CN109570781A - A kind of microwell array processing unit (plant) and method - Google Patents
A kind of microwell array processing unit (plant) and method Download PDFInfo
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- CN109570781A CN109570781A CN201710901388.6A CN201710901388A CN109570781A CN 109570781 A CN109570781 A CN 109570781A CN 201710901388 A CN201710901388 A CN 201710901388A CN 109570781 A CN109570781 A CN 109570781A
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- microwell array
- axicon
- laser
- array processing
- hot spot
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0005—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same
- B81C99/001—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same for cutting, cleaving or grinding
Abstract
The invention discloses a kind of microwell array processing unit (plant) and method, the microwell array processing method includes the following steps: step 1, and using axicon principle, laser beam is converted to Bezier hot spot, the hot spot is focused on element surface to be processed；Step 2 adjusts axicon according to microwell array needed for element to be processed, obtains the quantity and distribution of required hot spot；The hot spot is worked on element to be processed by step 3 using laser pulse, forms microwell array.The microwell array processing unit (plant) includes: laser light source, light source adjustment component, axicon and the sports platform set gradually along optical propagation direction；Wherein, the axicon is mounted on five axis precision rotation platforms and drives the angle adjusted between incident beam by five axis precision rotation platforms.Microwell array processing unit (plant) of the present invention and method realize the more capillary processings of single, improve working efficiency；The effect of heat affecting longer pulse laser is small, improves the quality of rapidoprint.
Description
Technical field
The present invention relates to microwell array manufacture field, in particular to a kind of microwell array processing unit (plant) and method.
Background technique
The processing and manufacturing of micropore suffers from extremely important work in the related fieldss such as Aeronautics and Astronautics and microfluidic device
With laser technology is applied to micropore manufacture and is of great practical significance by the continuous development of adjoint laser technology.Laser
Micropore manufactures the influence to contact with each other for overcoming former mechanical manufacturing technology, will not treat rapidoprint and generate mechanical damage,
Rupture failure will not occur because rapidoprint is harder, have a good application prospect.
As shown in Figure 1, prior art discloses a kind of processing unit (plant)s of laser micropore array, including along optical propagation direction according to
The laser system 1 of secondary setting, for generating laser；Half-wave plate and polarization 2, for adjusting laser energy；Prism of corner cube 3, is used for
Generate Bezier hot spot；Reflecting mirror 5；Plano-convex lens 4 and focusing objective len 6 form telescopic system, and the bessel beam is reduced
For micro- bessel beam；Sports platform 7, for placing and adjusting element to be processed, this device mainly passes through the high speed fortune of sports platform 7
The dynamic processing for carrying out microwell array, but the only processing to a hole every time, and in order to control the size in heat-affected zone, one
As use lesser laser single-pulse energy, capillary processing, such processing method are then carried out by way of scanning layer by layer
The raising of productivity is seriously affected.
Microwell array processing is also carried out using the rotary motion of scanning galvanometer in the prior art, compared with aforesaid way
Approximation is the processing of single single hole, cannot carry out microporous processing simultaneously；When carrying out the processing in each hole, in order to reduce
Heat-affected zone controls the pulse energy of laser in lesser range, and such processing method equally affects processing effect
The raising of rate.
Summary of the invention
To solve the above problems, the present invention provides a kind of microwell array processing unit (plant) and method, realize that the more micropores of single add
Work improves working efficiency；And the effect of heat affecting longer pulse laser is smaller, improves the quality of rapidoprint.
To achieve the above object, technical scheme is as follows:
A kind of microwell array processing method, includes the following steps:
Laser beam is converted to Bezier hot spot using axicon principle by step 1, the hot spot is focused on to be added
Work element surface；
Step 2 adjusts axicon according to microwell array needed for element to be processed, obtains the quantity and distribution of required hot spot；
The hot spot is worked on element to be processed by step 3 using laser pulse, forms microwell array.
Optionally, the step 1 includes:
11) laser beam is expanded into rear parallel projection to axicon to form Bezier hot spot；
12) position for adjusting element to be processed makes the hot spot be distributed to element corresponding position to be processed.
Optionally, the step 2 includes:
21) the optical field distribution function of the Bezier hot spot is obtained according to the amplitude transmittance of the axicon；
22) adjustable parameters are obtained according to the optical field distribution function, according to micropore battle array needed for element to be processed
Column obtain the adjustable parameters occurrence；
23) number of spots corresponding with the microwell array and distribution are formed according to the adjustable parameters occurrence.
Optionally, the adjustable parameters include angle between the laser beam and the axicon and/or described
The distance between optical field distribution plane and the axicon of Bezier hot spot.
Optionally, the step 2 further include choose Bezier hot spot between spacing as optical field distribution function at first
Optimal conditions.
Optionally, the axicon amplitude transmittance are as follows:
Whereinλ is lambda1-wavelength, and n is the refractive index of axicon, and γ is axicon base angle, and R is axicon
Radius, ρ are the radius of incident beam.
Optionally, the optical field distribution function are as follows:
Wherein, r represents the radius of optical field distribution plane, and φ represents optical field distribution Plane Angle, and z represents optical field distribution plane
The distance between described axicon；η represents the angle between laser beam and the axicon.
To achieve the above object, the present invention also provides a kind of microwell array processing unit (plant)s, comprising: along optical propagation direction according to
Laser light source, light source adjustment component, axicon and the sports platform of secondary setting；Wherein, the axicon is mounted on the rotation of five axis precisions
The angle adjusted between incident beam is driven on turntable and by the five axis precision rotation platform.
Optionally, the light source adjustment component includes adjusting unit along the laser energy that optical propagation direction is arranged and expanding
Device.
Optionally, it includes the half-wave plate and polarization splitting prism that sequence is placed that the laser energy, which adjusts unit,.
Optionally, the laser light source uses femto-second laser.
The present invention also provides a kind of microwell array processing methods using above-mentioned microwell array processing unit (plant), comprising:
The microwell array processing unit (plant) is installed；
Axicon is adjusted to beam orthogonal incidence with collimated incident beam；
Five axis precision rotation platforms adjust angle between axicon and incident beam, and then light needed for generation element to be processed
Spot number and distribution；
Microwell array is formed on element to be processed.
Optionally, microwell array is formed on the element to be processed in such a way that hot spot is continuously superimposed scanning.
Optionally, by adjusting power, the speed of scanning and the repetition parameter of laser of the laser light source, optimize institute
State microwell array.
Optionally, further includes: moving movement platform is to adjust the distance between element to be processed and axicon.
A kind of microwell array processing unit (plant) provided by the invention and method are added on the basis of existing equipment and are equipped with turntable
Axicon, replace conventional laser using femto-second laser, allow processing dimension to nanometer scale；And action time is short,
Heat affecting is smaller, to the intensity effect very little of rapidoprint, basically will not produce micro-crack, by adjusting laser beam with it is described
The method of angle and/or adjustment optical field distribution plane and the distance between the axicon between axicon obtains member to be processed
The more capillary processings of single are realized in the corresponding number of spots of micropore needed for part and distribution, improve working efficiency；And the hot shadow of femtosecond laser
The effect for ringing longer pulse laser is smaller, improves the quality of rapidoprint.
Detailed description of the invention
Fig. 1 is prior art micropore processing device schematic diagram；
Fig. 2 is the schematic diagram of micropore processing device in the embodiment of the present invention 1；
Fig. 3 is light intensity maximum hot spot distribution schematic diagram when N value is smaller in the embodiment of the present invention 1；
Fig. 4 is light intensity maximum hot spot distribution schematic diagram when N value is larger in the embodiment of the present invention 1.
Shown in Fig. 1: 1- laser system, 2- half-wave plate and polarization, 3- prism of corner cube, 4- plano-convex lens, 5- reflecting mirror, 6-
Focusing objective len, 7- sports platform；
Shown in Fig. 2-4: 8- femto-second laser, 9- laser energy adjust unit, 10- beam expander, 11- axicon, 12- rotation
Turntable, 13- three-dimensional motion platform.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.It should be noted that attached drawing of the present invention is all made of simplified form and uses non-essence
Quasi- ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
Embodiment one
As shown in Fig. 2, the present invention provides a kind of microwell array processing unit (plant) include: set gradually along optical propagation direction it is sharp
Light device, light source adjust component, axicon 11, three-dimensional motion platform 13, and the axicon 11 is mounted on turntable 12；The present embodiment
Laser be preferably femto-second laser 8, generate femtosecond laser, have action time it is short, heat affecting is smaller, to rapidoprint
The advantages of intensity effect is small, will not generate micro-crack；The turntable 12 is preferably five axis precision rotation platforms, can be with moving axis rib
Cone 11 continuously changes angle, and specifically, the femto-second laser 8, which emits after laser enters axicon 11, forms Bezier hot spot,
Using the movement of computer program control three-dimensional motion platform 13, Bezier region is made to be located at element surface to be processed, by adjusting
Turntable 12 changes the angle between axicon 11 and laser beam, is formed corresponding with microwell array needed for element to be processed
Bezier hot spot, and single-pulse laser is generated by femto-second laser 8, Bezier hot spot is worked on element to be processed.
Further, it includes along the laser energy adjusting unit 9 of optical propagation direction setting and expansion that the light source, which adjusts component,
Beam device 10, it includes the half-wave plate and polarization splitting prism that sequence is placed that the laser energy, which adjusts unit 9, utilizes laser energy tune
Section unit 9 adjusts the power of laser to optimize the processing quality of micropore, is expanded laser light incident light beam using beam expander 10 laggard
Enter the axicon 11, facilitates the angle of divergence for reducing laser beam, obtain multiple smaller hot spots, and make single hot spot
Higher energy density is obtained, capillary processing quality is improved.
The present invention also provides a microwell array processing methods to process index path using above-mentioned microwell array processing unit (plant)
As shown in Fig. 2, specifically comprising the following steps:
Step 1: utilize 11 principle of axicon, laser beam is converted into Bezier hot spot, by the hot spot focus on to
Machine component surface, specific as follows:
It opens femto-second laser 8 and generates laser beam, axicon 11 is adjusted to beam orthogonal incidence with collimated incident light
Beam, the laser beam are converted to Bezier hot spot after vertically injecting axicon 11 after beam expander 10 expands, utilize three-dimensional
The position that sports platform 13 adjusts element to be processed makes Bezier hot spot be distributed to element corresponding position to be processed.
Step 2: adjusting the quantity and distribution of the hot spot according to microwell array needed for element to be processed, specific as follows:
1) the optical field distribution function of the Bezier hot spot is obtained according to the amplitude transmittance of the axicon 11, it is known that axis
11 amplitude transmittance of pyramid are as follows:
Whereinλ is the wavelength of laser beam incident, and n is the refractive index of axicon 11, and γ is 11 base angle of axicon, R
For the radius of axicon 11, ρ is the radius of laser light incident light beam；
Obtain optical field distribution function are as follows:
Wherein, r represents the radius of optical field distribution plane, and φ represents optical field distribution Plane Angle, and z represents optical field distribution plane
The distance between described axicon 11, η represents the angle between laser beam and the axicon 11.
2) adjustable parameters are obtained according to the optical field distribution function, institute is obtained according to microwell array needed for element to be processed
Adjustable parameters occurrence is stated, specific as follows:
Due to
Wherein
It can be calculated steady cornerSteady corner is brought into H (ρ, r, φ, z) formula
Simplify and obtainsWherein U=k (n-1) γ r',
N=kz (n-1)2γ2sin2η/4, it can be seen that N directly affects the value of optical field distribution situation and N with laser beam
Angle η and the distance between optical field distribution plane and the axicon 11 z are closely related between the axicon 11, such as Fig. 3
Shown in 4, N value is bigger, and the hot spot number of light intensity maximum value is more, i.e., on identical imaging area, the quantity meeting of effective light spot
Increase.It is noted herein that N does not have specific physical significance, only during abbreviation a expression formula.
Microwell array needed for element to be processed is substituted into the optical field distribution function in the present embodiment, and preferred hot spot
Between condition of the spacing as optimized first, the distance between optical field distribution plane and the axicon 11 are not changed, are obtained
To angle η value between laser beam and the axicon 11.
3) the corresponding number of spots of the microwell array and distribution are formed according to the adjustable parameters occurrence, specifically
It is as follows:
Using five axis precision rotation platforms 12, axicon 11 is driven to rotate around Y-axis, adjustment laser beam and the axicon 11
Between angle be η, the spot array of micropore needed for forming element to be processed.
Spot array is worked on element to be processed by step 3 using laser pulse, forms microwell array.Specifically,
Starting femto-second laser 8 emits pulse and spot array is worked on element to be processed, and the present embodiment preferably uses hot spot to connect
The scanning mode of continuous superposition can be very good the uniformity for overcoming light in the case where a small range processing in this way
Influence to the micropore of processing；And pass through the parameters such as the speed of the power, scanning that change laser and the repetition of laser, Lai Youhua's
The quality of micropore is processed, the present embodiment adjusts the power of single-pulse laser using laser energy adjustment unit 9.
Embodiment two
The difference between this embodiment and the first embodiment lies in by adjusting between optical field distribution plane and the axicon away from
From method come the corresponding number of spots of microwell array and distribution needed for obtaining element to be processed, it is specific as follows:
Dissolved by optical field distribution function and obtains N value: N=kz (n-1)2γ2sin2η/4, specific step of dissolving are being implemented
Example is a kind of to be listed in detail, and the present embodiment is no longer repeated.As can be seen that N directly affects the value of optical field distribution situation and N with laser light
Angle η and closely related, this reality of the distance between optical field distribution plane and the axicon 11 between beam and the axicon 11
Apply after example substitutes into microwell array needed for element to be processed in the optical field distribution function, laser beam and the axicon 11 it
Between angle be 90 ° constant, the distance between optical field distribution plane and the axicon 11 z is calculated, specifically using three-dimensional
It is z with the light of micropore needed for obtaining element to be processed that sports platform 13, which adjusts the distance between element to be processed and the axicon 11,
Spot array.
The spot array method of adjustment of the present embodiment also can be applied in embodiment one, by adjusting laser beam simultaneously
Angle and the distance between optical field distribution plane and the axicon 11 can also obtain to be processed between the axicon 11
The spot array of micropore needed for element.
Obviously, those skilled in the art can carry out various modification and variations without departing from spirit of the invention to invention
And range.If in this way, these modifications and changes of the present invention belong to the claims in the present invention and its equivalent technologies range it
Interior, then the invention is also intended to include including these modification and variations.
Claims (15)
1. a kind of microwell array processing method, which comprises the steps of:
Laser beam is converted to Bezier hot spot using axicon principle by step 1, and the hot spot is focused on member to be processed
Part surface；
Step 2 adjusts axicon according to microwell array needed for element to be processed, obtains the quantity and distribution of required hot spot；
The hot spot is worked on element to be processed by step 3 using laser pulse, forms microwell array.
2. microwell array processing method as described in claim 1, which is characterized in that the step 1 includes:
11) laser beam is expanded into rear parallel projection to axicon to form Bezier hot spot；
12) position for adjusting element to be processed makes the hot spot be distributed to element corresponding position to be processed.
3. microwell array processing method as claimed in claim 2, which is characterized in that the step 2 includes:
21) the optical field distribution function of the Bezier hot spot is obtained according to the amplitude transmittance of the axicon；
22) adjustable parameters are obtained according to the optical field distribution function, obtained according to microwell array needed for element to be processed described in
Adjustable parameters occurrence；
23) number of spots corresponding with the microwell array and distribution are formed according to the adjustable parameters occurrence.
4. microwell array processing method as claimed in claim 3, which is characterized in that the adjustable parameters include the laser
Angle between light beam and the axicon and/or between the optical field distribution plane and the axicon of the Bezier hot spot
Distance.
5. microwell array processing method as claimed in claim 3, which is characterized in that the step 2 further includes choosing Bezier
Optimized first condition of the spacing as optical field distribution function between hot spot.
6. microwell array processing method as claimed in claim 3, which is characterized in that the axicon amplitude transmittance are as follows:
Whereinλ is the wavelength of laser beam incident, and n is the refractive index of axicon, and γ is axicon base angle, and R is axicon
Radius, ρ be laser light incident light beam radius.
7. microwell array processing method as claimed in claim 3, which is characterized in that the optical field distribution function are as follows:
Wherein, r represents the radius of optical field distribution plane, and φ represents optical field distribution Plane Angle, and z represents optical field distribution plane and institute
The distance between axicon is stated, η represents the angle between laser beam and the axicon.
8. a kind of microwell array processing unit (plant) characterized by comprising laser light source, the light set gradually along optical propagation direction
Source adjusts component, axicon and sports platform；Wherein, the axicon is mounted on five axis precision rotation platforms and by the five axis essence
Close turntable drives the angle adjusted between incident beam.
9. microwell array processing unit (plant) as claimed in claim 8, which is characterized in that the light source adjustment component includes passing along light
The laser energy for broadcasting direction setting adjusts unit and beam expander.
10. microwell array processing unit (plant) as claimed in claim 9, which is characterized in that the laser energy adjusts unit and includes
The half-wave plate and polarization splitting prism that sequence is placed.
11. microwell array processing unit (plant) as claimed in claim 8, which is characterized in that the laser light source uses femtosecond laser
Device.
12. a kind of microwell array processing method, using the microwell array processing unit (plant) as described in claim 8~11, feature
It is, comprising:
The microwell array processing unit (plant) is installed；
Axicon is adjusted to beam orthogonal incidence with collimated incident beam；
Five axis precision rotation platforms adjust angle between axicon and incident beam, and then hot spot number needed for generation element to be processed
Mesh and distribution；
Microwell array is formed on element to be processed.
13. microwell array processing method as claimed in claim 12, which is characterized in that be continuously superimposed the side of scanning using hot spot
Formula forms microwell array on the element to be processed.
14. microwell array processing method as claimed in claim 12, which is characterized in that by the function for adjusting the laser light source
The repetition parameter of rate, the speed of scanning and laser, optimizes the microwell array.
15. microwell array processing method as claimed in claim 12, which is characterized in that further include: moving movement platform is to adjust
The distance between element to be processed and axicon.
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| CN110102901A (en) * | 2019-04-30 | 2019-08-09 | 上海工程技术大学 | The ultrafast laser three-dimensional micro-nano texture method on negative electrode of lithium ion battery copper foil current collector surface |
| CN110237875A (en) * | 2019-05-31 | 2019-09-17 | 西安交通大学 | Label-free living cells based on quasi- Bezier optical waveguide structure detects micro-fluidic chip |
| CN110640338A (en) * | 2019-08-21 | 2020-01-03 | 江苏大学 | Composite pulse laser deep hole processing device based on Bessel light beam |
| CN110808355A (en) * | 2019-11-08 | 2020-02-18 | 西安交通大学 | Method for processing micro-nano composite structure copper foil current collector underwater by ultrafast laser |
| CN110877155A (en) * | 2019-10-29 | 2020-03-13 | 清华大学 | System for femtosecond laser parallel processing machine sealing surface micropore texture |
| CN111055011A (en) * | 2019-12-29 | 2020-04-24 | 中国科学院西安光学精密机械研究所 | High-coaxiality and large-depth-diameter-ratio micropore machining method and system |
| CN111505831A (en) * | 2020-04-01 | 2020-08-07 | 中国科学院西安光学精密机械研究所 | Focal spot focal depth variable Bessel beam laser processing system and method |
| CN111679349A (en) * | 2020-06-19 | 2020-09-18 | 北京理工大学 | Method for machining micro lens with variable numerical aperture by space shaping laser-assisted etching |
| WO2021036155A1 (en) * | 2019-08-28 | 2021-03-04 | Lumentum Operations Llc | Bessel beam with axicon for cutting transparent material |
| CN112496532A (en) * | 2020-11-03 | 2021-03-16 | 深圳市韵腾激光科技有限公司 | Laser processing system |
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| CN112975171A (en) * | 2021-03-25 | 2021-06-18 | 清华大学 | Ultrafast laser micropore rotary-cut processingequipment |
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| CN110102901A (en) * | 2019-04-30 | 2019-08-09 | 上海工程技术大学 | The ultrafast laser three-dimensional micro-nano texture method on negative electrode of lithium ion battery copper foil current collector surface |
| CN110237875A (en) * | 2019-05-31 | 2019-09-17 | 西安交通大学 | Label-free living cells based on quasi- Bezier optical waveguide structure detects micro-fluidic chip |
| CN110640338A (en) * | 2019-08-21 | 2020-01-03 | 江苏大学 | Composite pulse laser deep hole processing device based on Bessel light beam |
| WO2021036155A1 (en) * | 2019-08-28 | 2021-03-04 | Lumentum Operations Llc | Bessel beam with axicon for cutting transparent material |
| CN110877155A (en) * | 2019-10-29 | 2020-03-13 | 清华大学 | System for femtosecond laser parallel processing machine sealing surface micropore texture |
| CN110808355A (en) * | 2019-11-08 | 2020-02-18 | 西安交通大学 | Method for processing micro-nano composite structure copper foil current collector underwater by ultrafast laser |
| CN111055011A (en) * | 2019-12-29 | 2020-04-24 | 中国科学院西安光学精密机械研究所 | High-coaxiality and large-depth-diameter-ratio micropore machining method and system |
| CN111505831A (en) * | 2020-04-01 | 2020-08-07 | 中国科学院西安光学精密机械研究所 | Focal spot focal depth variable Bessel beam laser processing system and method |
| CN111505831B (en) * | 2020-04-01 | 2021-06-22 | 中国科学院西安光学精密机械研究所 | Focal spot focal depth variable Bessel beam laser processing system and method |
| CN111679349A (en) * | 2020-06-19 | 2020-09-18 | 北京理工大学 | Method for machining micro lens with variable numerical aperture by space shaping laser-assisted etching |
| CN112496532A (en) * | 2020-11-03 | 2021-03-16 | 深圳市韵腾激光科技有限公司 | Laser processing system |
| CN112570911A (en) * | 2020-11-17 | 2021-03-30 | 西安交通大学 | System and method for processing nano-scale small hole of hard and brittle material by using conical lens |
| CN112570911B (en) * | 2020-11-17 | 2022-05-20 | 西安交通大学 | System and method for processing nanoscale small holes in hard and brittle materials by using tapered lenses |
| CN112975171A (en) * | 2021-03-25 | 2021-06-18 | 清华大学 | Ultrafast laser micropore rotary-cut processingequipment |
| CN113296175A (en) * | 2021-05-25 | 2021-08-24 | 北京理工大学 | Method for processing micro-lens array with multiple numerical apertures |
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