CN111347179A - Ultraviolet laser processing technology and system for light-transmitting micropores of electronic equipment - Google Patents
Ultraviolet laser processing technology and system for light-transmitting micropores of electronic equipment Download PDFInfo
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- CN111347179A CN111347179A CN202010187303.4A CN202010187303A CN111347179A CN 111347179 A CN111347179 A CN 111347179A CN 202010187303 A CN202010187303 A CN 202010187303A CN 111347179 A CN111347179 A CN 111347179A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Optics & Photonics (AREA)
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- Laser Beam Processing (AREA)
Abstract
The invention provides a process and a system for processing a light-transmitting micropore of electronic equipment by ultraviolet laser.
Description
Technical Field
The invention belongs to the field of micropore fine processing, and particularly relates to a process and a system for processing light-transmitting micropores of electronic equipment by ultraviolet laser.
Background
In order to meet certain appearance decoration requirements of electronic products, the marks or certain shapes of the products can be processed at specific positions of the products to realize decoration through light transmission regulation. The specific expression is that micro holes are punched on the metal material to realize light transmission. The micro-holes of the type need to meet the requirements of light transmission on one hand and water resistance, dust resistance and the like on the other hand, so that the micro-holes are required to be extremely fine and have good light transmission, and therefore, the micro-holes have strict requirements on the aperture of light entering and exiting. The following methods are generally used to form the micro-holes in the metal plate:
1. traditional machining drilling: when small holes with the diameter of less than 2mm are machined, the requirement on the drill bit is high, the drill bit is easy to break, the drill bit is easy to deviate from the machining position, and the overall machining precision is not high.
2. Electric spark drilling: the aperture of the electric spark machining can be smaller than that of the mechanical machining, can reach 0.3mm, the machining efficiency is improved, in addition, the ultrasonic composite machining can be combined, dust accumulated at the bottom of a hole due to electric erosion can be removed, but the electric spark machining has heat influence deformation, and the machining aperture cannot meet the waterproof requirement.
The traditional mode can not independently edit the processed graph, and the processing effect of the micropore is poor.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the traditional processing mode can not automatically edit the processed graph, and the processing effect of the micropores is poor.
In order to solve the technical problems, the invention adopts the technical scheme that:
the invention provides a process for processing light-transmitting micropores of electronic equipment by ultraviolet laser, which comprises the following steps:
s1, preparing a material to be processed, and determining the thickness to be processed;
s2, determining a graph to be marked and outputting the graph to a marking system, and debugging laser etching parameters;
s3, horizontally placing the processing material on a processing platform and tightly pressing the processing material on a hollowed-out jig, wherein a processing area needs to be at a hollowed-out part, the hollowed-out part and the hollowed-out jig form a relatively closed space, starting laser equipment, adjusting laser focal length, adjusting laser beams to the surface of the processing material, starting blowing, introducing air flow into the closed space, performing laser processing according to a required pattern, processing to obtain light-transmitting micropores, and enabling the air flow to flow out of the light-transmitting micropores.
Further, the step S2 further includes: and confirming the size of the light-transmitting pattern and the dot density and the interval of the pattern.
Further, the light-emitting aperture of the light-transmitting micro-hole in the step S3 is in the range of 10-20 μm.
Further, the air blowing pressure is more than 0.5 MPa.
Further, the laser device used in step S3 is a high-power ultraviolet nanosecond laser.
Further, the first laser drilling parameter used in step S3 is: the marking mode is multiple winding circle, positive focal position, marking times are 1 time, marking speed is less than 300mm/s, and Q frequency is 15-30 KHZ.
Further, the second laser drilling parameter used in step S3 is: the marking mode is that a plurality of repeated single points and positive focal positions are adopted, the marking times are 1-100 times, the marking speed is 50-1000mm/s, and the Q frequency is 15-30 KHZ.
The system for any one of the processes comprises laser equipment, a processing platform, air blowing equipment and a marking system, wherein the laser equipment, the processing platform and the air blowing equipment are connected with the marking system through electric signals.
The invention has the beneficial effects that: in the traditional mode, the processing of small holes on a metal plate is limited by the size, taper and precision of the processable aperture, and the processing of light-transmitting micro holes which are densely arranged and have extremely large quantity in an extremely small area range cannot be generally carried out on the influence factors such as the deformation of the metal plate. Firstly, the device has high cost performance and a non-contact processing mode avoids processing pollution; secondly, the size and the taper of the processing light-transmitting micropore can be adjusted through a figure file of laser processing, the processed figure can be automatically edited according to requirements, the processing mode is simple, the efficiency is high, and the processing time of a single light-transmitting micropore can be less than 0.5S; thirdly, the size of the micropore can be stabilized within the range of 10-20 mu m, the roundness of the light-transmitting micropore is good, the light-transmitting micropore cannot be blocked after the processing is finished, and the waterproof performance is good due to the small size; in addition, the ultraviolet laser processing heat influence range is small, the metal plate is not deformed, and the influence on the appearance surface of the metal is small.
Drawings
The detailed structure of the invention is described in detail below with reference to the accompanying drawings
FIG. 1 is a schematic illustration of the process of the present invention;
FIG. 2 is a process flow diagram of the present invention.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1 and fig. 2, the present invention provides a process for processing a light-transmitting micro-hole of an electronic device by using ultraviolet laser, comprising the following steps:
s1, preparing a material to be processed, and determining the thickness to be processed;
s2, determining a graph to be marked and outputting the graph to a marking system, and debugging laser etching parameters;
s3, horizontally placing the processing material on a processing platform, starting laser equipment, installing a lens, adjusting the laser focal length to the surface of the processing material, performing laser processing according to a required pattern, and processing to obtain a light-transmitting micropore;
the system for realizing the process comprises laser equipment, a processing platform, air blowing equipment and a marking system, wherein the laser equipment, the processing platform and the air blowing equipment are electrically connected with the marking system.
The method comprises the following specific steps: the processing material used is exemplified by aluminum sheet 2, but is not limited to aluminum sheet 2,
preparing the aluminum plate 2 of the electronic equipment, wherein the thickness of a part to be processed is 0.3mm, (the thickness of the aluminum plate 2 is 0.3mm, the aperture of the corresponding processed light-transmitting micropore is 70-80 μm, and the aperture of the light-emitting through hole is 10-20 μm), the thickness of the aluminum plate 2 is not limited to 0.3mm, the aperture of the corresponding light-transmitting micropore and the processing capacity are not limited to the verification result of the example at present), the surface of the aluminum plate 2 is smooth and clean, whether the surface of the aluminum plate 2 is processed or not is not limited, the two surfaces of the aluminum plate 2 are ensured to be smooth and pollution-free, and the action of; determining the size of the light-transmitting pattern, the density and the spacing of pattern points, and introducing the pattern to be processed into marking software to debug laser etching process parameters; the front surface of the prepared aluminum plate 2 is horizontally placed on the processing platform and needs to be placed and pressed on the hollow jig 4, and the processing area needs to be located at a hollow part. The hollowed part and the hollowed jig 4 form a relatively closed space, laser equipment is started, a lens is installed, light is emitted, the laser focal length is adjusted, and the focal point is adjusted to the upper surface of the front side of the aluminum plate 2. Blowing and dust extraction are started, compressed air flow 3 is introduced into the relative closed space, high-power ultraviolet laser equipment is utilized to act on the aluminum plate 2 at the focus, dust generated by the action of the laser 1 is blown and extracted at the same time, the air flow 3 flows out of the light-transmitting micropores after the aluminum plate 2 penetrates through the aluminum plate under the action of the laser 1, and the dust is taken away to avoid blocking the laser and blocking the light-transmitting micropores; processed sample should avoid touching or press printing opacity micropore region, can not use ultrasonic cleaning, use dustless rubber gloves to take out processed sample, processed sample should avoid contacting or press the micropore region, can not use ultrasonic cleaning, should use the dust of the clean surface of blowing probably deposit, shift to the microscope and observe printing opacity micropore light transmissivity and circularity through being shaded, place the sample afterwards and seal up in dustless container and keep up and avoid polluting and block up the printing opacity micropore.
From the above description, the beneficial effects of the present invention are: firstly, the cost performance of the equipment is high, and the processing pollution is avoided by a non-contact processing mode; secondly, the size and the taper of the processed light-transmitting micro-hole can be adjusted by adjusting a drawing file of laser processing, the processed graph can be automatically edited according to requirements, the processing mode is simple, the efficiency is high, and the processing time of a single light-transmitting micro-hole can be less than 0.5S; thirdly, the size of the light-transmitting micropore can be stabilized within the range of 10-20 microns, the roundness of the light-transmitting micropore is good, the light-transmitting micropore cannot be blocked after the processing is finished, and the waterproof performance is good due to the small size; and fourthly, the blowing mode influences whether the processed light-transmitting micropores are transparent or not, the blowing mode is to introduce air flow into a closed space formed by the sample and the jig, the air flow can flow out of the laser-opened micropores, for example, the laser-opened micropores can cause the processed light-transmitting micropores to be not transparent or completely transparent due to blowing from the laser action surface, the light-transmitting micropores are seriously blocked, and the repeated processing liquid can not achieve the expected effect.
Example 1
Whether the air pressure is permeable or not after the processing of the light-transmitting micropores is influenced, in order to ensure that the processed light-transmitting micropores are permeable and cannot be blocked, the air blowing pressure is greater than 0.5MPa, the air pressure is too small, the processed light-transmitting micropores cannot be permeable or completely permeable, the light-transmitting micropores are seriously blocked, and the expected effect cannot be achieved after repeated processing.
Example 2
The adopted laser equipment is an ultraviolet nanosecond laser with the wavelength of 355nm and an F160 lens, the power of the laser is more than 10W, and the selection of the laser, the selection of the lens, the position of a focus, the size and the roundness of a light spot and laser etching parameters have great influence on the taper, the aperture and the punching efficiency of the light-transmitting micropore. The type of the laser determines whether metal can be finely processed, the high-power ultraviolet nanosecond laser is selected as the type of the laser, the type of the laser is better in effect and efficiency compared with ultraviolet picosecond and infrared picosecond lasers with the same power, for example, a common infrared nanosecond laser has longer wavelength and large heat influence and can cause metal deformation; the lens selection mainly determines the size and the focal depth of a light spot, so that the processing aperture and the taper are influenced; the aperture and the taper are influenced because the sizes of the positive focus of the focus and the light spot focused by the deflection focus are different; the quality of the light spot affects the energy distribution, and the roundness of the light spot affects the roundness of the aperture; while the selection of laser parameters affects the effect and efficiency, e.g. 1 high energy hit and 10 low energy hits.
Example 3
When carrying out laser drilling, the selection of output parameter will influence the processing effect, consequently in this embodiment, further optimization has been done to output parameter to realize better cutting effect, specifically as follows:
firstly, adopting a first laser punching parameter, wherein the marking mode is a multiple winding circle, the focus adopts a positive focal position, the marking frequency is 1 time, the marking speed is less than 300mm/s, and the Q frequency (repetition frequency) is 15-30KHZ, and then adopting a second laser punching parameter, the marking mode is a plurality of repeated single points, the focus adopts the positive focal position, the marking frequency is 1-100 times, the marking speed is 50-1000mm/s, and the Q frequency (repetition frequency) is 15-30 KHZ.
In summary, the process and the system for processing the light-transmitting micropores of the electronic equipment by using the ultraviolet laser provided by the invention have the advantages that firstly, the cost performance of the equipment is high, and the processing pollution is avoided by using a non-contact processing mode; secondly, the size and the taper of the processed light-transmitting micro-hole can be adjusted by adjusting a drawing file of laser processing, the processed graph can be automatically edited according to requirements, the processing mode is simple, the efficiency is high, and the processing time of a single light-transmitting micro-hole can be less than 0.5S; thirdly, the size of the through hole can be stabilized within the range of 10-20 μm, the roundness of the light-transmitting micropore is good, the light-transmitting micropore cannot be blocked after the processing is finished, and the waterproof performance is good due to the small size; in addition, the ultraviolet laser processing heat influence range is small, the aluminum plate has no deformation, the influence on the appearance surface of the aluminum plate is small, and the air blowing mode has the influence on whether the light-transmitting micropores are transparent or not after being processed.
The first … … and the second … … are only used for name differentiation and do not represent how different the importance and position of the two are.
Here, the upper, lower, left, right, front, and rear merely represent relative positions thereof and do not represent absolute positions thereof
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. A process for processing light-transmitting micropores of electronic equipment by ultraviolet laser is characterized in that: the method comprises the following steps:
s1, preparing a material to be processed, and determining the thickness to be processed;
s2, determining a graph to be marked and outputting the graph to a marking system, and debugging laser etching parameters;
s3, horizontally placing the processing material on a processing platform and tightly pressing the processing material on a hollowed-out jig, wherein a processing area needs to be at a hollowed-out part, the hollowed-out part and the hollowed-out jig form a relatively closed space, starting laser equipment, adjusting laser focal length, adjusting a laser beam to the surface of the processing material, starting blowing, introducing air flow into the closed space, performing laser processing according to a required pattern, processing to obtain light-transmitting micropores, and enabling the air flow to flow out of the light-transmitting micropores.
2. The process of claim 1, wherein the process comprises the steps of: the step S2 further includes: and confirming the size of the light-transmitting pattern and the dot density and the interval of the pattern.
3. The process of claim 1, wherein the process comprises the steps of: the light-emitting aperture of the light-transmitting micropore in the step S3 is within the range of 10-20 μm.
4. The process of claim 3, wherein the process comprises the steps of: the blowing air pressure is more than 0.5 MPa.
5. The process of claim 4, wherein the process comprises the steps of: the laser device adopted in the step S3 is a high-power ultraviolet nanosecond laser.
6. The process of claim 5, wherein the process comprises the steps of: the first laser drilling parameter adopted in step S3 is: the marking mode is multiple winding circle, positive focal position, marking times are 1 time, marking speed is less than 300mm/s, and Q frequency is 15-30 KHZ.
7. The process of claim 6, wherein the process comprises the steps of: the second laser drilling parameter used in step S3 is: the marking mode is that a plurality of repeated single points and positive focal positions are adopted, the marking times are 1-100 times, the marking speed is 50-1000mm/s, and the Q frequency is 15-30 KHZ.
8. A system for use in the process of any one of claims 1 to 7, wherein: the laser marking device comprises a laser device, a processing platform, a blowing device and a marking system, wherein the laser device, the processing platform and the blowing device are electrically connected with the marking system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010187303.4A CN111347179A (en) | 2020-03-17 | 2020-03-17 | Ultraviolet laser processing technology and system for light-transmitting micropores of electronic equipment |
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| CN202010187303.4A CN111347179A (en) | 2020-03-17 | 2020-03-17 | Ultraviolet laser processing technology and system for light-transmitting micropores of electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111975231A (en) * | 2020-07-22 | 2020-11-24 | 广东大族粤铭激光集团股份有限公司 | Laser micropore machining method |
| CN112518234A (en) * | 2020-10-10 | 2021-03-19 | 宁波劳伦斯汽车内饰件有限公司 | Processing method of light-transmitting metal ornament |
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| CN112518234A (en) * | 2020-10-10 | 2021-03-19 | 宁波劳伦斯汽车内饰件有限公司 | Processing method of light-transmitting metal ornament |
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Application publication date: 20200630 |