection intensity of the imaging light 41 on the second surface of the beam combining mirror 30 is increased, and the imaging of the imaging light 41 at the imaging part 50 is clearer.
Of course, in an alternative embodiment not shown in the drawings of the present application, a laser antireflection film may be further added on only the first surface of the beam combiner 30 according to actual needs; alternatively, a laser antireflection film may be added only on the second surface of the beam combiner 30.
In the embodiments of the present invention, the included angle α is greater than 0 ° and equal to or less than 90 °. Preferably, as shown in fig. 1, in the embodiment of the present invention, the included angle α is 45 °.
That is, the beam combining mirror 30 is disposed at an angle of 45 ° with respect to the surface of the workpiece 20 to be processed, and by this arrangement, the propagation direction of the imaging light 41 reflected by the beam combining mirror 30 is parallel to the surface of the workpiece 20 to be processed, and the imaging light 41 reflected by the surface of the workpiece 20 to be processed enters the imaging part 50 after being reflected by the beam combining mirror 30.
The arrangement angle of the imaging part 50 changes with the change of the arrangement angle of the beam combiner 30, and it can be seen from the above that, when the included angle α between the beam combiner 30 and the surface of the workpiece 20 to be processed is 45 °, the propagation direction of the imaging light 41 reflected by the beam combiner 30 is parallel to the surface of the workpiece 20 to be processed, so that the determination of the position of the imaging part 50 in the imaging system is facilitated, and the image formed by the imaging light 41 at the imaging part 50 is also clearest, truest and less distorted.
Of course, in an alternative embodiment not shown in the drawings of the present application, the included angle α may be set to any value within 0 ° to 90 ° according to actual needs.
Alternatively, in the embodiment of the present invention, the light source emitting portion 40 is provided with a through hole for transmitting the laser light 10 and the imaging light 41.
In the embodiment of the invention, the laser 10 is focused at the field lens 60, the focused laser 10 transmits through the beam combining lens 30 and then propagates to the surface of the workpiece 20 to be processed, in the process, the laser 10 passes through a through hole which is arranged on the light source emitting part 40 and is used for transmitting the laser 10, and the laser 10 reaches the surface of the workpiece 20 to be processed and processes the workpiece 20 to be processed; the light source emitting part 40 is located between the workpiece 20 to be processed and the beam combining mirror 30, light reflected perpendicular to the surface of the workpiece 20 to be processed forms imaging light 41, and a through hole is formed in the light source emitting part 40 for transmitting the imaging light 41.
Further, the light source emitting portion 40 is a ring structure, the light source emitting portion 40 has a hollow portion to pass the laser light 10 and the image light 41, and the light source emitting portion 40 of the ring structure can provide light with uniform light brightness distribution.
Of course, in an alternative embodiment not shown in the drawings of the present application, a laser lamp may also be used as the light source emitting portion 40 according to actual needs.
Alternatively, as shown in fig. 1 to 3, in the embodiment of the present invention, the imaging part 50 includes an imaging lens 51 and a camera 52 connected to the imaging lens 51, and the imaging light 41 reflected by the beam combiner 30 passes through the imaging lens 51 to form an image at the camera 52.
In the embodiment of the present invention, an included angle α between the beam combiner 30 and the surface of the workpiece 20 to be processed is 45 °, after being reflected by the beam combiner 30, the propagation direction of the imaging light 41 is parallel to the surface of the workpiece 20 to be processed, along the propagation direction of the imaging light 41 reflected by the beam combiner 30, the imaging lens 51 and the camera 52 are sequentially disposed, and the imaging lens 51 and the camera 52 are disposed parallel to the surface of the workpiece 20 to be processed.
Optionally, as shown in fig. 2 and 3, in the embodiment of the present invention, the imaging system further includes a housing 90, the housing 90 has an inner cavity and a first opening communicating with the inner cavity, the field lens 60 and the beam combiner 30 are both located in the inner cavity, and the imaging part 50 and the light source emitting part 40 are both located outside the housing 90.
In the above arrangement, the housing 90 is used for accommodating and protecting the field lens 60 and the beam combiner 30, and the field lens 60 and the beam combiner 30 are prevented from being damaged.
Optionally, as shown in fig. 1, in the embodiment of the present invention, the imaging system further includes a transparent plate 80 disposed at the first opening, and the transparent plate 80 is located between the beam combiner 30 and the light source emitting part 40.
Specifically, the transparent plate 80 is disposed at a first opening of the housing 90, the transparent plate 80 and the first opening of the housing 90 form a window, the field lens 60, the beam combiner 30 and the transparent plate 80 are sequentially disposed along the propagation direction of the laser 10, as shown in fig. 1, the field lens 60, the beam combiner 30 and the transparent plate 80 are sequentially disposed in an inner cavity of the housing 90 from top to bottom, and the light source emitting portion 40 is disposed at the bottom of the housing 90, so as to conveniently illuminate the workpiece 20 to be processed.
With the above arrangement, on the one hand, the laser light 10 and the imaging light 41 can pass through the transparent plate 80, and on the other hand, the transparent plate 80 can make the inner cavity of the housing 90 in a relatively sealed state, thereby protecting the beam combiner 30 and the field lens 60 in the inner cavity and preventing dust and the like from entering the inner cavity of the housing 90 to pollute the optical device.
Optionally, the transparent plate 80 is glass.
Of course, in an alternative embodiment not shown in the drawings of the present application, the light source emitting portion 40 may also be disposed in the inner cavity of the housing 90 according to actual needs, and at this time, the field lens 60, the beam combiner 30, the light source emitting portion 40, and the transparent plate 80 are sequentially disposed along the propagation direction of the laser light 10.
Optionally, in the embodiment of the present invention, the transparent plate 80 has a first surface facing the beam combiner 30 and a second surface facing the light source emitting portion 40, where the first surface and the second surface are both coated with a laser antireflection film and an imaging light antireflection film.
Specifically, along the propagation direction of the laser light 10, the field lens 60, the beam combiner 30, the transparent plate 80 and the light source emitting part 40 are sequentially arranged, and the imaging light 41 sequentially passes through the light source emitting part 40 and the transparent plate 80 and then is reflected at the beam combiner 30, so that the propagation direction of the imaging light 41 can be changed, as can be seen from the above, the laser light 10 and the imaging light 41 both need to transmit through the transparent plate 80, and the first surface and the second surface of the transparent plate are both plated with a laser antireflection film and an imaging light antireflection film, so that the transmission effects of the first surface and the second surface of the transparent plate 80 on the laser light 10 and the imaging light 41 can be increased, and the laser light 10 and the imaging light 41 can more easily transmit through the transparent plate 80.
Of course, in an alternative embodiment not shown in the drawings of the present application, a laser antireflection film and/or an imaging light antireflection film may be further added on only the first surface of the transparent plate according to actual needs; or, only the second surface of the transparent plate is additionally provided with a laser antireflection film and/or an imaging light antireflection film; or, a laser antireflection film or an imaging light antireflection film is additionally arranged on the first surface of the transparent plate and the second surface of the transparent plate.
Optionally, as shown in fig. 1 to fig. 3, in an embodiment of the present invention, the imaging system further includes a galvanometer 70, the housing 90 further has a fourth opening communicated with the inner cavity, the galvanometer 70 is fixedly connected to the fourth opening of the housing 90, the galvanometer 70 is located outside the housing 90, and the galvanometer 70 and the field lens 60 are sequentially arranged along the propagation direction of the laser 10.
Specifically, the fourth opening is disposed at the top of the housing 90, and the fourth opening is communicated with the inner cavity, the galvanometer 70 is fixedly connected to the housing 90 at the fourth opening, the galvanometer 70 is located above the housing 90, and the galvanometer 70 and the field lens 60 are sequentially disposed along the propagation direction of the laser 10.
through the above arrangement, the laser 10 emitted by the laser emitting portion sequentially deflects through the galvanometer 70 and focuses through the field lens 60, then sequentially passes through the beam combining lens 30, the transparent plate 80 and the light source emitting portion 40, and finally reaches the surface of the workpiece 20 to be processed to process the workpiece 20 to be processed, wherein the galvanometer 70 adjusts the laser 10 through lens deflection to perform laser processing on the workpiece 20 to be processed according to a planned route.
Optionally, as shown in fig. 2, in an embodiment of the present invention, the housing 90 further has a second opening communicated with the inner cavity, the second opening is opened on a front side wall of the housing 90 corresponding to the beam combiner 30, the imaging system further includes a first cover plate 100 located at the second opening, and the first cover plate 100 is fixedly connected to the housing 90 through a bolt.
Specifically, the second opening sets up on the front end lateral wall of shell 90, and second opening and inner chamber intercommunication, and the second opening sets up with the beam combiner 30 that is arranged in the inner chamber of shell 90 correspondingly, and first apron 100 sets up at the second opening department, and first apron 100 passes through the bolt fastening in the place ahead of shell 90, takes off first apron 100 back, makes things convenient for operating personnel to adjust the angle that is arranged in beam combiner 30 of the inner chamber of shell 90 through the second opening.
Optionally, as shown in fig. 3, in an embodiment of the present invention, the housing 90 further has a third opening communicated with the inner cavity, the third opening is formed on a side wall of the housing 90 corresponding to the beam combiner 30, the imaging system further includes a second cover plate 110 located at the third opening, and the second cover plate 110 is fixedly connected to the housing 90 through a bolt.
Specifically, the third opening is disposed on a side wall of the rear end of the housing 90, the third opening is communicated with the inner cavity, the third opening is disposed corresponding to the beam combiner 30 located in the inner cavity of the housing 90, the second cover plate 110 is disposed at the third opening and fixed behind the housing 90 through a bolt, and after the second cover plate 110 is removed, an operator can adjust an angle of the beam combiner 30 located in the inner cavity of the housing 90 conveniently through the third opening.
Alternatively, in an embodiment of the present invention, the second opening and the third opening are symmetrically disposed with respect to a center line of the housing 90.
the invention and the embodiment thereof also provide laser processing equipment which comprises a laser processing head and a laser emitting part used for emitting laser 10, wherein the laser 10 emitted by the laser emitting part is used for carrying out laser processing on a workpiece 20 to be processed through the laser processing head, and the laser processing head comprises the imaging system. Since the laser machining apparatus includes the imaging system of the present application, the laser machining apparatus also has the above-described advantages of the imaging system of the laser machining head of the present application, and the description thereof is omitted.
The laser machining process and the imaging process of the present invention are described in detail below with reference to fig. 1:
The laser 10 emitted from the laser emitting part passes through the vibrating mirror 70 and the field lens 60 in sequence, and then the laser 10 sequentially passes through the beam combining mirror 30 and the transparent plate 80 after the deflection adjustment of the vibrating mirror 70 and the focusing of the field lens 60; then, the laser 10 passing through the beam combining mirror 30 and the transparent plate 80 passes through the through hole on the light source emitting part 40 and reaches the surface of the workpiece 20 to be processed, so that the workpiece 20 to be processed can be subjected to laser processing; meanwhile, the light emitted by the light source emitting portion 40 irradiates the surface of the workpiece 20 to be processed, after being reflected by the surface of the workpiece 20 to be processed, the light reflected perpendicular to the surface of the workpiece 20 to be processed forms imaging light 41, the imaging light 41 passes through the through hole in the light source emitting portion 40 and propagates in the direction away from the surface of the workpiece 20 to be processed, the imaging light 41 is reflected at the beam combining mirror 30 through the window, and the imaging light 41 reflected by the beam combining mirror 30 passes through the imaging lens 51 and is finally imaged at the camera 52.
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects: the imaging light formed by vertically reflecting the light emitted by the light source emitting part on the surface of the workpiece to be processed passes through the through hole on the light source emitting part and is transmitted to the beam combining mirror, and the imaging light reflected by the beam combining mirror passes through the imaging lens to be imaged at the camera. It can be known from the above that, the imaging light reflected from the surface of the workpiece to be processed reaches the camera through the beam combiner and the imaging lens in sequence, the imaging light does not pass through the field lens and is not influenced by the design parameters of the field lens, therefore, the replacement of the field lens does not affect the imaging quality, the imaging part directly captures the imaging light reflected from the surface of the workpiece to be processed, the reflection of the beam combiner only changes the light path direction of the imaging light, the imaging influence on the imaging light is small, and the imaging light does not need to pass through the field lens as in the prior art, the intermediate links where the imaging light reaches the imaging part are few, the influence on the imaging light in the process of reaching the imaging part is small, the imaging part is beneficial to capturing the image, therefore, the imaging light is not influenced by the design parameters of the field lens, the image formed by the imaging light at the imaging part can truly reflect the processing condition of the surface of the workpiece to be processed, and the image distortion is small, the imaging quality is high, the imaging system is favorable for observing the workpiece to be processed and capturing images, and therefore the laser processing precision can be improved; the imaging light is perpendicular to the workpiece to be processed, and the imaging part captures the imaging light perpendicular to the workpiece to be processed, so that an image formed at the imaging part can accurately show the processing condition of the surface of the workpiece to be processed, the imaging system is favorable for observing the workpiece to be processed, and the laser processing precision is improved.
It is to be understood that the above-described embodiments are only a few, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly dictates otherwise, and it should be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of features, steps, operations, devices, components, and/or combinations thereof.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (14)
1. An imaging system of a laser processing head, the imaging system comprising:
The beam combining mirror (30) and the surface of the workpiece (20) to be processed form an included angle alpha;
The field lens (60) and the beam combiner (30) are arranged from top to bottom;
A light source emitting part (40) positioned between the workpiece to be processed (20) and the beam combining mirror (30);
The imaging part (50), the light that the light source emission part (40) emitted forms formation of image light (41) after being perpendicular to the surface reflection of waiting to process work piece (20), form image light (41) reach after the beam combining mirror (30) reflection.
2. The imaging system of claim 1, wherein the beam combiner (30) has a first surface and a second surface arranged oppositely, the first surface facing the field lens (60) and the second surface facing the workpiece (20) to be processed, wherein a laser antireflection film is provided on the first surface; or a laser antireflection film is arranged on the second surface; or the first surface and the second surface are both provided with a laser antireflection film; an imaging light reflection increasing film is arranged on the second surface so that the beam combining mirror (30) reflects the imaging light (41).
3. the imaging system of claim 1, wherein the included angle a is greater than 0 ° and less than or equal to 90 °.
4. The imaging system according to claim 1, wherein the light source emitting portion (40) is provided with a through hole for transmitting the laser light (10) and the imaging light (41).
5. The imaging system according to any one of claims 1 to 4, wherein the imaging section (50) includes an imaging lens (51) and a camera (52) connected to the imaging lens (51), and the imaging light (41) reflected by the beam combiner (30) forms an image at the camera (52) after passing through the imaging lens (51).
6. The imaging system according to any one of claims 1 to 4, further comprising a housing (90), the housing (90) having an inner cavity and a first opening communicating with the inner cavity, the field lens (60) and the beam combiner (30) both being located in the inner cavity, the imaging section (50) and the light source emitting section (40) both being located outside the housing (90).
7. the imaging system of claim 6, further comprising a transparent plate (80) disposed at the first opening, the transparent plate (80) being located between the beam combiner (30) and the light source emitting portion (40).
8. The imaging system according to claim 7, wherein the transparent plate (80) has a first surface facing the beam combiner (30) and a second surface facing the light source emitting part (40), wherein the first surface is provided with a laser antireflection film and/or an imaging light antireflection film; or a laser antireflection film and/or an imaging light antireflection film are/is arranged on the second surface of the transparent plate; alternatively, the first and second electrodes may be,
And the first surface and the second surface of the transparent plate are both provided with a laser antireflection film and/or an imaging light antireflection film.
9. The imaging system of claim 6, further comprising a galvanometer (70), the galvanometer (70) being positioned in series with the field lens (60) along a direction of propagation of the laser light (10), the galvanometer (70) being located outside of the housing (90).
10. The imaging system of claim 6, wherein the housing (90) further has a second opening communicating with the internal cavity, the second opening being provided in a side wall of the housing (90) corresponding to the beam combiner (30), the imaging system further comprising a first cover plate (100) at the second opening, the first cover plate (100) being detachably connected to the housing (90).
11. The imaging system of claim 10, wherein the housing (90) further has a third opening communicating with the internal cavity, the third opening being provided in a side wall of the housing (90) corresponding to the combiner mirror (30), the imaging system further comprising a second cover plate (110) at the third opening, the second cover plate (110) being detachably connected to the housing (90).
12. The imaging system of claim 11, wherein the second and third openings are symmetrically disposed with respect to a centerline of the housing (90).
13. A laser machining apparatus comprising a laser machining head and a laser emitting portion for emitting laser light (10), the laser emitting portion emitting the laser light (10) to laser machine a workpiece (20) to be machined by the laser machining head, the laser machining head including the imaging system of any one of claims 1 to 12.
14. the laser processing apparatus according to claim 13, wherein the laser light (10) is irradiated onto the surface of the workpiece to be processed (20) after passing through the field lens (60) and the beam combiner (30) in this order and passing through the light source emitting portion (40).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910844448.4A CN110560890A (en) | 2019-09-06 | 2019-09-06 | Imaging system of laser processing head and laser processing equipment with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910844448.4A CN110560890A (en) | 2019-09-06 | 2019-09-06 | Imaging system of laser processing head and laser processing equipment with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110560890A true CN110560890A (en) | 2019-12-13 |
Family
ID=68778493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910844448.4A Pending CN110560890A (en) | 2019-09-06 | 2019-09-06 | Imaging system of laser processing head and laser processing equipment with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110560890A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204018961U (en) * | 2014-08-22 | 2014-12-17 | 湖北三江航天红峰控制有限公司 | A kind of coaxial confocal light path realizes the device of field lens locating focal plane |
| CN105598579A (en) * | 2016-03-29 | 2016-05-25 | 深圳英诺激光科技有限公司 | Laser processing device and method for carrying out vision positioning based on two coaxial CCDs |
| CN207824203U (en) * | 2017-11-27 | 2018-09-07 | 广东铭钰科技股份有限公司 | A kind of laser optical path control structure |
| CN208067557U (en) * | 2017-11-30 | 2018-11-09 | 杭州思元智能科技有限公司 | A kind of laser carving equipment |
| CN109664017A (en) * | 2018-12-25 | 2019-04-23 | 中国科学院西安光学精密机械研究所 | Realize device and method, the laser process equipment of laser scanning manufacturing monitoring and processing positioning |
| CN210937652U (en) * | 2019-09-06 | 2020-07-07 | 廊坊西波尔钻石技术有限公司 | Imaging system of laser processing head and laser processing equipment with same |
-
2019
- 2019-09-06 CN CN201910844448.4A patent/CN110560890A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204018961U (en) * | 2014-08-22 | 2014-12-17 | 湖北三江航天红峰控制有限公司 | A kind of coaxial confocal light path realizes the device of field lens locating focal plane |
| CN105598579A (en) * | 2016-03-29 | 2016-05-25 | 深圳英诺激光科技有限公司 | Laser processing device and method for carrying out vision positioning based on two coaxial CCDs |
| CN207824203U (en) * | 2017-11-27 | 2018-09-07 | 广东铭钰科技股份有限公司 | A kind of laser optical path control structure |
| CN208067557U (en) * | 2017-11-30 | 2018-11-09 | 杭州思元智能科技有限公司 | A kind of laser carving equipment |
| CN109664017A (en) * | 2018-12-25 | 2019-04-23 | 中国科学院西安光学精密机械研究所 | Realize device and method, the laser process equipment of laser scanning manufacturing monitoring and processing positioning |
| CN210937652U (en) * | 2019-09-06 | 2020-07-07 | 廊坊西波尔钻石技术有限公司 | Imaging system of laser processing head and laser processing equipment with same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10166630B2 (en) | Optical measuring device for monitoring a joint seam, joining head and laser welding head with same | |
| CN105643110B (en) | A kind of precise laser cutting system | |
| CN210937652U (en) | Imaging system of laser processing head and laser processing equipment with same | |
| US5260965A (en) | Laser processing apparatus and laser processing method | |
| JP2004349721A (en) | Laser irradiation source, material working device by laser irradiation source, and operation method of the material working device | |
| CN112828448B (en) | Three-dimensional scanning imaging processing equipment and processing method based on vibrating mirror | |
| CN102820217B (en) | Processing unit (plant) | |
| CN105252144B (en) | A kind of high-precision laser is servo-actuated cutting head and its monitoring and automatic focus searching method | |
| DE102013008774B3 (en) | Analysis device installed in laser processing machine for analyzing laser radiation, has beam sensor that analyzes laser radiation in main beam path, and optical devices that analyzes respective analysis beam aligned on beam sensor | |
| CN108614351B (en) | Microscope with rotatable objective lens | |
| CN117729983A (en) | Method for monitoring a laser welding process and related laser welding system | |
| JP2001287064A (en) | Visualizing device for laser beam welded zone | |
| CN110560890A (en) | Imaging system of laser processing head and laser processing equipment with same | |
| CN113305418A (en) | Coaxial focus searching device for laser processing and laser processing method | |
| JP5349352B2 (en) | Laser light state inspection method and apparatus, laser processing method and apparatus, and solar panel manufacturing method | |
| JP3512388B2 (en) | Laser processing monitoring device | |
| CN112975162B (en) | Ground glass cutting device and method based on adaptive optics | |
| CN111761203B (en) | High-magnification online real-time imaging device for laser processing | |
| IL141252A (en) | Method and device for non-destructive control of a surface using a dye product | |
| KR20050030006A (en) | Apparatus and method for femto-second laser machining | |
| CN115740738B (en) | Laser manufacturing system | |
| CN220881003U (en) | Laser double-observation system | |
| US11975402B2 (en) | Beam machining head and method for beam machining | |
| CN115121938B (en) | Laser head monitoring module, multiband laser optical path system and laser processing equipment | |
| KR102068021B1 (en) | Optical fiber fusion splicer comprising tracking camera |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |