CN105458529A - Method for efficiently making large-depth-diameter-ratio micropore arrays - Google Patents
Method for efficiently making large-depth-diameter-ratio micropore arrays Download PDFInfo
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- CN105458529A CN105458529A CN201610040690.2A CN201610040690A CN105458529A CN 105458529 A CN105458529 A CN 105458529A CN 201610040690 A CN201610040690 A CN 201610040690A CN 105458529 A CN105458529 A CN 105458529A
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- bessel beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
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- Laser Beam Processing (AREA)
Abstract
The invention relates to a method for efficiently machining large-depth-diameter-ratio micropore arrays through a femtosecond laser Bessel beam, and belongs to the technical field of femtosecond laser application. According to the method, a femtosecond laser space light shaping method and a flight time punching method are integrated, the properties of small spot diameter and long focal depth of the femtosecond laser Bessel beam are effectively utilized, and a large area of large-depth-diameter-ratio micropore arrays can be efficiently machined within a short time. The depth-diameter ratio of the zero-taper micropores continuously machined under the single laser pulse condition reaches up to 330:1, the machining quality and machining efficiency of the micropore arrays are greatly improved, and the method has crucial application value in optics, optical instruments, aviation, biomedicine and the like.
Description
Technical field
The present invention relates to a kind of method of processing high aspect ratio microwell array, particularly a kind of method utilizing femtosecond laser bessel beam highly-efficient processing height aspect ratio microwell array, belongs to femtosecond laser applied technical field.
Background technology
Micropore is manufactured on the association areas such as aerospace field, photoelectricity field, microfluidic device extremely important application, and along with continuous progress and the development of laser technology, the research of micropore manufacture view is of great practical significance.The advantage of laser micropore manufacture is to have automaticity flexible and higher preferably, in addition, compared with traditional Machining Technology, laser micropore manufacturing technology is contactless technology, and machining tool also because rapidoprint quality is comparatively hard, rupture failure can not occur.Femtosecond laser is a kind of novel pulse laser, and its pulse duration can be low to moderate femtosecond magnitude.Compared with traditional Long Pulse LASER (as nanometer laser and picosecond laser), femtosecond laser has the advantage of its uniqueness in microfabrication: (1) processing yardstick is little, can realize sub-micron even photoelectric elements; (2) femtosecond laser adds the Plasma Shielding Effection that there will not be man-hour Long Pulse LASER often to occur, significantly improves working (machining) efficiency; (3) femtosecond laser processing significantly can reduce re cast layer, micro-crack and heat affected area.
Since femto-second laser produces, a large amount of capillary processing experimental study that utilized it to carry out on various material, wherein, the quality of pore size and micropore is most important two indices in micropore manufacture process, comprises the problems such as the diameter of micropore, the degree of depth and sidewall taper.In known femtosecond laser capillary processing method, major part is the femtosecond laser utilizing Gaussian intensity profile, focuses on aft-loaded airfoil transparent material, if but do not adopt special manufacturing process, the aspect ratio more difficult breakthrough 100:1 of micropore through high x Microscope Objective.The manufacture of femtosecond laser micropore is one of guardian technique promoting manufacturing industry progress and development, and the micropore of very small dimensions and very high-quality is the target of femtosecond laser micropore manufacture development.
In addition, high aspect ratio microwell array is applied more outstanding compared to single micropore in biomedicine, space flight and aviation, photoelectricity etc.Current Problems existing then, processing large area (such as 1cm × 1cm) high aspect ratio microwell array, required process time long and in array the quality of micropore fail ensure, working (machining) efficiency is extremely low.Therefore, at present in the urgent need to a kind of can highly-efficient processing height aspect ratio microwell array method and the homogeneity of each microvia quality in array can be ensured.
Summary of the invention
The object of the invention is to solve high-quality, the microwell array working (machining) efficiency of high aspect ratio is lower, cannot the difficult problem of the large-area high aspect ratio microwell array of rapid processing in the short period of time, a kind of method utilizing femtosecond laser bessel beam highly-efficient processing height aspect ratio microwell array is proposed, the present invention passes through the shaping of femtosecond laser spatial light, the electron density of regulation and control laser irradiation region transient state, and in conjunction with femtosecond laser " flight time punch method " (JournalofLaserApplications, 4 (2), 15-24, 1992), realize the highly-efficient processing of large area height aspect ratio microwell array.
The object of the invention is to be achieved through the following technical solutions:
Utilize a method for femtosecond laser bessel beam highly-efficient processing height aspect ratio microwell array, concrete steps are as follows:
The femtosecond laser Gauss beam reshaping of parallel incidence is femtosecond laser bessel beam by step one: utilize axle pyramidal rule;
Step 2: the bessel beam obtained by space light shaping in step one becomes micro-bessel beam by telescopic system minification, makes it have the processing that sufficiently high energy carries out sample;
Step 3: be placed in by processed sample on the translation stage of sextuple movement, controls translation stage and drives sample motion, the micro-bessel beam obtained in step 2 is focused on processed sample surfaces;
Step 4: utilize " flight time punch method ", under femtosecond laser bessel beam pulse condition, rapid processing large area height aspect ratio microwell array.The spacing between capillary processing speed and adjacent cells is controlled by the translational speed (sweep speed) controlling femtosecond laser repetition rate and translation stage.
As preferably, described step one uses axicon lens to be the longer bessel beam of depth of focus by the Gauss beam reshaping of parallel incidence.
As preferably, described telescopic system is made up of a planoconvex spotlight and a focusing objective len.
As preferably, described processed sample material is the transparent materials such as polymethyl methacrylate (PMMA)/PET/PC/ vitreous silica.
Utilize a device for femtosecond laser bessel beam highly-efficient processing height aspect ratio microwell array, comprise fs-laser system, half-wave plate, polarization splitting prism, continuously attenuator, mechanical shutter, diaphragm, axicon lens, planoconvex spotlight, dichroscope, focusing microcobjective and sextuple precision displacement platform;
Annexation: fs-laser system, half-wave plate, polarization splitting prism, continuously attenuator, mechanical shutter, diaphragm, axicon lens, planoconvex spotlight successively parallel, coaxially place, dichroscope be centrally located on the optical axis of planoconvex spotlight, placement at 45 °, optical axis passes through through dichroic mirror reflects the center focusing on microcobjective, processed sample and sextuple precision displacement platform successively;
Light path: femtosecond laser produces short pulse femtosecond laser, after utilizing the combination adjustment laser energy of half-wave plate and polarization splitting prism, use continuous attenuator to continuously change laser energy further, mechanical shutter is thereafter used for controlling the break-make of laser, thus whether controls Laser Processing; Use the spot size of diaphragm restriction Gaussian beam, its spot diameter inner laser energy even at a certain size is distributed; Then gauss laser is parallel enters to inject in axicon lens, and Gauss beam reshaping is bessel beam by axicon lens; Bessel beam is reduced into micro-bessel beam by the telescopic system through planoconvex spotlight and focusing microcobjective composition; Processed sample is fixed on sextuple precision displacement platform, and mobile sextuple precision displacement platform makes processed sample be positioned at micro-bessel beam region.
As preferably, described device also comprises imaging illumination light source and imageing sensor, and the two forms frontal imaging system, for monitoring process in real time; Imaging illumination light source is positioned at the below of sextuple precision displacement platform, and its illumination light sent, through processed sample, focusing objective len, dichroscope, enters ccd image sensor imaging.
Beneficial effect
1, a kind of method utilizing femtosecond laser bessel beam highly-efficient processing large area height aspect ratio microwell array of the present invention, compared with the capillary processing of traditional Gauss light beam, can improve several times in processing microvia quality and aspect ratio.
2, a kind of method utilizing femtosecond laser bessel beam highly-efficient processing large area height aspect ratio microwell array of the present invention, use pulse bessel beam can realize highly-efficient processing large area height aspect ratio microwell array in the short period, the working (machining) efficiency substantially increasing microwell array (per secondly processes thousands of microcellular structures, if laser instrument repetition rate and the processing platform translational speed upper limit higher, working (machining) efficiency can be improved further in theory).
Accompanying drawing explanation
Fig. 1 is in specific embodiment, femtosecond laser bessel beam processing index path.
Fig. 2 is be bessel beam by the Gauss beam reshaping of parallel incidence, is then reduced into the schematic diagram of micro-bessel beam by telescopic system.
Wherein, 1-fs-laser system, 2-half-wave plate, 3-polarization splitting prism, the continuous attenuator of 4-, 5-mechanical shutter, 6-diaphragm, 7-axicon lens, 8-planoconvex spotlight, 9-dichroscope, 10-focus on microcobjective, 11-processed sample, 12-sextuple precision displacement platform, 13-imaging illumination light source, 14-CCD imageing sensor.
Detailed description of the invention
Below in conjunction with Figure of description and embodiment, the present invention will be further described.
Realize in this detailed description of the invention the inventive system comprises: fs-laser system 1, half-wave plate 2, polarization splitting prism 3, continuously attenuator 4, mechanical shutter 5, diaphragm 6, axicon lens 7, planoconvex spotlight 8, focusing microcobjective 10, dichroscope 9, sextuple precision displacement platform 12.
Its annexation as shown in Figure 1.Fs-laser system 1, half-wave plate 2, polarization splitting prism 3, continuously attenuator 4, mechanical shutter 5, diaphragm 6, axicon lens 7, planoconvex spotlight 8 successively parallel, coaxially place, dichroscope 9 be centrally located on the optical axis of planoconvex spotlight 8, placement at 45 °, optical axis reflects successively by focusing on the center of microcobjective 10, processed sample 11, sextuple precision displacement platform 12 and imaging illumination light source 13 through dichroscope 9; Imaging CCD14 receives the transillumination light of dichroscope 9.Femtosecond laser 1 produces short pulse femtosecond laser, after utilizing the combination adjustment laser energy of half-wave plate 2 and polarization splitting prism 3, use continuous attenuator 4 can continuously change laser energy further, mechanical shutter 5 is thereafter used for controlling the break-make of laser, thus whether controls Laser Processing; Use diaphragm 6 to limit the spot size of Gaussian beam, its spot diameter inner laser energy even at a certain size is distributed; Then gauss laser is parallel enters to inject in axicon lens 7, and Gauss beam reshaping is bessel beam by axicon lens; Bessel beam is reduced into micro-bessel beam by the telescopic system formed through planoconvex spotlight 8 and focusing microcobjective 10; Processed sample 11 is fixed on sextuple precision displacement platform 12, illumination light is produced by the imaging illumination light source 13 below precision displacement platform 12, illumination light through sample 11, focusing objective len 10, dichroscope 9, thus enters ccd image sensor 14 imaging, to monitor process in real time.
Embodiment
What 1-fs-laser system adopted is the laser instrument that U.S.'s spectrum physics (SpectraPhysics) company produces, optical maser wavelength 800nm, pulse width 50 femtosecond, repetition rate 1KHz is adjustable, pulse ceiling capacity 3mJ, light distribution is Gaussian, linear polarization.
Experiment processed sample 11 is polymethyl methacrylate (PMMA), and its thickness is 5mm.
A kind of method utilizing femtosecond laser bessel beam highly-efficient processing height aspect ratio microwell array that the present invention proposes, as shown in Figure 1, concrete procedure of processing is as follows for processing index path:
Step one: utilize fs-laser system 1 to produce femtosecond pulse, utilizes half-wave plate 2 and polarization splitting prism 3 to regulate single-pulse laser energy at 20 μ J, also laser energy can be regulated to reach corresponding energy values with continuous attenuator 4.The break-make of laser is controlled by mechanical shutter 5.Use diaphragm 6 to limit the spot size of Gaussian beam, its spot diameter inner laser energy even at a certain size is distributed.
Step 2: parallel for the Gaussian beam in step one enter to inject cone base angle be in the axicon lens 7 of 2 °, and according to the principle of axle pyramid, be bessel beam by Gauss beam reshaping, then by the telescopic system that planoconvex spotlight 8 and 20 x Microscope Objective 10 of 150mm focal length forms, bessel beam is reduced into micro-bessel beam.Telescopic system is f by focal length
1the planoconvex spotlight of=150mm and 20 × focusing objective len (f
2=9mm), the scaling of telescopic system is f
1: f
2=16.67.
Step 3: be fixed on by PMMA sample 11 on sextuple precision displacement platform 12, with the movement of the sextuple precision displacement platform 12 of computer programme-control, makes Bezier region be positioned at processed sample 11 surface location place.Because bessel beam has Diode laser, as shown in Figure 2, as long as any position processed sample 11 being placed in Bezier region gets final product processed sample, this feature reduces the requirement to sample 11 focal position in process.
Step 4: move sextuple precision displacement platform 12 by computer and make it drive processed sample 11 to move, for obtaining high aspect ratio microwell array, mobile sextuple precision displacement platform 12 makes that Bezier region is as much as possible enters processed sample 11, frontal imaging system is formed, real-time monitored process by imaging illumination light source 13 and imageing sensor 14.
Step 5: regulate femtosecond laser repetition rate to 100Hz, by at the uniform velocity moving of the sextuple precision displacement platform 12 of computer programming programme-control, its translational speed is 2mm/s, namely can the speed of 100 holes/second, each laser pulse processes a micropore, obtains a line microcellular structure that spacing is 20 μm.By that analogy, control sextuple precision displacement platform and automatically carry out rapidly the processing of periodicity zigzag scanning, finally complete the highly-efficient processing of high aspect ratio microwell array.
When the pulsed laser energy of use 20 μ J, use the bessel beam machining of pulse to obtain the aspect ratio of micropore up to 330:1, be 52 times that conventional laser adds man-hour, wherein the diameter of micropore is about 1.58 μm, and hole depth is about 523 μm.Be 100Hz in laser repetition rate, when the translational speed of precision displacement platform 12 is 2mm/s, only use the high aspect ratio microwell array that namely machined 1cm × 1cm (amounting to 251,001 hole) for about 42 minutes on PMMA sample 11, its micropore spacing is 20 μm.A kind of method utilizing bessel beam highly-efficient processing height aspect ratio microwell array that the present invention proposes, pulse processing is realized by femtosecond laser Gaussian-shaped beam being shaped as bessel beam, this not only drastically increases microwell array working (machining) efficiency, and the micropore of processing has the features such as high aspect ratio, high-quality, zero draft and size uniformity, presents the clear superiority of this method at highly-efficient processing large area, high-quality high aspect ratio microwell array.
Because the present embodiment is under pulse bessel beam condition, process high aspect ratio microwell array, so the repetition rate of femtosecond laser determines capillary processing speed, when namely repetition rate is 100HZ, capillary processing speed is 100 holes/second.When platform movement speed allows, increase femtosecond laser repetition rate and then can increase capillary processing speed, further improve microwell array working (machining) efficiency.
In order to content of the present invention and implementation method are described, this description gives a specific embodiment.The object introducing details is not in an embodiment the scope of restriction claims, but helps to understand the method for the invention.One skilled in the art should appreciate that: in the spirit and scope not departing from the present invention and claims thereof, to the various amendments of most preferred embodiment step, change or to replace be all possible.Therefore, the present invention should not be limited to the content disclosed in most preferred embodiment and accompanying drawing.
Claims (6)
1. utilize a method for femtosecond laser bessel beam highly-efficient processing height aspect ratio microwell array, it is characterized in that, comprise the steps:
Step one, utilizes axle pyramidal rule, is femtosecond laser bessel beam by the femtosecond laser Gauss beam reshaping of parallel incidence;
Step 2, the bessel beam obtained by space light shaping in step one becomes micro-bessel beam by telescopic system minification, makes it have the processing that sufficiently high energy carries out sample;
Step 3, is placed in processed sample on the translation stage of sextuple movement, controls translation stage and drives sample motion, the micro-bessel beam obtained in step 2 is focused on processed sample surfaces;
Step 4, utilizes " flight time punch method ", under femtosecond laser bessel beam pulse condition, and rapid processing large area height aspect ratio microwell array.
2. a kind of method utilizing femtosecond laser bessel beam highly-efficient processing height aspect ratio microwell array according to claim 1, is characterized in that: described step one uses axicon lens to be the longer bessel beam of depth of focus by the Gauss beam reshaping of parallel incidence.
3. a kind of method utilizing femtosecond laser bessel beam highly-efficient processing height aspect ratio microwell array according to claim 1, is characterized in that: described telescopic system is made up of a planoconvex spotlight and a focusing objective len.
4., according to the arbitrary a kind of described method utilizing femtosecond laser bessel beam highly-efficient processing height aspect ratio microwell array of claim 1-3, it is characterized in that: described processed sample material is PMMA, PET, PC or vitreous silica.
5. utilize a device for femtosecond laser bessel beam highly-efficient processing height aspect ratio microwell array, it is characterized in that: comprise fs-laser system (1), half-wave plate (2), polarization splitting prism (3), continuously attenuator (4), mechanical shutter (5), diaphragm (6), axicon lens (7), planoconvex spotlight (8), dichroscope (9), focus on microcobjective (10) and sextuple precision displacement platform (12);
Annexation: fs-laser system (1), half-wave plate (2), polarization splitting prism (3), continuously attenuator (4), mechanical shutter (5), diaphragm (6), axicon lens (7), planoconvex spotlight (8) successively parallel, coaxially place, dichroscope (9) be centrally located on the optical axis of planoconvex spotlight (8), placement at 45 °, optical axis passes through through dichroscope (9) reflection the center focusing on microcobjective (10), processed sample (11) and sextuple precision displacement platform (12) successively;
Light path: femtosecond laser (1) produces short pulse femtosecond laser, after utilizing the combination adjustment laser energy of half-wave plate (2) and polarization splitting prism (3), continuous attenuator (4) is used to continuously change laser energy further, thereafter mechanical shutter (5) is used for controlling the break-make of laser, thus whether controls Laser Processing; Use the spot size of diaphragm (6) restriction Gaussian beam, its spot diameter inner laser energy even at a certain size is distributed; Then gauss laser is parallel enters to inject in axicon lens (7), and Gauss beam reshaping is bessel beam by axicon lens; Bessel beam is reduced into micro-bessel beam by the telescopic system formed through planoconvex spotlight (8) and focusing microcobjective (10); Processed sample (11) is fixed on sextuple precision displacement platform (12), and mobile sextuple precision displacement platform (12) makes processed sample (11) be positioned at micro-bessel beam region.
6. a kind of device utilizing femtosecond laser bessel beam highly-efficient processing height aspect ratio microwell array according to claim 5, it is characterized in that: also comprise imaging illumination light source (13) and imageing sensor (14), the two composition frontal imaging system, for monitoring process in real time; Imaging illumination light source (13) is positioned at the below of sextuple precision displacement platform (12), its illumination light sent, through processed sample (11), focusing objective len (10), dichroscope (9), enters ccd image sensor (14) imaging.
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