CN111940930A - Micropore laser processing method and equipment - Google Patents
Micropore laser processing method and equipment Download PDFInfo
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- CN111940930A CN111940930A CN202010779150.2A CN202010779150A CN111940930A CN 111940930 A CN111940930 A CN 111940930A CN 202010779150 A CN202010779150 A CN 202010779150A CN 111940930 A CN111940930 A CN 111940930A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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Abstract
The invention relates to the technical field of laser processing, in particular to a micropore laser processing method and equipment, wherein the processing method comprises the following steps: fixing the workpiece on a processing platform; setting control parameters of the laser equipment, wherein the control parameters comprise the number of machining turns, frequency, a machining inclination angle, power and a focus adjustable range; controlling the processing platform to drive the workpiece to enable the surface of the workpiece to be located at the focus of the laser; and controlling the laser equipment to emit laser beams to the surface of the workpiece according to the control parameters, wherein the laser beams rotate along a preset central point and perform material reduction processing by a spiral path to obtain micropores. Wherein, the laser is an infrared femtosecond laser with the wavelength of more than or equal to 1035nm and less than or equal to 1045 nm. The laser device is controlled to emit laser beams to the surface of the workpiece according to control parameters, and the laser beams are subjected to material reduction processing in a spiral path to process precise micropores, so that the speed is high, the cost is lower, the quality of the holes is high, the consistency is high, the edges are smooth, and the laser device is suitable for workpieces with high processing precision requirements.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a micropore laser processing method and micropore laser processing equipment.
Background
The processing mode of the material with larger thickness in the micropore processing is various, and the processing is mainly carried out through a numerical control processing platform, a linear cutting process and electric spark processing. When the number of the micropores is large and extremely small, for example, when the micropores on a spinneret plate are machined, the machining is carried out by adopting a numerical control machining platform, the limitation of the size of a drill bit is caused, the service life of a machining cutter is short, and the production cost is high and the machining precision is low. In the process of wire cutting, the material is easy to deform, so that the mass production is difficult to realize, and the production cost is high. The electric discharge machining is typically slow machining, the machining efficiency is reduced along with the improvement of the machining precision, the mass production is difficult to realize, and the production cost is high.
Disclosure of Invention
The invention aims to provide a micropore laser processing method and equipment, aiming at realizing the processing of micropores rapidly and at low cost.
In a first aspect, the laser processing method of the micro-hole provided by the invention comprises the following steps: fixing the workpiece on a processing platform; setting control parameters of laser equipment, wherein the control parameters comprise processing turns, frequency, processing inclination angle, power and focus adjustable range; controlling a processing platform to drive the workpiece to enable the surface of the workpiece to be located at the focus of the laser; starting a laser operation program, controlling the laser equipment to emit laser beams to the surface of the workpiece according to the control parameters, rotating the laser beams along a preset central point, and performing material reduction processing on the workpiece by a spiral path to obtain micropores; wherein the laser device generates the laser beam by using an infrared femtosecond laser, and the wavelength of the infrared femtosecond laser is 1035nm to 1045 nm.
Further, the laser beam performs a material reducing process on the workpiece in a spiral path, including: and adjusting the depth of the focus to enable the focus to be positioned on the surface of the micro-hole which is not penetrated, and then controlling the laser beam to rotate along the central point to perform material reduction processing on the workpiece in a spiral path.
Further, the processing inclination angle is 0 °, wherein when the depth of the focus is changed, the processing inclination angle is kept unchanged, and the spiral traveling path is kept unchanged; or, the processing inclination angle is greater than 0 ° and less than or equal to 100 °, wherein when the depth of the focus is changed, the processing inclination angle is kept unchanged, and the spiral path is narrowed; or the processing inclination angle is more than or equal to-100 degrees and less than 0 degree, wherein when the depth of the focus is changed, the processing inclination angle is kept unchanged, and the spiral traveling path is widened.
Further, the method further comprises: adjusting the relative position of the workpiece and the focal point by adjusting the machining platform or the laser device.
Further, after the controlling the laser device to emit a laser beam to the surface of the workpiece according to the control parameter for material reduction processing to obtain a micro-hole, the method further includes: carrying out ultrasonic cleaning on the workpiece, and wiping the surface of the workpiece by using a dust-free cloth; and then carrying out ultrasonic cleaning on the workpiece, and using a high-pressure air gun to aim at the processed micropores for air blowing and cleaning.
Further, before starting the laser operation program, the method further includes: an inert gas is injected toward the workpiece.
Further, the wavelength of the infrared femtosecond laser is 1040 nm.
Further, the number of processing turns is 1 to 1000.
Further, the maximum power of the infrared femtosecond laser is 16W.
In a second aspect, the present invention also provides a laser processing system for laser drilling by using the laser processing method for micro-holes according to any one of claims 1 to 9, the laser system comprising: laser equipment and be used for fixed work piece's processing platform, wherein, laser equipment includes: the device comprises an infrared femtosecond laser and a beam control module, wherein the wavelength of the infrared femtosecond laser is 1035nm to 1045nm, the infrared femtosecond laser is used for emitting laser beams, and the laser beams are projected to the workpiece through the beam control module.
The invention has the beneficial effects that: by setting control parameters of laser equipment, the control parameters comprise processing turns, frequency, processing inclination angle, power and focus adjustable range, then the wavelength is controlled to be more than or equal to 1035nm, and the infrared femtosecond laser with the wavelength of less than or equal to 1045nm generates a laser beam to the surface of a workpiece, the laser beam rotates along a preset central point, and the workpiece is subjected to material reduction processing by a spiral path so as to process precise micropores. The method comprises the steps of placing a workpiece on a processing platform before processing, setting control parameters of laser equipment, controlling the processing platform to enable the surface of the workpiece to be located at a focus of laser during processing, controlling the laser equipment to send laser beams to the surface of the workpiece according to the control parameters, and performing material reduction processing on the laser beams in a spiral path, so that the method is high in speed, low in cost, high in hole quality and consistency and smooth in edge.
Drawings
The following detailed description of embodiments of the invention will be made with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic view of a micro-hole laser machining apparatus of the present invention;
FIG. 2 is a flow chart of the present invention;
FIG. 3 is another flow chart of the present invention;
FIG. 4 is a schematic cross-sectional view of a zero taper hole machining process according to an embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view illustrating a forward taper hole forming process according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view illustrating a negative taper hole forming process according to an embodiment of the present invention;
the figures are numbered:
1. an infrared femtosecond laser; 2. a light beam control module; 3. a processing platform; 4. a laser beam; 5. a workpiece; 6. an outer light path.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
The invention provides a micropore laser processing device, as shown in figure 1, a micropore laser processing system comprises a laser device and a processing platform 3 for fixing a workpiece 5. The laser device comprises an infrared femtosecond laser 1 and a beam control module 2. The infrared femtosecond laser 1 has a wavelength of 1035nm or more and 1045nm or less, and is used for emitting a laser beam 4, and the laser beam 4 is projected to a workpiece 5 through the beam control module 2.
The infrared femtosecond laser has shorter pulse and higher single pulse energy, laser pulse is focused on a processed workpiece, and due to the extremely high frequency of the femtosecond pulse, the vaporized (etching) substance is little and is extremely fast to leave each time, so that the 'heat' exchange between the vaporized substance and the surrounding substances is not in time, the substances at the periphery of the vaporized substance are not influenced, and the processing is more precise.
The workpiece 5 in this embodiment is a spinneret, which is also called a spinning cap, and is used to convert a viscous-flow polymer melt or solution into a stream having a specific cross-section through a micropore, and to solidify the stream through a solidification medium such as air or a solidification bath to form a filament. Alternatively, the workpiece 5 may be another object to be processed with a minute hole.
By implementing the embodiment, the infrared femtosecond laser 1 emits the laser beam 4, and the laser beam 4 is projected to the workpiece 5 through the beam control module 2 for laser drilling. For traditional numerical control center processing, laser cutting need not to change the cutter, reduces the use of coolant liquid, and machining efficiency is faster, effectively improves the preparation efficiency of work piece, reduces the cost of manufacture, can not receive cutter size restriction, can process the minimum hole of chi to the material lectotype of work piece does not receive the hardness restriction of metal. Compared with an etching process and a linear cutting process, the laser processing has higher hole quality, more convenient control on the taper of the hole and reduced environmental pollution. Compared with electric spark machining, laser machining can produce and machine the micropores of the spinneret plate in a large scale at low cost. In summary, laser machining of micro-holes is faster, less costly, and the holes are of high quality, high consistency and smooth edges.
The processing platform of the micropore laser processing equipment is a three-dimensional processing platform in a simple and universal form. The two dimensional motion is in the horizontal plane, indicated at X, Y, with the two coordinate axes being perpendicular to each other and the third dimension, the Z-axis, being perpendicular to the X-Y plane. The three-dimensional processing platform can finish laser processing of various holes in a plane and group holes in a certain range.
Further, when a series of holes are to be machined in a tube or barrel of material, the machining platform should have a five-dimensional function, the added two dimensions being a 360 degree rotation of the X-Y plane, which we define as the A axis, and a 0-90 degree tilt of the X-Y plane in the Z direction, which we define as the B axis, in addition to the three dimensions mentioned above. Thus, various types of laser drilling can be performed by the five-dimensional workbench. Under the condition that equipment investment needs to be saved, the numerical control of the B axis can be changed into manual operation. Therefore, the method can save the fund and basically complete all punching tasks.
In a specific embodiment, the wavelength of the infrared femtosecond laser is 1040nm, as shown in fig. 1, experiments show that, compared with the wavelengths of 1035nm and 1045nm, the micro-hole processed by the infrared femtosecond laser 1 with the wavelength of 1040nm has less slag adhering to the inner wall, a heavy casting layer and cracks are light, the quality of the processed micro-hole is good, and the method is suitable for processing a workpiece 5 with high precision requirement.
In the laser processing process, as the depth of the hole increases, the focus gradually enters the workpiece 5, and the relative position of the focus and the workpiece 5 changes. Therefore, in order to change the relative position of the focal point and the workpiece 5, two preferred embodiments are described below.
In an embodiment, the micro-hole laser processing apparatus further comprises an outer optical path 6, the outer optical path 6 comprising a plurality of optical lenses, the focal position change being achieved by adjusting the optical lenses.
In one embodiment, as shown in fig. 1, the workpiece 5 is moved by the processing platform 3, so as to change the relative position of the focal point and the workpiece 5.
In actual production, the zoom capability of the outer light path 6 is limited, and when the workpiece 5 is thick, the relative position of the focus and the workpiece 5 is usually adjusted by matching the processing platform 3. The adjustable range of the focus in this embodiment is 0 to 4mm, with the zoom capability of the outer optical path being 0 to 1 mm.
The invention provides a micropore laser processing method, as shown in figures 1 and 2, the processing flow comprises:
step S1: fixing the workpiece 5 on the processing platform 3;
step S2: setting control parameters of the laser equipment, wherein the control parameters comprise the number of machining turns, frequency, a machining inclination angle, power and a focus adjustable range;
step S3: controlling the processing platform 3 to drive the workpiece 5, so that the surface of the workpiece 5 is positioned at the focus of the laser;
step S4: starting a laser operation program, controlling a laser device to emit a laser beam 4 to the surface of a workpiece 5 according to control parameters, rotating the laser beam 4 along a preset central point, and performing material reduction processing on the workpiece 5 by a spiral path to obtain micropores;
wherein, the laser device adopts an infrared femtosecond laser 1 to generate a laser beam 4, and the wavelength of the infrared femtosecond laser 1 is 1035nm to 1045 nm.
Through implementing this embodiment, before subtracting the material processing, set up the control parameter of laser equipment, the control parameter includes processing number of turns, frequency, processing inclination, power and focus adjustable range, opens laser operation procedure back, and laser equipment sends laser beam 4 according to above-mentioned control parameter, and the instantaneous high temperature of laser production in focus department makes the substrate take place to vaporize, realizes quick, high-quality processing micropore. For traditional numerical control center processing, laser cutting need not to change the cutter, reduces the use of coolant liquid, and machining efficiency is faster, effectively improves the preparation efficiency of work piece, reduces the cost of manufacture, can not receive cutter size restriction, can process the minimum hole of size to the material lectotype of work piece is not restricted by the hardness of metal. Compared with an etching process and a linear cutting process, the laser processing has higher hole quality, more convenient control on the taper of the hole and reduced environmental pollution. Compared with electric spark machining, laser machining can produce and machine the micropores of the spinneret plate in a large scale at low cost.
Before laser processing, a processing position is preset on the workpiece 5, the laser processing can be carried out by taking the position as a central point, the laser beam 4 rotates along the preset central point, the workpiece 5 is subjected to material reduction processing by a spiral path, and the hole wall is heated all the time in the process, so that the re-solidification process and the generation of a white thick layer are prevented. For workpieces such as a spinneret plate, which have larger thickness, small micropore size and higher requirement on the quality of the inner wall of the micropore, the processing flow is adopted, and the infrared femtosecond laser with the wavelength is adopted, so that the optimal processing method is obtained by the inventor according to creative work, and the micropore quality can be ensured. In conclusion, the processing method is adopted to process the micropores by laser, so that the processing speed can be effectively improved, the processing cost is reduced, the quality of the holes is high, the consistency is good, and the edges are smooth and have no burrs.
In a particular embodiment, the laser beam 4 performs a subtractive process on the workpiece 5 in a helical path comprising: and adjusting the depth of the focus to enable the focus to be positioned on the surface of the micro hole which is not penetrated, and then controlling the laser beam 4 to rotate along the central point of the micro hole to perform material reduction processing on the workpiece 5 in a spiral path.
When work piece 5 is thick, need carry out the successive layer and punch, after laser beam 4 has processed once according to the spiral path, a blind hole can appear, consequently need readjust the degree of depth of focus, and the laser beam 4 of controlling once more subtracts material processing with the spiral path to work piece 5, when reaching preset processing number of turns, the blind hole can be processed into the through-hole.
Further, during laser processing, the processing frequency is adjusted according to the change of the workpiece material, and the processing frequency of the embodiment is 100KHz to 1000 KHz.
Furthermore, during laser processing, the path is spiral, and the processing number of turns is the number of turns of the spiral path. Therefore, the depth and the size of the hole are both proportional to the number of machining turns of the laser machining, and the number of machining turns is 1 to 1000 in this embodiment.
Specifically, as shown in fig. 1, during laser processing, slag remains in the hole, and the deeper the hole is, the harder it is to remove the slag, and at this time, the taper of the hole needs to be changed by changing the processing inclination angle of the laser beam 4, which is the included angle between the laser beam and the axis of the hole, so as to remove the slag. Meanwhile, in order to meet the requirements of customers, various special-shaped holes such as a cylindrical hole, a positive taper hole, a negative taper hole and a square hole can be flexibly processed by the laser beam 4 by changing the processing inclination angle of the laser beam 4. The machining inclination angle of the present embodiment is-100 ° to 100 °. Three examples are described below.
In an embodiment, as shown in fig. 1 and 4, the processed micro-hole is a cylindrical hole, the included angle between the laser beam 4 and the axis of the hole is adjusted to be 0 °, and then the laser beam 4 is controlled to perform material reduction processing on the workpiece 5 in a spiral path.
In an embodiment, as shown in fig. 1 and 5, the processed micro-hole is a positive taper hole, an included angle between the laser beam 4 and the axis of the hole is adjusted according to a preset taper of the positive taper hole to be processed, the included angle ranges from greater than 0 ° to less than or equal to 100 °, the laser beam 4 is controlled to perform material reduction processing on the workpiece 5 in a spiral path, when the laser beam 4 is processed according to the spiral path, a positive taper blind hole appears, the depth of a focus needs to be adjusted, the processing inclination angle is kept unchanged, and the laser beam 4 is controlled again to perform material reduction processing on the workpiece 5 in the spiral path until the positive taper blind hole is processed into a through hole. The spiral path during the secondary processing is narrower than that during the previous processing, so that the processed hole is in a forward conical shape.
In an embodiment, as shown in fig. 1 and 6, the processed micro-hole is a negative taper hole, an included angle between the laser beam 4 and the axis of the hole is adjusted according to a preset taper of the negative taper hole to be processed, the included angle ranges from greater than-100 ° to less than 0 °, the laser beam 4 is controlled to perform material reduction processing on the workpiece 5 in a spiral path, when the laser beam 4 is processed according to the spiral path, a negative taper blind hole appears, the depth of a focus needs to be adjusted, the processing inclination angle is kept unchanged, and the laser beam 4 is controlled again to perform material reduction processing on the workpiece 5 in the spiral path until the negative taper blind hole is processed into a through hole. The spiral path during the secondary processing is wider than that during the last processing, so that the processed hole is in a negative cone shape.
In an embodiment, the wavelength of the infrared femtosecond laser 1 is 1040nm, as shown in fig. 4 to 6, experiments show that, compared with the wavelengths of 1035nm and 1045nm, the micro-hole processed by the infrared femtosecond laser 1 with the wavelength of 1040nm has less slag adhering to the inner wall, light recast layer and crack, and good quality of the processed micro-hole, and is suitable for the workpiece 5 with high requirement on processing precision.
In a specific embodiment, the maximum power of the infrared femtosecond laser 1 is 16W.
In an embodiment, the relative position of the workpiece 5 and the focus is adjustable, in the laser processing process, the focus can gradually go deep into the workpiece 5 along with the increase of the depth of the hole, the relative position of the focus and the workpiece 5 can be changed, in the actual production, the workpiece 5 can be driven to move by adjusting the processing platform 3 to adjust the relative position of the focus and the workpiece 5, and zooming can be realized by adjusting laser equipment to adjust the relative position of the focus and the workpiece 5.
In an embodiment, as shown in fig. 1 and fig. 3, the process flow further includes step S5: and (3) carrying out ultrasonic cleaning on the processed workpiece, wiping the surface of the workpiece by using dust-free cloth after cleaning, then carrying out ultrasonic cleaning, and then aligning the processed micropore with a high-pressure air gun for blowing and cleaning. A large amount of metal slag exists on the surface and in the holes of the processed workpiece 5, cleaning is needed to remove most of the slag, and then a dust-free cloth is used for wiping metal attachments on the surface of the spinneret plate, which are not cleaned. The cleaning is carried out again mainly for cleaning dust and the like attached to the surface of the spinneret plate in the wiping process of the dust-free cloth, and the high-pressure air gun can quickly remove water and residual dust on the surface and in holes of the spinneret plate.
The ultrasonic cleaning is adopted in the embodiment, and the cavitation action, the acceleration action and the direct current action of the ultrasonic waves in the liquid are utilized to directly and indirectly act on the liquid and dirt, so that the dirt layer is dispersed, emulsified and stripped to achieve the cleaning purpose. The ultrasonic cleaning has the following advantages: 1. the cleaning effect is good, the cleanliness is high, and the cleanliness of all workpieces is consistent; 2. the cleaning speed is high, the production efficiency is improved, the cleaning solution does not need to be contacted by hands, and the cleaning machine is safe and reliable; 3. deep holes, thin seams and hidden parts of a workpiece can be cleaned; 4. no damage to the surface of the workpiece.
In a specific embodiment, before performing the laser processing, the method further includes step S6: an inert gas is injected toward the workpiece. Mainly prevents metal slag generated in the processing process from splashing on the protective lens. In addition, the gas can remove the slag generated in the processing process in time, so that the slag is prevented from blocking the laser.
The embodiment of the invention discloses a micropore laser processing method, as shown in fig. 1 and fig. 2, by setting control parameters of laser equipment, wherein the control parameters comprise processing turn number, frequency, processing inclination angle, power and focus adjustable range, then, an infrared femtosecond laser 1 with the wavelength of more than or equal to 1035nm and less than or equal to 1045nm is controlled to generate a laser beam 4 to the surface of a workpiece 5, the laser beam 4 rotates along a preset central point, and the workpiece 5 is subjected to material reduction processing by a spiral path so as to process precise micropores. Before machining, a workpiece 5 is placed on the machining platform 3, control parameters of laser equipment are set, the machining platform 3 is controlled during machining to enable the surface of the workpiece 5 to be located at the focus of laser, the laser equipment is controlled to emit laser beams to the surface of the workpiece 5 according to the control parameters, the laser beams are subjected to material reduction machining in a spiral path, the speed is high, the cost is low, the quality of holes is high, the consistency is high, and the edges are smooth.
It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and all such modifications and alterations should fall within the scope of the appended claims.
Claims (10)
1. A micropore laser processing method is characterized by comprising the following steps:
fixing the workpiece on a processing platform;
setting control parameters of laser equipment, wherein the control parameters comprise processing turns, frequency, processing inclination angle, power and focus adjustable range;
controlling a processing platform to drive the workpiece to enable the surface of the workpiece to be located at the focus of the laser;
starting a laser operation program, controlling the laser equipment to emit laser beams to the surface of the workpiece according to the control parameters, rotating the laser beams along a preset central point, and performing material reduction processing on the workpiece by a spiral path to obtain micropores;
wherein the laser device generates the laser beam by using an infrared femtosecond laser, and the wavelength of the infrared femtosecond laser is 1035nm to 1045 nm.
2. The micro-via laser machining method of claim 1, wherein the laser beam performs subtractive machining of the workpiece in a helical path, comprising:
and adjusting the depth of the focus to enable the focus to be positioned on the surface of the micro hole which is not penetrated, and then controlling the laser beam to rotate along the central point of the micro hole to perform material reduction processing on the workpiece in a spiral path.
3. The laser machining method for micro-holes according to claim 2, wherein the machining inclination angle is 0 °, wherein the machining inclination angle is kept constant and the spiral path is kept constant when the depth of the focal point is changed; or,
the processing inclination angle is greater than 0 degrees and less than or equal to 100 degrees, wherein when the depth of the focus is changed, the processing inclination angle is kept unchanged, and the spiral path is narrowed; or,
the processing inclination angle is larger than or equal to-100 degrees and smaller than 0 degree, wherein when the depth of the focus is changed, the processing inclination angle is kept unchanged, and the spiral traveling path is widened.
4. The micro-via laser machining method of claim 2, further comprising:
adjusting the relative position of the workpiece and the focal point by adjusting the machining platform or the laser device.
5. The laser machining method of claim 4, wherein after controlling the laser device to emit the laser beam to the surface of the workpiece according to the control parameter for material reduction machining to obtain the micro-holes, the method further comprises:
carrying out ultrasonic cleaning on the workpiece, and wiping the surface of the workpiece by using a dust-free cloth;
and then carrying out ultrasonic cleaning on the workpiece, and using a high-pressure air gun to aim at the processed micropores for air blowing and cleaning.
6. The laser machining method of claim 4, wherein before the starting of the laser operating program, the method further comprises:
an inert gas is injected toward the workpiece.
7. A microporous laser machining method according to any of claims 1-5, characterized in that the wavelength of the infrared femtosecond laser is 1040 nm.
8. The micro-via laser machining method according to claim 6, wherein the number of machining turns is 1 to 1000.
9. A method of micro-via laser machining according to claim 6, wherein the infrared femtosecond laser has a maximum power of 16W.
10. A micro-via laser machining system for laser drilling using the micro-via laser machining method according to any one of claims 1 to 9, the laser system comprising: laser equipment and be used for fixed work piece's processing platform, wherein, laser equipment includes:
an infrared femtosecond laser with a wavelength of 1035nm to 1045nm for emitting a laser beam;
and the laser beam emitted by the infrared femtosecond laser is projected to the workpiece through the beam control module.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112917028A (en) * | 2021-02-01 | 2021-06-08 | 西安交通大学 | Laser processing method for flat-bottom blind hole on surface of packaging substrate |
| CN115255680A (en) * | 2021-04-29 | 2022-11-01 | 大族激光科技产业集团股份有限公司 | Ultrafast laser-based micropore machining method |
| CN115555741A (en) * | 2022-10-09 | 2023-01-03 | 广东中科微精光子制造科技有限公司 | Ultrafast Laser Machining Micropores of Atomized Sheet |
| CN116833594A (en) * | 2023-08-01 | 2023-10-03 | 泰州职业技术学院 | Micro-taper hole laser processing method for atomizer metal substrate |
| CN120460938A (en) * | 2025-07-14 | 2025-08-12 | 西南交通大学 | Laser drilling method |
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| CN116833594A (en) * | 2023-08-01 | 2023-10-03 | 泰州职业技术学院 | Micro-taper hole laser processing method for atomizer metal substrate |
| CN120460938A (en) * | 2025-07-14 | 2025-08-12 | 西南交通大学 | Laser drilling method |
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