CN201333592Y - Micro fine processing device for utilizing femtosecond lasers to modify material surface - Google Patents
Micro fine processing device for utilizing femtosecond lasers to modify material surface Download PDFInfo
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- CN201333592Y CN201333592Y CN 200920031767 CN200920031767U CN201333592Y CN 201333592 Y CN201333592 Y CN 201333592Y CN 200920031767 CN200920031767 CN 200920031767 CN 200920031767 U CN200920031767 U CN 200920031767U CN 201333592 Y CN201333592 Y CN 201333592Y
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Abstract
The utility model relates to a micro fine machining device for utilizing femtosecond lasers to modify a material surface. The machining device comprises a femtosecond laser, a microscopic light path system, a high-precision three-dimensional worktable and a control system main computer, wherein, laser beams emitted by the femtosecond laser are focused and projected on a processed component positioned on the three-dimensional worktable through the microscopic light path system; the microscopic light path system comprises a microscope for machining and observing and a light path system with a charge coupled device (CCD) monitoring and imaging unit; and the three-dimensional worktable is in control connection with the control system main computer. The utility model takes the femtosecond lasers as a machining light source to finely process and modify the material surface by the characteristics of unique ultrashort duration and ultra-intense peak power in coordination with an optical system and the high-precision three-dimensional worktable; and as a heat-affected zone does not occur in machining, the utility model can achieve the ultra-pression machining of the submicron grade, and provides a very useful tool for automotive industry, semiconductors, communication industry and the like requiring high precision machining.
Description
Technical field
The utility model belongs to optics fine machining system technical field, relates to the little retrofit device of a kind of femtosecond laser to material surface modifying.
Background technology
Research to laser surface treating technology starts from the sixties in 20th century, but after early 1970s was developed high power laser, this technology had just obtained actual application, and is developed rapidly in decades subsequently.Laser surface treating technology is a kind of new and high technology that multi-subject knowledges such as modern physics, chemistry, computer, material science and advanced manufacturing technology are integrated, it forms at material surface by the mode that adopts Laser Processing has certain thickness processing layer, can improve mechanical property, metallurgical performance and the physical property of material surface, thereby improve a series of performances such as wear-resisting, anti-corrosion, endurance of part, it also can make low grade material realize high-performance top layer modification, reaches the low-cost and high performance best of breed of working surface of part.
The laser surface modification technology is the important component part in the field of laser processing, its feature is that the heat that produces when utilizing high-energy-density laser irradiation workpiece heats fast to surface of the work, change luminous energy into heat energy, and then material surface is carried out unique processing handle.The advantage of this technology is to handle the material local surfaces selectively, and can obtain needed performance in local surfaces under the situation that does not change the material monolithic performance.
Be applied to laser material process for modifying surface method at present Nd:YAG Laser Processing, CO are arranged usually
2Three kinds of Laser Processing and PRK process technologies, the content division is as follows.
One, Nd:YAG Laser Processing: Nd:YAG laser is neodymium: the abbreviation of yttrium-aluminium-garnet, it is a kind of solid-state laser.Nd:YAG laser belongs to four-level system, the quantum efficiency height, and the stimulated radiation area is big.In the Laser Processing industry, because the Nd:YAG crystal has good thermal property, therefore be fit to very much make continuously and the repetition device, it is present unique solid operation material that at room temperature can continuous operation.Although the YAG laser instrument that with the YAG crystal is matrix is from coming out so far, its technology and technology is comparative maturity and being used widely all, but this process technology remains in following shortcoming: (1). in the process of laser and material effects, thermal diffusion makes the machining area material around constantly absorb energy, act on the energy minimizing that material is removed, thereby reduced working (machining) efficiency; (2). thermal diffusion has reduced the temperature of focus point, so that the temperature of focus can't can only constantly deposit by energy considerably beyond the fusing point of material, finishes the removal of material with boiling, vaporization mode; (3). because in laser processing procedure, heat is diffusion around focus, and machining area is bigger than focal spot size, thereby produces phenomenons such as fusion in the processing limit, so just can't obtain size strictness, workpiece that precision is high, has reduced the precision of microfabrication; (4). the heat that spreads in the laser processing procedure is propagated by the heat affected area, produces mechanical stress, causes mechanical crackle to produce, and the machining area material around is caused adverse effect.Progress along with correlation technique, for efficient, power output and the beam quality that improves the YAG laser instrument, expand its spectral range, people are still conducting a research and improvement energetically in technology such as laser material, structure and pumping source and pump mode and process aspect.
Two, CO
2Laser Processing: CO
2Laser processing technology be by with focus lamp with CO
2Laser beam focuses on material surface and makes material fusing, use simultaneously with the coaxial Compressed Gas of laser beam to blow away the material that is melted, and make laser beam and material along certain track do relative motion light harvesting, mechanical, electrically be the complex art of one.Since the seventies in 20th century along with CO
2Constantly improving and development of laser instrument and Numeric Control Technology, CO at present
2Laser processing technology has become a kind of material surface modifying processing method that generally adopts in the industry.But this method still has the defective that aforementioned Nd:YAG laser processing technology exists.In addition, during this method was implemented, the performance of the parameter of laser beam, machine and digital control system and precision all directly influenced the efficient and the quality of material surface modifying, because CO
2The Laser Processing breadth is subjected to the restriction of field lens size, and material surface is prone to the low-angle deviation.
Three, PRK processing: the operation material that the PRK process technology is used is excimers, and laser transition occurs in the excitation state that forms molecule and can not form between the ground state of molecule.Because the life-span of upper state is very short, laser instrument is with pulse mode work; Because following energy state is to repel attitude, the gain height of laser instrument can obtain high power output, and be the broadband transition, can obtain tunable laser emission again.The PRK most important characteristic is the high power laser light with ultraviolet and extreme ultraviolet region scope, and its process technology is particularly useful in some application in medical science, photoetching and other field.From practical effect, adopt excimer laser to process identical shaped hole and repeated aspect work be good, but whole efficient is not high, have only about 1% pulse energy to act on finished surface, and other light energy losses of about 99% is in template, so its power output is less, working (machining) efficiency is low.In addition, the cross section of excimer laser beam is big rectangle, space quality is relatively poor, this has seriously limited beams focusing, make and in little processing procedure, must use mask plate, and excimer laser all will use toxic gas, and the replacing of special gas, storage and adjustment process bother very much.
The utility model content
The purpose of this utility model is the problem that prior art exists is solved, so provide a kind of reasonable in design, easy to use, working (machining) efficiency is high, good security, add and do not have the heat affected area man-hour and have, can realize the little retrofit device of the good femtosecond laser of smooth Precision Machining and machining accuracy to material surface modifying.
The technical solution that adopts is so for achieving the above object: the femtosecond laser that is provided to little retrofit device of material surface modifying by femto-second laser, micro-light path system, high-precision three-dimensional workbench (the program control workbench of multiaxis) and control system main frame (system's control and management software) are formed, wherein: it is 800nm that femto-second laser adopts wavelength, pulsewidth 180fs, frequency 1kHz, power 1W, the femto-second laser of energy 1mJ, shine on the processed parts that are positioned at the three-dimensional working platform place through focusing on behind the micro-light path system by its laser beam that sends, micro-light path system comprises processing to be observed with microscope and the light path system that has CCD monitoring image-generating unit, the signal controlling input of femto-second laser connects with the optically-controlled signal output of control system main frame, the mobile control input end of three-dimensional working platform connects with the workbench working signal output of control system main frame, and the signal output/input of CCD image-generating unit connects with the ccd signal I/O end of control system main frame in the micro-light path system.
The utility model is used for the process of little retrofit of material surface modifying: under the control of computer (software), after the high level ultra-short pulsed laser beam that light source (femto-second laser) sends imports micro-light path system focusing by light path, shine the assigned address that is arranged on the processing component on the three-dimensional working platform, the three-dimensional motion that workbench is correlated with according to the drawing requirement of workpiece to be machined realizes the little retrofit to material surface modifying.Meanwhile, CCD in micro-light path system monitoring image-generating unit with microscopic examination to image be converted into picture signal and on computer display, show through numeral, analog signal, thereby realize real-time monitoring to whole material processing.
By above solution, the utility model proposes a kind of laser material process for modifying surface that breaks traditions, the high level ultrashort pulse femtosecond laser of wavelength 800nm, pulsewidth 180fs after its employing improves, frequency 1kHz, power 1W, energy 1mJ is as light source for processing, cooperate micro optical system and high-precision three-dimensional workbench, by the control of software program, material surface modifying is carried out little retrofit.Because femtosecond laser light source has the characteristics of narrow pulsewidth, ultrashort duration and superpower peak power, before machined material produces plasma and heat conduction, the surface modification process can be finished, therefore can not produce harmful effects such as fuel factor to working position, periphery, making to add does not have the heat affected area to exist man-hour; Again because the assimilation effect of femtosecond laser multi-photon, can absorb, decompose all material (comprising metal, resin, pottery, glass, monocrystal etc.), carry out non-hot-working, the frontier of having started hyperfine, low damage of material and space 3D processing thus and having handled considerably beyond the quasi-molecule processing characteristics.It can realize the ultraprecise processing of sub-micron grade, for the auto industry of the high-accuracy processing of needs, semiconductor (wafer, substrate cut, etching), communication (fiber waveguide) etc. provide very useful instrument.
With aforesaid Nd:YAG laser and CO
2Laser is compared little retrofit technology of material surface modifying, because the heat-affected zone that femtosecond laser processing produces is very little, so the utility model technology can access higher machining accuracy; Compare with the PRK process technology, though the PRK output light wavelength is shorter, but because of its radiant energy is absorbed by many transparent materials,, it is unsuitable for little retrofit so can only carrying out Surface Machining to material surface modifying, and when wavelength X＜200nm, also there is focusing optical element surface radiation injury problem in the PRK process technology.Studies show that, use femtosecond laser not only can carry out material surface modifying processing, can also carry out little processing (under the transparent situation of material) in the body, and machining accuracy is not less than the use precision that PRK reached.In sum, but advantage Gui Shuwei of the present utility model:
1, adds man-hour in that material is carried out surface modification, the melting phenomenon of machined surface can not occur; The crack can not occur, finished surface is smooth, the precision height;
2, the processing residue is few, can realize smooth Precision Machining;
3, rapidoprint has popularity, and the size of processing has submicron features, can carry out the three dimensions working ability;
4, can carry out surface modification processing to transparent materials such as glass, diamond, crystals;
5, have the stability height, can realize long-time continuous running, environmental adaptation and endurance quality advantages of higher.
Description of drawings
Fig. 1 is the theory structure schematic diagram of little retrofit device described in the utility model.
Fig. 2 is the structural representation of the used femto-second laser of this processing unit (plant).
The software control schematic flow sheet that Fig. 3 is provided with for the utility model.
The specific embodiment
Referring to accompanying drawing 1, femtosecond laser described in the utility model is made of femto-second laser 1, micro-light path system, high-precision three-dimensional workbench 5 and control system main frame (system's control and management software) 2 four parts little retrofit device of material surface modifying.The laser beam that femto-second laser 1 sends shines on the processed parts 4 that are positioned at three-dimensional working platform 5 places through focusing on behind the micro-light path system, the signal controlling input of femto-second laser 1 connects with the optically-controlled signal output of control system main frame 2, the mobile control input end of three-dimensional working platform 5 connects with the workbench working signal output of control system main frame 2, and the signal output/input of CCD monitoring image-generating unit connects with the ccd signal I/O end of control system main frame 2 in the micro-light path system.
Femtosecond laser to the material surface modifying processing procedure in, play an important role to processing effect the action time of laser energy and laser and machined material, the utility model designer improves the structure of existing femto-second laser for this reason, as shown in Figure 2.It has pump laser 11, optical fiber oscillator 12, fiber stretcher 13 and the optical pulse compressor 18 that is provided with according to beam path, between fiber stretcher 13 and optical pulse compressor 18, be provided with the firm power output system (the SPOS structure is shown in the frame of broken lines) that constitutes by the femtosecond laser regenerative amplifier 16 that has been equipped with quasi-continuous power supply 14 of long-life, diode pumping solid laser 15 and photo-electric control module (high stability power supply/light beam/round transport passage) 17.Above-mentioned SPOS structure main feature is to be equipped with quasi-continuous power supply 14 of long-life to diode pumping solid laser 15, femtosecond laser regenerative amplifier 16 has been designed photo-electric control module (high stability power supply/light beam/round transport passage) 17, be actually having carried out optimal design as the diode pumping solid laser 15 of exciting light source and the control of femtosecond laser regenerative amplifier 16.Can realize system of processing fault-free continuous operation 12000 hours by this design.The practical work process of this femto-second laser is according to down described: (1). when laser obtains the laser of 1550nm/100MHz/100mW/1nJ during by optical fiber oscillator 12 (process I Fig. 2) from pump laser 11; (2). when laser obtains the laser of 775nm/1ps during by fiber stretcher 13 (process II); (3). obtain the laser of 800nm/1KHz/3W/1uJ by femtosecond laser regenerative amplifier (process III) when laser; (4). when laser passes through optical pulse compressor 18 (process IV), finally obtain the laser of wavelength 800nm/ frequency 1KHz/ power 1W/ energy 1mJ/ pulsewidth 180fs, be little retrofit light source (femtosecond laser) material surface modifying.As a kind of embodiment, pump laser 11 in the femto-second laser is selected the PL-WH-01 device for use, optical fiber oscillator 12 is selected the OPO-WH-01 device for use, fiber stretcher 13 is selected the OPE-WH-01 device for use, long-life, quasi-continuous power supply 14 was selected the PCPs-WH-01 device for use, diode pumping solid laser 15 is selected the DPSL-WH-01 device for use, femtosecond laser regenerative amplifier 16 is selected the GRA-WH-01 device for use, photo-electric control module (high stability power supply/light beam/round transport passage) 17 is selected the OEPS-1 device for use, and optical pulse compressor 18 is selected the LPC-WH-01 device for use.
The structure of micro-light path system also as shown in Figure 1 in the utility model, it has light path gatherer 33, half-reflection and half-transmission spectroscope 34, observe to focus on and monitor image-generating unit with the CCD that CCD32 forms with microscope (OPIELICS C130) 35 with by the monitoring of band monitor 31, the high level ultra-short pulsed laser beam that femto-second laser light source 1 sends behind light path gatherer 33 to half-reflection and half-transmission spectroscope 34, its reverberation is through focusing on the assigned address that shines on the processed parts 4 that are positioned at three-dimensional working platform 5 places behind the microscope 35, its optical signal transmissive passes in the CCD monitoring image-generating unit, CCD monitoring image-generating unit with microscope 35 observed images through numeral, analog signal is converted into picture signal and shows on computer display, thereby realizes the real-time monitoring to whole material processing.
The high-precision three-dimensional workbench of addressing in this processing unit (plant) 5 is the program control workbench of multiaxis.When the light beam of femtosecond laser focuses on the processing component 4 through microscope 35, when microscope 35 is observed, move by the automatic control of three-dimensional working platform 5, realize processing to parts 4.
In the utility model practical structures, control system main frame 2 can adopt TMSIS-4000.System's control and management software adopts Visual C++6.0 as developing instrument based on the ATUOCAD platform, has realized automated programming, by the communication of RS-232 interface and control system, can realize the external control to equipment, has improved programming precision and accuracy.In entire work process,, comprise that System menu, form, dialog box and some other miscellaneous function of program operation ejects interface etc. for the user provides abundant friendly operation interface module.When system moved, program master interface required user's new document, thus the beginning design process; The user imports design parameter, and system accesses data from design database, and the drawing function that utilizes program to formulate designs and draws; Can store and manage design data after design is finished.Can under the VC environment, draw, print the processing drawing according to the design parameter that comes by the transmission of designing and calculating module.Software also has warning function simultaneously, and as when being provided with of laser head, cooler etc. is incorrect, system all provides warning, and measure and the step of pointing out the user to take.On operation interface, the user can realize opening and closing femto-second laser, microscopical burnt adjustment, the acceleration of setting workbench, origin position, the operating desk moving direction etc. of focusing on, by RS-232 interface a series of instructions are sent to system of processing, instruct the correct work of whole system of processing.
Claims (3)
1, a kind of femtosecond laser is to little retrofit device of material surface modifying, it is characterized in that by femto-second laser (1), micro-light path system, three-dimensional working platform (5) and control system main frame (2) are formed, it is 800nm that femto-second laser (1) adopts wavelength, pulsewidth 180fs, frequency 1kHz, power 1W, the femto-second laser of energy 1mJ, its laser beam that sends is positioned on the processed parts (4) that three-dimensional working platform (5) locates through focusing on behind the micro-light path system to shine, micro-light path system comprises that processing observes with microscope (35) and have the light path system that CCD monitors image-generating unit, the signal controlling input of femto-second laser (1) connects with the optically-controlled signal output of control system main frame (2), the mobile control input end of three-dimensional working platform (5) connects with the workbench working signal output of control system main frame (2), and the signal output/input of CCD monitoring image-generating unit connects with the ccd signal I/O end of control system main frame (2) in the micro-light path system.
2, femtosecond laser according to claim 1 is to little retrofit device of material surface modifying, it is characterized in that femto-second laser (1) has pump laser (11), optical fiber oscillator (12), fiber stretcher (13) and the optical pulse compressor (18) that is provided with according to beam path, is provided with the firm power output system that is made of the femtosecond laser regenerative amplifier (16) that has been equipped with quasi-continuous power supply of long-life (14), diode pumping solid laser (15) and photo-electric control module (17) between fiber stretcher (13) and optical pulse compressor (18).
3, femtosecond laser according to claim 2 is to little retrofit device of material surface modifying, it is characterized in that micro-light path system has light path gatherer (33), half-reflection and half-transmission spectroscope (34), microscope (35) and the CCD monitoring image-generating unit of forming with CCD (32) by the monitoring of band monitor (31), the laser beam that femto-second laser (1) sends behind light path gatherer (33) to half-reflection and half-transmission spectroscope (34), its reverberation is positioned on the processed parts (4) that three-dimensional working platform (5) locates through focusing on behind the microscope (35) to shine, and its optical signal transmissive passes in the CCD monitoring image-generating unit.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200920031767 CN201333592Y (en) | 2009-01-20 | 2009-01-20 | Micro fine processing device for utilizing femtosecond lasers to modify material surface |
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| CN 200920031767 CN201333592Y (en) | 2009-01-20 | 2009-01-20 | Micro fine processing device for utilizing femtosecond lasers to modify material surface |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103515315A (en) * | 2012-06-25 | 2014-01-15 | 株式会社迪思科 | Processing method and processing apparatus |
| CN107116308A (en) * | 2017-05-03 | 2017-09-01 | 湖北工业大学 | Waveguide micro/nano processing system and processing method |
| CN107627025A (en) * | 2017-09-15 | 2018-01-26 | 南开大学 | A kind of preparation method of broad-band gap crystalline material surface micro-nano structure |
| CN109664035A (en) * | 2017-10-11 | 2019-04-23 | 无锡映型三维数字技术有限公司 | A kind of three-dimensional modeling machine that laser damage structure is cut and its application method |
| CN109894747A (en) * | 2019-03-27 | 2019-06-18 | 上海理工大学 | Femtosecond chevilled silk is used for the hyperfine processing unit (plant) in surface and method backwards to shock wave |
| CN112975133A (en) * | 2021-02-07 | 2021-06-18 | 福建师范大学 | Device for quickly modifying surface of material by laser |
-
2009
- 2009-01-20 CN CN 200920031767 patent/CN201333592Y/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103515315A (en) * | 2012-06-25 | 2014-01-15 | 株式会社迪思科 | Processing method and processing apparatus |
| CN103515315B (en) * | 2012-06-25 | 2018-07-31 | 株式会社迪思科 | Processing method and processing unit (plant) |
| CN107116308A (en) * | 2017-05-03 | 2017-09-01 | 湖北工业大学 | Waveguide micro/nano processing system and processing method |
| CN107627025A (en) * | 2017-09-15 | 2018-01-26 | 南开大学 | A kind of preparation method of broad-band gap crystalline material surface micro-nano structure |
| CN107627025B (en) * | 2017-09-15 | 2020-06-26 | 南开大学 | Preparation method of wide-bandgap crystal material surface micro-nano structure |
| CN109664035A (en) * | 2017-10-11 | 2019-04-23 | 无锡映型三维数字技术有限公司 | A kind of three-dimensional modeling machine that laser damage structure is cut and its application method |
| CN109894747A (en) * | 2019-03-27 | 2019-06-18 | 上海理工大学 | Femtosecond chevilled silk is used for the hyperfine processing unit (plant) in surface and method backwards to shock wave |
| CN112975133A (en) * | 2021-02-07 | 2021-06-18 | 福建师范大学 | Device for quickly modifying surface of material by laser |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20091028 Effective date of abandoning: 20090120 |