CN105057895A - Micropore molding and taper improving method for steel foil with ultrashort pulse laser - Google Patents
Micropore molding and taper improving method for steel foil with ultrashort pulse laser Download PDFInfo
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Abstract
The invention discloses a micropore molding and taper improving method for steel foil with ultrashort pulse laser. The method comprises the following steps: a laser generation step: a femtosecond laser device is adopted to generate infrared laser; a laser drilling step: the infrared laser after attenuation processing is focused to the surface of steel foil through a focusing lens to prepare micropores in the surface of steel foil with an outline circuity method; the focusing spot of the infrared laser gradually moves down and feeds along with the increase of the depth of the micropore; a surface cleaning step: after the micropore preparation is finished, the surface of steel foil is cleaned; wherein, the infrared laser is fundamental mode laser. The micropore molding and taper improving method has the advantages that the taper of the micropore is small, and the precision is high.
Description
Technical field
The present invention relates to laser processing technology and improve field, particularly a kind of ultra-short pulse laser steel foil micro molding and tapering ameliorative way.
Background technology
In laser boring field, common Long Pulse LASER processing heat affected area is large, cannot meet the impact on capillary processing in Precision Machining industry.And ultra-short pulse laser has superpower, ultrafast and cold worked advantage, ultra-short pulse laser processing can realize precise micropore processing, but the micropore produced always exists cone angle problem.Particularly when the focal beam spot of laser exists basic mode and high-order mode simultaneously, will process distortion hole, the micropore precision processed is not high.
In view of the various limitation of common capillary processing method and the processing of common Long Pulse LASER cannot meet precise micropore processing request, the capillary processing technology of high-speed and high-efficiency, the energy-conserving and environment-protective realization of simultaneously increasing economic efficiency more small-angle is the research field received much concern always.
Summary of the invention
It is little that main purpose of the present invention is to provide a kind of micropore tapering, the ultra-short pulse laser steel foil micro molding that precision is high and tapering ameliorative way.
Technical scheme provided by the invention is: a kind of ultra-short pulse laser steel foil micro molding and tapering ameliorative way, comprise the following steps:
Laser generation step 1: adopt femto-second laser to produce infrared laser;
Laser boring step 2: described infrared laser focuses on steel foil surface by condenser lens and prepares micropore by the roundabout method of profile on steel foil surface after attenuation processing; The focal beam spot of described infrared laser moves down feeding gradually along with the increase of the micropore degree of depth;
Removing surface step 3: micropore preparation terminates to clear up steel foil surface afterwards;
Wherein, described infrared laser is basic mode laser.
It should be noted that: the light distribution on laser beam cross section is called transverse mode, basic mode TEM
00be the simplest transverse mode form of laser beam, the advantage of basic mode light beam is that the angle of divergence is little, concentration of energy.In the present invention, the defocusing amount of the focal beam spot of infrared laser is 0.
The focal beam spot of infrared laser moves down feeding gradually along with the increase of the micropore degree of depth and is specifically: first infrared laser has swept a circle in the mode of the roundabout method of profile, then laser spot feeding, and then sweep circle, by that analogy until steel foil processing thoroughly, namely successively feeding, successively processes.Concrete feed speed is:
This method parameter is generally set as primary feed 20 μm (steel foil thickness is about 130 μm) of distance, micro-pore diameter 100 μm, arc machining speed 200 μm/s, z-axis (i.e. the speed of equipment decline) feed speed 300 μm/s, so average feed speed is about 12.66 μm/s)
In above-mentioned ultra-short pulse laser steel foil micro molding and tapering ameliorative way, in described laser boring step, described infrared laser makes infrared basic mode laser keep rotating in process by FP optically-active module.
In above-mentioned ultra-short pulse laser steel foil micro molding and tapering ameliorative way, in described laser boring step, before described condenser lens, be also provided with a diaphragm.Find that the light intensity of the hot spot each several part of basic mode laser after lens focus presents uneven distribution in actual processing, the light intensity of focus center is maximum, and light distribution is asymmetric.The uneven meeting of Gaussian beam Energy distribution causes processed hole circle degree second-rate.In order to address this problem, with the addition of the diaphragm of a diameter 8mm before condenser lens, stop to fall the laser that part light distribution is uneven, the laser facula quality of adding after diaphragm meets processing request.Diaphragm diameter used is 8mm, mates with used laser beam spot size, because be easy diaphragm, so do not have special specifications parameter requirement except size.
In above-mentioned ultra-short pulse laser steel foil micro molding and tapering ameliorative way, before laser boring step, also comprise beam detection step, detected by the quality of beam quality analysis instrument to light beam.The size mainly detecting hot spot detect the quality of light beam and spot energy distribution, because beam energy skewness can cause processed hole circle degree second-rate, so need the Energy distribution of requirement light beam as far as possible even.
In above-mentioned ultra-short pulse laser steel foil micro molding and tapering ameliorative way, before laser generation step, also comprise pre-treatment step, described pre-treatment step is for cleaning steel foil surface and drying.
In above-mentioned ultra-short pulse laser steel foil micro molding and tapering ameliorative way, described removing surface step is specially: after steel foil punching terminates, steel foil is placed in absolute alcohol solution and soaks a period of time, then adopts ultrasonic cleaner to clean.
In above-mentioned ultra-short pulse laser steel foil micro molding and tapering ameliorative way, the parameter of described infrared laser is: pulsewidth 400fs, and wavelength is 1030nm, and repetition rate is 50KHz, and single pulse energy is 20 μ J.
In the present invention, when carrying out laser boring to material, usually to consider scaling loss threshold value φ th.Scaling loss threshold value is exactly destroy the minimum laser energy density required for surface of material.Pulsewidth, repetition, single pulse energy all can affect laser energy density.The parameter that this method uses is through the empirical data that a large amount of technological experiment sums up out, and these parameters are taken into account scaling loss threshold value, working (machining) efficiency and processing effect etc. simultaneously and drawn.The infrared laser of other parameters is also passable, as long as exceed scaling loss threshold value just may be used for rapidoprint.The diameter of pulsewidth and micropore is closely related, and general pulsewidth is larger, and micro-pore diameter is larger.
In above-mentioned ultra-short pulse laser steel foil micro molding and tapering ameliorative way, in described step 2, the arc machining speed of described infrared laser is 0.2mm/s.
Why this method uses arc machining speed for 0.2mm/s, the servomotor defectiveness of the processing platform due to this equipment in fact, when process diameter less than 300 μm circle and set arc machining excessive velocities time, the translational speed of platform x-axis and y-axis is not mated, micropore can be caused to become oval, when finding in experiment that arc machining speed is more than 0.4mm/s, just there will be gross distortion.Arc machining speed can be 0.1-0.4mm/s, and the consideration of comprehensive circularity and working (machining) efficiency uses 0.2mm/s.Under normal conditions, improving equipment precision can make arc machining speed improve.
Beneficial effect of the present invention is as follows:
The feeding that the present invention adopts and FP optically-active module reduce the method for micropore cone angle, while the advantage not damaging Laser Processing high-speed and high-efficiency, do not need expensive additional device, increase economic efficiency, energy-conserving and environment-protective.
Accompanying drawing explanation
Fig. 1 is the flow diagram of the embodiment of the present invention 1;
Fig. 2 is the light path schematic diagram of the embodiment of the present invention 1.
Detailed description of the invention
Below in conjunction with detailed description of the invention, technical scheme of the present invention is described in further detail, but does not form any limitation of the invention.
Embodiment 1
As shown in Figure 1, the concrete grammar of the present embodiment comprises:
S01 pretreatment: getting the 06Cr19Ni10 stainless steel foil that 130 μm of domestic production are thick, is the wipes of alcohol wash clean of 99.7% with mass fraction, removes the spots such as grease, uses dryer within 10 minutes, to dry at 130 DEG C;
S02 detects light beam: the femto-second laser of use is French AmplitudeSystems brand laser instrument, model is S-PulseHP2, maximum average power is 6w, minimum light spot diameter 8 μm, export wave band 1030,515,343nm, repetition rate 1 ~ 300KHz, pulsewidth 500fs ~ 10ps, adopts reflective hard optic path.
What the present invention adopted is wavelength is 1030nm, and pulsewidth is the infrared laser of 400fs.
The laser facula quality of beam quality analysis instrument to experiment of the 4196d model using DumaOptronics company to produce is observed, and in order to avoid the CCD parts of analyzer are damaged by too high laser energy, this hot spot is the laser facula in positive out of focus situation.In order to solve the uneven problem of fundamental mode spot beam quality, before condenser lens, add the diaphragm of a diameter 8mm, make through optical quality meet requirement of experiment;
S03 processes: use the infrared laser of 400fs pulsewidth to be punched by the roundabout method of profile;
Use respectively single pulse energy Ep=15 μ J, 20 μ J, 25 μ J, 30 μ J laser with arc machining speed v=0.2mm/s, be that the steel foil of 130 μm punches in thickness h, research single pulse energy is on the impact of steel foil capillary processing; Find in experimentation, experimental result is: along with the increase of single pulse energy, and the upper aperture of micropore and lower aperture are all in increase, and the speed that upper aperture increases is greater than the speed that lower aperture increases, therefore the tapering of micropore is in increase.
Use zoom planar process and FP optically-active module to punch simultaneously, measure the change of micropore tapering.
As shown in Figure 2, wherein 01 is decay mirror to concrete light path, and 02A is the first speculum, 02A is the second speculum, 02C is the 3rd speculum, and 03 is optical shutter, and 04 is diaphragm, 05 is condenser lens, 06 is sample, and 07 is sample stage, and 08 is femto-second laser, 09 is FP optically-active module, and 10 is processing supervision CCD.
First femto-second laser 08 produces infrared laser, after decay mirror 01, first speculum 02A, optical shutter 03, second speculum 02B, FP optically-active module 09, arrive the 3rd speculum 02C, the CCD module then arriving beam quality analysis instrument through diaphragm 04, condenser lens 05 carries out beam quality detection under the prerequisite of positive out of focus.
After beam quality detection is qualified, femto-second laser 08 produces infrared laser, after decay mirror 01, first speculum 02A, optical shutter 03, second speculum 02B, FP optically-active module 09, arrive the 3rd speculum 02C, be applied on sample 06 after diaphragm 04, condenser lens 05.Processing monitors that CCD10 effect is to obtain the manuscript picture of surface of the work, monitoring machine process, and in general processing monitors that CCD10 can select is a coaxial camera.
S04 soaks: after S03 manufacturing procedure completes, and use the alcoholic solution of 99.7% to carry out complete immersion treatment to the 06Cr19Ni10 stainless steel foil that 130 μm after processing are thick, treatment temperature is room temperature (15-30 DEG C), and the processing time is 10-12 minute.
S05 cleans: after S04 immersion treatment Jie Bouquet, 130 μm that are immersed in 99.7% alcoholic solution thick 06Cr19Ni10 stainless steel foils is put into KQ5200DE type numerical control ultrasonic cleaner and cleans.
S06 measures: after S05 matting completes, and takes out, is placed into dryer, under 130 DEG C of conditions, dries 10-15 minute; NikonSMZ800 type Stereo microscope is adopted to observe micropore effect.
The steel foil punching of the present embodiment terminates rear measurement result and correlated results demonstration is as follows:
1) the Laser Processing platform that this technique adopts has Z axis, and Z axis can allow Laser Focusing hot spot move down gradually in process, i.e. feeding.This zoom planar process can improve the tapering problem caused by laser-beam divergence to a certain extent.Repetition rate f=50KHz is used in experiment, the laser of single pulse energy Ep=20 μ J punches on 130 μm of thick steel foils respectively when different feeding distance, the tapering of micropore is changed to the increase along with feeding distance z, cone angle presents the trend first reducing to increase afterwards, when feeding distance z is in material thicknesses left and right, the tapering of micropore is minimum, is 14 ° to 15 °.
2) be furnished with FP optically-active module in the light path system of this technique, laser can be made to keep rotating in process, weaken the impact of optical quality on punching effect, and reduce the tapering of machining hole to a certain extent.This technique is on the basis that research processing feeding distance is tested the impact of micropore tapering, the laser of identical parameters is adopted to carry out when using module repeating experiment, the tapering change of micropore does not present regular variation tendency, reaches about 13 ° by the most I of the tapering of the known micropore of a series of experimental data.
Above-describedly be only preferred embodiment of the present invention, all do within the scope of the spirit and principles in the present invention any amendment, equivalently to replace and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. ultra-short pulse laser steel foil micro molding and a tapering ameliorative way, is characterized in that: comprise the following steps:
Laser generation step: adopt femto-second laser to produce infrared laser;
Laser boring step: described infrared laser focuses on steel foil surface by condenser lens and prepares micropore by the roundabout method of profile on steel foil surface after attenuation processing; The focal beam spot of described infrared laser moves down feeding gradually along with the increase of the micropore degree of depth;
Removing surface step: micropore preparation terminates to clear up steel foil surface afterwards;
Wherein, described infrared laser is basic mode laser.
2. ultra-short pulse laser steel foil micro molding according to claim 1 and tapering ameliorative way, is characterized in that: in described laser boring step, and described infrared laser makes infrared basic mode laser keep rotating in process by FP optically-active module.
3. ultra-short pulse laser steel foil micro molding according to claim 2 and tapering ameliorative way, is characterized in that: in described laser boring step, is also provided with a diaphragm before described condenser lens.
4. ultra-short pulse laser steel foil micro molding according to claim 1 and tapering ameliorative way, is characterized in that: also comprise beam detection step before described laser boring step, is detected by the quality of beam quality analysis instrument to light beam.
5. ultra-short pulse laser steel foil micro molding according to claim 1 and tapering ameliorative way, is characterized in that: also comprise pre-treatment step before described laser generation step, and described pre-treatment step is for cleaning steel foil surface and drying.
6. ultra-short pulse laser steel foil micro molding according to claim 1 and tapering ameliorative way, it is characterized in that: described removing surface step is specially: after steel foil punching terminates, steel foil is placed in absolute alcohol solution and soaks a period of time, then adopt ultrasonic cleaner to clean.
7. ultra-short pulse laser steel foil micro molding according to claim 1 and tapering ameliorative way, is characterized in that: the parameter of described infrared laser is: pulsewidth 400fs, and wavelength is 1030nm, and repetition rate is 50KHz, and single pulse energy is 20 μ J.
8., according to the arbitrary described ultra-short pulse laser steel foil micro molding of claim 1 to 7 and tapering ameliorative way, it is characterized in that: in described laser boring step, the arc machining speed of described infrared laser is 0.2mm/s.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108393599A (en) * | 2018-05-14 | 2018-08-14 | 华南师范大学 | A kind of device and method of laser segmented scanning micropore |
| CN109317816A (en) * | 2018-11-28 | 2019-02-12 | 广东省新材料研究所 | The preparation method in the micro- hole preparation facilities of ceramic coating surface and the micro- hole of ceramic coating surface |
| CN110788498A (en) * | 2019-11-28 | 2020-02-14 | 深圳市吉祥云科技有限公司 | Infrared laser rapid punching method |
| CN110900008A (en) * | 2019-12-19 | 2020-03-24 | 苏州德吉克激光设备有限公司 | Intelligent optical fiber laser cutting system and application method thereof |
| CN111940930A (en) * | 2020-08-05 | 2020-11-17 | 大族激光科技产业集团股份有限公司 | Micropore laser processing method and equipment |
| CN113414507A (en) * | 2021-07-12 | 2021-09-21 | 深圳来福士雾化医学有限公司 | Micropore processing method for polyimide film atomization sheet |
| CN113751887A (en) * | 2020-05-28 | 2021-12-07 | 深圳市大族数控科技股份有限公司 | Detection method, device and equipment of laser processing equipment and storage medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09285887A (en) * | 1996-04-23 | 1997-11-04 | Canon Inc | Drilling method and drilling device, and mask for drilling |
| CN102039486A (en) * | 2010-11-09 | 2011-05-04 | 苏州德龙激光有限公司 | Laser helically rotating optical module applied to laser process equipment |
| CN102218605A (en) * | 2011-05-18 | 2011-10-19 | 苏州德龙激光有限公司 | Laser rotary-cut drilling device |
| CN103418913A (en) * | 2013-08-13 | 2013-12-04 | 中国航空工业集团公司北京航空制造工程研究所 | Device for machining small hole by using ultrashort pulse laser and small hole machining method |
-
2015
- 2015-08-17 CN CN201510505715.7A patent/CN105057895A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09285887A (en) * | 1996-04-23 | 1997-11-04 | Canon Inc | Drilling method and drilling device, and mask for drilling |
| CN102039486A (en) * | 2010-11-09 | 2011-05-04 | 苏州德龙激光有限公司 | Laser helically rotating optical module applied to laser process equipment |
| CN102218605A (en) * | 2011-05-18 | 2011-10-19 | 苏州德龙激光有限公司 | Laser rotary-cut drilling device |
| CN103418913A (en) * | 2013-08-13 | 2013-12-04 | 中国航空工业集团公司北京航空制造工程研究所 | Device for machining small hole by using ultrashort pulse laser and small hole machining method |
Non-Patent Citations (1)
| Title |
|---|
| 林远添等: "《超短脉冲激光钢箔打孔效果及锥度改善》", 《应用激光》 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108393599A (en) * | 2018-05-14 | 2018-08-14 | 华南师范大学 | A kind of device and method of laser segmented scanning micropore |
| CN109317816A (en) * | 2018-11-28 | 2019-02-12 | 广东省新材料研究所 | The preparation method in the micro- hole preparation facilities of ceramic coating surface and the micro- hole of ceramic coating surface |
| CN109317816B (en) * | 2018-11-28 | 2024-03-12 | 广东省新材料研究所 | Ceramic coating surface micro-pit preparation device and ceramic coating surface micro-pit preparation method |
| CN110788498A (en) * | 2019-11-28 | 2020-02-14 | 深圳市吉祥云科技有限公司 | Infrared laser rapid punching method |
| CN110900008A (en) * | 2019-12-19 | 2020-03-24 | 苏州德吉克激光设备有限公司 | Intelligent optical fiber laser cutting system and application method thereof |
| CN113751887A (en) * | 2020-05-28 | 2021-12-07 | 深圳市大族数控科技股份有限公司 | Detection method, device and equipment of laser processing equipment and storage medium |
| CN113751887B (en) * | 2020-05-28 | 2023-10-10 | 深圳市大族数控科技股份有限公司 | Detection method, device and equipment of laser processing equipment and storage medium |
| CN111940930A (en) * | 2020-08-05 | 2020-11-17 | 大族激光科技产业集团股份有限公司 | Micropore laser processing method and equipment |
| CN113414507A (en) * | 2021-07-12 | 2021-09-21 | 深圳来福士雾化医学有限公司 | Micropore processing method for polyimide film atomization sheet |
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Application publication date: 20151118 |