JP2023502617A - Laser processing system and laser processing method - Google Patents

Abstract

The present invention provides a laser processing system and laser processing method. The present invention includes a laser oscillator that outputs a laser beam, a machining table on which a workpiece is attached and that moves in a preset direction, and a laser beam that is positioned between the laser oscillator and the machining table to emit a laser beam onto the workpiece. and a mirror for causing the laser beam output from the laser oscillator to enter the lens; A laser processing system is provided, comprising a laser processing apparatus including a first controller that adjusts the position of the laser beam.

Description

An embodiment of the present invention relates to a laser processing system and a laser processing method.

2. Description of the Related Art In recent years, display panels having various shapes or display panels realizing zero bezel as pixels are highly converged have been developed and produced. Such a display panel is formed by laminating a plurality of layers including a dielectric material, but in consideration of processing accuracy, a non-contact cutting method is used instead of a conventional contact cutting method. is used for cutting.

In the case of the conventional non-contact cutting method using a laser, after inputting in advance the coordinates of the design of the edge of the workpiece to be cut, the cutting is performed as it is according to the input coordinates. However, there may be an error between the design coordinates and the actual coordinates of the workpiece, and such an error is not constant. Large workpieces cannot be obtained.

Moreover, the conventional non-contact cutting method using a laser has the problem that it is difficult to control the laser processing apparatus in real time according to the shape of the workpiece.

The aforementioned background art is technical information possessed by the inventor for deriving the present invention or acquired in the process of deriving the present invention, and is not necessarily publicly known prior to the filing of the present invention. is not necessarily the technology of

An embodiment of the present invention is a laser processing system capable of performing various non-contact processing including cutting with high precision and controlling a laser processing device in real time according to the shape of a workpiece. An object of the present invention is to provide a laser processing method. However, the above-described problems relate to the embodiments of the present invention, and the objects and problems to be solved by the present invention are not limited thereto.

A laser processing system according to an embodiment of the present invention includes a laser oscillator that outputs a laser beam, a processing table on which a workpiece is attached and that moves in a preset direction, and a laser beam between the laser oscillator and the processing table. an optical unit that includes a lens for causing a laser beam to enter a workpiece and a mirror for causing a laser beam output from a laser oscillator to enter the lens; and a first controller that controls the mirror and adjusts the position of the laser beam incident on the lens.

The laser processing system and laser processing method according to the present invention can correct the difference between the design processing coordinates and the actual processing coordinates of the workpiece. Further, the laser processing system and laser processing method according to the present invention control the laser processing apparatus in real time according to the shape of the workpiece, thereby processing workpieces having various shapes with high precision and high speed. It can be carried out. In particular, the laser processing system and laser processing method according to the present invention can process the surface of the workpiece at various angles by controlling the incident path of the laser. Moreover, the laser processing system and the laser processing method according to the present invention can accurately process a workpiece including a dielectric.

1 is a diagram showing a laser processing system according to one embodiment of the present invention; FIG. Figure 2 shows the first controller of Figure 1; 2 is a diagram showing an example of positions of laser beams incident on the lens of FIG. 1; FIG. 2 is a diagram showing another example of positions of laser beams incident on the lens of FIG. 1; FIG. 5A to 5C are diagrams showing the machining state of the workpiece according to the positions of the laser beams shown in FIGS. FIG. 2 is a diagram showing a state in which a workpiece is processed using the laser processing system of FIG. 1; It is a figure which shows the inspection apparatus based on one Example of this invention. Figure 8 shows the second controller of Figure 7; FIG. 10 is a diagram showing a laser processing system according to another embodiment of the present invention; Figure 10 shows the first controller of Figure 9; It is a figure which shows the laser processing method based on other Example of this invention.

A laser processing system according to an embodiment of the present invention includes a laser oscillator that outputs a laser beam, a processing table on which a workpiece is attached and that moves in a preset direction, and a laser beam between the laser oscillator and the processing table. an optical unit that includes a lens for causing a laser beam to enter a workpiece and a mirror for causing a laser beam output from a laser oscillator to enter the lens; and a first controller that controls the mirror and adjusts the position of the laser beam incident on the lens.

In the laser processing system according to one embodiment of the present invention, the first controller controls the position of the laser beam incident on the lens along the circumferential direction of the lens and the position of the laser beam along the radial direction of the lens. At least one of the positions may be adjusted to adjust the angle of the laser beam incident on the workpiece.

In the laser processing system according to one embodiment of the present invention, the first controller makes the laser beam incident on the lens so that the processed surface of the workpiece has a predetermined inclination according to the shape of the edge of the workpiece. The position of the laser beam may be adjusted.

In a laser processing system according to an embodiment of the present invention, the first controller maintains a constant distance of the laser beam incident on the lens from the center of the lens according to the shape of the edge of the workpiece. You may adjust the position along the circumference direction of the laser beam which injects into.

In the laser processing system according to one embodiment of the present invention, the optical unit may move independently of the processing table.

In a laser processing system according to an embodiment of the present invention, an imaging unit that captures an image of a workpiece while moving in a preset direction and generates actual machining coordinates of the workpiece based on the captured image. The inspection device may further include a second controller.

In the laser processing system according to an embodiment of the present invention, the second controller compares a difference value between the designed processing coordinates and the actual processing coordinates with a preset threshold value, and if the difference value is equal to or less than the threshold value, , the actual machining coordinates may be transmitted to the first controller, and if the difference value exceeds a threshold value, it may be determined to interrupt the machining.

The laser processing system according to one embodiment of the present invention may include one or more inspection devices, and may include more laser processing devices than the number of inspection devices.

A laser processing method according to another embodiment of the present invention is a laser processing method in which a laser beam output from a laser oscillator is incident on a workpiece using an optical unit having a mirror and a lens, and a step of performing laser processing by controlling a mirror according to the acquired processing coordinates and adjusting the position of the laser beam incident on the lens.

In the laser processing method according to another embodiment of the present invention, the step of performing laser processing includes at least one of positions along the circumferential direction of the lens and positions along the radial direction of the lens with respect to the position of the laser beam incident on the lens. or one of them may be adjusted to adjust the angle of the laser beam incident on the workpiece.

In the laser processing method according to another embodiment of the present invention, the step of performing laser processing includes adjusting the lens so that the processed surface of the workpiece has a predetermined inclination according to the shape of the edge of the workpiece. The position of the incident laser beam may be adjusted.

In the laser processing method according to another embodiment of the present invention, the step of performing laser processing includes adjusting the lens so that the processed surface of the workpiece has a predetermined inclination according to the shape of the edge of the workpiece. The position of the incident laser beam may be adjusted.

In the laser processing method according to another embodiment of the present invention, the step of acquiring the processing coordinates of the workpiece includes the step of capturing an image of the workpiece with an imaging unit that moves in a preset direction; and obtaining actual machining coordinates of the workpiece based on.

In the laser processing method according to another embodiment of the present invention, after the step of obtaining the processing coordinates of the workpiece, the difference value between the pre-stored design processing coordinates and the actual processing coordinates is compared with a preset threshold value. replacing the designed machining coordinates with the actual machining coordinates if the difference value is less than or equal to the threshold; and determining to interrupt machining if the difference value exceeds the threshold.

Other aspects, features, and advantages in addition to those described above will become apparent from the following detailed description, claims, and drawings.

The present invention is capable of various modifications and has various embodiments, specific embodiments of which are illustrated in the drawings and will be described in detail in the description of the invention. However, it is not intended to limit the invention to any particular embodiment, but should be understood to encompass all modifications, equivalents or alternatives falling within the spirit and scope of the invention. . In the description of the present invention, the same components are given the same reference numerals even if they are shown in other embodiments.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. Terms may be used to distinguish one element from another.

The terminology used in this application is merely used to describe particular embodiments and is not intended to be limiting of the invention. In this application, terms such as "including" or "having" specify the presence of features, numbers, steps, acts, components, parts, or combinations thereof described herein; It should be understood by not precluding the possibility of the presence or addition of one or more other features, figures, steps, acts, components, parts, or combinations thereof.

The present invention will now be described in detail with reference to embodiments according to the present invention illustrated in the accompanying drawings.

FIG. 1 is a diagram showing a laser processing system 1 according to one embodiment of the present invention. FIG. 2 is a diagram showing the first controller 19 of FIG.

The laser processing system 1 according to one embodiment of the present invention may be used for various laser processing such as laser drilling including laser cutting, laser writing, laser patterning, laser scribing. However, below, for convenience of explanation, the laser processing system 1 will be described as being used for laser cutting. In addition, the kind of to-be-processed object W is not specifically limited. The workpiece W may be a metal sheet, a ceramic substrate, etc., as well as a display panel containing a dielectric material.

As shown in FIG. 1, the laser oscillator 11 is arranged on one side of the laser processing apparatus 10 . Laser oscillator 11 may comprise a laser source capable of generating and outputting a laser beam having a specific wavelength. The type of laser beam output from the laser oscillator 11 is not particularly limited, and may be appropriately selected according to the type of workpiece W and processing method. For example, the laser beams output from the laser oscillator 11 include solid-state laser beams such as ruby laser beams, Nd:YAG laser beams, and Ti:sapphire laser beams, liquid laser beams such as dye laser beams, and CO ₂ laser beams. gas laser beams, including He—Ne laser beams, Ar ⁺ laser beams, excimer laser beams, and the like. However, for convenience of explanation, the laser beam output from the laser oscillator 11 is assumed to be a CO ₂ laser beam. Also, the wavelength of the CO ₂ laser beam may be 9.3 μm or more and 10.6 μm or less.

The laser oscillator 11 is connected to a power supply (not shown), and can output a laser beam when power is applied from the power supply. Also, as shown in FIG. 1, the laser oscillator 11 is connected to the first controller 19 . The characteristics of the laser beam output from the laser oscillator 11 , such as the intensity, period, and output timing of the laser beam, can be controlled by signals generated by the first controller 19 .

Referring to FIG. 1, a laser processing apparatus 10 according to one embodiment of the present invention includes a processing table 13. As shown in FIG. The processing table 13 may be arranged so as to face the laser oscillator 11 . The processing table 13 has an attachment surface on which the workpiece W is attached, and may move in a preset direction with the workpiece W attached. For example, the processing table 13 may move in the directions of the X-axis, the Y-axis, and the Z-axis, and may rotate about the Z-axis.

The processing table 13 may have a fixing member (not shown). The fixing member described above is formed on one side of the processing table 13 and fixes the workpiece W to the mounting surface of the processing table 13 . Thereby, the fixing member can prevent the workpiece W from being detached from the mounting surface while the machining process is being performed. The type of the fixing member is not particularly limited, and may be a plurality of suction holes formed on the upper surface of the processing table 13 or a plurality of clamp units for mechanically fixing the workpiece W. As shown in FIGS. 1 and 2, the machining table 13 is connected to a first controller 19. As shown in FIG.

The operation of the processing table 13 , for example, the operation of fixing the workpiece W by the fixing member, or the moving speed, rotation speed, moving direction, moving distance, etc. of the processing table 13 can be controlled by the first controller 19 .

Referring to FIG. 1, mirror 15 may be positioned between laser oscillator 11 and processing table 13 . The mirror 15 can control the optical path of the laser beam La output from the laser oscillator 11 . The number of mirrors 15 included in the laser processing apparatus 10 is not particularly limited, and for convenience of explanation, the laser processing apparatus 10 will be described below as including a first mirror 15a and a second mirror 15b. In one embodiment of the present invention, the mirror 15 can be a Galvano-mirror in order to realize a fast response speed according to the control signal of the first controller 19 .

As shown in FIGS. 1 and 2, mirror 15 is connected to first controller 19 . The operation of the mirror 15 , such as the tilt angle and tilt speed of the mirror 15 can be controlled by the first controller 19 . More specifically, referring to FIGS. 1 and 2, the laser beam La output from the laser oscillator 11 is first reflected by the first mirror 15a. The laser beam Lb reflected by the first mirror 15a enters the second mirror 15b. The laser beam Lc re-reflected by the second mirror 15b is incident on one surface of a lens 17, which will be described later, and is irradiated onto the workpiece W through the lens 17 (laser beam Ld).

Referring to FIG. 1, lens 17 may be positioned between processing table 13 and mirror 15 . The lens 17 collects the laser beam Lc reflected from the mirror 15 and irradiates the workpiece W with the laser Ld. In one embodiment of the invention, lens 17 may be an f-theta lens. Although FIG. 1 shows that there is one lens 17, it is not limited to this. For example, lens 17 may consist of a plurality of spherical or planar lenses. Thereby, the lens 17 can focus the laser beam Ld on the workpiece W even if the laser beam Lc is incident on a region other than the central portion of the lens 17 .

Referring to FIG. 1, the optical unit 14 may consist of a mirror 15 and a lens 17 . The optical unit 14 can adjust the optical path of the laser beam La output from the laser oscillator 11 and irradiate a desired position on the workpiece W with the laser beam Ld. Also, the movement and position of the optical unit 14 may be controlled by the first controller 19 .

The first controller 19 adjusts the position of the laser beam incident on the lens by controlling the mirror according to the design processing coordinates of the workpiece W stored in advance. As shown in FIGS. 1 and 2, the first controller 19 may include a driver 191 , a processor 193 , a memory 195 and an input/output interface 197 . Drive unit 191 receives control signals from processor 193 and controls laser oscillator 11 , processing table 13 , mirror 15 , and lens 17 . More specifically, the drive unit 191 generates signals for controlling the position of the laser oscillator 11, the intensity, period, output timing, etc. of the laser beam output from the laser oscillator 11, based on instructions from the processor 193. may be transferred. Further, the driving unit 191 controls the position, moving speed, moving direction, moving distance of the processing table 13, fixing of the workpiece W using a fixing member provided on the processing table 13, and the like, based on a command from the processor 193. A control signal may be generated and transferred.

In addition, the drive unit 191 may generate and transfer signals for controlling the position, tilt angle, tilt speed, etc. of the mirror 15 based on instructions from the processor 193 . Further, the drive unit 191 may generate and transfer a signal for controlling the position of the lens 17 based on the instruction from the processor 193 . Further, the driving section 191 may generate and transfer a signal for integrally controlling the optical unit 14 including the mirror 15 and the lens 17 based on an instruction from the processor 193 .

Further, the drive unit 191 may transfer signals to the laser oscillator 11, the processing table 13, the mirror 15, and the lens 17 independently to control them. For example, the drive unit 191 may control only the processing table 13 on which the workpiece W is attached to perform the processing step, or may control only the mirror 15 or the lens 17 to perform the processing step.

The processor 193 may control the driving section 191 based on the processing information of the workpiece W stored in the memory 195 . For example, the processor 193 may control the driving section 191 based on the designed machining coordinates stored in the memory 195 and serving as the machining reference values for the workpiece W. FIG. As a result, the drive unit 191 controls the laser oscillator 11, the processing table 13, the mirror 15, and the lens 17 so that the laser beam La output from the laser oscillator 11 travels along a preset optical path to the workpiece. A signal may be transferred and controlled so that the design machining coordinates on W are irradiated.

FIG. 3 is a diagram showing an example of the position of the laser beam Lc incident on the lens of FIG. FIG. 4 is a diagram showing another example of the position of the laser beam Lc incident on the lens of FIG. 5A to 5E are diagrams showing the machining state of the workpiece W according to the position of the laser beam Lc shown in FIG. FIG. 6 is a diagram showing a state in which the workpiece W is processed using the laser processing system 1 of FIG.

As described above, the laser processing system 1 according to one embodiment of the present invention can process the workpiece W by controlling the optical path of the laser beam La output from the laser oscillator 11 . For example, the laser processing system 1 may control the position of the laser beam Lc incident on the lens 17 and the position of the laser beam Ld incident on the workpiece W, as shown in FIG. More specifically, referring to FIG. 1, the optical path of the laser beam La output from the laser oscillator 11 is deflected through the first mirror 15a and the second mirror 15b, and the deflected laser beam Lc is It can be incident on one surface of the lens 17 . At this time, the first controller 19 controls the positions, tilt angles, or tilt speeds of the first mirror 15a and the second mirror 15b to cause the laser beam Lc to enter a desired position on the lens 17. good.

As shown in FIG. 3, a coordinate system (X' axis and Y' axis) may be defined with the center point O' of the lens 17 as the origin. Further, the position of the laser beam Lc incident on the upper surface of the lens 17 may be represented by polar coordinates represented by a horizontal distance r from the center point O' and an angle θ with the center point O'. Further, referring to FIG. 3, when the lens 17 is viewed from above, that is, when the lens 17 is viewed in the direction in which the laser beam Lc is incident, the laser beam (Lc) is incident on various positions on the upper surface of the lens 17. can be Each laser beam Lc may have the same or different position along the circumferential direction of the lens 17 or the position along the diameter direction of the lens 17 .

Referring to FIG. 4 , the laser processing system 1 according to one embodiment of the present invention can be controlled such that the position of the laser beam Lc incident on the lens 17 is different from the center point O′ of the lens 17 . More specifically, the laser beam Lc<b>1 may enter the center point O′ of the lens 17 . At this time, the distance r1 from the center point O' is zero. Also, the laser beam Lc2 may be incident on a position separated from the center point O' of the lens 17 by a distance r2 in the X'-axis direction. Also, the laser beam Lc3 may be incident on a position separated from the center point O' of the lens 17 by a distance r3 in the X'-axis direction. Also, the laser beam Lc4 may be incident on a position separated from the center point O' of the lens 17 by a distance r4 in the X'-axis direction. In addition, the laser beam Lc5 may be incident on a position separated from the center point O' of the lens 17 by a distance r5 in the X'-axis direction.

5A to 5E, the laser processing system 1 according to one embodiment of the present invention controls the position of the laser beam Lc incident on the upper surface of the lens 17 so that the processed surface of the workpiece W is different. can be processed into More specifically, in FIGS. 5A to 5E, axis Ax1 is an axis extending vertically from the lowest end of the region to be processed formed in workpiece W. As shown in FIG. Also, C1 is the distance between the axis Ax1 and the left end of the region to be processed on the upper surface of the workpiece W. As shown in FIG. Also, C2 is the distance between the axis Ax1 and the right end of the region to be processed on the upper surface of the workpiece W. As shown in FIG. φ is the angle between the axis Ax1 and the right surface of the workpiece W to be processed. At this time, the object to be processed may be the right surface of the workpiece W to be processed.

FIG. 5A is a diagram showing a processing state when the laser beam Lc1 of FIG. 4 is incident on the upper surface of the lens 17, and shows that the processed region of the workpiece W is substantially symmetrical about the axis Ax1. I understand. That is, in FIG. 5A, C1 and C2 may be substantially the same. Also, φ1 and φ2 may be substantially the same.

FIG. 5B is a diagram showing a processing state when the laser beam Lc2 of FIG. 4 is incident on the upper surface of the lens 17. The position of the laser beam Lc2 is r2 It can be seen that the axis Ax1 is shifted to the right as compared to FIG. 5A by separating by . That is, C1 may be greater than C2. Also, φ1 may be larger than φ2.

FIG. 5C is a diagram showing a processing state when the laser beam Lc3 of FIG. 4 is incident on the upper surface of the lens 17. The position of the laser beam Lc3 is r3 It can be seen that the axis Ax1 is further shifted to the right compared to FIG. That is, C1 may be greater than C2. Also, φ1 may be larger than φ3.

FIG. 5D is a diagram showing a processing state when the laser beam Lc4 of FIG. 4 is incident on the upper surface of the lens 17. The position of the laser beam Lc4 is r4 It can be seen that the axis Ax1 is further shifted to the right compared to FIG. In particular, the upper surface of the workpiece W and the right workpiece surface can be substantially perpendicular. That is, on the top surface of the workpiece W, the total distance between the edges of the workpiece area may be C1 and C2 may be substantially zero. Also, φ4 can be substantially zero.

FIG. 5E is a diagram showing the processing state when the laser beam Lc5 of FIG. 4 is incident on the upper surface of the lens 17. The position of the laser beam Lc5 is r5 It can be seen that the axis Ax1 has shifted further to the right compared to FIG. In particular, the right work surface of the work W forms an overhang region projecting left from the axis Ax1. Thereby, the right side surface of the workpiece W may have a reverse taper shape inclined leftward with respect to the axis Ax1. That is, C1 may be greater than C2 and φ5 may be in the negative direction. However, the aforementioned meaning of "substantially symmetrical, perpendicular, or zero" is a erroneous concept in engineering and may not mean symmetrical, perpendicular, or zero in the strict sense of mathematics.

As described above, the laser processing system 1 according to one embodiment of the present invention can control the position of the laser beam Lc incident on the lens 17 and process the surface of the workpiece W to be processed in various shapes. can. For example, as shown in FIG. 6, the workpiece W may include edges of various shapes such as long side portions, short side portions, concave portions, and convex portions. Also, the curvature of the edge of the workpiece W may vary depending on the machining coordinates of the workpiece W. FIG.

The laser processing system 1 controls at least one of the laser oscillator 11, the processing table 13, the mirror 15, and the lens 17 through the first controller 19 based on the design processing coordinates of the workpiece W stored in advance. , and various shapes of the workpiece W can be dealt with. More specifically, when the inclination of the surface to be processed of the workpiece W is to be formed to be constant, the laser processing system 1 controls the position and inclination angle of the mirror 15 so that the center point O' of the lens 17 and the laser beam The machining process can proceed while keeping the distance r to the beam Lc constant. Alternatively, when the inclination of the surface to be processed of the workpiece W is to be formed differently depending on the shape of the workpiece W or the processing coordinates, the laser processing system 1 adjusts the mirror 15 according to the shape of the workpiece W. The machining process can proceed while controlling the position and tilt angle and setting different distances r between the center point O' of the lens 17 and the laser beam Lc. At this time, when the workpiece W is viewed from above, the distance between the edge of the workpiece W and the lens 17 can be kept constant.

Further, the laser processing system 1 may perform processing while moving the processing table 13 on which the workpiece W is attached in a preset direction. Alternatively, the laser processing system 1 may perform processing while moving not only the processing table 13 but also the optical unit 14 in a preset direction. As a result, when the workpiece W has various shapes according to the machining coordinates, high-speed machining can be easily performed.

With such a configuration, the laser processing system 1 according to one embodiment of the present invention can process the shape of the surface of the workpiece W to be processed in various ways. In addition, the laser processing system 1 can quickly process workpieces W having various shapes.

FIG. 7 is a diagram showing an inspection device 20 according to one embodiment of the present invention. FIG. 8 is a diagram showing the second controller 29 of FIG.

Referring to FIG. 7, the laser processing system 1 according to another embodiment of the present invention may further include an inspection device 20. FIG. The inspection device 20 can inspect the shape of the workpiece W, acquire the actual machining coordinates of the workpiece W, and transmit them to the laser processing device 10 . The inspection apparatus 20 may include an inspection table 21 , a support table 23 , an imaging unit 25 , a transport unit 27 and a second controller 29 .

The inspection table 21 has a mounting surface on which the workpiece W is mounted. Although FIG. 7 shows that the inspection table 21 moves the workpiece W in one direction, it is not limited to this. For example, like the processing table 13 described above, the inspection table 21 itself may rotate about the Z-axis while moving horizontally in the directions of the X-, Y-, and Z-axes. The inspection table 21 may have substantially the same configuration as the processing table 13 described above, and detailed description thereof will be omitted.

The support 23 is provided on one side of the inspection table 21 and may have a gantry shape. The support base 23 is provided with an imaging unit 25, which will be described later, and may include a configuration for moving the imaging unit 25 in a preset direction. Although FIG. 7 shows that the support base 23 is fixed to the inspection table 21, it is not limited to this. For example, the support base 23 may be connected through the inspection table 21 and rollers (not shown) or the like and move in one direction.

The imaging unit 25 is provided on one side of the support base 23 and images the workpiece W while moving in a preset direction. More specifically, an image may be captured along the edge of the workpiece W and transmitted to the second controller 29, which will be described later. The second controller 29 may acquire the actual machining coordinates of the workpiece W based on the captured image. At this time, the imaging unit 25 may selectively image a specific point on the edge of the workpiece W to be imaged.

The transport unit 27 may be provided separately from the inspection table 21 . The transport unit 27 transports the inspected workpiece W to the laser processing apparatus 10 or carries it out to the outside. A conveying method is not particularly limited.

The second controller 29 generates actual machining coordinates of the workpiece W based on the image captured by the imaging unit 25 . 7 and 8, the second controller 29 may include a drive section 291, a processor 293, a memory 295, and an input/output interface section 297. FIG. The drive unit 291 can receive commands from the processor 293 and transfer signals to integrally or independently control the inspection table 21 , the support table 23 , the imaging unit 25 and the transport unit 27 .

The processor 293 may control the driving section 291 based on the processing information of the workpiece W stored in the memory 295 . For example, the processor 293 may control the driving section 291 so that the imaging unit 25 captures an image of the edge of the workpiece W based on the design machining coordinates stored in the memory 295 . At this time, the processor 293 can set the imaging point of the workpiece W to be imaged. For example, the processor 293 can appropriately set the number and location of imaging points for long and short sides or concave and convex portions. Also, the processor 293 acquires the actual machining coordinates for the edge of the workpiece W based on the image captured by the imaging unit 25 . The processor 293 can also calculate a difference value (offset value) between the acquired actual machining coordinates and the stored design machining coordinates.

The processor 293 may perform an operation of comparing the difference value between the actual machining coordinates and the design machining coordinates with a threshold value stored in the memory 295 . More specifically, the processor 293 transmits the actual machining coordinates to the first controller 19 of the laser processing apparatus 10 when the difference value between the two coordinates is less than or equal to a preset threshold. The processor 293 also controls the transport unit 27 to transport the workpiece W to the laser processing apparatus 10 . On the other hand, if the difference between the two coordinates exceeds a preset threshold value, the processor 293 may determine that the workpiece W is unsuitable for laser processing, and may determine that processing should be interrupted. Alternatively, the conveying unit 27 may be controlled to carry out the workpiece W to the outside.

The first controller 19 of the laser processing apparatus 10 may perform laser processing on the workpiece W based on the received actual processing coordinates. Laser processing using the laser processing apparatus 10 is substantially the same as the laser processing described above, and detailed description thereof will be omitted.

As described above, the laser processing system 1 according to the present invention includes both the laser processing device 10 and the inspection device 20, so that the error between the designed processing coordinates and the actual processing coordinates of the workpiece W can be corrected. . Thereby, the laser processing system 1 can process the workpiece W more accurately.

In another embodiment, the second controller 29 may acquire corrected machining coordinates by correcting the acquired actual machining coordinates of the workpiece W. FIG. For example, when the workpiece W is to be processed by reducing or enlarging it more than the actual processing coordinates, the corrected processing coordinates may be obtained by enlarging or reducing the obtained actual processing coordinates by a predetermined ratio. The second controller 29 may transmit the acquired corrected processing coordinates to the first controller 19, and the first controller 19 may perform laser processing based on the corrected processing coordinates. However, the corrected processing coordinates are not limited to those obtained by enlarging or reducing the actual processing coordinates, and may be obtained by correcting only the coordinates of a specific area.

In another embodiment, the laser processing system 1 according to the present invention may include multiple laser processing devices 10 and multiple inspection devices 20 . For example, if the process time spent in the laser processing apparatus 10 is longer than the process time spent in the inspection apparatus 20, the laser processing system 1 includes one or more inspection apparatuses 20 and a larger number of inspection apparatuses 20 than the number of inspection apparatuses 20. A number of laser processing apparatuses 10 may be provided. As a result, the workpiece W that has been inspected by the inspection device 20 can be transferred to the laser processing device 10, and the process time required for laser machining the workpiece W can be minimized. However, the numbers of the laser processing apparatuses 10 and the inspection apparatuses 20 are not particularly limited, and may be appropriately selected in consideration of the time required for the processing process.

In another embodiment, the laser processing system 1 according to the present invention may be used for processing both sides of one workpiece W. For example, the laser processing system 1 may include two laser processing devices 10 and one inspection device 20 . Alternatively, the two laser processing apparatuses 10 may be arranged on the upper surface and the lower surface of the workpiece W, respectively. First, the inspection device 20 is used to generate actual processing coordinates for one surface of the workpiece W, and the laser processing device 10 arranged on one surface of the workpiece W scans the workpiece W based on the actual processing coordinates. process one side of Next, the laser processing device 10 arranged on the other side of the workpiece W inverts the actual machining coordinates to generate the inverted machining coordinates, and processes the other side of the workpiece W based on this. may In other words, it is possible to invert only the generated actual machining coordinates without inverting the attached workpiece W, and to perform the machining as it is. With such a configuration, the time required for laser processing can be shortened.

FIG. 9 is a diagram showing a laser processing system 1 according to another embodiment of the invention. FIG. 10 is a diagram showing the first controller 19 of FIG.

In another embodiment, the laser processing system 1 according to the present invention may include the laser processing device 10 and the inspection device 20 that are integrated. Referring to FIGS. 9 and 10, a laser processing system 1 according to the present invention includes a laser processing apparatus 10 including a laser oscillator 11, an optical unit 14 including a mirror 15 and a lens 17, and a first controller 19. It's okay. Also, the inspection apparatus 20 may include an inspection table 21 , a support table 23 , and an imaging unit 25 . Also, both the optical unit 14 and the imaging unit 25 may be provided on the support base 23 . Also, the first controller 19 can control the laser oscillator 11 , the optical unit 14 , the inspection table 21 , the support base 23 and the imaging unit 25 . Thereby, the laser processing system 1 according to the present embodiment can image the workpiece W attached to the inspection table 21 with the imaging unit 25 and acquire the actual processing coordinates.

Further, the laser processing system 1 can perform laser processing on the workpiece W with the laser oscillator 11 and the optical unit 14 based on the acquired actual processing coordinates. With such a configuration, the laser processing can be performed on the workpiece W in one region, the overall size of the laser processing system 1 can be reduced, and the structure of the laser processing system 1 can be simplified. .

FIG. 11 is a diagram showing a laser processing method according to another embodiment of the present invention.

Referring to FIGS. 1 to 11, the laser processing method according to the present invention uses an optical unit 14 having a mirror 15 and a lens 17 to cause a laser beam output from a laser oscillator 11 to enter a workpiece W. In the processing method, laser processing is performed by step S100 of acquiring the processing coordinates of the workpiece W, and controlling the mirror 15 according to the acquired processing coordinates to adjust the position of the laser beam incident on the lens 17. and performing step S300.

First, the processing coordinates of the workpiece W are acquired (S100). Here, the processing coordinates of the workpiece W may be design processing coordinates stored in the first controller 19 of the laser processing apparatus 10 . Alternatively, the processing coordinates of the workpiece W may be actual processing coordinates obtained by imaging the workpiece W using the inspection device 20 . Alternatively, it may be corrected machining coordinates that have been corrected to be reduced or enlarged based on the acquired actual machining coordinates.

Next, the acquired processing coordinates and the stored processing coordinates may be compared to determine whether or not the difference between the two coordinate values exceeds a preset threshold value (S200). Specifically, when the actual machining coordinates of the workpiece W are acquired using the inspection device 20, the design machining coordinates stored in the memory 195 of the laser processing device 10 are compared with the actual machining coordinates, and both coordinate values Calculate the difference between Further, when the difference between the two coordinate values exceeds a preset threshold, the inspection device 20 may determine that the workpiece W is not suitable for laser processing, and may determine processing interruption (S300). When determining the interruption of processing, the workpiece W may be carried out by the inspection device 20 to the outside. Alternatively, if the difference between the two coordinate values is equal to or less than a preset threshold, the inspection device 20 transmits the actual processing coordinates to the laser processing device 10 . Further, the laser processing apparatus 10 may replace the stored design processing coordinates with the acquired actual processing coordinates.

If laser processing is performed based on the designed processing coordinates, or if the acquired actual processing coordinates are corrected according to a preset standard and the laser processing is performed based on the corrected processing coordinates, step S200 may be omitted. .

Next, laser processing is performed by controlling the position of the laser beam Lc incident on the lens 17 (S300). Specifically, the laser oscillator 11 outputs a laser beam La in order to perform laser processing based on the acquired processing coordinates. The output laser beam La passes through the mirror 15 and enters the lens 17 (laser beam Lc). At this time, the laser processing apparatus 10 can control the position of the laser beam Lc incident on the lens 17 by controlling the mirror 15 in accordance with the obtained processing coordinates and the shape of the workpiece W. Regarding the position of the laser beam Lc incident on the lens 17, at least one of the position of the laser beam along the circumferential direction of the lens 17 and the position of the laser beam along the diameter direction of the lens 17 may be controlled. Thereby, the position of the laser beam Ld incident on the workpiece W through the lens 17 can be controlled. The position of the laser beam Lc incident on the lens 17 may be controlled according to the shape of the edge of the workpiece W and the inclination of the surface to be processed.

The laser processing system 1 and the laser processing method according to the present invention can correct the difference between the design processing coordinates and the actual processing coordinates of the workpiece W. FIG. In addition, the laser processing system 1 and the laser processing method according to the present invention control the laser processing apparatus 10 in real time according to the shape of the workpiece W, thereby highly processing workpieces W having various shapes. It can be done with precision and speed. In particular, the laser processing system 1 and the laser processing method according to the present invention can process the surface of the workpiece W at various angles by controlling the incident path of the laser. Moreover, the laser processing system 1 and the laser processing method according to the present invention can accurately process the workpiece W including a dielectric.

Although the invention has been described herein with a focus on limited examples, a variety of other examples can be included within the scope of the invention. Although not further described, equivalent means are also intended to be directly combined with the present invention. Therefore, the true scope of protection of the present invention should be determined by the following claims.

The present invention relates to a laser processing system, and can be applied to a laser processing system that requires real-time processing according to the shape of workpieces having various shapes.

Claims (14)

a laser oscillator that outputs a laser beam;
a processing table on which a workpiece is mounted and which moves in a preset direction;
An optical unit located between the laser oscillator and the processing table, and comprising a lens for causing the laser beam to enter the workpiece, and a mirror for causing the laser beam output from the laser oscillator to enter the lens. When,
a first controller that controls the mirror according to prestored design processing coordinates of the workpiece and adjusts the position of the laser beam incident on the lens. system. The first controller is
At least one of a position along the circumferential direction of the lens and a position along the radial direction of the lens is adjusted with respect to the position of the laser beam incident on the lens, and the laser beam is incident on the workpiece. 2. The laser processing system according to claim 1, wherein the angle of is adjusted. The first controller is
3. The laser according to claim 2, wherein the position of said laser beam incident on said lens is adjusted so that the surface to be processed of said workpiece has a predetermined inclination according to the shape of the edge of said workpiece. processing system. The first controller is
While maintaining a constant distance of the laser beam incident on the lens from the center of the lens, the position along the circumferential direction of the laser beam incident on the lens is changed according to the shape of the edge of the workpiece. 3. The laser processing system of claim 1, wherein the laser processing system is adjusted. The optical unit is
2. The laser processing system of claim 1, wherein the processing table moves independently of the processing table. an imaging unit that captures an image of the workpiece while moving in a preset direction;
2. The laser processing system of claim 1, further comprising an inspection device including a second controller that generates actual processing coordinates of the workpiece based on the captured image. The second controller is
A difference value between the design machining coordinates and the actual machining coordinates is compared with a preset threshold value, and if the difference value is equal to or less than the threshold value, the actual machining coordinates are transmitted to the first controller, and 7. The laser processing system according to claim 6, wherein processing interruption is determined when the difference value exceeds the threshold. 7. The laser processing system according to claim 6, comprising one or more of said inspection devices, and comprising more said laser processing devices than said inspection devices. A laser processing method in which a laser beam output from a laser oscillator is incident on a workpiece using an optical unit having a mirror and a lens,
obtaining machining coordinates of the workpiece;
and controlling the mirror according to the acquired processing coordinates to adjust the position of the laser beam incident on the lens. Adjusting the position of the laser beam comprises:
At least one of a position along the circumferential direction of the lens and a position along the radial direction of the lens is adjusted with respect to the position of the laser beam incident on the lens, and the laser beam is incident on the workpiece. 10. The laser processing method according to claim 9, wherein the angle of is adjusted. Adjusting the position of the laser beam comprises:
10. The laser according to claim 9, wherein the position of the laser beam incident on the lens is adjusted so that the processed surface of the workpiece has a predetermined inclination according to the shape of the edge of the workpiece. processing method. Adjusting the position of the laser beam comprises:
10. The laser according to claim 9, wherein the position of the laser beam incident on the lens is adjusted so that the processed surface of the workpiece has a predetermined inclination according to the shape of the edge of the workpiece. processing method. The step of obtaining processing coordinates of the workpiece includes:
capturing an image of the workpiece with an imaging unit that moves in a preset direction;
10. The laser processing method according to claim 9, comprising obtaining actual processing coordinates of the workpiece based on the captured image. After the step of obtaining the machining coordinates of the workpiece,
comparing a difference value between the pre-stored design machining coordinates and the actual machining coordinates with a preset threshold;
replacing the design machining coordinates with the actual machining coordinates when the difference value is equal to or less than the threshold;
14. The laser processing method according to claim 13, further comprising determining to interrupt processing when the difference value exceeds the threshold value.

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