CN109128532A - A kind of laser array capillary processing method that multistation cleans immediately - Google Patents
A kind of laser array capillary processing method that multistation cleans immediately Download PDFInfo
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- CN109128532A CN109128532A CN201811127198.4A CN201811127198A CN109128532A CN 109128532 A CN109128532 A CN 109128532A CN 201811127198 A CN201811127198 A CN 201811127198A CN 109128532 A CN109128532 A CN 109128532A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/08—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for flash removal
Abstract
The present invention provides a kind of laser array capillary processing method that multistation cleans immediately, the following steps are included: workpiece A and workpiece B are individually fixed on the Ultraprecise platform of workpiece washing station and laser processing station, Ultraprecise platform is fixed in sink, and sink is fixed on Work turning table;Before processing, workpiece A is transported by Work turning table and is cleaned to workpiece washing station and dry, then transports the workpiece A after cleaning to laser machining station；While laser micropore is processed, Work turning table transports workpiece B to the cleaning of workpiece washing station and drying；Then workpiece A is exchanged with the processing stations of workpiece B with washing station by Work turning table, so recycles, is finally completed the array capillary processing of workpiece A and B.By cleaning immediately, cleaning process and laser machining process before and after integrated work pieces process greatly improve processing efficiency, and residue caused by laser processing can be made to be cleared up after cleaning the present invention, in favor of subsequent array capillary processing, effectively improve processing quality.
Description
Technical field
The invention belongs to technical field of laser processing, and in particular to a kind of laser array micropore that multistation cleans immediately adds
Work method.
Background technique
As high energy beam processing method, laser processing because have with workpiece it is non-contact, worn without machining tool and can be online
The series of advantages such as working process parameter are controlled, field of material processing is widely used to.When laser action is in material processing district
It when domain, is brought rapidly up after the energy of material absorption laser, occurs to melt and then evaporate to be removed.The fuel factor of laser is easily drawn
Material ablation is played, or even generates micro-crack in material internal and scraps workpiece, seriously affects processing effect.For this purpose, reducing heat
Effect is particularly significant for the popularization of laser processing technology.Array capillary processing for material, high heat accumulation are not only easily right
Material causes thermal damage, and the heat affected area of large area is even more that can seriously limit further reducing for micropore spacing, it is difficult to which satisfaction is worked as
The trend of modern parts machining micromation, Highgrade integration development.Although ultrafast laser has cold working characteristic, what it was induced
Plasma also can generate thermal ablation to material to a certain extent.The slag formed in laser processing procedure is covered on material table
Face can cause to hinder to following process, and workpiece is usually removed to after processing is completed and carried out cleaning removal, but nothing inside micropore
The slag that method sprays will lead to difficult processing to carry out, and affect machining accuracy and processing efficiency.This is also that current laser micropore adds
One of major issue encountered in work, urgent need are effectively improved.
In currently available technology, be primarily present following problems: heat waste when 1. laser processing array micropore injures heat affecting
Area's limitation micropore spacing further reduces, it is difficult to meet the development trend of micromation, Highgrade integration components；2. laser processing
Front and back is both needed to carry out individually cleaning to workpiece to remove the slag generated in impurity removing and process respectively, affects machining accuracy
With processing efficiency.
Summary of the invention
In view of this, the present invention provides a kind of laser array capillary processing method that multistation cleans immediately, the present invention is logical
Cleaning immediately is crossed, cleaning process and laser machining process before and after integrated work pieces process greatly improve processing efficiency, and clean
After can make laser processing caused by residue cleared up, in favor of subsequent array capillary processing, effectively improve processing quality.
The technical solution of the present invention is as follows: a kind of laser array capillary processing method that multistation cleans immediately, feature exist
In, comprising the following steps:
S1. the workpiece A of required processing and workpiece B workpiece washing station is individually fixed in put down with the ultraprecise for laser machining station
On platform, Ultraprecise platform is fixed in sink, and sink is fixed on Work turning table;Wherein, workpiece washing station is disposed with drying
Gas nozzle and fluid injector, laser processing station are disposed with laser-processing system and processing gas nozzle；
S2. before laser machining, workpiece A is transported to workpiece washing station by Work turning table, mobile Ultraprecise platform finds processing accurately
Fluid injector injection liquid is opened in the machining area surface of workpiece A in region；
S3. clean after the completion of, closing liquid nozzle and open dry gas nozzle sprays gas so that workpiece A machining area table
Face is dry;
S4. workpiece A is transported by Work turning table and finds machining area accurately to station, mobile Ultraprecise platform is laser machined, adjustment swashs
Light system of processing is completed laser in the machining area surface of workpiece A and is focused;
S5. the laser beam issued through laser-processing system carries out capillary processing to workpiece A, while spraying gas by processing gas nozzle
Slag of the body to assist removal laser processing to generate;
S6. when Work turning table transports workpiece A to when laser machining station, Work turning table transports workpiece B to workpiece washing station, moves
Dynamic Ultraprecise platform finds machining area accurately, is cleaned, is dried to the machining area surface of workpiece B；
S7. the single hole of workpiece A after processing is completed, is transported to workpiece washing station by Work turning table, mobile Ultraprecise platform is simultaneously
Fluid injector injection liquid is opened in the capillary processing region of workpiece A；
S8. clean after the completion of, closing liquid nozzle and open dry gas nozzle sprays gas so that workpiece A capillary processing area
Domain is dry；
S9. Work turning table transport workpiece B starts laser micropore processing to station is laser machined, while being sprayed by processing gas nozzle
Slag of the gas to assist removal laser processing to generate；
S10. S1-S9 is recycled, the array capillary processing of workpiece A Yu workpiece B are finally completed；
Wherein, step S7 is synchronous with S9 carries out.
Further, the laser-processing system be millisecond, nanosecond, picosecond, femtosecond laser system of processing, the laser adds
The optical maser wavelength of work system is ultraviolet light, green light, infrared light；
Further, the liquid is alcohol, acetone, water, and the gas is air, nitrogen, oxygen, argon gas.
Further, the station is arranged as single combination for laser machining station and either simplex part washing station.
Further, the station is arranged as the combination of double excitation processing stations Yu dual-workpiece washing station, can the same time-division
The cleaning and laser processing of other places reason more than one piece workpiece.
Further, the workpiece A be metal material, ceramic material it is any, the workpiece B be metal material, pottery
Ceramic material it is any.
Further, the metal material be copper foil, aluminium foil it is any, ceramic material be aluminium oxide, silicon nitride, oxidation
Any one of zirconium, aluminium nitride.It should be noted that metal material of the present invention, ceramic material are not limited to the present invention
For example, any metal material in the prior art or ceramic material can also be used.
The operation principle of the present invention is that: when laser processing array micropore, it is deposited in heat waste caused by the high heat of storeroom
It injures heat affected area easily to adversely affect microvia quality, and seriously limits further reducing for pitch of holes.Single hole processing
After the completion, it is cleaned, can both material was made to be fully cooled, the slag also generated in removable material process, favorably
In following process.After material is cleaned be adequately cooled after, slag is also removed, then carries out subsequent capillary processing, can be had
Effect reduces the pitch of holes of array micropore, had both improved processing efficiency and has also improved machining accuracy, miniature to meet parts machining
Change, the trend of Highgrade integration development.Laser processing front and back, the sundries of material surface and the material after processing before being processed for removal
Residue etc., workpiece is usually removed clean to it, affects overall processing efficiency and effect.It is clear that the present invention integrates workpiece
It washes and laser machining process, machining accuracy and processing efficiency can be greatly improved.
In the application, inventor is by a large amount of creative work, and so that the technical solution of the application is reached: workpiece is clear
The heat waste washed with laser processing during alternately can effectively reduce laser array capillary processing injures heat affected area, favorably
In the pitch of holes for reducing array micropore；Immediately cleaning can remove laser processing slag caused by material and micropore surface in time,
To reduce slag to the adverse effect of following process, machining accuracy is improved；The cleaning process and laser of integrated processing front and back workpiece
Processing technology removes the multiple clamping of workpiece from, improves processing efficiency.
The beneficial effects of the present invention are:
1, it reduces heat waste when even being eliminated laser processing array micropore and injures heat affected area, further reduce micropore spacing, with
Meet the development trend of micromation, Highgrade integration components；
2, by cleaning immediately, cleaning process and laser machining process before and after integrated work pieces process greatly improve processing efficiency,
And after cleaning slag caused by laser processing can be cleared up, in favor of subsequent array capillary processing, effectively improve processing
Quality.
Detailed description of the invention
Fig. 1 is processing unit (plant) structural schematic diagram of the present invention；
Fig. 2 is schematic diagram of the process of the invention；
Fig. 3 is schematic diagram of the process of the invention；
Fig. 4 is schematic diagram of the process of the invention；
Wherein, 1- Work turning table；2- sink；3- dry gas nozzle；4- fluid injector；5- workpiece A；6- Ultraprecise platform；7-
Laser-processing system；8- laser beam；9- processing gas nozzle；10- workpiece B.
Specific embodiment
Present pre-ferred embodiments are provided with reference to the accompanying drawing, in order to explain the technical scheme of the invention in detail.
Embodiment 1
A kind of laser array capillary processing method that multistation cleans immediately, comprising the following steps: by the copper foil of required processing with
Aluminium oxide is individually fixed on the Ultraprecise platform 6 of workpiece washing station and laser processing station, and Ultraprecise platform 6 is fixed on water
In slot 2, sink 2 is fixed on Work turning table 1.Workpiece washing station is disposed with dry gas nozzle 3 and fluid injector 4, laser
Processing stations are disposed with green light nanosecond laser system of processing 7 and processing gas nozzle 9.Before laser processing, transported by Work turning table 1
Send copper foil to workpiece washing station, mobile Ultraprecise platform 6 finds machining area accurately, opens fluid injector 4 and sprays alcohol in copper foil
Machining area surface.After the completion of cleaning, closing liquid nozzle 4 simultaneously opens dry gas nozzle 3 and sprays air so that copper foil
Machining area dry tack free.Copper foil, which is transported, by Work turning table 1 finds processing accurately to station, mobile Ultraprecise platform 6 is laser machined
Region, adjustment green light nanosecond laser system of processing 7 are completed laser in the machining area surface of copper foil and are focused.Through green light nanosecond laser
The laser beam 8 that system of processing 7 issues carries out capillary processing to copper foil, while spraying argon gas by processing gas nozzle 9 to assist swashing
Light processing removal slag.When Work turning table 1 transports copper foil to laser processing station, Work turning table 1 transports aluminium oxide to workpiece
Washing station, mobile Ultraprecise platform 6 find machining area accurately, carry out acetone cleaning, air to the machining area surface of aluminium oxide
It is dry.The single hole of copper foil is transported to workpiece washing station after processing is completed, by Work turning table 1, and mobile Ultraprecise platform 6 is simultaneously opened
It opens fluid injector 4 and sprays alcohol in the capillary processing region of copper foil.After the completion of cleaning, closing liquid nozzle 4 simultaneously opens dry gas
Body nozzle 3 sprays air so that the capillary processing region of copper foil is dry.At the same time, Work turning table 1 transports aluminium oxide to laser
Processing stations start laser micropore processing, while spraying oxygen by processing gas nozzle 9 and processing removal slag with auxiliary laser.Such as
This circulation, is finally completed copper foil and the array capillary processing of aluminium oxide workpiece.
Embodiment 2:
A kind of laser array capillary processing method that multistation cleans immediately, comprising the following steps: by the aluminium foil of required processing with
Silicon nitride is individually fixed on the Ultraprecise platform 6 of workpiece washing station and laser processing station, and Ultraprecise platform 6 is fixed on water
In slot 2, sink 2 is fixed on Work turning table 1.Workpiece washing station is disposed with dry gas nozzle 3 and fluid injector 4, laser
Processing stations are disposed with infrared femtosecond laser-processing system 7 and processing gas nozzle 9.Before laser processing, transported by Work turning table 1
Send aluminium foil to workpiece washing station, mobile Ultraprecise platform 6 finds machining area accurately, opens fluid injector 4 and sprays acetone in aluminium foil
Machining area surface.After the completion of cleaning, closing liquid nozzle 4 simultaneously opens dry gas nozzle 3 and sprays air so that aluminium foil
Machining area dry tack free.Aluminium foil, which is transported, by Work turning table 1 finds processing accurately to station, mobile Ultraprecise platform 6 is laser machined
Region, adjustment infrared femtosecond laser-processing system 7 are completed laser in the machining area surface of aluminium foil and are focused.Through infrared femtosecond laser
The laser beam 8 that system of processing 7 issues carries out capillary processing to aluminium foil, while spraying argon gas by processing gas nozzle 9 to assist swashing
Light processing removal slag.When Work turning table 1 transports aluminium foil to laser processing station, Work turning table 1 transports silicon nitride to workpiece
Washing station, mobile Ultraprecise platform 6 find machining area accurately, carry out alcohol washes, air to the machining area surface of silicon nitride
It is dry.The single hole of aluminium foil is transported to workpiece washing station after processing is completed, by Work turning table 1, and mobile Ultraprecise platform 6 is simultaneously opened
It opens fluid injector 4 and sprays acetone in the capillary processing region of aluminium foil.After the completion of cleaning, closing liquid nozzle 4 simultaneously opens dry gas
Body nozzle 3 sprays air so that the capillary processing region of aluminium foil is dry.At the same time, Work turning table 1 transports silicon nitride to laser
Processing stations start laser micropore processing, while spraying nitrogen by processing gas nozzle 9 and processing removal slag with auxiliary laser.Such as
This circulation, is finally completed aluminium foil and the array capillary processing of silicon nitride workpiece.
Embodiment 3
A kind of laser array capillary processing method that multistation cleans immediately, comprising the following steps: by the zirconium oxide of required processing
It is individually fixed in aluminium nitride on the Ultraprecise platform 6 of workpiece washing station and laser processing station, Ultraprecise platform 6 is fixed on
In sink 2, sink 2 is fixed on Work turning table 1.Workpiece washing station is disposed with dry gas nozzle 3 and fluid injector 4, swashs
Light processing stations are disposed with ultraviolet picosecond laser-processing system 7 and processing gas nozzle 9.Before laser processing, pass through Work turning table 1
Zirconium oxide is transported to workpiece washing station, mobile Ultraprecise platform 6 finds machining area accurately, open fluid injector 4 spray alcohol in
The machining area surface of zirconium oxide.After the completion of cleaning, closing liquid nozzle 4 and open dry gas nozzle 3 spray air so that
The machining area dry tack free of zirconium oxide.Zirconium oxide is transported to station is laser machined by Work turning table 1, moves Ultraprecise platform
6 find machining area accurately, and adjustment ultraviolet picosecond laser-processing system 7 is completed laser in the machining area surface of zirconium oxide and focused.Through
The laser beam 8 that ultraviolet picosecond laser-processing system 7 issues carries out capillary processing to zirconium oxide, while being sprayed by processing gas nozzle 9
It penetrates oxygen and removal slag is processed with auxiliary laser.When Work turning table 1 transports zirconium oxide to laser processing station, Work turning table 1
Aluminium nitride is transported to workpiece washing station, mobile Ultraprecise platform 6 finds machining area accurately, to the machining area surface of aluminium nitride into
Row alcohol washes are air-dried.The single hole of zirconium oxide is transported to workpiece washing station after processing is completed, by Work turning table 1, moves
Dynamic Ultraprecise platform 6 simultaneously opens the injection alcohol of fluid injector 4 in the capillary processing region of zirconium oxide.After the completion of cleaning, liquid is closed
Body nozzle 4 simultaneously opens the injection air of dry gas nozzle 3 so that the capillary processing region of zirconium oxide is dry.At the same time, it works
Turntable 1 transports aluminium nitride to laser processing station and starts laser micropore processing, while spraying nitrogen by processing gas nozzle 9 with auxiliary
Help laser processing removal slag.So circulation, is finally completed the array capillary processing of zirconium oxide Yu aluminium nitride workpiece.
Embodiment 4
The present embodiment provides a kind of laser array capillary processing methods that multistation same as Example 1 cleans immediately, and institute is not
With the workpiece A is aluminium oxide, and the workpiece B is silicon nitride.
Embodiment 5
The present embodiment provides a kind of laser array capillary processing methods that multistation same as Example 2 cleans immediately, and institute is not
With the workpiece A is aluminium foil, and the workpiece B is aluminium nitride.
Embodiment 6
The present embodiment provides a kind of laser array capillary processing methods that multistation same as Example 3 cleans immediately, and institute is not
With the workpiece A is aluminium oxide, and the workpiece B is zirconium oxide.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment only includes one
A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say
As a whole, the technical solutions in the various embodiments may also be suitably combined for bright book, and forming those skilled in the art can be with
The other embodiments of understanding.It, can be any existing by this field for the technical detail of not detailed descriptions all in the present invention
There is technology realization.
Claims (7)
1. a kind of laser array capillary processing method that multistation cleans immediately, which comprises the following steps:
S1. the workpiece A of required processing and workpiece B workpiece washing station is individually fixed in put down with the ultraprecise for laser machining station
On platform, Ultraprecise platform is fixed in sink, and sink is fixed on Work turning table；Wherein, workpiece washing station is disposed with drying
Gas nozzle and fluid injector, laser processing station are disposed with laser-processing system and processing gas nozzle；
S2. before laser machining, workpiece A is transported to workpiece washing station by Work turning table, mobile Ultraprecise platform finds processing accurately
Fluid injector injection liquid is opened in the machining area surface of workpiece A in region；
S3. clean after the completion of, closing liquid nozzle and open dry gas nozzle sprays gas so that workpiece A machining area table
Face is dry;
S4. workpiece A is transported by Work turning table and finds machining area accurately to station, mobile Ultraprecise platform is laser machined, adjustment swashs
Light system of processing is completed laser in the machining area surface of workpiece A and is focused；
S5. the laser beam issued through laser-processing system carries out capillary processing to workpiece A, while spraying gas by processing gas nozzle
Slag of the body to assist removal laser processing to generate；
S6. when Work turning table transports workpiece A to when laser machining station, Work turning table transports workpiece B to workpiece washing station, moves
Dynamic Ultraprecise platform finds machining area accurately, is cleaned, is dried to the machining area surface of workpiece B；
S7. the single hole of workpiece A after processing is completed, is transported to workpiece washing station by Work turning table, mobile Ultraprecise platform is simultaneously
Fluid injector injection liquid is opened in the capillary processing region of workpiece A；
S8. clean after the completion of, closing liquid nozzle and open dry gas nozzle sprays gas so that workpiece A capillary processing area
Domain is dry；
S9. Work turning table transport workpiece B starts laser micropore processing to station is laser machined, while being sprayed by processing gas nozzle
Slag of the gas to assist removal laser processing to generate；
S10. S1-S9 is recycled, the array capillary processing of workpiece A Yu workpiece B are finally completed；
Wherein, step S7 is synchronous with S9 carries out.
2. the laser array capillary processing method that multistation according to claim 1 cleans immediately, which is characterized in that described
Laser-processing system be millisecond, nanosecond, picosecond, femtosecond laser system of processing, the optical maser wavelength of the laser-processing system is purple
Outer light, green light, infrared light.
3. the laser array capillary processing method that multistation according to claim 1 cleans immediately, which is characterized in that institute
Stating liquid is alcohol, acetone, water, and the gas is air, nitrogen, oxygen, argon gas.
4. the laser array capillary processing method that multistation according to claim 1 cleans immediately, which is characterized in that described
Station is arranged as single combination for laser machining station and either simplex part washing station.
5. the laser array capillary processing method that multistation according to claim 1 cleans immediately, which is characterized in that described
Station is arranged as the combination of double excitation processing stations Yu dual-workpiece washing station.
6. the laser array capillary processing method that multistation according to claim 1 cleans immediately, which is characterized in that described
Workpiece A and B is any of metal material or ceramic material.
7. metal material according to claim 6 be copper foil, aluminium foil it is any, ceramic material be aluminium oxide, silicon nitride,
Any one of zirconium oxide, aluminium nitride.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811127198.4A CN109128532B (en) | 2018-09-27 | 2018-09-27 | Multi-station instant cleaning laser array micropore machining method |
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|---|---|---|---|
| CN201811127198.4A CN109128532B (en) | 2018-09-27 | 2018-09-27 | Multi-station instant cleaning laser array micropore machining method |
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| CN109128532A true CN109128532A (en) | 2019-01-04 |
| CN109128532B CN109128532B (en) | 2020-07-28 |
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| CN201811127198.4A Active CN109128532B (en) | 2018-09-27 | 2018-09-27 | Multi-station instant cleaning laser array micropore machining method |
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| CN110497286A (en) * | 2019-08-22 | 2019-11-26 | 贾方平 | A kind of marine oil and gas exploitation deep water ball valve processing grinding apparatus |
| CN110919193A (en) * | 2019-12-31 | 2020-03-27 | 上海工程技术大学 | Nanosecond laser processing method for ceramic surface hole based on processing track optimization |
| CN113881840A (en) * | 2020-07-03 | 2022-01-04 | 中国科学院沈阳自动化研究所 | Device and process for coating and removing laser shock strengthening absorption layer |
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| CN113881840A (en) * | 2020-07-03 | 2022-01-04 | 中国科学院沈阳自动化研究所 | Device and process for coating and removing laser shock strengthening absorption layer |
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| Publication number | Publication date |
|---|---|
| CN109128532B (en) | 2020-07-28 |
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