CN111505831B - Focal spot focal depth variable Bessel beam laser processing system and method - Google Patents
Focal spot focal depth variable Bessel beam laser processing system and method Download PDFInfo
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0911—Anamorphotic systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
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- G—PHYSICS
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- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
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- G—PHYSICS
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- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0972—Prisms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/0977—Reflective elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
Abstract
The invention belongs to the field of laser precision manufacturing, and relates to a focal spot focal depth variable Bessel beam laser processing system and a method, which solve the problem that the existing Bessel beam laser processing system cannot be suitable for processing different hole patterns and material thicknesses, and comprise a laser, and a beam expander, a diaphragm, a wave plate, a zoom lens, a positive axis pyramid and a lens which are sequentially arranged in an emergent light path of the laser; light beams emitted from the laser are expanded and homogenized by the beam expander, enter the diaphragm to filter out stray light, reach the wave plate, enter the zoom lens, change the focal spot focal depth of the generated Bessel light beams by adjusting the focal length of the zoom lens and the distance between the zoom lens and the positive axicon to obtain light beams to be processed, and act on the surface of a workpiece after being focused by the lens. The focal spot focal depth change of the Bessel beam can be processed by the system, multipurpose processing of micropores, transparent materials and the like with large depth-diameter ratio is realized, and guarantee is provided for high-precision micropore type manufacturing, high-quality transparent material cutting and the like.
Description
Technical Field
The invention belongs to the field of laser precision manufacturing, and relates to a processing system and a processing method for processing a beam into a Bessel beam and changing the focal depth of a focal spot of the beam.
Background
At present, the best processing mode in the field of laser micromachining is to realize the processing of micropores, transparent materials and the like with large depth-diameter ratio through Bessel beams. The Bessel processing beam is generated as a key technology in a processing system, and the generation mode comprises an axicon, a circumferential seam lens, a spatial light modulator, a deformable mirror and the like. The axicon mode has the advantages of low loss, low cost and the like and is widely concerned.
In the processing of the micropore and the transparent material with large depth-diameter ratio, the requirements for processing light beams are different according to different hole patterns and different material thicknesses. The Bessel light beam with large focal depth and large focal spot is needed for deep holes and thick materials, so that the verticality of the processed micropores and the transparent materials is guaranteed. For shallow holes and thin materials, Bessel beams with small focal depth and small focal spots are needed, and narrow machining line width is obtained to realize high-verticality machining, so that machining quality is guaranteed.
At present, a laser processing system for generating Bessel beams by utilizing an axicon has fixed focal spots and focal depths, and different processing systems need to be replaced when different hole patterns and material thicknesses are processed, so that the function is single, and the processing cost is high.
Disclosure of Invention
The invention provides a focal spot focal depth variable Bessel beam processing system and a method, aiming at solving the problem that the existing Bessel beam laser processing system cannot be suitable for processing different hole patterns and material thicknesses.
The technical scheme of the invention is to provide a Bessel beam laser processing system with a variable focal spot focal depth, which is characterized in that: the device comprises a laser, and a beam expander, a diaphragm, a wave plate, a zoom lens, a right-axis pyramid and a lens which are sequentially arranged in an emergent light path of the laser;
the beam expander is used for expanding and homogenizing the light beam emitted by the laser; the diaphragm is used for filtering out stray light of the expanded and homogenized light beam; the wave plate is used for modulating the polarization state of the laser; the zoom lens and the positive axicon are used for generating a Bessel light beam with a target focal spot focal depth, and the focal length of the zoom lens and the distance between the zoom lens and the positive axicon are adjusted; the lens is used for focusing the Bessel light beam with the target focal spot focal depth and then acting on the surface of the workpiece.
Further, the focal length of the zoom lens is related to the focal spot R of the bessel beam as follows:
R＝(n-1)γf (1)
wherein n is the refractive index of the right pyramid, γ is the cone angle of the right pyramid, and f is the focal length of the zoom lens.
Further, the distance between the zoom lens and the positive axicon and the depth of focus Z of the bessel beam are as follows:
wherein M is2And representing the beam quality of the laser, wherein lambda is the output wavelength of the laser, D is the distance between the zoom lens and the right-axis pyramid, D is the diameter of a light spot before entering the zoom lens, n is the refractive index of the right-axis pyramid, and gamma is the cone angle of the right-axis pyramid.
Furthermore, the laser processing system also comprises a high-precision displacement table, and the zoom lens is arranged on the high-precision displacement table; the distance between the zoom lens and the right-axis pyramid is adjusted through the high-precision displacement table.
Further, this laser beam machining system still includes first speculum and second mirror, and above-mentioned first speculum is located between laser instrument and the beam expanding lens, and above-mentioned second speculum is located between beam expanding lens and the diaphragm, and first speculum is 45 jiaos with incident beam and places, and the second speculum is 45 jiaos with incident beam and places.
Further, the zoom lens includes a negative lens group and a positive lens group which are arranged in this order along an optical path.
Further, the beam expander comprises a concave lens and a convex lens which are sequentially arranged along the optical path.
The realization process is as follows: the laser beam emitted from the laser is reflected by a first reflector arranged at an angle of 45 degrees, enters a beam expanding lens for expansion and homogenization, then is reflected by a second reflector arranged at an angle of 45 degrees, enters a light diaphragm for filtering out stray light, reaches a wave plate, then enters a zoom lens, the focal depth of a focal spot of a generated Bessel beam is changed by adjusting the focal length of the zoom lens and the distance between the zoom lens and a positive axis pyramid so as to obtain a light beam to be processed, and the light beam is focused by the lens and then acts on the surface of a workpiece, so that the precise processing of laser large depth-diameter ratio micropores, transparent materials and the like is.
The invention also provides a processing method realized by the Bessel beam laser processing system with the focal spot focal depth variable, which comprises the following steps:
and 4, focusing the Bessel beam with the target focal spot focal depth generated by the right-axis pyramid through a lens, and acting on a workpiece to be processed to perform laser micro-processing.
Further, in step 3, the focal length of the zoom lens and the distance between the zoom lens and the right axicon are adjusted according to the following formula to obtain a Bessel light beam with a target focal spot focal depth;
the focal length of the zoom lens is related to the focal spot R of the bessel beam as follows:
R＝(n-1)γf (1)
wherein n is the refractive index of the right pyramid, γ is the cone angle of the right pyramid, and f is the focal length of the zoom lens.
The distance between the zoom lens and the right-axis pyramid is related to the depth of focus Z of the bessel beam as follows:
wherein M is2And representing the beam quality of the laser, wherein lambda is the output wavelength of the laser, D is the distance between the zoom lens and the right-axis pyramid, D is the diameter of a light spot before entering the zoom lens, n is the refractive index of the right-axis pyramid, and gamma is the cone angle of the right-axis pyramid.
Further, in step 1, laser emitted by a laser firstly reaches a first reflecting mirror arranged at an angle of 45 degrees with the light propagation direction, reaches a beam expander after being reflected, then enters a second reflecting mirror arranged at an angle of 45 degrees with the light propagation direction, and reflected light enters a diaphragm;
in step 2, the laser is made to pass through the diaphragm by the following adjustment: adjusting the aperture of the diaphragm to the diameter of a light spot, firstly placing the diaphragm at a point a behind the second reflector, adjusting the first reflector to enable the laser to pass through the center of the diaphragm, then placing the diaphragm at a point b behind the second reflector, and adjusting the second reflector to enable the laser to pass through the center of the diaphragm; the diaphragm is then fixed at a point a behind the second mirror, where the distance from point a to the second mirror is less than the distance from point b to the second mirror.
The invention has the beneficial effects that:
1. the focal spot focal depth variable Bessel beam processing system can realize high-quality flexible processing of the micropores with the large depth-diameter ratio and the transparent materials, reduce the processing cost, flexibly switch the processing beams and meet the processing requirements of the micropores with the high precision and the large depth-diameter ratio and the transparent materials.
2. The Bessel beam with the target focal spot focal depth is generated by adjusting the focal length of the zoom lens and the distance between the zoom lens and the positive axicon, and the adjustment process is simple and easy to realize.
Drawings
FIG. 1 is a schematic diagram of the optical path of a focal spot focal depth variable Bessel beam laser processing system according to the present invention;
the reference numbers in the figures are: the laser comprises a 1-laser, a 2-first reflector, a 3-beam expander, a 4-second reflector, a 5-diaphragm, a 6-wave plate, a 7-zoom lens, an 8-high-precision displacement table, a 9-right-axis pyramid and a 10-lens.
Detailed Description
The present invention will be described in detail below with reference to embodiments shown in the drawings. These embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present invention.
The invention designs a Bessel beam laser processing system with a variable focal spot focal depth to solve the multipurpose processing problem of an ultrafast laser device. Referring to fig. 1, the processing system includes a laser 1, a first reflector 2, a beam expander 3, a second reflector 4, a diaphragm 5, a wave plate 6, a zoom lens 7, a high-precision displacement stage 8, a right-axis pyramid 9 and a lens 10. The laser beam emitted from the laser 1 is reflected by a first reflector arranged at an angle of 45 degrees, enters a beam expanding lens for expansion and homogenization, then is reflected by a second reflector arranged at an angle of 45 degrees, enters a light diaphragm for filtering out stray light, reaches an 1/4 wave plate for modulating the polarization state of the laser, then enters a zoom lens and a right-axis pyramid, a required processing light beam is obtained by adjusting the focal length of the zoom lens and the distance between the zoom lens and the right-axis pyramid, and is focused by the lens and then acts on the surface of a workpiece, so that the precision processing of laser large depth-diameter ratio micropores, transparent materials and the like is realized.
Because the processing demand is different, needs different laser to process, especially processing beam focal spot and depth of focus are the key factor that influences processingquality, consequently this system is expanded around the regulation of Bessel beam focal spot depth of focus to promote processingquality, realize multipurpose processing, reduce the processing cost. The present embodiment employs an ultrafast laser, which is a commercial femtosecond laser or picosecond laser. The femtosecond laser is output by a solid femtosecond laser system, and the specific parameters are as follows: the central wavelength of the laser is 1030nm, the pulse width is 290fs, the repetition frequency is adjustable between 1kHz and 1100kHz, and the polarization state of the laser is linear polarization. The specific parameters of the picosecond laser are as follows: the central wavelength of the laser is 1064nm, the pulse width is 8ps, the repetition frequency is adjustable between single pulse and 1000kHz, and the polarization state of the laser is linear polarization. The system comprises the following specific working steps:
1. the laser light emitted from the laser 1 reaches a first mirror 2 placed at an angle of 45 ° to the light propagation direction, is reflected to reach a beam expander 3, and then enters a second mirror 4 placed at an angle of 45 ° to the light propagation direction, and the reflected light enters a diaphragm 5.
2. The aperture of the diaphragm 5 is adjusted to the spot diameter size by first placing it 0.2m behind the second mirror 4, adjusting the first mirror 2 to pass the laser through the center of the diaphragm 5, and then placing the diaphragm 5 2m behind the second mirror 4, adjusting the second mirror 4 to pass the laser through the center of the diaphragm 5. The diaphragm 5 is then fixed at a position 0.2m behind the second mirror 4.
3. The laser light passes through the diaphragm 5 and then enters the 1/4 wave plate 6 and then enters the zoom lens 7, wherein the zoom lens 7 is fixed on the high-precision displacement table 8, then the right axicon 9 is placed, and the distance between the zoom lens 7 and the right axicon 9 is adjusted through the high-precision displacement table 8. The focal length of the zoom lens 7 is adjusted to change the angle of light entering the right axicon, and the output spot size from the right axicon is:
R＝(n-1)γf (1)
wherein n is the refractive index of the right pyramid, gamma is the cone angle, and f is the focal length of the zoom lens.
The depth of focus of the right axicon is:
where a is the spot radius into the right-axis pyramid, which can be expressed as:
M2and represents the beam quality of the laser, wherein lambda is the output wavelength of the laser, D is the distance between the zoom lens and the right axicon, and D is the diameter of a light spot before entering the zoom lens 7.
Combining equations (2) and (3), we can obtain the depth of focus of the Bessel beam output from the regular axicon in this system as:
4. bessel beams generated by the right-axis pyramid 9 are focused by the lens 10 and then act on a processing workpiece for laser micro-processing, so that high-quality processing of micropores and transparent materials with large depth-diameter ratio is realized.
Claims (7)
1. The utility model provides a focal spot focal depth changeable Bessel beam laser processing system which characterized in that: the device comprises a laser (1), and a beam expanding lens (3), a diaphragm (5), a wave plate (6), a zoom lens (7), a right-axis pyramid (9) and a lens (10) which are sequentially arranged in an emergent light path of the laser;
the beam expanding lens (3) is used for expanding and homogenizing the light beam emitted by the laser; the diaphragm (5) is used for filtering out stray light of the expanded and homogenized light beam; the wave plate (6) is used for modulating the polarization state of the laser; the zoom lens (7) and the positive axicon (9) are used for generating a Bessel light beam with a target focal spot focal depth, and the focal length of the zoom lens (7) and the distance between the zoom lens and the positive axicon (9) are adjusted; the lens (10) is used for focusing the Bessel beam with the target focal spot focal depth and then acting on the surface of the workpiece; the focal length of the zoom lens (7) is related to the focal spot R of the bessel beam as follows:
R＝(n-1)γf (1)
wherein n is the refractive index of the right pyramid, γ is the cone angle of the right pyramid, and f is the focal length of the zoom lens; the distance between the zoom lens (7) and the positive axis pyramid (9) is related to the focal depth Z of the bessel beam as follows:
wherein M is2And representing the beam quality of the laser, wherein lambda is the output wavelength of the laser, D is the distance between the zoom lens and the right-axis pyramid, D is the diameter of a light spot before entering the zoom lens, n is the refractive index of the right-axis pyramid, and gamma is the cone angle of the right-axis pyramid.
2. The focal spot focal depth variable bessel beam laser processing system of claim 1, characterized by: the zoom lens is characterized by further comprising a high-precision displacement table (8), wherein the zoom lens (7) is arranged on the high-precision displacement table; the distance between the zoom lens (7) and the right-axis pyramid (9) is adjusted through a high-precision displacement table.
3. The focal spot focal depth variable bessel beam laser processing system of claim 2, characterized in that: still include first speculum (2) and second mirror (4), first speculum (2) are located between laser instrument (1) and beam expanding lens (3), second mirror (4) are located between beam expanding lens (3) and diaphragm (5), and first speculum (2) are 45 jiaos with incident beam and place, and second mirror (4) are 45 jiaos with incident beam and place.
4. The focal spot focal depth variable bessel beam laser processing system of claim 3, characterized in that: the zoom lens (7) comprises a negative lens group and a positive lens group which are sequentially arranged along an optical path.
5. The focal spot focal depth variable bessel beam laser processing system of claim 4, characterized in that: and the beam expander (3) comprises a concave lens and a convex lens which are sequentially arranged along a light path.
6. The processing method implemented by the focal spot focal depth variable bessel beam laser processing system of claim 1, characterized by comprising the steps of:
step 1, laser emitted from a laser (1) sequentially reaches a beam expander (3) and a diaphragm (5);
step 2, adjusting the aperture of the diaphragm (5) to the diameter of a light spot, enabling the laser to enter a wave plate (6) after passing through the diaphragm (5), and then entering a zoom lens (7) and a right-axis pyramid (9);
step 3, adjusting the focal length of the zoom lens (7) and the distance between the zoom lens (7) and the right-axis pyramid (9) to obtain a Bessel beam with the target focal spot focal depth;
step 4, the Bessel beam with the target focal spot focal depth generated by the right-axis pyramid (9) is focused by a lens (10) and then acts on a processing workpiece to perform laser micro-processing; in the step 3, the focal length of the zoom lens (7) and the distance between the zoom lens (7) and the right-axis pyramid (9) are adjusted according to the following formula to obtain a Bessel beam with the target focal spot focal depth;
the focal length of the zoom lens (7) is related to the focal spot R of the bessel beam as follows:
R＝(n-1)γf (1)
wherein n is the refractive index of the right pyramid, γ is the cone angle of the right pyramid, and f is the focal length of the zoom lens;
the distance between the zoom lens (7) and the positive axis pyramid (9) is related to the focal depth Z of the bessel beam as follows:
wherein M is2And representing the beam quality of the laser, wherein lambda is the output wavelength of the laser, D is the distance between the zoom lens and the right-axis pyramid, D is the diameter of a light spot before entering the zoom lens, n is the refractive index of the right-axis pyramid, and gamma is the cone angle of the right-axis pyramid.
7. The process of claim 6, wherein: in the step 1, laser emitted by a laser (1) firstly reaches a first reflecting mirror (2) arranged at an angle of 45 degrees with the light propagation direction, and reaches a beam expanding mirror (3) after being reflected, and then enters a second reflecting mirror (4) arranged at an angle of 45 degrees with the light propagation direction, and reflected light enters a diaphragm (5);
in step 2, the laser is made to pass through the diaphragm (5) through the following adjustment: adjusting the aperture of the diaphragm (5) to the size of the diameter of a light spot, firstly placing the diaphragm at a point a behind the second reflector (4), adjusting the first reflector (2) to enable the laser to pass through the center of the diaphragm (5), then placing the diaphragm (5) at a point b behind the second reflector (4), adjusting the second reflector (4) to enable the laser to pass through the center of the diaphragm (5); then the diaphragm (5) is fixed at the position of a point behind the second reflector (4), wherein the distance between the point a and the second reflector (4) is smaller than the distance between the point b and the second reflector (4).
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