DE112020006412T5 - Laser processing system and laser processing method - Google Patents

Abstract

The present invention provides a laser processing system and a laser processing method. According to the present invention, there is provided a laser processing system including a laser processing device, the laser processing device including: a laser oscillator that outputs a laser beam; a machining table on which the workpiece sits, the machining table moving in a preset direction; an optical unit positioned between the laser oscillator and the processing table, the optical unit including a lens whereby the laser beam is incident on the workpiece and a mirror whereby the laser beam output from the laser oscillator is incident on the lens; and a first controller for adjusting the position of the laser beam incident on the lens by controlling the mirror according to the design processing coordinates of the workpiece stored in advance.

Description

field of technology

Embodiments of the present invention relate to a laser processing system and a laser processing method.

State of the art

Recently, display panels of various shapes or frameless display panels corresponding to a high pixel concentration have been developed and manufactured. Such a display panel is formed by stacking a plurality of layers containing a dielectric material, and for the sake of processing accuracy, the cutting process is performed by a non-contact cutting method instead of a conventional contact cutting method.

In a conventional non-contact cutting method using a laser, the design coordinates of the edge of the workpiece to be cut are input in advance, and then cutting is performed according to the input coordinates. However, there may be an error between the design coordinates of the work and the actual coordinates, and since this error is not constant, it is impossible to obtain a work of a desired size when cutting is performed depending on the design coordinates.

In addition, the conventional non-contact cutting method using a laser has a problem that it is difficult to control the laser processing apparatus in real time in accordance with the shape of the workpiece.

The prior art mentioned above is technical information that the inventor possessed for the derivation of the present invention or acquired in the course of the derivation of the present invention, and cannot necessarily be said to be known art prior to the filing of the present invention with the public has been published.

description

Technical problem

The object of the embodiments of the present invention is to provide a laser processing system and a laser processing method in which various non-contact processing including cutting processing can be performed with high precision and the laser processing device can be controlled in real time according to the shape of the workpiece. However, the objects described above relate to the embodiments of the present invention, and the purpose of the present invention and the objects to be achieved are not limited thereto.

Technical solution

A laser processing system according to an embodiment of the present invention includes a laser processing apparatus including: a laser oscillator that outputs a laser beam; a machining table on which the workpiece sits, the machining table moving in a preset direction; an optical unit positioned between the laser oscillator and the processing table, the optical unit having a lens whereby the laser beam is incident on the workpiece and a mirror whereby the laser beam output from the laser oscillator is incident on the lens; and a first controller for adjusting the position of the laser beam incident on the lens by controlling the mirror according to the design processing coordinates of the workpiece stored in advance.

effect of the invention

According to the laser processing system and the laser processing method according to the present invention, the difference between the design processing coordinates and the actual processing coordinates of the workpiece can be corrected. In addition, according to the laser processing system and the laser processing method of the present invention, workpieces of various shapes can be processed with high precision and at a high speed by controlling the laser processing device in real time according to the shape of the workpieces. In particular, according to the laser processing system and laser processing method of the present invention, the processing surface of the workpiece can be processed at various angles by controlling the incident path of the laser. In addition, according to the laser processing system and the laser processing method according to the present invention, workpieces having a dielectric material can be precisely processed.

character list

• 1 12 is a view showing a laser processing system according to an embodiment of the present invention.
• 2 is a view showing a first controller of 1 represents.
• 3 FIG. 12 is a view showing an example of a position of a lens on the lens of FIG 1 incident laser beam illustrated.
• 4 FIG. 14 is a view showing another example of a position of a lens on the lens of FIG 1 incident laser beam illustrated.
• 5A until 5E are views showing a machining state of a workpiece according to the position of the in 4 represent shown laser beam.
• 6 FIG. 14 is a view showing a state in which a workpiece is processed by the laser processing system of FIG 1 is processed.
• 7 12 is a view showing an inspection device according to an embodiment of the present invention.
• 8th is a view showing a second controller of 7 represents.
• 9 12 is a view showing a laser processing system according to another embodiment of the present invention.
• 10 is a view showing the first controller of 9 represents.
• 11 12 is a view showing a laser processing method according to another embodiment of the present invention.

Best Mode for Realizing the Invention

A laser processing system according to an embodiment of the present invention includes a laser processing apparatus including: a laser oscillator that outputs a laser beam; a machining table on which the workpiece sits, the machining table moving in a preset direction; an optical unit positioned between the laser oscillator and the processing table, the optical unit including a lens whereby the laser beam is incident on the workpiece and a mirror whereby the laser beam output from the laser oscillator is incident on the lens; and a first controller for adjusting the position of the laser beam incident on the lens by controlling the mirror according to the design processing coordinates of the workpiece stored in advance.

In the laser processing system according to an embodiment of the present invention, the first controller can adjust the angle of the laser beam incident on the workpiece by adjusting at least one of the position in a circumferential direction of the lens and the position in a diameter direction of the lens, with respect to the position of the laser beam incident on the lens , set to.

In the laser processing system according to an embodiment of the present invention, the first controller can adjust the position of the laser beam incident on the lens so that a processing surface of the workpiece has a predetermined inclination corresponding to a shape of an edge of the workpiece.

In the laser processing system according to an embodiment of the present invention, the first controller can adjust the circumferential position of the laser beam incident on the lens by keeping the distance from the center of the lens to the laser beam incident on the lens constant according to the shape of the edge of the workpiece.

In the laser processing system according to an embodiment of the present invention, the optical unit can move independently of the processing table.

The laser processing system according to an embodiment of the present invention may further include an inspection device, the inspection device including: an image pickup unit that takes an image of the workpiece while moving in a preset direction; and a second controller for generating actual machining coordinates of the workpiece from the captured image.

In the laser processing system according to an embodiment of the present invention, the second controller can compare a difference value between the draft processing coordinates and the actual processing coordinates with a preset threshold, and when the difference value is smaller than the threshold, the second controller can transmit the actual processing coordinates to the first controller , and if the difference value exceeds the threshold, the second controller can decide to stop processing.

In the laser processing system according to an embodiment of the present invention, one or more of the inspection devices may be provided, and the laser processing devices of a number more than the number of the inspection devices may be provided.

A laser processing method according to another embodiment of the present invention relates to a laser processing method in which a laser beam output from a laser oscillator is incident on a workpiece through an optical unit having a mirror and a lens, and includes: obtaining of machining coordinates of the workpiece; and performing the laser processing by adjusting the position of the laser beam incident on the lens by controlling the mirror according to the obtained processing coordinates.

When performing the laser processing in the laser processing method according to another embodiment of the present invention, the angle of the laser beam incident on the workpiece can be adjusted by adjusting at least one of the position in a circumferential direction of the lens and the position in a diameter direction of the lens, with respect to the position of the Lens incident laser beam to be adjusted.

In the laser processing method according to another embodiment of the present invention, in adjusting the position of the laser beam, the position of the laser beam incident on the lens can be adjusted so that a processing surface of the workpiece has a predetermined inclination corresponding to a shape of an edge of the workpiece.

In the laser processing method according to another embodiment of the present invention, in adjusting the position of the laser beam, the position of the laser beam incident on the lens can be adjusted so that a processing surface of the workpiece has a predetermined inclination corresponding to a shape of an edge of the workpiece.

In the laser machining method according to another embodiment of the present invention, obtaining the machining coordinates of the workpiece may include: capturing an image of the workpiece with an image pickup unit moving in a preset direction; and obtaining actual machining coordinates of the workpiece from the captured image.

The laser machining method according to another embodiment of the present invention may further include: comparing a difference value between the design machining coordinates stored in advance and the actual machining coordinates with a preset threshold value; replacing the design edit coordinates with the actual edit coordinates if the difference value is less than or equal to the threshold; and if the difference value exceeds the threshold, making a decision to stop processing.

Aspects, features and advantages other than those described above will be apparent from the following forms, claims and drawings of carrying out the invention.

Description of the embodiments

Because the present embodiments are susceptible to various changes, specific embodiments are shown in the drawings and described in detail in the specification. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that all changes, equivalents and substitutions included within the spirit and scope of the present invention are included. In the description of the present invention, the same reference numbers are used for the same components, even if they are shown in different embodiments.

Terms such as first, second, etc. can be used to describe various components, but the components should not be limited by the terms. The terms are only used to distinguish one component from another.

The terms used in the present application are only used to describe certain embodiments and are not intended to limit the present invention. In the present application, terms such as "comprising" or "having" or the like are intended to indicate that a feature, number, step, operation, component, part described herein or a combination thereof exists and it understood that this does not exclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

In the following, the present invention will be described in detail with reference to embodiments related to the present invention shown in the accompanying drawings.

1 12 is a view showing a laser processing system 1 according to an embodiment of the present invention. 2 12 is a view showing a first controller 19 of FIG 1 represents.

The laser processing system 1 according to an embodiment of the present invention can be used for various laser processing such as laser cutting, laser drilling, laser writing, laser patterning, and laser scribing. However, in the following, for the sake of simplicity of description, the laser processing system tem 1 described as being used for laser cutting processing. In addition, the kind of the workpiece W is not particularly limited. The workpiece W may comprise a display panel comprising a dielectric material, or a metal sheet, a ceramic substrate or the like.

As in 1 1, a laser oscillator 11 is disposed on a laser processing apparatus 10 side. The laser oscillator 11 may include a laser source capable of generating and outputting a laser beam having a specific wavelength. The type of laser beams that are output from the laser oscillator 11 is not particularly limited, and can be appropriately selected according to the type or processing method of the workpiece W. For example, the laser beam output from the laser oscillator 11 may be one of a solid laser beam including a ruby laser beam, a Nd:YAG laser beam, a Ti:sapphire laser beam, and the like, a liquid laser beam including a dye laser beam, and the like, and a gas laser beam including a CO ₂ laser beam, a He-Ne laser beam, an Ar+ laser beam, an excimer laser beam, and the like. However, in the following, for convenience of description, it will be described that the laser beam emitted from the laser oscillator 11 is a CO ₂ laser beam. In addition, the wavelength of the CO ₂ laser beam can be 9.3 μm or more and 10.6 μm or less.

The laser oscillator 11 is connected to a power supply (not shown), and can output a laser beam when power is supplied from the power supply. In addition, as in 1 shown, the laser oscillator 11 is connected to the first controller 19. The characteristics of the laser beam output from the laser oscillator 11, such as intensity, period and output time of the laser beam can be controlled by a signal generated by the first controller 19.

With reference to 1 according to an embodiment of the present invention, the laser processing apparatus 10 includes a processing table 13. The processing table 13 may be arranged to face the laser oscillator 11. The machining table 13 has a seating surface on which the workpiece W is seated, and can move in a preset direction in the state where the workpiece W is seated. For example, the machining table 13 can move in any of the X-axis, Y-axis, and Z-axis directions, and can rotate around the Z-axis.

The machining table 13 may include a fastener (not shown). The fastening member is formed on a side of the machining table 13 to fasten the work W to the seating surface of the machining table 13 . Accordingly, the fastener can prevent the workpiece W from being separated from the seat surface during the machining process. The kind of the fixing member is not particularly limited, and may be a plurality of suction holes formed on the top surface of the machining table 13 or a plurality of clamp units for fixing the workpiece W mechanically. As in 1 and 2 shown, the processing table 13 is connected to the first controller 19 . The operation of the machining table 13, for example, the operation in which the fastener fastens the workpiece W, or the moving speed or rotational speed, moving direction, and moving distance of the machining table 13 can be controlled by the first controller 19.

With reference to 1 For example, a mirror 15 may be disposed between the laser oscillator 11 and the processing table 13. The mirror 15 can control the optical path of the laser beam La output from the laser oscillator 11 . The number of mirrors 15 included in the laser processing apparatus 10 is not particularly limited, but in the following, for convenience of description, the laser processing apparatus 10 includes a first mirror 15a and a second mirror 15b. In an embodiment of the present invention, the mirror 15 may be a galvano mirror to realize a fast response speed according to a control signal of the first controller 19 .

As in 1 and 2 shown, the mirror 15 is connected to the first controller 19 . The operation of the mirror 15, such as a tilting angle and a tilting speed of the mirror 15, can be controlled by the first controller 19. More specifically, with reference to 1 and 2 the laser beam La output from the laser oscillator 11 is first reflected by the first mirror 15a. The laser beam Lb reflected by the first mirror 15a is incident on the second mirror 15b. The laser beam Lc reflected by the second mirror 15b is again incident on a surface of a lens 17 to be described later, and is irradiated through the lens 17 onto the workpiece W (laser beam Ld).

With reference to 1 can the lens 17 between the processing table 13 and the Mirror 15 can be arranged. The lens 17 converges the laser beam Lc reflected by the mirror 15 and irradiates the laser Ld onto the workpiece W. In an embodiment of the present invention, the lens 17 may be an f-theta lens. In 1 Fig. 11 illustrates a single lens 17, but the present invention is not limited thereto. For example, the lens 17 can consist of several spherical lenses or plane lenses. Accordingly, the lens 17 can focus the laser beam Ld on the workpiece W even if the laser beam Lc is incident on an area other than the center of the lens 17.

With reference to 1 the mirror 15 and the lens 17 can form an optical unit 14. The optical unit 14 can adjust the optical path of the laser beam La output from the laser oscillator 11 to emit the laser beam Ld to a desired position on the workpiece W. FIG. Furthermore, the operation and the position of the optical unit 14 can be controlled by the first controller 19 .

The first controller 19 adjusts the position of the laser beam incident on the lens by controlling the mirror according to the design processing coordinates of the workpiece Wein stored in advance. As in 1 and 2 As shown, the first controller 19 may include a drive unit 191, a processor 193, a memory 195, and an input/output interface unit 197. The drive unit 191 receives a control signal from the processor 193 and thereby controls the laser oscillator 11, the processing table 13, the mirror 15, and the lens 17. More specifically, the drive unit 191 can, based on an instruction from the processor 193, a signal for controlling the position of the laser oscillator 11 , the intensity of the laser beam output from the laser oscillator 11, their period and output timing, etc., and send the signal. In addition, the drive unit 191 can generate a signal for controlling the position, moving speed, moving direction, moving distance of the machining table 13, fastening of the workpiece W by a fastening member provided in the machining table 193 by an instruction from the processor 193, and send the signal.

In addition, the drive unit 191 can generate a signal for controlling the position, tilt angle, tilt speed, etc. of the mirror 15 based on an instruction from the processor 193 and send the signal. In addition, the drive unit 191 can generate a signal for controlling the position of the lens 17 and the like based on an instruction from the processor 193 and send the signal. In addition, the driving unit 191 can generate a signal for integrally controlling the optical unit 14 including the mirror 15 and the lens 17 by an instruction from the processor 193 and send the signal.

In addition, the drive unit 191 can control the laser oscillator 11, the processing table 13, the mirror 15, and the lens 17 independently of each other by sending the individual signals. For example, the drive unit 191 can perform the machining process by controlling only the machining table 13 on which the workpiece W is seated, or by controlling the mirror 15 or the lens 17 only.

The processor 193 can control the drive unit 191 based on the machining information of the workpiece W stored in the memory 195 . For example, the processor 193 can control the driving unit 191 based on the design machining coordinates stored in the memory 195, which are the machining reference values of the workpiece W. Accordingly, the drive unit 191 can control the laser oscillator 11, the processing table 13, the mirror 15 and the lens 17 by sending a signal so that the laser beam La output from the laser oscillator 11 is irradiated onto the design processing coordinates on the workpiece W along a preset optical path .

3 FIG. 12 is a view showing an example of a position of a lens on the lens of FIG 1 incident laser beam Lc. 4 FIG. 14 is a view showing another example of a position of a lens on the lens of FIG 1 incident laser beam Lc. 5A until 5E are views showing a machining state of a workpiece W according to the position of the in 4 shown laser beam Lc. 6 FIG. 14 is a view showing a state in which a workpiece W is processed using the laser processing system 1 of FIG 1 is processed.

As described above, the laser processing system 1 according to an embodiment of the present invention can control the optical path of the laser beam La output from the laser oscillator 11 to process the workpiece W. As for example in 3 As shown, the laser processing system 1 can control the position of the laser beam Lc incident on the lens 17 to control the position of the laser beam Ld incident on the workpiece W. More specifically, with reference to 1 the optical path of the laser beam La output from the laser oscillator 11 is deflected via the first mirror 15a and the second mirror 15b, and the deflected laser beam Lc is allowed to be incident on a surface of the lens 17. Here the first controller 19 can position, Nei control the inclination angles or the inclination speeds of the first mirror 15a and the second mirror 15b to cause the laser beam Lc to be incident on the desired position on the lens 17.

As in 3 As shown, coordinate systems (X' and Y' axes) can be defined with the center O' of the lens 17 as the origin. In addition, the position of the laser beam Lc incident on the upper surface of the lens 17 can be represented in polar coordinates expressed by the horizontal distance r from the center O' and the angle θ with the center O'. When the lens 17 is viewed from the upper surface, that is, when the lens 17 is viewed from the direction in which the laser beam Lc is incident, the laser beam Lc can be seen with reference to FIG 3 are incident on the top surface of the lens 17 at different positions. Each of the laser beams Lc may have the same or different positions in the circumferential direction of the lens 17 or in the diametrical direction of the lens 17.

Referring to FIG. 4, the laser processing system 1 according to an embodiment of the present invention can control the distance of the position of the laser beam Lc incident on the lens 17 from the center O' of the lens 17 differently. More specifically, the laser beam Lc1 can be incident on the center O' of the lens 17. In this case, the distance r1 from the center O' is 0. In addition, the laser beam Lc2 can be incident at a position spaced from the center O' of the lens 17 by a distance r2 in the X'-axis direction. In addition, the laser beam Lc3 can be incident at a position spaced from the center O' of the lens 17 by a distance r3 in the X'-axis direction. In addition, the laser beam Lc4 can be incident at a position spaced from the center O' of the lens 17 by a distance r4 in the X'-axis direction. In addition, the laser beam Lc5 can be incident at a position spaced from the center O' of the lens 17 by a distance r5 in the X'-axis direction.

With reference to 5A until 5E For example, the laser processing system 1 according to an embodiment of the present invention can control the position of the laser beam Lc incident on the top surface of the lens 17 to process the processing surface differently. More precisely, in the 5A until 5E the axis Ax1 is an axis extending from the lowermost end of the region to be machined formed in the workpiece W in the vertical direction. Also, C1 is a distance between the axis Ax1 and the left end of the area to be machined on the top surface of the workpiece W. Also, C2 is the distance between the axis Ax1 and the right end of the area to be machined on the top surface of the workpiece W. Also, φ is an angle between the axis Ax1 and the right machining surface of the workpiece W. In this case, the object to be machined may be the right machining surface of the workpiece W.

5A FIG. 14 is a view showing a machining state when the laser beam Lc1 of FIG 4 incident on the upper surface of the lens 17, the areas of the workpiece W to be machined being substantially symmetrical about the axis Ax1. That means in 5A C1 and C2 can be essentially the same.

In addition, φ1 and φ2 can also be essentially the same.

5B FIG. 14 is a view showing a machining state when the laser beam Lc2 of FIG 4 is incident on the upper surface of the lens 17, and as the position of the laser beam Lc2 is spaced from the center O' of the lens 17 by r2 in the direction of the X'-axis, the axis is Ax1 compared to 5A shifted to the right. That is, C1 can be greater than C2. And φ1 can be larger than φ2.

5C FIG. 14 is a view showing a machining state when the laser beam Lc3 of FIG 4 is incident on the upper surface of the lens 17, and as the position of the laser beam Lc3 is spaced from the center O' of the lens 17 by r3 in the direction of the X'-axis, the axis is Ax1 compared to 5B also shifted to the right. That is, C1 can be greater than C2. And φ1 can be larger than cp3.

5D FIG. 14 is a view showing a machining state when the laser beam Lc4 of FIG 4 is incident on the upper surface of the lens 17, and as the position of the laser beam Lc4 is spaced from the center O' of the lens 17 by r4 in the direction of the X'-axis, the axis is Ax1 compared to 5C also shifted to the right. In particular, the top surface of the workpiece W and the right processing surface may be substantially perpendicular to each other. That is, on the top surface of the workpiece W, the total distance between the ends of the region to be machined may be C1 and C2 may be substantially zero. In addition, φ4 can be essentially zero.

5E FIG. 14 is a view showing a machining state when the laser beam Lc5 of FIG 4 is incident on the upper surface of the lens 17, and as the position of the laser beam Lc5 from Center O' of the lens 17 is spaced by r5 in the direction of the X' axis, the axis is Ax1 compared to 5D also shifted to the right. Specifically, an overhang area is formed in which the right machining surface of the workpiece W protrudes leftward from the axis Ax1. Accordingly, the right machining surface of the workpiece Weine may have a reverse taper shape inclined to the left with respect to the axis Ax1. That is, C1 can be larger than C2 and φ5 can be in a negative direction. However, the above-mentioned meaning of "essentially symmetrical, vertical, or zero" is a concept that implies a design flaw, and need not mean symmetrical, vertical, or zero in the strict mathematical sense.

As described above, the laser processing system 1 according to an embodiment of the present invention can control the position of the laser beam Lc incident on the lens 17 to process the processing surface in various shapes. For example, as in 6 1, the workpiece W may have edges of various shapes such as a long side portion, a short side portion, a concave portion, and a convex portion. In addition, depending on the machining coordinates of the workpiece W, the curvature of the edge of the workpiece W may differ.

The laser processing system 1 can control at least one of the laser oscillator 11, the processing table 13, the mirror 15, and the lens 17 by the first controller 19 based on the design processing coordinates of the workpiece W stored in advance to correspond to various shapes of the workpiece W. More specifically, when a constant inclination of the machining surface of the workpiece W is desired, the laser machining system 1 can control the position and inclination angle of the mirror 15 to perform the machining process by increasing the distance r between the center O' of the lens 17 and the laser beam Lc is kept constant. Alternatively, when it is desired to make the inclination of the machining surface of the workpiece W different depending on the shape or machining coordinates of the workpiece W, the laser machining system 1 can control the position and inclination angle of the mirror 15 to perform the machining process by adjusting the distance r between between the center O' of the lens 17 and the laser beam Lc is set to be different. At this time, when the workpiece W is observed in a plan view, the distance between the edge of the workpiece W and the lens 17 can be kept constant.

In addition, the laser processing system 1 can perform processing while moving the processing table 13 on which the workpiece W is set in a preset direction. Alternatively, the laser processing system 1 may perform processing while moving not only the processing table 13 but also the optical unit 14 in a preset direction. Accordingly, when the workpiece W has various shapes according to the machining coordinates, high-speed machining can be easily performed.

With such configuration, the laser processing system 1 according to an embodiment of the present invention can process the shape of the processing surface of the workpiece W in various ways. In addition, the laser processing system 1 can quickly process the workpiece W having various shapes.

7 12 is a view showing an inspection device 20 according to an embodiment of the present invention. 8th 12 is a view showing a second controller 29 of FIG 7 represents.

With reference to 7 For example, according to another embodiment of the present invention, the laser processing system 1 may further include the inspection device 20 . The inspection device 20 can inspect the shape of the workpiece W, obtain actual machining coordinates of the workpiece W, and transmit them to the laser machining device 10 . The inspection device 20 may include an inspection table 21 , a support 23 , an image pickup unit 25 , a transmission unit 27 , and the second controller 29 .

The inspection table 21 has a seating surface on which the workpiece W is placed. 7 shows that the inspection table 21 moves the workpiece W in one direction, but is not limited to this. For example, like the processing table 13 described above, the inspection table 21 can rotate itself around the Z-axis while moving horizontally in the X-axis, Y-axis and Z-axis directions. The inspection table 21 may have substantially the same configuration as the processing table 13 described above, and a detailed description thereof will be omitted.

The support 23 is attached to a side of the inspection table 21 and may have a gantry shape. The image pickup unit 25, which will be described later, is mounted on the support 23, and may include a component for moving the image pickup unit 25 in a preset direction. 7 shows that the Support 23 is fixed with respect to inspection table 21, but not limited thereto. For example, the support 23 can be connected to the inspection table 21 by a roller (not shown) or the like and can move in one direction.

The image capturing unit 25 is attached to a side of the support 23 and moves in a preset direction to capture an image of the workpiece W. As shown in FIG. More specifically, an image can be captured along the edge of the workpiece W, and the image can be transmitted to the second controller 29 to be described later. The second controller 29 can obtain actual machining coordinates of the workpiece W based on the captured image. Here, the imaging unit 25 can selectively capture an image of a specific point of the edge of the workpiece W to be imaged.

The transfer unit 27 can be attached so that it is spaced from the inspection table 21 . The transfer unit 27 transfers or takes out the inspected workpiece W to the laser processing apparatus 10 . The transmission method is not particularly limited.

The second controller 29 generates actual machining coordinates of the workpiece W from the image captured by the image capturing unit 25 . With reference name to 7 and 8th For example, the second controller 29 may include a drive unit 291, a processor 293, a memory 295, and an input/output interface unit 297. The driving unit 291 receives an instruction from the processor 293 and can send a signal that controls the inspection table 21, the support 23, the image pickup unit 25, and the transmission unit 27 in the entirety or independently.

The processor 293 can control the driving unit 291 based on the machining information of the workpiece W stored in the memory 295 . For example, the processor 293 may control the driving unit 291 to capture an image of the edge of the workpiece W through the imaging unit 25 based on the design machining coordinates of the workpiece W stored in the memory 295 . Here, the processor 293 can set an imaging point of the workpiece W as an imaging target. For example, the processor 293 can appropriately set the number and positions of the imaging points of the long and short side parts or the concave and convex portions. Also, the processor 293 acquires actual machining coordinates for the edge of the workpiece W based on the image captured by the image capturing unit 25 . In addition, the processor 293 can calculate a difference value (offset value) between the obtained actual machining coordinates and the stored design machining coordinates.

The processor 293 can perform a calculation to compare the difference value between the actual machining coordinates and the design machining coordinates with a threshold value stored in the memory 295 . More specifically, when the difference value between the two coordinates is less than or equal to a preset threshold, the processor 293 transmits the actual processing coordinates to the first controller 19 of the laser processing apparatus 10. And the processor 293 controls the transmission unit 27 to transfer the workpiece W to the laser processing apparatus 10 to transfer. On the other hand, if the difference value between the two coordinates exceeds a preset threshold, the processor 293 can determine that the workpiece W is unsuitable for laser processing and can make a decision to stop processing. And by controlling the transfer unit 27, it is possible to take out the work W to the outside.

The first controller 19 of the laser processing apparatus 10 can perform laser processing of the workpiece W based on the received actual processing coordinates. The laser processing by the laser processing apparatus 10 may be basically the same as the laser processing described above, and a detailed description thereof will be omitted.

As described, the laser processing system 1 according to the present invention includes both the laser processing device 10 and the inspection device 20, whereby the error between the design processing coordinates of the workpiece W and the actual processing coordinates can be corrected. Accordingly, the laser processing system 1 can process the workpiece W more accurately.

In another embodiment, the second controller 29 can obtain corrected machining coordinates by correcting the actual machining coordinates of the workpiece W obtained. For example, when the workpiece W is decreased or increased from the actual machining coordinates to be machined, the obtained actual machining coordinates are increased or decreased by a predetermined ratio to obtain corrected machining coordinates. The second controller 29 can transfer the obtained corrected machining coordinates to the first controller 19, and the first controller 19 can perform laser processing based on the corrected processing coordinates. However, the corrected machining coordinates are not limited to enlarged or reduced actual machining coordinates, and only the coordinates of a specific area can be corrected.

In another embodiment, the laser processing system 1 according to the present invention may include multiple laser processing devices 10 and multiple inspection devices 20 . For example, if the processing time required in the laser processing device 10 is longer than the processing time required in the inspection device 20, the laser processing system 1 may include one or more inspection devices 20 and a number of laser processing devices 10 that is more than the number of the inspection devices 20. Accordingly, the processing time required for the laser processing of the workpiece W can be minimized by transferring the workpiece W inspected by the inspection device 20 to the laser processing device 10 . However, the number of the laser processing device 10 and the inspection device 20 is not particularly limited and can be selected appropriately in consideration of the time required for the processing process.

In another embodiment, the laser processing system 1 according to the present invention can be used to process both surfaces of a workpiece W. For example, the laser processing system 1 may include two laser processing devices 10 and one inspection device 20 . In addition, the two laser processing devices 10 may be arranged on the upper surface and the lower surface of the workpiece W, respectively. First, actual machining coordinates for a surface of the workpiece W are generated using the inspection device 20, and then the laser machining device 10 placed on a surface of the workpiece W machines the one surface of the workpiece W based on the actual machining coordinates. Next, the laser processing apparatus 10 arranged on the other surface of the workpiece W inverts the actual processing coordinates to generate the inverted processing coordinates and can perform the processing of the other surface of the workpiece W based thereon. That is, the machining can be performed as it is without inverting the resting workpiece W only by inverting the generated actual machining coordinates. With this configuration, it is possible to shorten the time required for the laser processing.

9 12 is a view showing a laser processing system 1 according to another embodiment of the present invention. 10 12 is a view showing the first controller 19 of FIG 1 represents.

In another embodiment, the laser processing system 1 according to the present invention may include multiple laser processing devices 10 and multiple inspection devices 20 . With reference name to 9 and 10 For example, the laser processing system 1 according to the present invention may include, as the laser processing apparatus 10, a laser oscillator 11, an optical unit 14 having a mirror 15 and a lens 17, and the first controller 19. The inspection device 20 may include an inspection table 21 , a support 23 , and an imaging unit 25 . In addition, both the optical unit 14 and the imaging unit 25 can be mounted on the support 23 . In addition, the first controller 19 can control the laser oscillator 11, the optical unit 14, the inspection table 21, the support 23 and the image pickup unit 25. Accordingly, the laser machining system 1 according to the present embodiment can obtain the actual machining coordinates by imaging the workpiece W placed on the inspection table 21 with the imaging unit 25 .

The laser processing system 1 can perform laser processing of the workpiece W with the laser oscillator 11 and the optical unit 14 based on the obtained actual processing coordinates. With such configuration, it is possible to perform laser processing of the workpiece W in one area, whereby the overall size of the laser processing system 1 can be reduced and the structure of the laser processing system 1 can be simplified.

11 12 is a view showing a laser processing method according to another embodiment of the present invention.

With reference to 1 until 11 The laser processing method according to the present invention relates to a laser processing method in which a laser beam output from the laser oscillator 11 is caused to be incident on the workpiece W by means of the optical unit 14 having the mirror 15 and the lens 17, and the method comprises that Obtaining machining coordinates of the workpiece W (S100) and performing laser machining (S300) by adjusting the position of the laser beam incident on the lens 17 by controlling the mirror 15 according to the obtained machining coordinates.

First, the machining coordinates of the workpiece W are obtained (S100). Here, the machining coordinates of the workpiece W may be design machining coordinates stored in the first controller 19 of the laser machining device 10 . Alternatively, the machining coordinates of the workpiece W may be actual machining coordinates obtained by imaging the workpiece W using the inspection device 20 . Alternatively, it can be corrected machining coordinates that have been reduced or increased on the basis of the actual machining coordinates obtained.

Next, by comparing the obtained machining coordinates with the stored machining coordinates, it can be determined whether the difference between the two coordinate values exceeds a preset threshold (S200). Specifically, when the actual machining coordinates of the workpiece W are obtained using the inspection device 20, the design machining coordinates stored in the memory 195 of the laser machining device 10 are compared with the actual machining coordinates, and the difference of the two coordinate values is calculated. When the difference between the two coordinate values exceeds a preset threshold, the inspection device 20 can determine that the workpiece W is unsuitable for laser processing and can make a decision to stop processing (S300). When it is decided to stop the machining, the workpiece W can be taken out through the inspection device 20 to the outside. Alternatively, when the difference between the two coordinate values is less than or equal to a preset threshold, the inspection device 20 transmits the actual machining coordinates to the laser machining device 10. And the laser machining device 10 can replace the stored design machining coordinates with the actual machining coordinates obtained.

When laser processing is performed based on the design processing coordinates or the obtained actual processing coordinates are corrected according to a preset standard and laser processing is performed based on the corrected processing coordinates, the step (S200) described above can be omitted.

Next, laser processing is performed by controlling the position of the laser beam Lc incident on the lens 17 (S300). Specifically, in order to perform laser machining based on the obtained machining coordinates, the laser oscillator 11 outputs a laser beam La. The output laser beam La is incident on the lens 17 via the mirror 15 (laser beam Lc). Here, the laser processing apparatus 10 can control the position of the laser beam Lc incident on the lens 17 by controlling the mirror 15 according to the obtained processing coordinates and the shape of the workpiece W. Regarding the position of the laser beam Lc incident on the lens 17, at least one of the position of the laser beam Lc in a circumferential direction of the lens 17 or the position in a diameter direction of the lens 17 can be controlled. Accordingly, the position of the laser beam Ld incident on the workpiece W via the lens 17 can be controlled. The position of the laser beam Lc incident on the lens 17 can be controlled according to the shape of the edge of the workpiece W and the inclination of the processing surface to be formed.

According to the laser processing system 1 and the laser processing method according to the present invention, the difference between the design processing coordinates and the actual processing coordinates of the workpiece can be corrected. In addition, according to the laser processing system 1 and the laser processing method of the present invention, the workpieces W having various shapes can be processed with high precision and at a high speed by controlling the laser processing apparatus 10 according to the shape of the workpiece W in real time. In particular, according to the laser processing system 1 and the laser processing method according to the present invention, the processing surface of the workpiece W can be processed at various angles by controlling the incident path of the laser. In addition, the laser processing system 1 and the laser processing method according to the present invention can precisely process a workpiece W having a dielectric material.

In the present specification, the present invention has been described with reference to limited embodiments, however, various embodiments are possible within the scope of the present invention. Moreover, although not described, it is said that equivalent means are also put together in the present invention. Accordingly, the true scope of the present invention should be defined by the following claims.

Industrial Applicability

The present invention relates to a laser processing system and may include a Laser processing system can be applied, which requires real-time processing according to the shape of a workpiece with various shapes.

Claims (14)

Laser processing system comprising a laser processing device, wherein the laser processing device comprises: a laser oscillator that outputs a laser beam; a machining table on which the workpiece sits, the machining table moving in a preset direction; an optical unit positioned between the laser oscillator and the processing table, the optical unit having a lens whereby the laser beam is incident on the workpiece and a mirror whereby the laser beam output from the laser oscillator is incident on the lens; and a first controller for adjusting the position of the laser beam incident on the lens by controlling the mirror according to the design processing coordinates of the workpiece stored in advance. laser processing system claim 1 wherein the first controller adjusts the angle of the laser beam incident on the workpiece by adjusting at least one of the position in a circumferential direction of the lens and the position in a diameter direction of the lens with respect to the position of the laser beam incident on the lens. laser processing system claim 2 , wherein the first controller adjusts the position of the laser beam incident on the lens so that a processing surface of the workpiece has a predetermined inclination corresponding to a shape of an edge of the workpiece. laser processing system claim 1 wherein the first controller adjusts the circumferential position of the laser beam incident on the lens by keeping constant the distance from the center of the lens to the laser beam incident on the lens according to the shape of the edge of the workpiece. laser processing system claim 1 , wherein the optical unit moves independently of the processing table. laser processing system claim 1 , further comprising an inspection device, the inspection device comprising: an image pickup unit that takes an image of the workpiece while moving in a preset direction; and a second controller for generating actual machining coordinates of the workpiece from the captured image. laser processing system claim 6 , wherein the second controller compares a difference value between the design editing coordinates and the actual editing coordinates with a preset threshold, and if the difference value is less than the threshold, the second controller transmits the actual editing coordinates to the first controller, and if the difference value exceeds the threshold, the second controller decides to interrupt the processing. laser processing system claim 6 wherein one or more of the inspection devices are provided, and the laser processing devices of a number more than the number of the inspection devices are provided. A laser machining method in which a laser beam output from a laser oscillator is incident on a workpiece through an optical unit having a mirror and a lens, comprising: obtaining machining coordinates of the workpiece; and Adjusting the position of the laser beam incident on the lens by controlling the mirror according to the processing coordinates obtained. laser processing method claim 9 wherein in adjusting the position of the laser beam, the angle of the laser beam incident on the workpiece is adjusted by adjusting at least one of the position in a circumferential direction of the lens and the position in a diameter direction of the lens with respect to the position of the laser beam incident on the lens. laser processing method claim 9 wherein in adjusting the position of the laser beam, the position of the laser beam incident on the lens is adjusted so that a processing surface of the workpiece has a predetermined inclination corresponding to a shape of an edge of the workpiece. laser processing method claim 9 wherein in adjusting the position of the laser beam, the position of the laser beam incident on the lens is adjusted so that a processing surface of the workpiece has a predetermined inclination corresponding to a shape of an edge of the workpiece. laser processing method claim 9 , where obtaining the machining coordinates of the workpiece comprises: capturing an image of the workpiece with an image pickup unit moving in a preset direction; and obtaining actual machining coordinates of the workpiece from the captured image. laser processing method Claim 13 , further comprising, after obtaining the machining coordinates of the workpiece: comparing a difference value between the design machining coordinates stored in advance and the actual machining coordinates with a preset threshold value; replacing the design edit coordinates with the actual edit coordinates if the difference value is less than or equal to the threshold; and if the difference value exceeds the threshold, making a decision to stop processing.

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