CN103100797A - Laser micro machining equipment and laser micro machining method based on adaptive optics - Google Patents
Laser micro machining equipment and laser micro machining method based on adaptive optics Download PDFInfo
- Publication number
- CN103100797A CN103100797A CN2013100247885A CN201310024788A CN103100797A CN 103100797 A CN103100797 A CN 103100797A CN 2013100247885 A CN2013100247885 A CN 2013100247885A CN 201310024788 A CN201310024788 A CN 201310024788A CN 103100797 A CN103100797 A CN 103100797A
- Authority
- CN
- China
- Prior art keywords
- shaft platform
- spindle motor
- light
- speculum
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Microscoopes, Condenser (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses laser micro machining equipment and a laser micro machining method based on adaptive optics. Through the adaptive optics, the laser micro machining equipment and the laser micro machining method are capable of dynamically adjusting a light path status of the lasher machining equipment, solving the problems of focus size, changes of depth of focus, focus position offset caused by the fact that a flight light path is adopted in the lasher machining equipment. Meanwhile, light intensity distribution such as Gaussian light, ceiling light and super Gaussian light are generated by using the adaptive optics, and lasher cutting and lasher drilling are processed by using the obtained light intensity distribution. Therefore, by means of the laser micro machining equipment based on the adaptive optics, stability, accuracy and practical applicability of the system are improved.
Description
Technical field
The present invention relates to field of laser processing, be specifically related to a kind of laser fine process equipment and method based on adaptive optics.
Background technology
At present, laser process equipment is widely used in laser cutting and the laser boring of metal, pottery, glass, printed circuit.The workbench of present laser process equipment mainly contains two kinds of frame modes, and a kind of is monoblock type x, and y bidimensional platform, another kind are separate type x, the y two-dimensional stage.Along with the demand of development and the application of technology, laser process equipment is also gradually to the separate type future development.This is because the separate type platform more adapts to the needs of automation and streamline production.But this mode has also been brought very large challenge to laser optical path, wherein main is the variation of the following aspects of bringing of flight light path: (1) is because the emergent light of present laser instrument is all Gaussian beam, it has certain angle of divergence, when flight light path length changes, the angle of divergence is also different in conglomeration mirror light, the beam cross-section on condenser lens surface is long-pending also along with variation, and the focusing effect of light beam has been produced impact.(2) emergent light of laser instrument is not a desirable light beam, can have certain aberration, and simultaneously, light path system is also being deposited the aberration of a bit, when the flight light path position changes, can produce different diffracting effects, and the focusing of light beam is exerted an influence.(3) flight light path all is fixed on a moveable platform, and platform is at x-y, and the flatness of the several directions of y-z-z-x can exert an influence to the incident angle of light beam, thereby makes the focal position change.Therefore, flight light path can be to the Laser Focusing focus size, and the depth of focus, focal position all can change, and this will inevitably have a huge impact processing, has seriously affected the particularly performance of laser boring of laser cutting.
The problem of bringing in order to solve flight light path, people have proposed a lot of methods, adopt beam expanding lens to carry out beam path alignment as (1), girdle the waist to reduce far-field divergence angle by what increase light beam, but the size of light beam can not infinitely enlarge, and beam expanding lens also can bring extra system aberration and power attenuation.(2) adopt variable curvature radius eyeglass (VRM), the variable curvature radius can dynamically be adjusted the characteristic parameter of light beam when optical path length changes, keep the radius of focus and stablizing of focus trial, but this method can not be adjusted a light path system error well.(3) the servomotor aplanatism system that directly drives, the advantage such as it has simple in structure, and cost is low, easy to adjust, but the impact of correcting motor flatness effectively can only be adjusted the focal radius of laser equipment and the size of depth of focus.
at present, adaptive optical technique is widely used in astronomical telescope, the fields such as laser beam shaping, US Patent No. Pat.No.8, 198, 564 and US.Pat.No.US2012/0250134 proposed to utilize adaptive optical technique to be applied to the technology of laser process equipment, dynamically adjust the quality of laser beam, can obtain good laser cutting, the laser boring effect, simultaneously, utilize adaptive optical technique, can also carry out shaping to laser beam, obtain the output of flat-top light, be conducive to obtain good laser boring effect, but should invention adopt the double wave front sensor, structure is more complicated, cost is higher, and the employing of their mechanical platform is the monolithic two-dimensional translation stage, can not be well in automation loading and unloading combination, be unfavorable for improving Laser Processing efficient.
Summary of the invention
Technical problem to be solved by this invention is certainly the problems such as focus size, depth of focus change and focal position skew that existing laser fine process equipment employing flight light path brings, and a kind of laser fine process equipment and method based on adaptive optics is provided.
For addressing the above problem, the present invention is achieved by the following scheme:
A kind of laser fine process equipment based on adaptive optics mainly is comprised of laser instrument, beam expander, the first speculum, distorting lens, the second speculum, vertical support frame, x spindle motor, the 3rd speculum, x shaft platform, spectroscope, the 4th speculum, z spindle motor, z shaft platform, two-dimensional scan galvanometer, scanning objective, horizontal stand, y spindle motor, y shaft platform, first lens, the second lens, Wavefront sensor and computer;
Speculum, two-dimensional scan galvanometer and scanning objective are positioned on the z shaft platform; Z shaft platform, spectroscope, first lens, the second lens and Wavefront sensor are positioned on the x shaft platform; X shaft platform, the 3rd speculum, the second speculum, distorting lens, the first speculum, beam expander and laser instrument are positioned on vertical support frame; The y shaft platform is positioned on horizontal stand;
X spindle motor, z spindle motor and y spindle motor are connected with computer; The z shaft platform is connected with the z spindle motor, and the z spindle motor is done on the x shaft platform at drive z shaft platform under the control of computer and moved up and down; The x shaft platform is connected with the x spindle motor, and the x spindle motor drives the x shaft platform and does on vertical support frame and move left and right under the control of computer; The y shaft platform is connected with the y spindle motor, and the y spindle motor drives the y shaft platform and does on horizontal stand and move forward and backward under the control of computer;
Wavefront sensor is connected computer with distorting lens; The light that laser instrument sends incides spectroscope by the first speculum, distorting lens, the second speculum, the 3rd speculum successively and carries out light splitting after beam expander expands, the light of a part enters Wavefront sensor, sends in computer after by Wavefront sensor detecting light beam wavefront properties through first lens and first lens successively, the light of another part through the 4th speculum incide the two-dimensional scan galvanometer, by the two-dimensional scan vibration mirror reflected to scanning objective and focus on the y shaft platform.
In such scheme, described distorting lens can be discrete distorting lens, continuous deformation mirror, two voltage distorting lens, MEMS distorting lens, membrane deformable mirror, LCD space light modulator or quick titling mirror one of them.
In such scheme, near the target hot spot of the emergent light of the described distorting lens focal position is Gauss light, super-Gaussian beam or flat-top light.
In such scheme, described y shaft platform can be the common translation stage of artificial loading, can be also the automation charging equipment of automatic charging.
The laser micro-processing method based on adaptive optics according to the described design of above-mentioned laser process equipment comprises the steps:
1. computer reads the laser fine processed file, needing to obtain the path planning of processing, and issue instructions to x spindle motor, y spindle motor and/or z spindle motor go to control the x shaft platform along the x axle move, the y shaft platform moves and/or the z shaft platform moves along the z axle along the y axle, move with the three-dimensional that realizes focal beam spot;
2. before the laser fine processing work, by mobile z spindle motor, make the z shaft platform be in different positions, utilize Wavefront sensor and distorting lens to carry out closed-loop control, obtain the target hot spot that light beam focuses on through scanning objective, and at this moment distoring mirror shape and wavefront sensor data are saved as the demarcation file in computer;
3. during the laser fine processing work, the wavefront of Wavefront sensor real-time detection light beam, by with computer in the demarcation file calculate, obtain the deflection of distorting lens, control distorting lens wavefront and the angle of light beam are adjusted, make light beam obtain the target hot spot and incide exactly in sample to be processed near the scanning objective focus.
In step 2. and 3., comprise further that also distorting lens adjusts the wavefront of incident beam, make emergent light obtain the step of flat top beam, super-Gaussian beam or flat-top optical target hot spot near the focal position.
The present invention utilizes the dynamic characteristic of Wavefront sensor exploring laser light light path and the demarcation file of demarcating in advance, according to the target hot spot, control angular deviation and the wavefront properties of distorting lens Caliberation Flight light path, obtain desirable focus characteristics and focus point is focused on sample exactly near the scanning objective focus, carrying out laser cutting and Laser Processing; By adaptive optical technique, can be dynamically transfer the optical path states of laser process equipment with transferring, can solve effectively that focus size, the depth of focus that laser process equipment adopts flight light path to bring changes, the focal position is offset to get problem; Simultaneously, can also utilize generation Gauss light, flat-top light, the super-Gaussian light isocandela of adaptive optical technique system to distribute, and utilize the light distribution that obtains to carry out laser cutting, laser boring.Therefore, the automatic laser microfabrication equipments based on adaptive optics can improve Systems balanth, accuracy and practicality.
Description of drawings
Fig. 1 is a kind of schematic diagram of the laser fine process equipment based on adaptive optics.
The specific embodiment
A kind of laser fine process equipment based on adaptive optics shown in Figure 1 mainly is comprised of laser instrument 1, beam expander 2, the first speculum 3, distorting lens 4, the second speculum 5, vertical support frame 6, x spindle motor 7, the 3rd speculum 8, x shaft platform 9, spectroscope 10, the 4th speculum 11, z spindle motor 12, z shaft platform 13, two-dimensional scan galvanometer 14, scanning objective 15, horizontal stand 16, y spindle motor 17, y shaft platform 18, first lens 19, the second lens 20, Wavefront sensor 21 and computer.
In the present embodiment, laser instrument 1 adopts the ultraviolet fixed laser, and wavelength is 355nm, and the outgoing spot size is 2mm.The light that laser instrument 1 sends is after beam expander 2 expands, and the outgoing hot spot is 10mm.In the present invention, described distorting lens 4 can be discrete distorting lens, continuous deformation mirror, two voltage distorting lens, MEMS distorting lens, membrane deformable mirror, LCD space light modulator or quick titling mirror one of them.Near the target hot spot of the emergent light of distorting lens 4 focal position is Gauss light, super-Gaussian beam or flat-top light.In the present embodiment, distorting lens 4 adopts two piezoelectric deforming mirrors of Unit 37, has larger dynamic stroke, is used in flat-top light and super-Gaussian light are proofreaied and correct and obtained to wavefront.Wavefront sensor 21 adopts traditional Shack-Hartmann wavefront sensor, and sub-aperture number is 127.What two-dimensional scan galvanometer 14 adopted is ScanLab two-dimensional scan galvanometer.Scanning objective 15 adopts the F-theta lens, can guarantee that focal beam spot vertically arrives sample in a subtle way.What x spindle motor 7, z spindle motor 12 and y spindle motor 17 adopted is the HIWIN linear electric motors, and positioning accuracy and repeatable accuracy are 5um.In the present invention, described y shaft platform 18 can be the common translation stage of artificial loading, can be also the automation charging equipment of automatic charging.In the present embodiment, y shaft platform 18 platform sizes are the automation charging equipment of 450mm * 450mm.
Speculum 11, two-dimensional scan galvanometer 14 and scanning objective 15 are positioned on z shaft platform 13.Z shaft platform 13, spectroscope 10, first lens 19, the second lens 20 and Wavefront sensor 21 are positioned on x shaft platform 9.X shaft platform 9, the 3rd speculum 8, the second speculum 5, distorting lens 4, the first speculum 3, beam expander 2 and laser instrument 1 are positioned on vertical support frame 6.Y shaft platform 18 is positioned on horizontal stand 16.
The laser micro-processing method based on adaptive optics according to the described design of above-mentioned laser fine process equipment comprises the steps:
1. computer reads the Laser Processing file, needing to obtain the path planning of processing, and issue instructions to x spindle motor 7, y spindle motor 17 and/or z spindle motor 12 go to control x shaft platform 9 along the x axle move, y shaft platform 18 moves and/or z shaft platform 13 moves along the z axle along the y axle, move with the three-dimensional that realizes focal beam spot;
2. before the laser fine processing work, by mobile z spindle motor 12, make z shaft platform 13 be in different positions, utilize Wavefront sensor 21 and distorting lens 4 to carry out closed-loop control, obtain the target hot spot that light beam focuses on through scanning objective 15, and at this moment 4 shapes of distorting lens and Wavefront sensor 21 data are saved as the demarcation file in computer;
3. during the laser fine processing work, the wavefront of Wavefront sensor 21 real-time detection light beams, by with computer in the demarcation file calculate, obtain the deflection of distorting lens 4, control wavefront and the angle of 4 pairs of light beams of distorting lens and adjust, make light beam obtain the target hot spot and incide exactly in sample to be processed near the scanning objective focus.
In addition, in step 2. and 3., the wavefront that also further comprises 4 pairs of incident beams of distorting lens is adjusted, and makes emergent light obtain flat top beam, super-Gaussian beam or flat-top optical target hot spot near the focal position, adapts to the step of the demand of different laser processings.
More than that better enforcement of the present invention is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent variations or replacement under the prerequisite of spirit of the present invention, the distortion that these are equal to or replacement all are included in the application's claim limited range.
Claims (6)
1. based on the laser fine process equipment of adaptive optics, it is characterized in that:
mainly by laser instrument (1), beam expander (2), the first speculum (3), distorting lens (4), the second speculum (5), vertical support frame (6), x spindle motor (7), the 3rd speculum (8), x shaft platform (9), spectroscope (10), the 4th speculum (11), z spindle motor (12), z shaft platform (13), two-dimensional scan galvanometer (14), scanning objective (15), horizontal stand (16), y spindle motor (17), y shaft platform (18), first lens (19), the second lens (20), Wavefront sensor (21) and computer form,
Speculum (11), two-dimensional scan galvanometer (14) and scanning objective (15) are positioned on z shaft platform (13); Z shaft platform (13), spectroscope (10), first lens (19), the second lens (20) and Wavefront sensor (21) are positioned on x shaft platform (9); X shaft platform (9), the 3rd speculum (8), the second speculum (5), distorting lens (4), the first speculum (3), beam expander (2) and laser instrument (1) are positioned on vertical support frame (6); Y shaft platform (18) is positioned on horizontal stand (16);
X spindle motor (7), z spindle motor (12) and y spindle motor (17) are connected with computer; Z shaft platform (13) is connected with z spindle motor (12), and z spindle motor (12) is done on x shaft platform (9) at drive z shaft platform (13) under the control of computer and moved up and down; X shaft platform (9) is connected with x spindle motor (7), and x spindle motor (7) is done on vertical support frame (6) at drive x shaft platform (9) under the control of computer and moved left and right; Y shaft platform (18) is connected with y spindle motor (17), and y spindle motor (17) is done on horizontal stand (16) at drive y shaft platform (18) under the control of computer and moved forward and backward;
Wavefront sensor (21) is connected 4 with distorting lens) the connection computer, the light that laser instrument (1) sends after beam expander (2) expands successively by the first speculum (3), distorting lens (4), the second speculum (5), the 3rd speculum (8) incides spectroscope (10) and carries out light splitting, the light of a part enters Wavefront sensor (21) through first lens (19) and first lens (20) successively, by sending in computer after Wavefront sensor (21) detecting light beam wavefront properties, the light of another part incides two-dimensional scan galvanometer (14) through the 4th speculum (11), reflex to scanning objective (15) and focus on y shaft platform (18) by two-dimensional scan galvanometer (14).
2. the laser fine process equipment based on adaptive optics according to claim 1 is characterized in that:
Distorting lens (4) is discrete distorting lens, continuous deformation mirror, two voltage distorting lens, MEMS distorting lens, membrane deformable mirror, LCD space light modulator or quick titling mirror.
3. the laser fine process equipment based on adaptive optics according to claim 1 is characterized in that:
Near the target hot spot of the emergent light of distorting lens (4) focal position is Gauss light, super-Gaussian beam or flat-top light.
4. the laser fine process equipment based on adaptive optics according to claim 1 is characterized in that:
Y shaft platform (18) is common translation stage or automation charging equipment.
5. according to claim 1 based on the laser micro-processing method based on adaptive optics of the laser fine process equipment of adaptive optics, it is characterized in that comprising the steps:
1. computer reads the laser fine processed file, needing to obtain the path planning of processing, and issue instructions to x spindle motor (7), y spindle motor (17) and/or z spindle motor (12) go to control x shaft platform (9) along the x axle move, y shaft platform (18) moves and/or z shaft platform (13) moves along the z axle along the y axle, move with the three-dimensional that realizes focal beam spot;
2. before the laser fine processing work, by mobile z spindle motor (12), make z shaft platform (13) be in different positions, utilize Wavefront sensor (21) and distorting lens (4) to carry out closed-loop control, obtain the target hot spot that light beam focuses on through scanning objective (15), and at this moment distorting lens (4) face shape and Wavefront sensor (21) data are saved as the demarcation file in computer;
3. during the laser fine processing work, the wavefront of Wavefront sensor (21) real-time detection light beam, by with computer in the demarcation file calculate, obtain the deflection of distorting lens (4), control distorting lens (4) wavefront and the angle of light beam are adjusted, make light beam obtain the target hot spot and incide exactly in sample to be processed near the scanning objective focus.
6. the laser micro-processing method based on adaptive optics according to claim 5, it is characterized in that in step 2. and 3., comprise further that also distorting lens (4) adjusts the wavefront of incident beam, make emergent light obtain the step of flat top beam, super-Gaussian beam or flat-top optical target hot spot near the focal position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310024788.5A CN103100797B (en) | 2013-01-23 | 2013-01-23 | Based on laser assisted microprocessing equipment and the method for adaptive optics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310024788.5A CN103100797B (en) | 2013-01-23 | 2013-01-23 | Based on laser assisted microprocessing equipment and the method for adaptive optics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103100797A true CN103100797A (en) | 2013-05-15 |
| CN103100797B CN103100797B (en) | 2015-09-09 |
Family
ID=48309180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310024788.5A Expired - Fee Related CN103100797B (en) | 2013-01-23 | 2013-01-23 | Based on laser assisted microprocessing equipment and the method for adaptive optics |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103100797B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104858544A (en) * | 2014-02-26 | 2015-08-26 | 恩耐激光技术有限公司 | Square Pulse Laser Lift Off |
| CN105527796A (en) * | 2014-09-28 | 2016-04-27 | 上海微电子装备有限公司 | Gantry type device and control method |
| CN105772957A (en) * | 2015-01-08 | 2016-07-20 | 通用电气公司 | Method And System For Confined Laser Drilling |
| CN105772956A (en) * | 2015-01-08 | 2016-07-20 | 通用电气公司 | Method And System For Confined Laser Drilling |
| CN106271122A (en) * | 2015-05-29 | 2017-01-04 | 上海微电子装备有限公司 | A kind of vertical control device and method of laser package equipment |
| CN108025393A (en) * | 2015-09-03 | 2018-05-11 | Eo科技股份有限公司 | Laser processing device and laser processing |
| CN109029719A (en) * | 2018-06-25 | 2018-12-18 | 南京理工大学 | Ultraviolet photic-energy transfer detection system and its detection method based on Shack Hartmann method |
| CN110996557A (en) * | 2020-01-15 | 2020-04-10 | 深圳市聚永能科技有限公司 | Method and apparatus for laser roughening copper foil surface of printed circuit board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5484982A (en) * | 1992-01-31 | 1996-01-16 | Fanuc Ltd. | Beam axis adjusting method for a laser robot |
| US20030132208A1 (en) * | 2002-01-11 | 2003-07-17 | Cutler Donald R. | Simulated laser spot enlargement |
| CN1612793A (en) * | 2002-01-11 | 2005-05-04 | 电子科学工业公司 | Method for laser machining a workpiece with laser spot enlargement |
| JP2011225183A (en) * | 2010-04-22 | 2011-11-10 | Howa Kasei Kk | Register |
| CN102860817A (en) * | 2012-10-12 | 2013-01-09 | 中国科学院光电技术研究所 | Laser scanning confocal ophthalmoscope device based on double wave front corrector |
| CN203124969U (en) * | 2013-01-23 | 2013-08-14 | 刘茂珍 | Laser micro machining equipment based on adaptive optics |
-
2013
- 2013-01-23 CN CN201310024788.5A patent/CN103100797B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5484982A (en) * | 1992-01-31 | 1996-01-16 | Fanuc Ltd. | Beam axis adjusting method for a laser robot |
| US20030132208A1 (en) * | 2002-01-11 | 2003-07-17 | Cutler Donald R. | Simulated laser spot enlargement |
| CN1612793A (en) * | 2002-01-11 | 2005-05-04 | 电子科学工业公司 | Method for laser machining a workpiece with laser spot enlargement |
| JP2011225183A (en) * | 2010-04-22 | 2011-11-10 | Howa Kasei Kk | Register |
| CN102860817A (en) * | 2012-10-12 | 2013-01-09 | 中国科学院光电技术研究所 | Laser scanning confocal ophthalmoscope device based on double wave front corrector |
| CN203124969U (en) * | 2013-01-23 | 2013-08-14 | 刘茂珍 | Laser micro machining equipment based on adaptive optics |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104858544B (en) * | 2014-02-26 | 2018-09-21 | 恩耐公司 | Laser-stripping method and system for causing laser lift-off in target |
| CN104858544A (en) * | 2014-02-26 | 2015-08-26 | 恩耐激光技术有限公司 | Square Pulse Laser Lift Off |
| CN105527796A (en) * | 2014-09-28 | 2016-04-27 | 上海微电子装备有限公司 | Gantry type device and control method |
| CN105527796B (en) * | 2014-09-28 | 2018-03-13 | 上海微电子装备（集团）股份有限公司 | Planer-type equipment and control method |
| CN105772957A (en) * | 2015-01-08 | 2016-07-20 | 通用电气公司 | Method And System For Confined Laser Drilling |
| CN105772956A (en) * | 2015-01-08 | 2016-07-20 | 通用电气公司 | Method And System For Confined Laser Drilling |
| CN105772956B (en) * | 2015-01-08 | 2020-11-03 | 通用电气公司 | Method and system for confined laser drilling |
| CN106271122B (en) * | 2015-05-29 | 2019-01-18 | 上海微电子装备（集团）股份有限公司 | A kind of vertical control device and method of laser package equipment |
| CN106271122A (en) * | 2015-05-29 | 2017-01-04 | 上海微电子装备有限公司 | A kind of vertical control device and method of laser package equipment |
| CN108025393A (en) * | 2015-09-03 | 2018-05-11 | Eo科技股份有限公司 | Laser processing device and laser processing |
| US10286485B2 (en) | 2015-09-03 | 2019-05-14 | Eo Technics Co., Ltd. | Laser processing device and laser processing method |
| CN109029719A (en) * | 2018-06-25 | 2018-12-18 | 南京理工大学 | Ultraviolet photic-energy transfer detection system and its detection method based on Shack Hartmann method |
| CN110996557A (en) * | 2020-01-15 | 2020-04-10 | 深圳市聚永能科技有限公司 | Method and apparatus for laser roughening copper foil surface of printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103100797B (en) | 2015-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203124969U (en) | Laser micro machining equipment based on adaptive optics | |
| CN103100797B (en) | Based on laser assisted microprocessing equipment and the method for adaptive optics | |
| CN105081586B (en) | A kind of laser processing and device | |
| CN110125536B (en) | Laser processing device and method for removing thin film material | |
| CN111505831B (en) | Focal spot focal depth variable Bessel beam laser processing system and method | |
| CN104570363A (en) | Gauss laser beam shaping method and device and precise laser micropore processing device | |
| CN105478767A (en) | Device and method for obtaining metal dental prosthesis through laser 3D printing | |
| CN110174769A (en) | Light irradiation device and method, the optical machining device and method that have light irradiation device | |
| CN106773025B (en) | Focusing lens and lens vibrating type laser scanning system | |
| CN103157904B (en) | Laser processing device based on dynamic focusing | |
| CN105598579A (en) | Laser processing device and method for carrying out vision positioning based on two coaxial CCDs | |
| CN203149208U (en) | Shaping and beam equalizing device of excimer laser | |
| CN103639590B (en) | A kind of thin metal blank radius of curvature method of adjustment based on hollow beam laser-impact and device | |
| CN105301768A (en) | Galvanometer laser scanning system | |
| CN201693290U (en) | Laser processing device | |
| CN103658975A (en) | Laser beam splitting and processing device | |
| CN103418911A (en) | Narrow-space laser marking method and marking machine thereof | |
| CN113649595A (en) | Annular light spot optical system for metal SLM printing and printing method | |
| CN105458492A (en) | Precision laser processing device based on swing angle compression | |
| CN204934880U (en) | There is the laser cutting machine of multi-parameter set-up function | |
| CN204248222U (en) | A kind of three axle dynamic focusing laser mark printing devices | |
| CN204934881U (en) | There is the laser cutting head of real-time adjusting process parameter function | |
| CN105974579A (en) | Angle changing device for large-aperture parallel beams based on off-axis parabolic mirror | |
| CN216990332U (en) | Laser processing device | |
| CN105149792A (en) | Control system for three-dimensional laser carving machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150909 Termination date: 20220123 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |