CN109128533A - A kind of method that fluid auxiliary ultrafast laser processing taper is adjustable micro porous - Google Patents

A kind of method that fluid auxiliary ultrafast laser processing taper is adjustable micro porous Download PDF

Info

Publication number
CN109128533A
CN109128533A CN201811127183.8A CN201811127183A CN109128533A CN 109128533 A CN109128533 A CN 109128533A CN 201811127183 A CN201811127183 A CN 201811127183A CN 109128533 A CN109128533 A CN 109128533A
Authority
CN
China
Prior art keywords
processing
fluid
workpiece
laser
taper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811127183.8A
Other languages
Chinese (zh)
Other versions
CN109128533B (en
Inventor
王成勇
王宏建
唐梓敏
郑李娟
杜策之
胡小月
黄欣
吴茂忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong University of Technology
Original Assignee
Guangdong University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong University of Technology filed Critical Guangdong University of Technology
Priority to CN201811127183.8A priority Critical patent/CN109128533B/en
Publication of CN109128533A publication Critical patent/CN109128533A/en
Application granted granted Critical
Publication of CN109128533B publication Critical patent/CN109128533B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • B23K26/384Removing material by boring or cutting by boring of specially shaped holes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention provides a kind of method that fluid auxiliary ultrafast laser processing taper is adjustable micro porous, comprising the following specific steps securing the workpiece against on Ultraprecise platform, before laser processing, completes workpiece cleaning and drying using cleaning liquid, dry gas;The auxiliary fluid used when requiring selection processing laser beam with the micropore of scanning mode processing first floor material according to the first floor composition material thickness of workpiece and micropore taper, while being processed according to material composition is selected;After the completion of first floor material capillary processing, machining area is washed and dried, then laser focussing plane to lower layer of material surface is moved down by ultrafast laser machining system and carries out capillary processing, while using fluid secondary process process, and then completes processing and obtains finished product.The present invention requires to select corresponding ultrafast laser scanning mode according to material thickness and capillary processing taper, and bond material ingredient is equipped with fluid secondary process, can greatly improve the capillary processing taper controllability and micropore aspect ratio of composite material.

Description

A kind of method that fluid auxiliary ultrafast laser processing taper is adjustable micro porous
Technical field
The invention belongs to technical field of laser processing, and in particular to a kind of fluid auxiliary ultrafast laser machining composite material cone Spend adjustable micro porous method.
Background technique
Laser micropore processing is to focus on capillary processing region by high energy laser beam and interact with material, makes it It is brought rapidly up in a short time to fusing and is even vaporized, and then removed.Due to the focusing and spatial characteristics of laser beam, The micropore processed is often in certain taper.As the thickness of material increases, the slag of laser processing is deposited in difficult inside micropore To spray, the depth of capillary processing is restricted, and seriously affects processing quality.Composite material is because combining the superior of multiple material Characteristic is widely used in fields such as aerospace, auto industry, textile machine and medical instruments, is made of multilayer material Laminar composite is Typical Representative.It is difficult only with a kind of processing technology since each composition of layer of this kind of composite material is different To process the micropore of high quality, and the processing controllability difficulty of its micropore taper is bigger.Patent 201510505715.7 proposes Ultra-short pulse laser steel foil micro molding and taper ameliorative way, using femtosecond infrared laser by profile detour and at present It is moved into and processes micropore to the mode of focussing plane, though this method can improve to a certain degree micropore taper, applicable material Extremely limited, for the laminar composite being made of Multiple components, such processing method is unable to satisfy the adjustable need of taper It asks.Patent CN201610350918.8 proposes a kind of device and method for improving through-hole taper by liquid-scattering, first by swashing Light processes taper through-hole, then the liquid level reflection laser beam through liquid is with the taper of successive elimination laser processing through-hole.This method The reflection angle of stability and laser beam to liquid level is more difficult to control, and the energy loss of laser beam after reflection is even more can not be accurate It calculates, application aspect is difficult to realize.To meet the composite processing demand increasing to demand, urgent need solves its taper can The capillary processing problem of tune.
Currently, there are following technical problems for the prior art: 1, laser micropore processing shows certain taper, for stratiform For composite material, the adjustable high quality micropore of taper is difficult to out only with a kind of process;2, composite material is sharp The high-temperature slag ingredient generated during light capillary processing is different, such as removes not in time, not only make machinable micropore depth by Limit, and easily react with undressed region and introduce impurity, seriously affect processing quality.
Summary of the invention
In view of this, the present invention provides a kind of method that fluid auxiliary ultrafast laser processing taper is adjustable micro porous, the present invention It requires to select corresponding ultrafast laser scanning mode according to material thickness and capillary processing taper, and bond material ingredient is equipped with stream Body secondary process can greatly improve the capillary processing taper controllability and micropore aspect ratio of composite material.
The technical solution of the present invention is as follows: a kind of method that fluid auxiliary ultrafast laser processing taper is adjustable micro porous, feature It is, comprising the following specific steps
S1. it secures the workpiece against on Ultraprecise platform, is disposed with gas and fluid injector above workpiece, Ultraprecise platform is fixed on In sink, sink is fixed on workbench;
S2. it before laser machining, is cleaned using liquid and gas nozzle difference jet cleaning liquid, dry gas completion workpiece and dry It is dry, then the focusing focusing of laser beam completion laser is adjusted by ultrafast laser machining system, and mobile Ultraprecise platform is selected Capillary processing region;
S3. require selection processing laser beam A or laser beam B to sweep according to the first floor composition material thickness of workpiece and micropore taper The mode of retouching processes the micropore of first floor material, while the auxiliary fluid used when processing selected according to the first floor material composition of workpiece;
S4. after the completion of the capillary processing of first floor material, liquid rinse is sprayed through fluid injector and gas nozzle injection gas dry is micro- Hole machined region, then laser focussing plane is moved down to second layer material surface by ultrafast laser machining system;
S5. according to the second layer composition material thickness of workpiece and micropore taper require selection processing with laser beam A or laser beam B with Scanning mode processes the micropore of the second layer material, while the auxiliary used when processing selected according to the second layer material composition of workpiece Fluid;
S6. after the completion of the capillary processing of the second layer material, through fluid cleaning and dry capillary processing region, then laser focusing is moved down Plane carries out the capillary processing of lower layer of material;
S7. it by this step successively by after the completion of the layers of material capillary processing of workpiece, then cleans through fluid and dry, removes workpiece Obtain finished product.
Further, the workpiece is laminar composite, and material forms the number of plies >=2.
Further, the laser pulse width of the ultrafast laser machining system is the ps of 290 fs ~ 10, and power is 0 ~ 20 W, is swept Retouching speed is 0 ~ 2000 mm/s, and repetition rate is 1 ~ 600 kHz, and Wavelength tunable section is ultraviolet light, green light, infrared light.
Further, the laser beam flying mode of the capillary processing is rotary-cut scanning or helical scanning.
Further, the fluid be liquid or gas, the liquid be alcohol, acetone or water, the gas be nitrogen, Oxygen, argon gas or air, the spray angle of the fluid are 10 ° ~ 80 °, and liquid injection pressure is 0 ~ 20 MPa, gas injection pressure Power is 0 ~ 1 MPa.
Further, the workpiece is the laminar composite of metal material and ceramic material composition;The metal material For any one of copper, aluminium, titanium, ceramic material is any one of silicon nitride, aluminium oxide, aluminium nitride.It should be noted that this The invention metal material, ceramic material be not limited to the present invention for example, in the prior art can also be used A kind of metal material or ceramic material.
The operation principle of the present invention is that: for laminar composite, the performance of each layer composition material is different, it is difficult to use Same laser processing technology parameter completes the high quality capillary processing of composite material entirety, and the adjustable capillary processing of taper is difficult It spends bigger.According to each layer composition material ingredient of laminar composite, selects corresponding fluid auxiliary laser to process, be conducive to mention The stability of high material in process reduces and even material is avoided to chemically react, reduces the impurity of machining area.Root According to thickness and micropore the taper requirement of each layer composition material of composite material, through ultrafast laser in a manner of rotary-cut or helical scanning It is advantageously implemented the adjustable micro porous processing of high-precision taper, and improves micropore aspect ratio.After the completion of layers of material capillary processing, warp After liquid rinse, gas dry, then subsurface material processing is carried out, processing slag can be removed, improves capillary processing quality.
In the application, inventor keeps the technical solution of the application multiple according to stratiform by a large amount of creative work Thickness and micropore the taper requirement of each layer composition material of condensation material workpiece individually add to layers of material using ultrafast laser Work can effectively improve capillary processing precision, be conducive to the controllable processing of micropore taper;It can be according to each layer group of composite material work piece Secondary process is carried out at the corresponding fluid of component selections at material, can effectively reduce single atmosphere in process to material The adverse effect of material, such as it is easy to happen chemical reaction, improve processing quality;It is clear that layers of material first carries out liquid after processing is completed Wash and gas dry, then carry out subsurface material processing, be conducive to remove material slag, improved while improving micropore aspect ratio plus Work efficiency rate.
The beneficial effects of the present invention are:
1, the present invention requires to select corresponding ultrafast laser scanning mode according to material thickness and capillary processing taper, and combines material Material ingredient is equipped with fluid secondary process, can greatly improve the capillary processing taper controllability and micropore aspect ratio of composite material;
2, by way of often processing layer of material and using liquid rinse and gas dry, be conducive to remove in process The slag of generation effectively improves capillary processing quality and efficiency.
Detailed description of the invention
Fig. 1 is processing unit (plant) structural schematic diagram of the present invention;
Fig. 2 is composite structure schematic diagram of the present invention;
Fig. 3 is machining sketch chart of the invention;
Fig. 4 is machining sketch chart of the invention;
Fig. 5 is machining sketch chart of the invention;
Wherein, 1- workbench;2- sink;3- Ultraprecise platform;4- composite material work piece;41- first floor material;Lower layer of 42- Material;5- gas nozzle;6- processing laser beam A;Laser beam is used in 7- focusing;Laser beam B is used in 8- processing;9- fluid injector;10- Capillary processing region.
Specific embodiment
Present pre-ferred embodiments are provided with reference to the accompanying drawing, in order to explain the technical scheme of the invention in detail.
Embodiment 1
A kind of method that fluid auxiliary ultrafast laser processing taper is adjustable micro porous, comprising the following specific steps by required processing Silicon nitride covers carbon/carbon-copper composite material workpiece 4 and is fixed on Ultraprecise platform 3, and gas nozzle 5 and fluid injector are disposed with above workpiece 4 9, Ultraprecise platform 3 is fixed in sink 2, and sink 2 is fixed on workbench 1.Before laser processing, fluid injector 9, gas are used Body nozzle 5 sprays alcohol respectively and air completes workpiece cleaning.Alcohol spray angle is 30 °, and pressure is 2 MPa, air injection Angle is 30 °, and pressure is 0.3 MPa.The focusing focusing of the completion laser of laser beam 7 is adjusted by ultrafast laser machining system, And mobile Ultraprecise platform 3 selectes capillary processing region 10.Selection is required according to the copper product thickness of 4 first floor of workpiece and positive taper hole Processing processes micropore with laser beam 8 with rotary-cut scanning mode, while spraying the processing of argon gas auxiliary laser, spray by gas nozzle 5 Firing angle degree is 40 °, and pressure is 0.6 MPa.The laser pulse width of ultrafast laser machining system is 290 fs, and power is 5 W, scanning speed Degree is 500 mm/s, and repetition rate is 300 kHz, and wavelength is infrared light.After the completion of the capillary processing of layers of copper material, sprayed through liquid Mouth 9 sprays acetone cleaning and the injection of gas nozzle 5 is air-dried capillary processing region 10.Acetone spray angle is 50 °, and pressure is 2 MPa, air injection angle degree are 30 °, and pressure is 0.6 MPa.Laser focussing plane is moved down extremely by ultrafast laser machining system Silicon nitride layer material surface requires selection processing laser beam 6 according to the silicon nitride material thickness of 4 second layer of workpiece and cylindrical hole Micropore is processed with spiral scan pattern, while the processing of nitrogen auxiliary laser is sprayed by gas nozzle 5, spray angle is 50 °, pressure Power is 0.6 MPa.Wherein, the laser pulse width of ultrafast laser machining system is 290 fs, and power is 10 W, scanning speed 1000 Mm/s, repetition rate are 100 kHz, and wavelength is infrared light.After the completion of silicon nitride layer capillary processing, fluid injector 9 sprays alcohol Cleaning and the injection of gas nozzle 5 are air-dried capillary processing region 10.Alcohol spray angle is 80 °, and pressure is 15 MPa, air Spray angle is 70 °, and pressure is 0.8 MPa.It removes silicon nitride and covers carbon/carbon-copper composite material workpiece 4 and obtain finished product.
Embodiment 2
A kind of method that fluid auxiliary ultrafast laser processing taper is adjustable micro porous, comprising the following specific steps by required processing Aluminium oxide covers aluminium composite material workpiece 4 and is fixed on Ultraprecise platform 3, and gas nozzle 5 and fluid injector are disposed with above workpiece 4 9, Ultraprecise platform 3 is fixed in sink 2, and sink 2 is fixed on workbench 1.Before laser processing, fluid injector 9, gas are used Body nozzle 5 sprays alcohol respectively and air completes workpiece cleaning.Alcohol spray angle is 20 °, and pressure is 1 MPa, air injection Angle is 30 °, and pressure is 0.2 MPa.The focusing focusing of the completion laser of laser beam 7 is adjusted by ultrafast laser machining system, And mobile Ultraprecise platform 3 selectes capillary processing region 10.Selection is required according to the aluminum material thickness of 4 first floor of workpiece and cylindrical hole Processing processes micropore with laser beam 6 with spiral scan pattern, while spraying the processing of argon gas auxiliary laser, spray by gas nozzle 5 Firing angle degree is 50 °, and pressure is 0.8 MPa.The laser pulse width of ultrafast laser machining system is 10 ps, and power is 3 W, scanning speed Degree is 500 mm/s, and repetition rate is 100 kHz, and wavelength is ultraviolet light.After the completion of the capillary processing of aluminium layer material, sprayed through liquid Mouth 9 sprays acetone cleaning and the injection of gas nozzle 5 is air-dried capillary processing region 10.Acetone spray angle is 60 °, and pressure is 2 MPa, air injection angle degree are 40 °, and pressure is 0.7 MPa.Laser focussing plane is moved down extremely by ultrafast laser machining system Alumina layer material surface requires selection processing laser beam 6 according to the alumina material thickness of 4 second layer of workpiece and cylindrical hole Micropore is processed with rotary-cut scanning mode, while the processing of oxygen auxiliary laser is sprayed by gas nozzle 5, spray angle is 70 °, pressure Power is 0.8 MPa.Wherein, the laser pulse width of ultrafast laser machining system is 290 fs, power 5W, scanning speed 700 Mm/s, repetition rate are 500 kHz, and wavelength is infrared light.After the completion of alumina layer capillary processing, fluid injector 9 sprays alcohol Cleaning and the injection of gas nozzle 5 are air-dried capillary processing region 10.Alcohol spray angle is 80 °, and pressure is 10 MPa, air Spray angle is 80 °, and pressure is 0.8 MPa.It removes aluminium oxide and covers aluminium composite material workpiece 4 and obtain finished product.
Embodiment 3
A kind of method that fluid auxiliary ultrafast laser processing taper is adjustable micro porous, comprising the following specific steps by required processing Aluminium nitride covers titanium composite material workpiece 4 and is fixed on Ultraprecise platform 3, and gas nozzle 5 and fluid injector are disposed with above workpiece 4 9, Ultraprecise platform 3 is fixed in sink 2, and sink 2 is fixed on workbench 1.Before laser processing, fluid injector 9, gas are used Body nozzle 5 sprays acetone respectively and air completes workpiece cleaning.Acetone spray angle is 30 °, and pressure is 1 MPa, air injection Angle is 30 °, and pressure is 0.2 MPa.The focusing focusing of the completion laser of laser beam 7 is adjusted by ultrafast laser machining system, And mobile Ultraprecise platform 3 selectes capillary processing region 10.Selection is required according to the titanium material thickness of 4 first floor of workpiece and cylindrical hole Processing processes micropore with laser beam 6 with spiral scan pattern, while spraying the processing of argon gas auxiliary laser, spray by gas nozzle 5 Firing angle degree is 30 °, and pressure is 0.7 MPa.The laser pulse width of ultrafast laser machining system is 10 ps, and power is 3 W, scanning speed Degree is 400 mm/s, and repetition rate is 100 kHz, and wavelength is green light.After the completion of the capillary processing of titanium layer material, through fluid injector 9 injection alcohol washes and the injection of gas nozzle 5 are air-dried capillary processing region 10.Alcohol spray angle is 50 °, pressure 3 MPa, air injection angle degree are 50 °, and pressure is 0.4 MPa.Laser focussing plane is moved down to nitrogen by ultrafast laser machining system Change aluminium layer material surface, according to the aluminium nitride material thickness of 4 second layer of workpiece and reverse taper holes require selection processing with laser beam 8 with Rotary-cut scanning mode processes micropore, while spraying the processing of nitrogen auxiliary laser by gas nozzle 5, and spray angle is 70 °, pressure For 0.8 MPa.Wherein, the laser pulse width of ultrafast laser machining system is 290 fs, and power 8W, scanning speed is 700 mm/ S, repetition rate are 100 kHz, and wavelength is infrared light.After the completion of aln layer capillary processing, fluid injector 9 sprays alcohol washes And the injection of gas nozzle 5 is air-dried capillary processing region 10.Alcohol spray angle is 80 °, and pressure is 10 MPa, air injection Angle is 70 °, and pressure is 0.7 MPa.It removes aluminium nitride and covers titanium composite material workpiece 4 and obtain finished product.
Embodiment 4
The present embodiment provides a kind of method that fluid auxiliary ultrafast laser processing taper same as Example 1 is adjustable micro porous, institutes Unlike, the workpiece is the laminar composite of metal material and ceramic material composition;The metal material is titanium, ceramics Material is aluminium oxide.
Embodiment 5
The present embodiment provides a kind of method that fluid auxiliary ultrafast laser processing taper same as Example 2 is adjustable micro porous, institutes Unlike, the workpiece is the laminar composite of metal material and ceramic material composition;The metal material is copper, ceramics Material is aluminium nitride.
Embodiment 6
The present embodiment provides a kind of method that fluid auxiliary ultrafast laser processing taper same as Example 3 is adjustable micro porous, institutes Unlike, the workpiece is the laminar composite of metal material and ceramic material composition;The metal material is aluminium, ceramics Material is silicon nitride.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment only includes one A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say As a whole, the technical solutions in the various embodiments may also be suitably combined for bright book, and forming those skilled in the art can be with The other embodiments of understanding.It, can be any existing by this field for the technical detail of not detailed descriptions all in the present invention There is technology realization.

Claims (7)

1. a kind of method that fluid auxiliary ultrafast laser processing taper is adjustable micro porous, which is characterized in that comprising the following specific steps
S1. it secures the workpiece against on Ultraprecise platform, is disposed with gas and fluid injector above workpiece, Ultraprecise platform is fixed on In sink, sink is fixed on workbench;
S2. it before laser machining, is cleaned using liquid and gas nozzle difference jet cleaning liquid, dry gas completion workpiece and dry It is dry, then the focusing focusing of laser beam completion laser is adjusted by ultrafast laser machining system, and mobile Ultraprecise platform is selected Capillary processing region;
S3. require selection processing laser beam A or laser beam B to sweep according to the first floor composition material thickness of workpiece and micropore taper The mode of retouching processes the micropore of first floor material, while the auxiliary fluid used when processing selected according to the material composition of workpiece;
S4. after the completion of the capillary processing of first floor material, liquid rinse is sprayed through fluid injector and gas nozzle injection gas dry is micro- Hole machined region, then laser focussing plane is moved down to second layer material surface by ultrafast laser machining system;
S5. according to the second layer composition material thickness of workpiece and micropore taper require selection processing with laser beam A or laser beam B with Scanning mode processes the micropore of the second layer material, while the auxiliary used when processing selected according to the second layer material composition of workpiece Fluid;
S6. after the completion of the capillary processing of the second layer material, through fluid cleaning and dry capillary processing region, then laser focusing is moved down Plane carries out the capillary processing of lower layer of material;
S7. it by this step successively by after the completion of the layers of material capillary processing of workpiece, then cleans through fluid and dry, removes workpiece Obtain finished product.
2. a kind of adjustable micro porous method of fluid auxiliary ultrafast laser processing taper according to claim 1, feature exist In the workpiece is laminar composite, and material forms the number of plies >=2.
3. a kind of adjustable micro porous method of fluid auxiliary ultrafast laser processing taper according to claim 1, feature exist In the laser pulse width of the ultrafast laser machining system is the ps of 290 fs ~ 10, and power is 0 ~ 20 W, and scanning speed is 0 ~ 2000 Mm/s, repetition rate are 1 ~ 600 kHz, and Wavelength tunable section is ultraviolet light, green light, infrared light.
4. a kind of adjustable micro porous method of fluid auxiliary ultrafast laser processing taper according to claim 1, feature exist In the laser beam flying mode of the capillary processing is rotary-cut scanning or helical scanning.
5. a kind of adjustable micro porous method of fluid auxiliary ultrafast laser processing taper according to claim 1, feature exist In the fluid is liquid or gas, and the liquid is alcohol, acetone or water, and the gas is nitrogen, oxygen, argon gas or sky Gas, the spray angle of the fluid are 10 ° ~ 80 °, and liquid injection pressure is 0 ~ 20 MPa, and gas jet pressure is 0 ~ 1 MPa.
6. a kind of adjustable micro porous method of fluid auxiliary ultrafast laser processing taper according to claim 2, feature exist In the workpiece is the laminar composite of metal material and ceramic material composition.
7. metal material according to claim 6 is any one of copper, aluminium, titanium, ceramic material is silicon nitride, oxidation Any one of aluminium, aluminium nitride.
CN201811127183.8A 2018-09-27 2018-09-27 Method for machining taper-adjustable micropores through fluid-assisted ultrafast laser Active CN109128533B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811127183.8A CN109128533B (en) 2018-09-27 2018-09-27 Method for machining taper-adjustable micropores through fluid-assisted ultrafast laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811127183.8A CN109128533B (en) 2018-09-27 2018-09-27 Method for machining taper-adjustable micropores through fluid-assisted ultrafast laser

Publications (2)

Publication Number Publication Date
CN109128533A true CN109128533A (en) 2019-01-04
CN109128533B CN109128533B (en) 2020-05-19

Family

ID=64812516

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811127183.8A Active CN109128533B (en) 2018-09-27 2018-09-27 Method for machining taper-adjustable micropores through fluid-assisted ultrafast laser

Country Status (1)

Country Link
CN (1) CN109128533B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111045120A (en) * 2020-01-02 2020-04-21 北京理工大学重庆创新中心 High-pressure gas-assisted CO-based gas turbine2Laser melting microlens manufacturing method
CN111943499A (en) * 2020-07-17 2020-11-17 中国航空工业集团公司北京长城航空测控技术研究所 Ultrafast laser precision cutting method based on ultrasonic nitrogen jet
CN111992876A (en) * 2020-08-31 2020-11-27 北京理工大学重庆创新中心 Complex three-dimensional micropore machining method based on laser and liquid interaction regulation and control
CN112475577A (en) * 2019-09-12 2021-03-12 马自达汽车株式会社 Resistance welding device and resistance welding method
CN112824004A (en) * 2019-11-20 2021-05-21 中国科学院宁波材料技术与工程研究所 Composite water-assisted laser processing system and processing method thereof
WO2021115921A1 (en) * 2019-12-11 2021-06-17 Rogers Germany Gmbh Method for machining a metal-ceramic substrate, system for such a method and metal-ceramic substrates produced using such a method
CN113146074A (en) * 2021-02-25 2021-07-23 贵阳航发精密铸造有限公司 Machining method of air film hole in turbine blade
CN113909709A (en) * 2020-07-07 2022-01-11 大族激光科技产业集团股份有限公司 Method and device for processing micropores of thrombus removal catheter and thrombus removal catheter

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1191114A (en) * 1997-09-18 1999-04-06 Matsushita Electric Ind Co Ltd Production of nozzle plate for ink jet recording head
CN1535195A (en) * 2001-04-05 2004-10-06 ������������ʽ���� Carbon dioxide gas laser machining method of multilayer material
CN1785577A (en) * 2005-12-21 2006-06-14 北京工业大学 Laser perforating method and its perforating device
CN101743089A (en) * 2007-06-01 2010-06-16 伊雷克托科学工业股份有限公司 Method of and apparatus for laser drilling holes with improved taper
CN103857191A (en) * 2014-03-18 2014-06-11 西安交通大学 Multi-layer flexible circuit board micro-hole processing technology based on picosecond laser

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1191114A (en) * 1997-09-18 1999-04-06 Matsushita Electric Ind Co Ltd Production of nozzle plate for ink jet recording head
CN1535195A (en) * 2001-04-05 2004-10-06 ������������ʽ���� Carbon dioxide gas laser machining method of multilayer material
CN1785577A (en) * 2005-12-21 2006-06-14 北京工业大学 Laser perforating method and its perforating device
CN101743089A (en) * 2007-06-01 2010-06-16 伊雷克托科学工业股份有限公司 Method of and apparatus for laser drilling holes with improved taper
CN103857191A (en) * 2014-03-18 2014-06-11 西安交通大学 Multi-layer flexible circuit board micro-hole processing technology based on picosecond laser

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112475577A (en) * 2019-09-12 2021-03-12 马自达汽车株式会社 Resistance welding device and resistance welding method
CN112824004A (en) * 2019-11-20 2021-05-21 中国科学院宁波材料技术与工程研究所 Composite water-assisted laser processing system and processing method thereof
WO2021115921A1 (en) * 2019-12-11 2021-06-17 Rogers Germany Gmbh Method for machining a metal-ceramic substrate, system for such a method and metal-ceramic substrates produced using such a method
CN114786863A (en) * 2019-12-11 2022-07-22 罗杰斯德国有限公司 Method for processing a metal-ceramic substrate, installation for such a method and metal-ceramic substrate produced by means of such a method
CN111045120A (en) * 2020-01-02 2020-04-21 北京理工大学重庆创新中心 High-pressure gas-assisted CO-based gas turbine2Laser melting microlens manufacturing method
CN113909709A (en) * 2020-07-07 2022-01-11 大族激光科技产业集团股份有限公司 Method and device for processing micropores of thrombus removal catheter and thrombus removal catheter
CN111943499A (en) * 2020-07-17 2020-11-17 中国航空工业集团公司北京长城航空测控技术研究所 Ultrafast laser precision cutting method based on ultrasonic nitrogen jet
CN111992876A (en) * 2020-08-31 2020-11-27 北京理工大学重庆创新中心 Complex three-dimensional micropore machining method based on laser and liquid interaction regulation and control
CN111992876B (en) * 2020-08-31 2022-05-20 北京理工大学重庆创新中心 Complex three-dimensional micropore processing method based on laser and liquid interaction regulation and control
CN113146074A (en) * 2021-02-25 2021-07-23 贵阳航发精密铸造有限公司 Machining method of air film hole in turbine blade

Also Published As

Publication number Publication date
CN109128533B (en) 2020-05-19

Similar Documents

Publication Publication Date Title
CN109128533A (en) A kind of method that fluid auxiliary ultrafast laser processing taper is adjustable micro porous
CN110385521A (en) A kind of femtosecond laser processing device and method for the quick deep etching of silicon carbide
JP7082042B2 (en) A method for continuously forming holes in a flexible substrate sheet and related products.
CN106238918A (en) The ceramic etching system of a kind of ultrasonic wave added laser and method
JP2018509365A (en) Method for manufacturing channels in glass articles by laser damage and etching and articles made thereby
CN110773872A (en) Femtosecond laser precision removing method for thermal barrier coating of turbine blade
CN104439956A (en) Method for connecting materials difficult to connect through ultrafast lasers
CN111098045B (en) Processing system and method for glass zero-taper precise deep hole array
CN109128530B (en) Dynamic adjustment multi-focus laser micropore machining method
CN112371653A (en) Laser cleaning method for removing oxide skin on surface of titanium alloy
CN106891092B (en) A kind of silica micro structure processing method
KR20220007072A (en) High silicate glass articles having through glass vias and methods of making and using same
CN110125532A (en) A kind of method, system and its equipment of water guiding laser processing workpiece
CN109128532B (en) Multi-station instant cleaning laser array micropore machining method
CN103521928A (en) Laser etching processing technology for ITO film and silver paste film
CN112917027A (en) Small-taper high-quality and high-efficiency processing device and method for conducting hole in surface of packaging substrate
CN106312332B (en) A kind of ceramic boring method of jet stream and gas auxiliary laser
WO2020056590A1 (en) Method for processing array micro-nano structure using ultrafast laser combined pulse sequence
CN113510393B (en) Method for laser drilling of ceramic workpiece
US20200180068A1 (en) Method for processing, in particular separating, a substrate by means of laser-induced deep reactive etching
Zhao et al. A study of laser machining combined with dynamic chemical etching in micro‐hole drilling of 2.5 D SiCf/SiC composites
CN113119285A (en) Laser sanding method for ceramic workpiece
CN114273800A (en) Ultrafast laser drilling method and system suitable for stainless steel workpiece
Sun et al. Laser drilling in silicon carbide and silicon carbide matrix composites
CN109755118B (en) FRGPP chip glass-front multiple diffusion process

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant