CN109128532B - Multi-station instant cleaning laser array micropore machining method - Google Patents
Multi-station instant cleaning laser array micropore machining method Download PDFInfo
- Publication number
- CN109128532B CN109128532B CN201811127198.4A CN201811127198A CN109128532B CN 109128532 B CN109128532 B CN 109128532B CN 201811127198 A CN201811127198 A CN 201811127198A CN 109128532 B CN109128532 B CN 109128532B
- Authority
- CN
- China
- Prior art keywords
- workpiece
- processing
- laser
- station
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/08—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for flash removal
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a laser array micropore processing method with multi-station instant cleaning, which comprises the following steps: before processing, conveying the workpiece A to the workpiece cleaning station by the working rotary table for cleaning and drying, and then conveying the cleaned workpiece A to the laser processing station; during laser micropore machining, the working rotary table conveys the workpiece B to a workpiece cleaning station for cleaning and drying; and then, exchanging the processing stations and the cleaning stations of the workpiece A and the workpiece B by the working rotary table, and circulating the steps to finally finish the array micropore processing of the workpiece A and the workpiece B. The invention integrates the cleaning process before and after the processing of the workpiece and the laser processing process by cleaning in time, greatly improves the processing efficiency, and can clean the residues caused by the laser processing after cleaning, thereby being beneficial to the subsequent array micropore processing and effectively improving the processing quality.
Description
Technical Field
The invention belongs to the technical field of laser processing, and particularly relates to a laser array micropore processing method with multi-station instant cleaning.
Background
As a high-energy beam processing method, laser processing has been widely used in the field of material processing because of a series of advantages of non-contact with a workpiece, no wear of a processing tool, capability of controlling processing technological parameters on line, and the like. When laser acts on a material processing area, the material absorbs the energy of the laser and then rapidly rises in temperature, and is melted and evaporated to be removed. The heat effect of the laser can easily cause material ablation, even microcracks are generated in the material to scrap the workpiece, and the processing effect is seriously influenced. For this reason, it is important to reduce the thermal effect for the popularization of the laser processing technology. For the processing of the array micropores of the material, the high heat accumulation not only easily causes heat damage to the material, but also severely limits the further reduction of the micropore distance in the large-area heat affected zone, and is difficult to meet the trend of the miniaturization and high-integration development of the processing of the current parts. The ultrafast laser, although having cold working characteristics, induces plasma that also produces thermal ablation of the material to some extent. Slag formed in the laser processing process covers the surface of a material to hinder subsequent processing, a workpiece is usually taken down and cleaned and removed after the processing is finished, but the slag which cannot be sprayed out of the inner part of the micropore can cause difficulty in processing, and the processing precision and the processing efficiency are influenced. This is also one of the important problems encountered in the current laser micro-via processing, and needs to be improved effectively.
In the prior art, the following problems mainly exist: 1. the heat damage and the heat affected zone limit the micro-hole distance to be further reduced when the array micro-hole is processed by laser, and the development trend of miniaturization and high integration parts is difficult to meet; 2. before and after laser processing, the workpiece needs to be cleaned separately to remove impurities and slag generated in the processing process, so that the processing precision and the processing efficiency are influenced.
Disclosure of Invention
In view of the above, the invention provides a laser array micropore machining method with multi-station instant cleaning, which integrates cleaning procedures before and after workpiece machining and laser machining procedures through instant cleaning, greatly improves machining efficiency, and can clean residues caused by laser machining after cleaning, so as to facilitate subsequent array micropore machining and effectively improve machining quality.
The technical scheme of the invention is as follows: a laser array micropore processing method with multi-station instant cleaning is characterized by comprising the following steps:
s1, respectively fixing a workpiece A and a workpiece B to be processed on an ultra-precise platform of a workpiece cleaning station and a laser processing station, wherein the ultra-precise platform is fixed in a water tank, and the water tank is fixed on a working turntable;
s2, before laser processing, conveying the workpiece A to a workpiece cleaning station through a working turntable, moving the ultra-precision platform to find a processing area, and starting a liquid nozzle to spray liquid on the surface of the processing area of the workpiece A;
s3, after cleaning is finished, closing the liquid nozzle and opening the dry gas nozzle to spray gas so as to dry the surface of the processing area of the workpiece A;
s4, conveying the workpiece A to a laser processing station through a working turntable, moving the ultra-precise platform to accurately find a processing area, and adjusting a laser processing system to finish laser focusing on the surface of the processing area of the workpiece A;
s5, carrying out micropore machining on the workpiece A by using laser beams emitted by a laser machining system, and simultaneously jetting gas by using a machining gas nozzle to assist in removing slag generated by laser machining;
s6, when the working rotary table conveys the workpiece A to the laser processing station, the working rotary table conveys the workpiece B to the workpiece cleaning station, the ultra-precise platform is moved to accurately find the processing area, and the surface of the processing area of the workpiece B is cleaned and dried;
s7, after the single-hole machining of the workpiece A is finished, conveying the workpiece A to a workpiece cleaning station through a working rotary table, moving the ultra-precision platform, and opening a liquid nozzle to spray liquid to a micropore machining area of the workpiece A;
s8, after cleaning is finished, closing the liquid nozzle and opening the drying gas nozzle to spray gas so as to dry the micropore machining area of the workpiece A;
s9, conveying the workpiece B to a laser processing station by the working turntable to start laser micropore processing, and simultaneously spraying gas by a processing gas nozzle to assist in removing slag generated by laser processing;
s10, circulating S1-S9 to finally finish the array micro-hole machining of the workpiece A and the workpiece B;
wherein, the step S7 is performed synchronously with the step S9.
Further, the laser processing system is a millisecond, nanosecond, picosecond or femtosecond laser processing system, and the laser wavelength of the laser processing system is ultraviolet light, green light or infrared light;
further, the liquid is alcohol, acetone and water, and the gas is air, nitrogen, oxygen or argon.
Further, the stations are arranged as a combination of a single laser machining station and a single workpiece cleaning station.
Further, the stations are arranged as a combination of a double laser processing station and a double workpiece cleaning station, and can respectively process the cleaning and the laser processing of a plurality of workpieces at the same time.
Further, the workpiece a is made of any one of a metal material and a ceramic material, and the workpiece B is made of any one of a metal material and a ceramic material.
Further, the metal material is any one of copper foil and aluminum foil, and the ceramic material is any one of aluminum oxide, silicon nitride, zirconium oxide and aluminum nitride. It should be noted that the metal material and the ceramic material described in the present invention are not limited to the examples given in the present invention, and any metal material or ceramic material in the prior art may also be used.
The working principle of the invention is as follows: when laser machining an array of micro-holes, thermal damage from high heat build-up between materials and heat affected zones tend to adversely affect the quality of the micro-holes and severely limit further reduction of the hole pitch. After the single-hole machining is finished, the single-hole machining device is cleaned, so that the material can be fully cooled, slag generated in the material machining process can be removed, and the subsequent machining is facilitated. After the material is fully cooled by cleaning, the slag is removed, and then the subsequent micropore processing is carried out, so that the hole spacing of the array micropores can be effectively reduced, the processing efficiency is improved, the processing precision is also improved, and the trend of miniaturization and high-integration development of part processing is met. Before and after laser processing, in order to remove impurities on the surface of a material before processing, material residues after processing and the like, a workpiece is usually taken down and cleaned, and the overall processing efficiency and effect are influenced. The invention integrates the working procedures of workpiece cleaning and laser processing, and can greatly improve the processing precision and the processing efficiency.
In this application, the inventor makes the technical scheme of this application can reach through a large amount of creative work: the cleaning of the workpiece and the laser processing are carried out alternately, so that the heat loss and the heat affected zone in the processing process of the laser array micropores can be effectively reduced, and the hole spacing of the array micropores can be reduced; the slag on the surfaces of the material and the micropores caused by laser processing can be removed in time by instant cleaning, so that the adverse effect of the slag on subsequent processing is reduced, and the processing precision is improved; the cleaning process and the laser processing process of the workpiece before and after processing are integrated, so that multiple clamping of the workpiece is omitted, and the processing efficiency is improved.
The invention has the beneficial effects that:
1. the heat damage and the heat affected zone when the array micropores are processed by laser are reduced or even eliminated, and the micropore spacing is further reduced so as to meet the development trend of miniaturized and highly integrated parts;
2. through instant cleaning, the cleaning process and the laser processing process before and after workpiece processing are integrated, the processing efficiency is greatly improved, and the slag caused by laser processing can be cleaned after cleaning, so that the subsequent array micropore processing is facilitated, and the processing quality is effectively improved.
Drawings
FIG. 1 is a schematic view of a processing apparatus according to the present invention;
FIG. 2 is a schematic process flow diagram of the present invention;
FIG. 3 is a schematic process flow diagram of the present invention;
FIG. 4 is a schematic process flow diagram of the present invention;
wherein, 1, a working turntable; 2-a water tank; 3-drying gas nozzle; 4-a liquid nozzle; 5-workpiece A; 6-ultra-precise platform; 7-a laser processing system; 8-a laser beam; 9-a process gas nozzle; 10-workpiece B.
Detailed Description
The following provides a detailed description of the preferred embodiments of the present invention with reference to the accompanying drawings.
Example 1
A laser array micropore processing method with multi-station instant cleaning comprises the following steps: the copper foil and the aluminum oxide which need to be processed are respectively fixed on the ultra-precise platform 6 of the workpiece cleaning station and the laser processing station, the ultra-precise platform 6 is fixed in the water tank 2, and the water tank 2 is fixed on the working rotary table 1. The workpiece cleaning station is provided with a drying gas nozzle 3 and a liquid nozzle 4, and the laser processing station is provided with a green light nanosecond laser processing system 7 and a processing gas nozzle 9. Before laser processing, a copper foil is conveyed to a workpiece cleaning station through a working turntable 1, a processing area is accurately found by moving an ultra-precise platform 6, and a liquid nozzle 4 is opened to spray alcohol on the surface of the processing area of the copper foil. After the cleaning is completed, the liquid nozzle 4 is closed and the dry gas nozzle 3 is opened to spray air to dry the surface of the processed area of the copper foil. And conveying the copper foil to a laser processing station through the working turntable 1, moving the ultra-precise platform 6 to find a processing area, and adjusting the green light nanosecond laser processing system 7 to finish laser focusing on the surface of the processing area of the copper foil. And carrying out micropore processing on the copper foil by a laser beam 8 emitted by a green light nanosecond laser processing system 7, and simultaneously spraying argon gas by a processing gas nozzle 9 to assist laser processing in removing slag. When the working rotary table 1 conveys the copper foil to the laser processing station, the working rotary table 1 conveys alumina to the workpiece cleaning station, the ultra-precise platform 6 is moved to find the processing area, and acetone cleaning and air drying are carried out on the surface of the processing area of the alumina. After the single-hole machining of the copper foil is finished, the copper foil is conveyed to a workpiece cleaning station through the working rotary table 1, the ultra-precise platform 6 is moved, and the liquid nozzle 4 is opened to spray alcohol to a micropore machining area of the copper foil. After the cleaning is completed, the liquid nozzle 4 is closed and the dry gas nozzle 3 is opened to spray air to dry the micro-hole processed region of the copper foil. At the same time, the working turret 1 conveys alumina to the laser machining station to start laser micro-via machining, while oxygen is injected by the machining gas nozzle 9 to assist laser machining in removing slag. And circulating the steps to finally finish the micropore processing of the copper foil and the aluminum oxide workpiece array.
Example 2:
a laser array micropore processing method with multi-station instant cleaning comprises the following steps: aluminum foil and silicon nitride which need to be processed are respectively fixed on an ultra-precise platform 6 of a workpiece cleaning station and a laser processing station, the ultra-precise platform 6 is fixed in a water tank 2, and the water tank 2 is fixed on a working rotary table 1. The workpiece cleaning station is provided with a drying gas nozzle 3 and a liquid nozzle 4, and the laser processing station is provided with an infrared femtosecond laser processing system 7 and a processing gas nozzle 9. Before laser processing, the aluminum foil is conveyed to a workpiece cleaning station through the working turntable 1, the ultra-precise platform 6 is moved to find a processing area, and the liquid nozzle 4 is opened to spray acetone on the surface of the processing area of the aluminum foil. After the cleaning is completed, the liquid nozzle 4 is closed and the dry gas nozzle 3 is opened to spray air to dry the surface of the processed area of the aluminum foil. The aluminum foil is conveyed to a laser processing station through the working rotary table 1, the ultra-precise platform 6 is moved to find a processing area, and the infrared femtosecond laser processing system 7 is adjusted to finish laser focusing on the surface of the processing area of the aluminum foil. The laser beam 8 emitted by the infrared femtosecond laser processing system 7 is used for carrying out micropore processing on the aluminum foil, and meanwhile, the processing gas nozzle 9 is used for spraying argon to assist laser processing in removing slag. When the working rotary table 1 conveys the aluminum foil to the laser processing station, the working rotary table 1 conveys silicon nitride to the workpiece cleaning station, the ultra-precise platform 6 is moved to accurately find the processing area, and the surface of the processing area of the silicon nitride is cleaned by alcohol and dried by air. After the single hole processing of the aluminum foil is finished, the aluminum foil is conveyed to a workpiece cleaning station through the working rotary table 1, the ultra-precise platform 6 is moved, and the liquid nozzle 4 is opened to spray acetone to a micropore processing area of the aluminum foil. After the cleaning is completed, the liquid nozzle 4 is closed and the dry gas nozzle 3 is opened to spray air to dry the micro-hole processing region of the aluminum foil. Meanwhile, the working turntable 1 conveys silicon nitride to the laser processing station to start laser micro-hole processing, and nitrogen is sprayed by the processing gas nozzle 9 to assist laser processing in removing slag. And circulating the steps to finally finish the micro-hole processing of the aluminum foil and silicon nitride workpiece array.
Example 3
A laser array micropore processing method with multi-station instant cleaning comprises the following steps: the zirconium oxide and the aluminum nitride which need to be processed are respectively fixed on the ultra-precise platform 6 of the workpiece cleaning station and the laser processing station, the ultra-precise platform 6 is fixed in the water tank 2, and the water tank 2 is fixed on the working turntable 1. The workpiece cleaning station is provided with a drying gas nozzle 3 and a liquid nozzle 4, and the laser processing station is provided with an ultraviolet picosecond laser processing system 7 and a processing gas nozzle 9. Before laser processing, the zirconium oxide is conveyed to a workpiece cleaning station through the working turntable 1, the ultra-precise platform 6 is moved to find a processing area accurately, and the liquid nozzle 4 is opened to spray alcohol on the surface of the processing area of the zirconium oxide. After the cleaning is completed, the liquid nozzle 4 is closed and the dry gas nozzle 3 is opened to spray air to dry the surface of the zirconia work area. Zirconium oxide is conveyed to a laser processing station through the working turntable 1, the ultra-precise platform 6 is moved to find a processing area, and the ultraviolet picosecond laser processing system 7 is adjusted to finish laser focusing on the surface of the processing area of the zirconium oxide. The zirconia is micro-perforated by a laser beam 8 emitted by an ultraviolet picosecond laser processing system 7, and oxygen is sprayed by a processing gas nozzle 9 to assist laser processing in removing slag. When the working rotary table 1 conveys zirconium oxide to the laser processing station, the working rotary table 1 conveys aluminum nitride to the workpiece cleaning station, the ultra-precise platform 6 is moved to accurately find the processing area, and the surface of the processing area of the aluminum nitride is cleaned by alcohol and dried by air. After the single-hole processing of zirconia is completed, the workpiece is conveyed to a workpiece cleaning station through the working turntable 1, the ultra-precise platform 6 is moved, and the liquid nozzle 4 is opened to spray alcohol to the micro-hole processing area of the zirconia. After the cleaning is completed, the liquid nozzle 4 is closed and the dry gas nozzle 3 is opened to spray air to dry the micro-porous processed region of zirconia. At the same time, the working turret 1 conveys aluminum nitride to the laser machining station to start laser micro-hole machining, while nitrogen is injected from the machining gas nozzle 9 to assist laser machining in removing slag. And circulating the steps to finally finish the array micropore machining of the zirconium oxide and aluminum nitride workpiece.
Example 4
This example provides a laser array micro-hole machining method with multi-station instant cleaning similar to that of example 1, except that the workpiece a is alumina and the workpiece B is silicon nitride.
Example 5
This example provides a laser array micro-hole processing method with multi-station instant cleaning similar to that of example 2, except that the workpiece a is aluminum foil and the workpiece B is aluminum nitride.
Example 6
This example provides a laser array micro-hole machining method with multi-station instant cleaning similar to that of example 3, except that the workpiece a is alumina and the workpiece B is zirconia.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. All technical details which are not described in detail in the present invention can be implemented by any prior art in the field.
Claims (7)
1. A laser array micropore processing method with multi-station instant cleaning is characterized by comprising the following steps: s1, fixing a workpiece A and a workpiece B to be processed on ultra-precise platforms of a workpiece cleaning station and a laser processing station respectively, wherein the ultra-precise platforms are fixed in a water tank, and the water tank is fixed on a working rotary table; the laser processing system comprises a workpiece cleaning station, a laser processing station, a workpiece cleaning system and a workpiece cleaning system, wherein the workpiece cleaning station is provided with a drying gas nozzle and a liquid nozzle; s2, before laser processing, conveying the workpiece A to a workpiece cleaning station through a working turntable, moving the ultra-precision platform to find a processing area, and starting a liquid nozzle to spray liquid on the surface of the processing area of the workpiece A; s4, conveying the workpiece A to a laser processing station through a working turntable, moving an ultra-precise platform to accurately find a processing area, and adjusting a laser processing system to finish laser focusing on the surface of the processing area of the workpiece A; s5, carrying out micropore machining on the workpiece A by using laser beams emitted by a laser machining system, and simultaneously jetting gas by using a machining gas nozzle to assist in removing slag generated by laser machining; s6, when the working rotary table conveys the workpiece A to the laser processing station, the working rotary table conveys the workpiece B to the workpiece cleaning station, the ultra-precise platform is moved to accurately find the processing area, and the surface of the processing area of the workpiece B is cleaned and dried; s7, after the single-hole machining of the workpiece A is finished, conveying the workpiece A to a workpiece cleaning station through a working rotary table, moving the ultra-precision platform, and opening a liquid nozzle to spray liquid to a micropore machining area of the workpiece A; s8, after cleaning is finished, closing the liquid nozzle and opening the drying gas nozzle to spray gas so as to dry the micropore machining area of the workpiece A; s9, conveying the workpiece B to a laser processing station by the working turntable to start laser micropore processing, and simultaneously spraying gas by a processing gas nozzle to assist in removing slag generated by laser processing; s10, circulating S1-S9 to finally finish the array micro-hole machining of the workpiece A and the workpiece B; wherein, the step S7 is performed synchronously with the step S9.
2. The method of claim 1, wherein the laser processing system is a millisecond, nanosecond, picosecond, or femtosecond laser processing system, and the laser wavelength of the laser processing system is ultraviolet light, green light, or infrared light.
3. The method according to claim 1, wherein the liquid is alcohol, acetone, or water, and the gas is air, nitrogen, oxygen, or argon.
4. A method of multi-station instant cleaning laser array micro-hole machining according to claim 1, characterized in that the stations are arranged as a combination of a single laser machining station and a single workpiece cleaning station.
5. A method of multi-station instant cleaning laser array micro-hole machining according to claim 1, characterized in that the stations are arranged as a combination of dual laser machining stations and dual workpiece cleaning stations.
6. The method of claim 1, wherein the work pieces A and B are made of any one of a metallic material and a ceramic material.
7. The method for processing the laser array micro-holes by the multi-station instant cleaning according to claim 6, wherein the metal material is any one of copper foil and aluminum foil, and the ceramic material is any one of aluminum oxide, silicon nitride, zirconium oxide and aluminum nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811127198.4A CN109128532B (en) | 2018-09-27 | 2018-09-27 | Multi-station instant cleaning laser array micropore machining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811127198.4A CN109128532B (en) | 2018-09-27 | 2018-09-27 | Multi-station instant cleaning laser array micropore machining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109128532A CN109128532A (en) | 2019-01-04 |
| CN109128532B true CN109128532B (en) | 2020-07-28 |
Family
ID=64812575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811127198.4A Active CN109128532B (en) | 2018-09-27 | 2018-09-27 | Multi-station instant cleaning laser array micropore machining method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109128532B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110497286A (en) * | 2019-08-22 | 2019-11-26 | 贾方平 | A kind of marine oil and gas exploitation deep water ball valve processing grinding apparatus |
| CN110919193B (en) * | 2019-12-31 | 2022-04-01 | 上海工程技术大学 | Nanosecond laser processing method for ceramic surface hole based on processing track optimization |
| CN113881840A (en) * | 2020-07-03 | 2022-01-04 | 中国科学院沈阳自动化研究所 | Device and process for coating and removing laser shock strengthening absorption layer |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0339888A1 (en) * | 1988-04-23 | 1989-11-02 | Elliott Industries Limited | Machining method and apparatus |
| CN1653207A (en) * | 2002-04-08 | 2005-08-10 | 应用材料有限公司 | Laser drilled surfaces for substrate processing chambers |
| CN101402156A (en) * | 2008-11-04 | 2009-04-08 | 江苏宏大特种钢机械厂 | Laser eyeglass protection method and apparatus based on laser composite life-prolonging technique |
| CN202506985U (en) * | 2012-01-19 | 2012-10-31 | 昆山思拓机器有限公司 | Double-station laser micromachining equipment for thin-wall pipe |
| CN202922099U (en) * | 2012-10-25 | 2013-05-08 | 苏州罗博特科自动化设备有限公司 | Laser automatic punching system for high speed silicon wafer |
| CN203140827U (en) * | 2012-11-29 | 2013-08-21 | 福州闽侯精钻机械厂 | Numerical control drilling amchine for circular moulds |
| CN203390536U (en) * | 2013-08-05 | 2014-01-15 | 浙江宏远数控机床有限公司 | Multi-station automatic drilling and tapping machine tool |
-
2018
- 2018-09-27 CN CN201811127198.4A patent/CN109128532B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0339888A1 (en) * | 1988-04-23 | 1989-11-02 | Elliott Industries Limited | Machining method and apparatus |
| CN1653207A (en) * | 2002-04-08 | 2005-08-10 | 应用材料有限公司 | Laser drilled surfaces for substrate processing chambers |
| CN101402156A (en) * | 2008-11-04 | 2009-04-08 | 江苏宏大特种钢机械厂 | Laser eyeglass protection method and apparatus based on laser composite life-prolonging technique |
| CN202506985U (en) * | 2012-01-19 | 2012-10-31 | 昆山思拓机器有限公司 | Double-station laser micromachining equipment for thin-wall pipe |
| CN202922099U (en) * | 2012-10-25 | 2013-05-08 | 苏州罗博特科自动化设备有限公司 | Laser automatic punching system for high speed silicon wafer |
| CN203140827U (en) * | 2012-11-29 | 2013-08-21 | 福州闽侯精钻机械厂 | Numerical control drilling amchine for circular moulds |
| CN203390536U (en) * | 2013-08-05 | 2014-01-15 | 浙江宏远数控机床有限公司 | Multi-station automatic drilling and tapping machine tool |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109128532A (en) | 2019-01-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109128532B (en) | Multi-station instant cleaning laser array micropore machining method | |
| Hanon et al. | Experimental and theoretical investigation of the drilling of alumina ceramic using Nd: YAG pulsed laser | |
| CN109128533B (en) | Method for machining taper-adjustable micropores through fluid-assisted ultrafast laser | |
| CN106425125A (en) | Ceramic drilling method of composite nanosecond-picosecond-femtosecond laser technology | |
| US20100147813A1 (en) | Method for laser processing glass with a chamfered edge | |
| US20100252540A1 (en) | Method and apparatus for brittle materials processing | |
| CN106238918A (en) | The ceramic etching system of a kind of ultrasonic wave added laser and method | |
| US20180072606A1 (en) | Manufacturing method of 3d glass | |
| WO2014058606A1 (en) | Method and apparatus for machining a workpiece | |
| CN111889895A (en) | Jet-assisted multi-pulse-width laser ingot stripping method | |
| CN108500468A (en) | A kind of method of curved profile laser deburring | |
| CN103831540A (en) | Laser composite punching method for ceramics | |
| CN114749806B (en) | Method for preparing cooling film holes on turbine blade with thermal barrier coating | |
| Pham et al. | Laser milling | |
| CN112589263A (en) | Evaporation-fusion composite laser polishing method for metal surface with peak clipping and valley filling | |
| CN109048054B (en) | Multi-axis laser-abrasive water jet precise polishing synchronous processing method | |
| CN104625432B (en) | The laser cutting method of a kind of wolfram steel thin slice and system | |
| CN217315884U (en) | High-energy laser material increasing and decreasing composite manufacturing device | |
| CN114632944B (en) | Multi-energy field-based dissimilar material additive manufacturing method | |
| Markauskas et al. | Efficient milling and cutting of borosilicate glasses through a thin flowing water film with a picosecond laser | |
| CN111805077B (en) | Method for manufacturing wafer microstructure | |
| US8497449B1 (en) | Micro-machining of ceramics using an ytterbium fiber-laser | |
| US9452484B2 (en) | Method for component machining by ablation and controlled recast layer removal by fluoride ion cleaning | |
| CN106312332A (en) | Ceramic drilling method through lasers assisted with jets and gas | |
| CN102506173B (en) | Oil ring wire rod |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |