CN107199408A

CN107199408A - The method that cutting taper lifts cutting speed is reduced using multi beam ultrafast laser

Info

Publication number: CN107199408A
Application number: CN201710613304.9A
Authority: CN
Inventors: 陶沙; 张�杰; 赵晓杰; 秦国双
Original assignee: INNO MACHINING Co Ltd; Innovo Laser Polytron Technologies Inc
Current assignee: INNO MACHINING Co Ltd; Innovo Laser Polytron Technologies Inc
Priority date: 2017-07-25
Filing date: 2017-07-25
Publication date: 2017-09-26
Also published as: WO2019019424A1

Abstract

The invention belongs to field of laser processing, and in particular to a kind of method for reducing cutting taper and lifting cutting speed using multi beam ultrafast laser in laser cutting.Methods described step is as follows：Beam of laser is divided into beam of laser is divided at least two beam laser beams；The laser beams of at least two beams will be divided into and focus on sample surfaces by condenser lens, the focus of multiple arrangements is formed.The characteristics of invention is concentrated using small light spot energy reduces taper, and energy utilization efficiency is further enhanced being influenced each other with material effects between the light beam more importantly focused on；With great market prospects and economic value.

Description

The method that cutting taper lifts cutting speed is reduced using multi beam ultrafast laser

Technical field

The invention belongs to field of laser processing, and in particular to one kind is reduced in laser cutting using multi beam ultrafast laser cuts The method for cutting taper and lifting cutting speed.

Background technology

Because Gaussian Profile is presented in the light beam that typical laser is exported, so in material cutting, taper is also presented in joint-cutting, After taper is formed, material removal efficiency is substantially reduced, and clipping time increases with thickness index, is completely cut through to realize, and one Then extend process time, or increase laser energy.Its result is all that processing efficiency is low, and cost is high, of poor quality.So to laser It is extremely important especially for taper is reduced for the processing of ultrafast laser for cutting.Because with high-end manufacture The increase of demand and ultrafast laser stability are improved and prices, and ultrafast laser processing has been embraced by the industry, so improving Ultrafast laser processing efficiency turns into a problem that must be solved.

At present, the method that taper is solved in the prior art is mainly the angle of change incident light or or using flat-top light. But the mode for changing incident angle of light is mainly suitable drilling.Although flat-top light can have for cutting, the depth of focus Limit, is difficult to realize the cutting that thickness is more than 100 micro materials.So needing to find a kind of effective and feasible method and realize to reduce Taper, improves cutting efficiency.

The content of the invention

Therefore, the technical problems to be solved by the invention are to overcome problem of the prior art, so as to propose a kind of effective And feasible method is realized and reduces taper, the cutting method of cutting efficiency is improved.

In order to solve the above technical problems, reducing cutting taper and lifting using multi beam ultrafast laser the invention discloses one kind The method of cutting speed, methods described step is as follows：

1) beam of laser is divided into and beam of laser is divided at least two beam laser beams；

2) laser beams of at least two beams will be divided into and focuses on sample surfaces by condenser lens, form Jiao of multiple arrangements Point.

It is preferred that, the distance between described focus is 1-10 times of the diameter for the hot spot that the focus is formed.

It is preferred that, the pulse width of the laser in methods described will be in 300 femtoseconds to 50 psecs.

It is preferred that, the laser beam is vertical in 90 degree relative to the sample surfaces.

It is preferred that, along the X direction, cut direction can positively or negatively be carried out the laser beam along X.

It is preferred that, in X direction, cut direction can positively or negatively be cut the laser beam along Y.

It is preferred that, along the X direction, cut direction can positively or negatively be carried out the laser beam along any angle between XY Cutting.

It is preferred that, the step 1) laser is divided into the instrument of laser beam for diffraction optical device.

It is more highly preferred to, the step 1) laser is divided into the instrument of laser beam for micro lens array.

The above-mentioned technical proposal of the present invention has advantages below compared with prior art：The invention is unique in that utilization The characteristics of small light spot energy is concentrated reduces taper, influences each other more to enter with material effects between the light beam more importantly focused on One step enhances energy utilization efficiency；With great market prospects and economic value.

Embodiment

Embodiment 1

Present embodiment discloses a kind of method that use multi beam ultrafast laser reduces cutting taper and lifting cutting speed

1st, that beam of laser is divided into some beams using diffraction optical device DOE (diffractiveopticelement) is (more Shu Jiguang)；

2nd, multiple laser focuses on sample surfaces by condenser lens, forms the focus of multiple arrangements.Process along focusing The direction of hot spot arrangement is carried out.Extremely important general 5 times in spot size of reduction of the distance between the focus to taper；

3rd, the cutting that the multiple laser of 2 dimensions can be used to focus on progress two dimension is needed according to processing；

4th, the pulse width of ultrafast laser is 40 psecs；

5th, the spacing of multiple laser focal point is maintained at the size of 5 times of hot spots.

Wherein, the laser beam is vertical in 90 degree relative to the sample surfaces；The laser beam along the X direction, is cut Direction can positively or negatively be carried out along X.

Embodiment 2

1st, beam of laser is divided into some beams (multiple laser) using micro lens array；

2nd, multiple laser focuses on sample surfaces by condenser lens, forms the focus of multiple arrangements.Process along focusing The direction of hot spot arrangement is carried out.Extremely important general 1 times in spot size of reduction of the distance between the focus to taper；

4th, the pulse width of ultrafast laser is 50 psecs；

5th, the spacing of multiple laser focal point is maintained at the size of 1 times of hot spot.

Wherein, the laser beam is vertical in 90 degree relative to the sample surfaces；The laser beam in X direction, cutting side To can positively or negatively be cut along Y.

Embodiment 3

2nd, multiple laser focuses on sample surfaces by condenser lens, forms the focus of multiple arrangements.Process along focusing The direction of hot spot arrangement is carried out.Extremely important general 10 times in spot size of reduction of the distance between the focus to taper；

4th, the pulse width of ultrafast laser will be between 300 femtoseconds；

5th, the spacing of multiple laser focal point is maintained at the size of 10 times of hot spots.

Wherein, the laser beam is vertical in 90 degree relative to the sample surfaces；The laser beam along the X direction, is cut Direction can positively or negatively be cut along any angle between XY.

To sum up, such a multi beam, which is focused on when laser is processed according to orientation, can realize reduction taper.Except single Beyond focus on light beam energy is concentrated, another crucial effect is exactly in material removal process, to be influenced each other between light beam, example Such as, on the material position to be removed, after a pulse excitation, material is still when excitation state again by the one of succeeding impulse It is secondary to excite, so as to improve removal efficiency, also improve energy utilization efficiency.

Obviously, above-described embodiment is only intended to clearly illustrate example, and the not restriction to embodiment.It is right For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or Among changing still in the protection domain of the invention.

Claims

1. a kind of method that use multi beam ultrafast laser reduces cutting taper and lifting cutting speed, it is characterised in that the side Method step is as follows：

2) laser beams of at least two beams will be divided into and focuses on sample surfaces by condenser lens, form the focus of multiple arrangements.

2. the method as described in claim 1, it is characterised in that the distance between described focus is the light that the focus is formed 1-10 times of the diameter of spot.

3. method as claimed in claim 2, it is characterised in that the pulse width of the laser in methods described will be 300 Femtosecond is to 50 psecs.

4. method as claimed in claim 3, it is characterised in that the laser beam hangs down relative to the sample surfaces in 90 degree Directly.

5. method as claimed in claim 4, it is characterised in that along the X direction, cut direction can be along X just for the laser beam To or negative sense carry out.

6. method as claimed in claim 4, it is characterised in that in X direction, cut direction can be positive along Y for the laser beam Or negative sense is cut.

7. method as claimed in claim 4, it is characterised in that the laser beam along the X direction, cut direction can along XY it Between any angle positively or negatively cut.

8. the method as described in claim any one of 1-7, it is characterised in that the step 1) laser is divided into laser beam Instrument be diffraction optical device.

9. the method as described in claim any one of 1-7, it is characterised in that the step 1) laser is divided into laser beam Instrument be micro lens array.