CN106271122B - A kind of vertical control device and method of laser package equipment - Google Patents
A kind of vertical control device and method of laser package equipment Download PDFInfo
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- CN106271122B CN106271122B CN201510288406.9A CN201510288406A CN106271122B CN 106271122 B CN106271122 B CN 106271122B CN 201510288406 A CN201510288406 A CN 201510288406A CN 106271122 B CN106271122 B CN 106271122B
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Abstract
The present invention relates to a kind of vertical control device and methods of laser package equipment, the device includes marble pedestal, Substrate table, contourgraph, glass substrate, portal frame, laser and multiple scanning galvanometers, catenary motion actuator is installed, drive substrate platform vertically moves in Substrate table；Portal frame is installed on marble pedestal by portal frame guide rail, and portal frame can horizontally move on portal frame guide rail；The laser beam of laser transmitting, is irradiated on glass substrate or contourgraph through scanning galvanometer；Each scanning galvanometer side is mounted on contactless elevation carrection sensor, for measuring contactless elevation carrection transducer zeroing and the distance between glass substrate or contourgraph；Substrate table elevation carrection sensor is additionally provided on Substrate table, for measure glass substrate between marble pedestal at a distance from.The present invention is encapsulated using multiple scanning galvanometer parallel scans, solves the vertical control problem of large-size substrate encapsulation, while improving the yield and quality of encapsulation.
Description
Technical field
The present invention relates to the vertical control devices and side of laser package apparatus field more particularly to a kind of laser package equipment
Method.
Background technique
In recent years, being constantly progressive and perfect, the also court of glass substrate used in laser package with flat panel display
Large scale direction develop.There is whole wedge shape and partial face shape in glass substrate, after substrate size increases, substrate it is integral inclined and
Partial face shape may cause encapsulation field edge defocus；To the laser package equipment for using non-telecentric structure lens, there is also vertical
To horizontally crosstalk phenomenon, i.e., vertical defocus causes laser beam to translate in horizontal direction, seriously affects laser package
Quality.
Traditional laser package device and method, as disclosed on December 25th, 2013, application publication number is
The Chinese patent application of CN103465471A, wherein just lacking vertical control device and method, after substrate size becomes larger, with biography
The laser package equipment of system is packaged, it is possible to which there are edge defocus, package qualities to be unsatisfactory for requiring, while packaging efficiency
(Throughout) lower problem.
Summary of the invention
The present invention provides a kind of vertical control device and method of laser package equipment, to improve sized rectangular glass substrate
Packaging efficiency is eliminated vertical to horizontally crosstalk, guarantee package quality.
In order to solve the above technical problems, the present invention provides a kind of vertical control device of laser package equipment, comprising: laser
Light source, for emitting laser light source；Multiple scanning galvanometers for receiving above-mentioned laser light source, and are formed for carrying out to substrate
The hot spot of laser annealing；Substrate table, for carrying above-mentioned substrate, the scanning galvanometer or/and the Substrate table according to measurement institute
The parameter of hot spot, including light spot energy and shape are stated, vertical distance adjustment is carried out.
Specifically, the vertical control device of the laser package equipment, comprising: marble pedestal is fixed on the Dali
Substrate table on stone pedestal and the contourgraph for measuring laser beam spot size and light intensity, the glass being placed on the Substrate table
Glass substrate is equipped with catenary motion actuator in the Substrate table, the Substrate table is driven vertically to move；
Portal frame, the portal frame are installed on the marble pedestal by portal frame guide rail, and the portal frame energy
It is enough to be moved in the horizontal direction on portal frame guide rail；
Laser for emitting laser beams, the multiple scanning galvanometers being fixed on the portal frame, the laser hair
The laser beam penetrated is irradiated on the glass substrate or the contourgraph by the scanning galvanometer；
Each scanning galvanometer side is mounted on a contactless elevation carrection sensor, described non-for measuring
The distance between contact elevation carrection transducer zeroing and the glass substrate or contactless elevation carrection transducer zeroing
The distance between described contourgraph；
Substrate table elevation carrection sensor is additionally provided on the Substrate table, for measuring the glass substrate and the Dali
The distance between stone pedestal.
Preferably, being equipped with movable lens, the focus of the scanning galvanometer described in vertically delicate adjusting in the scanning galvanometer.
Preferably, the quantity of the portal frame is one, the multiple scanning galvanometer is on the portal frame, along the horizontal plane
On perpendicular to the scanning galvanometer scanning direction arrange.
Preferably, the quantity of the portal frame be it is multiple, the multiple portal frame is along the scanning direction of the scanning galvanometer
Arrangement.
Preferably, the contactless elevation carrection sensor uses Chromatic sensor, displacement sensor or focusing and leveling
Sensor.
Preferably, the Substrate table elevation carrection sensor presses transformer or interferometer using grating scale, linear variable.
The present invention also provides a kind of vertical control methods of laser package equipment, are applied to vertical control as described above
In device, include the following steps:
S1: when the scanning galvanometer is radiated at the laser beam spot light intensity maximum on contourgraph, the contactless height
The height for spending measurement sensor measurement contourgraph, demarcates pinpointed focus, is denoted as ZBF；
S2: when the scanning galvanometer is radiated at the laser beam spot light intensity maximum on contourgraph, the Substrate table height
Measurement sensor measures the height between the glass substrate and marble pedestal, and calibration substrate platform reference altitude is denoted as
ZpsBFref；
S3: encapsulation all on glass substrate field is grouped, and determines the center of each encapsulation group by grouping algorithm；
S4: contactless each encapsulation group centre-height of elevation carrection sensor measurement is denoted as Zmes_i；
S5: it is calculated in scanning encapsulation process by model of focusing by group by field measurement, the Substrate table height set ZSWith
The vertical adjustment amount Δ z of each scanning galvanometeri；
S6: the Substrate table and scanning galvanometer Joint regulation make each scanning galvanometer pinpointed focus be located at the glass substrate
On.
Preferably, to encapsulating, the step of field is grouped is as follows in step S3:
S31: point column screen the smallest x from all bottom left vertex x coordinates for not dividing and arranging ungrouped encapsulation fieldmin, the
The left margin point x of one columnleftWith right margin point xrightShown in calculation formula such as formula (1):
Wherein, lwidowFor the width for being grouped window；
S32: do not divide in the ungrouped encapsulation field of column from all, by encapsulating field bottom left vertex x coordinate (x ∈ [xleft,
xright]) determine all encapsulation fields for belonging to first row；
S33: the smallest y is screened from all encapsulation field bottom left vertex y-coordinates of first rowmin, determine the column first grouping
Window bottom left vertex coordinate, as shown in formula (2):
S34: lower boundary and the coboundary of grouping window y-coordinate are calculated by formula (3):
S35: the centre coordinate (x of first grouping window is determinedcenter,ycenter), as shown in formula (4):
S36: from all encapsulation fields of first row, by encapsulating field bottom left vertex y-coordinate (y ∈ [ydown,yup]) determination belong to
All encapsulation fields of first grouping window；
S37: judging the encapsulation field for whether needing to be grouped in the column, if so, then update grouping window bottom left vertex y-coordinate be
Same column waits being grouped encapsulation field bottom left vertex coordinate y minimum value ymin, loop to determine；
S38: column encapsulation field grouping is completed, grouping window bottom left vertex x coordinate x is updatedmin, go to step S31.
Preferably, determining the Substrate table height set Z in step S5SThe step of it is as follows:
S51: straight line fitting is done to same a line encapsulation group centre-height of parallel measurement, meets formula (5):
Formula (5) has redundancy, and the Zl and Ryl of fitting a straight line can be acquired by formula (5)；
S52: vertical adjustment Substrate table tilts Ry, the glass substrate local dip Ryl that compensation (5) calculate；
S53: calculating the height value Zaim of target point, if target point horizontal X coordinate is xaim, then target point height is by formula
(6) it can obtain:
Zaim=Zl-Ryl·xaim...............................(6)
S54: calculating the vertical height set ZS of Substrate table, as shown in formula (7):
ZS=ZpsBFref+(ZBF-Zaim)...............................(7)。
Preferably, in step S5, the vertical adjustment amount Δ z of each scanning galvanometeriAs shown in formula (8):
Δzi=Zl-Ryl·xmes_i-Zmes_i...............................(8).With the prior art
It compares, the vertical control device and method of laser package equipment provided by the invention has the advantages that
A scanning galvanometer parallel scan encapsulation more than 1., and a contourgraph is shared, the reference altitude of each scanning galvanometer is demarcated,
Yield is improved, while occupied area can be saved with save the cost；
2. being equipped with movable lens in scanning galvanometer, movable lens are combined with Substrate table carries out vertical adjusting, compensates large scale
Real estate shape, compensation adjustment range is big, high reliablity；
3. a pair encapsulation field is grouped, controls multiple scanning galvanometers while being moved along the center of encapsulation group, rather than along envelope
The center movement of dress field further increases yield to reduce vertical mobile number and distance.
Detailed description of the invention
Fig. 1 is the vertical controling device structure diagram of the laser package equipment of the embodiment of the present invention one；
Fig. 2 is the flow diagram of group technology in the present invention；
Fig. 3 is the encapsulation field center schematic diagram before grouping；
Fig. 4 is the scan path schematic diagram of single sweep galvanometer in existing laser package equipment；
Fig. 5 is present invention grouping post package group center schematic diagram；
Fig. 6 is the scan path schematic diagram of multiple scanning galvanometers in the embodiment of the present invention one；
Fig. 7 is that the Substrate table height in the embodiment of the present invention one adjusts schematic diagram；
Fig. 8 is the vertical controling device structure diagram of the laser package equipment of the embodiment of the present invention two；
Fig. 9 is the scan path schematic diagram of multiple scanning galvanometers in the embodiment of the present invention two.
In Fig. 1-7: the contactless elevation carrection sensor of 1- laser, 2-, 3- contourgraph, 4- scanning galvanometer, 5- substrate
Platform elevation carrection sensor, 6- catenary motion actuator, 7- glass substrate, 8- portal frame, 9- portal frame guide rail, 10- Substrate table,
11- marble pedestal, 12- are grouped window；
In Fig. 8-9: 24- scanning galvanometer, the first portal frame of 28A-, the second portal frame of 28B-.
Specific embodiment
In order to more state the technical solution of foregoing invention in detail, being exemplified below specific embodiment proves that technology is imitated
Fruit；It is emphasized that these embodiments are not limited to limit the scope of the invention for illustrating the present invention.
Embodiment one
A kind of vertical control device of laser package equipment provided by the invention, as shown in Figure 1, comprising: marble pedestal
11, the Substrate table 10 being fixed on the marble pedestal 11 and the contourgraph 3 for measuring laser beam spot size and light intensity,
The glass substrate 7 being placed on the Substrate table 10, is equipped with catenary motion actuator 6 in the Substrate table 10, described in driving
Substrate table 10 vertically (Z-direction) moves；
Portal frame 8, the portal frame 8 is installed on the marble pedestal 11 by portal frame guide rail 9, and described gantry
Frame 8 being capable of (X to the and Y-direction) movement in the horizontal direction on portal frame guide rail 9；
Laser 1 for emitting laser beams, the multiple scanning galvanometers 4 being fixed on the portal frame 8, the laser
The laser beam of 1 transmitting, is irradiated on the glass substrate 7 or the contourgraph 3 by the scanning galvanometer 4；
Each 4 side of the scanning galvanometer is mounted on a contactless elevation carrection sensor 2, described for measuring
The distance between contactless 2 zero-bit of elevation carrection sensor (being defined as horizontal direction zero-bit) and the glass substrate 7 non-connect
The distance between 2 zero-bit of touch elevation carrection sensor and the contourgraph 3；
Substrate table elevation carrection sensor 5 is additionally provided on the Substrate table 10, for measure the glass substrate 7 with it is described
The distance between marble pedestal 11.
In the present invention, portal frame 8 carries scanning galvanometer 4 and moves in the horizontal direction along portal frame guide rail 9, and Substrate table 10 is held
7 catenary motion of glass substrate is carried, to realize laser package.And multiple 4 parallel scans of scanning galvanometer is utilized to encapsulate, improve envelope
The yield and quality of dress, and multiple scanning galvanometers 4 share a contourgraph 3, demarcate the reference altitude of each scanning galvanometer 4, solve
The vertical control problem of large-size substrate encapsulation, and save the cost, save occupied area.
Preferably, being equipped with movable lens (not shown), the scanning galvanometer described in vertically delicate adjusting in the scanning galvanometer 4
4 focus has 3DOF (x, y, Δ z) so that scanning galvanometer 4 can be scanned with drive laser beam according to desired trajectory.
Preferably, with continued reference to FIG. 1, the quantity of the portal frame 8 is one, the multiple scanning in the present embodiment
Galvanometer 4 on the portal frame 8, along the horizontal plane on perpendicular to the scanning galvanometer 4 scanning direction (X-direction in Fig. 1) arrange,
When portal frame 8 is moved along scanning direction (Y-direction), multiple scanning galvanometers 4 on portal frame 8 are scanned parallel, improve encapsulation
Efficiency.
Preferably, the contactless elevation carrection sensor 2 is using Chromatic sensor, displacement sensor or focusing and leveling
Sensor, specifically, the contactless elevation carrection sensor 2 can return to quilt under the premise of not contacting testee
The numerical value for surveying a certain measuring surface at least Z-direction on object, can measure the relatively contactless elevation carrection sensor 2 of glass plate 7
The height value of 3 upper surface of height value and contourgraph of zero-bit.
Preferably, the Substrate table elevation carrection sensor 5 presses transformer or interference using grating scale, linear variable
Instrument, specifically, the Substrate table elevation carrection sensor 5 can measure height of the glass substrate 7 relative to marble pedestal 11
Value, and realize that closed-loop control carrys out moving substrate platform 10 with the catenary motion actuator 6, to make the best coke of scanning galvanometer 4
Point is located on glass substrate 7.
The present invention also provides a kind of vertical control methods of laser package equipment, are applied to vertical control as described above
In device, please continue to refer to Fig. 1 and Fig. 7, include the following steps:
S1: described contactless when the scanning galvanometer 4 is radiated at the laser beam spot light intensity maximum on contourgraph 3
Elevation carrection sensor 2 measures the height of contourgraph 3, and off-line calibration pinpointed focus is denoted as ZBF；
S2: when the scanning galvanometer 4 is radiated at the laser beam spot light intensity maximum on contourgraph 3, the Substrate table is high
Degree measurement sensor 5 measures the height between the glass substrate 7 and marble pedestal 11, and off-line calibration Substrate table is with reference to high
Degree, is denoted as ZpsBFref；
S3: encapsulation fields all on the glass substrate 7 are grouped, and are determined in each encapsulation group by grouping algorithm
The heart；
S4: the contactless elevation carrection sensor 2 measures each encapsulation group centre-height, is denoted as Zmes_i；
S5: it is calculated in scanning encapsulation process by model of focusing by group by field measurement, the Substrate table height set ZSWith
The vertical adjustment amount Δ z of each scanning galvanometer 4i；
S6: 4 Joint regulation of the Substrate table 10 and scanning galvanometer makes each 4 pinpointed focus of scanning galvanometer be located at the glass
On substrate 7.
Preferably, ask emphasis with reference to Fig. 2, in step S3, the step of being grouped to encapsulation field, is as follows:
S31: point column screen the smallest x from all bottom left vertex x coordinates for not dividing and arranging ungrouped encapsulation fieldmin, the
The left margin point x of one columnleftWith right margin point xrightShown in calculation formula such as formula (1):
Wherein, lwidowFor the width for being grouped window 12；
S32: do not divide in the ungrouped encapsulation field of column from all, by encapsulating field bottom left vertex x coordinate (x ∈ [xleft,
xright]) determine all encapsulation fields for belonging to first row；
S33: the smallest y is screened from all encapsulation field bottom left vertex y-coordinates of first rowmin, determine the column first grouping
12 bottom left vertex coordinate of window, as shown in formula (2):
S34: lower boundary and the coboundary of the y-coordinate of grouping window 12 are calculated by formula (3):
S35: the centre coordinate (x of first grouping window 12 is determinedcenter,ycenter), as shown in formula (4):
S36: from all encapsulation fields of first row, by encapsulating field bottom left vertex y-coordinate (y ∈ [ydown,yup]) determination belong to
All encapsulation fields of first grouping window 12；
S37: judging the encapsulation field for whether needing to be grouped in the column, if so, then updating grouping 12 bottom left vertex y-coordinate of window
Wait being grouped encapsulation field bottom left vertex coordinate y minimum value y for same columnmin, loop to determine；
S38: column encapsulation field grouping is completed, grouping 12 bottom left vertex x coordinate x of window is updatedmin, go to step S31.
The present invention carries out logical partitioning according to the size of encapsulation field apex coordinate and grouping window 12, wraps in an encapsulation group
Containing several physical package fields, compared by Fig. 5 and Fig. 3 it is found that multiple scanning galvanometers 4 after being grouped are moved along the center of encapsulation group simultaneously
It is dynamic, rather than the center movement along encapsulation field further increases yield to reduce vertical mobile number and distance.
Preferably, determining the Substrate table height set Z in step S5SThe step of it is as follows:
S51: straight line fitting is done to same a line encapsulation group centre-height of parallel measurement, meets formula (5):
Formula (5) has redundancy, and the Z of fitting a straight line can be acquired by formula (5)lAnd Ryl；
S52: vertical adjustment Substrate table tilts Ry, the glass substrate local dip R of compensation (5) calculatingyl；
S53: the height value Z of target point is calculatedaimIf target point horizontal X coordinate is xaim, then target point height is by formula (6)
It can obtain:
Zaim=Zl-Ryl·xaim...............................(6)
S54: the vertical height set Z of Substrate table is calculatedS, as shown in formula (7):
ZS=ZpsBFref+(ZBF-Zaim) ... ... ... ... ... (7),
Within the focal depth range of 7 integrated regulation of glass substrate to scanning galvanometer 4.
Preferably, in step S5, the vertical adjustment amount Δ z of each scanning galvanometeriAs shown in formula (8):
Δzi=Zl-Ryl·xmes_i-Zmes_i... ... ... ... ... (8),
Each 4 pinpointed focus of scanning galvanometer is adjusted in the fitting a straight line determined by formula (5).
The present invention carries out vertical Joint regulation by the movable lens in Substrate table 10 and scanning galvanometer 4, and each scanning is made to shake
4 pinpointed focus of mirror is adjusted on glass substrate 7, and is compared by Fig. 6 and Fig. 4 it is found that three 4 parallel scans of scanning galvanometer encapsulate,
Improved efficiency 3 times.
Embodiment two
Please emphasis refer to Fig. 8, the difference between this embodiment and the first embodiment lies in: the quantity of the portal frame be it is multiple, this
It is two in embodiment, i.e. the first portal frame 28A and the second portal frame 28B, the multiple portal frame is along the scanning galvanometer 24
Scanning direction (Y-direction) arrangement.It is driven thereon in this way, the first portal frame 28A and the second portal frame 28B is moved along Y-direction simultaneously
Scanning galvanometer 24 is scanned, and obtains scan path figure as shown in Figure 9, with Fig. 4 comparison it is found that six scanning galvanometers 4 are parallel
Scanning encapsulation, improved efficiency 6 times.
In conclusion a kind of vertical control device of laser package equipment provided by the invention, which includes marble
Pedestal, the Substrate table being fixed on the marble pedestal and the contourgraph for measuring laser beam spot size and light intensity, put
The glass substrate being placed on the Substrate table is equipped with catenary motion actuator in the Substrate table, drives the Substrate table edge
Catenary motion；Portal frame, the portal frame are installed on the marble pedestal by portal frame guide rail, and the portal frame energy
It is enough to be moved in the horizontal direction on portal frame guide rail；Laser for emitting laser beams is fixed on more on the portal frame
A scanning galvanometer, the laser beam of the laser transmitting, is irradiated to the glass substrate or the wheel by the scanning galvanometer
On wide instrument；Each scanning galvanometer side is mounted on a contactless elevation carrection sensor, described non-for measuring
The distance between contact elevation carrection transducer zeroing and the glass substrate or contactless elevation carrection transducer zeroing
The distance between described contourgraph；Substrate table elevation carrection sensor is additionally provided on the Substrate table, for measuring the glass
The distance between glass substrate and the marble pedestal.The present invention is encapsulated using multiple scanning galvanometer parallel scans, is solved big
The vertical control problem of size substrate encapsulation, while improving the yield and quality of encapsulation.
Obviously, those skilled in the art can carry out various modification and variations without departing from spirit of the invention to invention
And range.If in this way, these modifications and changes of the present invention belong to the claims in the present invention and its equivalent technologies range it
Interior, then the invention is also intended to include including these modification and variations.
Claims (10)
1. a kind of vertical control device of laser package equipment characterized by comprising
Marble pedestal, the Substrate table being fixed on the marble pedestal and for measuring laser beam spot size and light intensity
Contourgraph, the glass substrate being placed on the Substrate table are equipped with catenary motion actuator in the Substrate table, described in driving
Substrate table vertically moves；
Portal frame, the portal frame are installed on the marble pedestal by portal frame guide rail, and the portal frame can be
It is moved in the horizontal direction on portal frame guide rail；
Laser for emitting laser beams, the multiple scanning galvanometers being fixed on the portal frame, the laser transmitting
Laser beam is irradiated on the glass substrate or the contourgraph by the scanning galvanometer；
Each scanning galvanometer side is mounted on a contactless elevation carrection sensor, described non-contact for measuring
The distance between formula elevation carrection transducer zeroing and the glass substrate or contactless elevation carrection transducer zeroing and institute
State the distance between contourgraph；It is described non-when the scanning galvanometer is radiated at the laser beam spot light intensity maximum on contourgraph
The height of contact elevation carrection sensor measurement contourgraph demarcates pinpointed focus；
Substrate table elevation carrection sensor is additionally provided on the Substrate table, for measuring the glass substrate and the marble bottom
The distance between seat, and when the scanning galvanometer is radiated at the laser beam spot light intensity maximum on contourgraph, the Substrate table
Height between glass substrate described in elevation carrection sensor measurement and marble pedestal, calibration substrate platform reference altitude；
The Substrate table and scanning galvanometer Joint regulation are located at each scanning galvanometer pinpointed focus on the glass substrate.
2. a kind of vertical control device of laser package equipment as described in claim 1, which is characterized in that the scanning galvanometer
It is interior to be equipped with movable lens, the focus of the scanning galvanometer described in vertically delicate adjusting.
3. a kind of vertical control device of laser package equipment as described in claim 1, which is characterized in that the portal frame
Quantity be one, the multiple scanning galvanometer on the portal frame, along the horizontal plane on perpendicular to the scanning galvanometer scanning
Direction arrangement.
4. a kind of vertical control device of laser package equipment as described in claim 1, which is characterized in that the portal frame
Quantity be it is multiple, the multiple portal frame along the scanning galvanometer scanning direction arrange.
5. a kind of vertical control device of laser package equipment as described in claim 1, which is characterized in that described contactless
Elevation carrection sensor uses Chromatic sensor, displacement sensor or focusing and leveling sensor.
6. a kind of vertical control device of laser package equipment as described in claim 1, which is characterized in that the Substrate table is high
Degree measurement sensor presses transformer or interferometer using grating scale, linear variable.
7. a kind of vertical control method of laser package equipment is applied to such as vertical control according to any one of claims 1 to 6
In device processed, which comprises the steps of:
S1: when the scanning galvanometer is radiated at the laser beam spot light intensity maximum on contourgraph, the contactless height is surveyed
Quantity sensor measures the height of contourgraph, demarcates pinpointed focus, is denoted as ZBF；
S2: when the scanning galvanometer is radiated at the laser beam spot light intensity maximum on contourgraph, the Substrate table elevation carrection
Height between glass substrate described in sensor measurement and marble pedestal, calibration substrate platform reference altitude, is denoted as ZpsBFref；
S3: encapsulation all on glass substrate field is grouped, and determines the center of each encapsulation group by grouping algorithm；
S4: contactless each encapsulation group centre-height of elevation carrection sensor measurement is denoted as Zmes_i；
S5: it is calculated in scanning encapsulation process by model of focusing by group by field measurement, the Substrate table height set ZSWith each scanning
The vertical adjustment amount Δ z of galvanometeri；
S6: the Substrate table and scanning galvanometer Joint regulation are located at each scanning galvanometer pinpointed focus on the glass substrate.
8. a kind of vertical control method of laser package equipment as claimed in claim 7, which is characterized in that right in step S3
The step of encapsulation field is grouped is as follows:
S31: point column screen the smallest x from all bottom left vertex x coordinates for not dividing and arranging ungrouped encapsulation fieldmin, first row
Left margin point xleftWith right margin point xrightShown in calculation formula such as formula (1):
Wherein, lwidowFor the width for being grouped window；
S32: do not divide in the ungrouped encapsulation field of column from all, by encapsulating field bottom left vertex x coordinate (x ∈ [xleft,xright]) really
Surely belong to all encapsulation fields of first row；
S33: the smallest y is screened from all encapsulation field bottom left vertex y-coordinates of first rowmin, determine that first grouping window of the column is left
Lower apex coordinate, as shown in formula (2):
S34: lower boundary and the coboundary of grouping window y-coordinate are calculated by formula (3):
S35: the centre coordinate (x of first grouping window is determinedcenter,ycenter), as shown in formula (4):
S36: from all encapsulation fields of first row, by encapsulating field bottom left vertex y-coordinate (y ∈ [ydown,yup]) determination belong to first
All encapsulation fields of a grouping window；
S37: judging the encapsulation field for whether needing to be grouped in the column, if so, then updating grouping window bottom left vertex y-coordinate is same column
Wait be grouped encapsulation field bottom left vertex coordinate y minimum value ymin, loop to determine；
S38: column encapsulation field grouping is completed, grouping window bottom left vertex x coordinate x is updatedmin, go to step S31.
9. a kind of vertical control method of laser package equipment as claimed in claim 8, which is characterized in that in step S5, really
The fixed Substrate table height set ZSThe step of it is as follows:
S51: straight line fitting is done to same a line encapsulation group centre-height of parallel measurement, meets formula (5):
Formula (5) has redundancy, and the Z of fitting a straight line can be acquired by formula (5)lAnd Ryl；
S52: vertical adjustment Substrate table tilts Ry, the glass substrate local dip R of compensation (5) calculatingyl；
S53: the height value Z of target point is calculatedaimIf target point horizontal X coordinate is xaim, then target point height can be obtained by formula (6):
Zaim=Zl-Ryl·xaim………………………….(6)
S54: the vertical height set Z of Substrate table is calculatedS, as shown in formula (7):
ZS=ZpsBFref+(ZBF-Zaim)………………………….(7)。
10. a kind of vertical control method of laser package equipment as claimed in claim 9, which is characterized in that in step S5, institute
State the vertical adjustment amount Δ z of each scanning galvanometeriAs shown in formula (8):
Δzi=Zl-Ryl·xmes_i-Zmes_i………………………….(8)。
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| CN109471333B (en) * | 2017-09-08 | 2020-05-01 | 上海微电子装备（集团）股份有限公司 | Galvanometer correction system and method |
| CN109967866A (en) * | 2019-04-19 | 2019-07-05 | 苏州德龙激光股份有限公司 | Marking on the fly mode Combined process equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0785472A2 (en) * | 1996-01-16 | 1997-07-23 | Canon Kabushiki Kaisha | Scan type projection exposure apparatus and device manufacturing method using the same |
| CN101158818A (en) * | 2007-11-16 | 2008-04-09 | 上海微电子装备有限公司 | Alignment apparatus, alignment method and imagery quality detecting method |
| CN202896121U (en) * | 2012-10-31 | 2013-04-24 | 义乌市圣石激光技术有限公司 | Large-format laser engraving machine |
| CN103100797A (en) * | 2013-01-23 | 2013-05-15 | 刘茂珍 | Laser micro machining equipment and laser micro machining method based on adaptive optics |
| CN103465471A (en) * | 2013-08-09 | 2013-12-25 | 上海大学 | Laser packaging method and device |
-
2015
- 2015-05-29 CN CN201510288406.9A patent/CN106271122B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0785472A2 (en) * | 1996-01-16 | 1997-07-23 | Canon Kabushiki Kaisha | Scan type projection exposure apparatus and device manufacturing method using the same |
| CN101158818A (en) * | 2007-11-16 | 2008-04-09 | 上海微电子装备有限公司 | Alignment apparatus, alignment method and imagery quality detecting method |
| CN202896121U (en) * | 2012-10-31 | 2013-04-24 | 义乌市圣石激光技术有限公司 | Large-format laser engraving machine |
| CN103100797A (en) * | 2013-01-23 | 2013-05-15 | 刘茂珍 | Laser micro machining equipment and laser micro machining method based on adaptive optics |
| CN103465471A (en) * | 2013-08-09 | 2013-12-25 | 上海大学 | Laser packaging method and device |
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