CN114473214A - Double laser beam coupling polishing method for ceramic surface - Google Patents
Double laser beam coupling polishing method for ceramic surface Download PDFInfo
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- CN114473214A CN114473214A CN202210335099.5A CN202210335099A CN114473214A CN 114473214 A CN114473214 A CN 114473214A CN 202210335099 A CN202210335099 A CN 202210335099A CN 114473214 A CN114473214 A CN 114473214A
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
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- B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
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Abstract
The invention discloses a ceramic surface double-laser-beam coupling polishing method, which comprises the following steps: acquiring a three-dimensional model of a workpiece to be polished; generating a laser processing track according to the three-dimensional model; and preheating the surface of the workpiece to be polished by using infrared laser, and performing laser cold polishing on the workpiece to be polished by using ultrafast laser according to a laser processing track after preheating is completed. According to the technical scheme provided by the invention, a three-dimensional model of a workpiece to be polished is obtained, a laser processing track is generated according to the three-dimensional model, then the workpiece to be polished is preheated by using infrared laser, so that the temperature of the workpiece to be polished is close to the melting point temperature of the workpiece to be polished, after the preheating is finished, the workpiece to be polished is subjected to cold polishing by using ultrafast laser according to the laser processing track, during the laser cold polishing, the action time of the laser and the workpiece to be polished is short, the heat affected zone is very small, the obtained processing section is relatively flat, and therefore, the lower surface roughness and the higher surface quality can be obtained.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a double-laser-beam coupling polishing method for a ceramic surface.
Background
The ceramic material has excellent heat resistance and mechanical properties, and has wide application in the aspects of electronic devices, aerospace, biomedicine and the like. However, due to poor surface quality of the ceramic device caused by the conventional manufacturing process, the ceramic device is severely limited in a high precision application environment. Because of high hardness, the polishing of ceramic parts is always the processing bottleneck of modern manufacturing industry, the traditional polishing process (including manual polishing) is labor-intensive, has a series of problems of poor processing precision, low efficiency, serious pollution, lack of consistency and stability of product quality and the like, and cannot meet the requirements of high automation, intellectualization and networking of modern manufacturing equipment, so that the selection or development of a novel ceramic polishing process is particularly important.
In order to meet the polishing requirements of high efficiency and environmental protection of ceramic parts, the conventional solution of the polishing industry is to adopt a laser polishing mode. Laser polishing is one of the most promising and effective polishing technologies in this century, and compared with the traditional polishing technology, laser polishing has the advantages of being green, free of pollution, high in polishing efficiency, high in flexibility, capable of polishing complex free-form surface shapes, wide in application range and the like. Therefore, the laser polishing technology is widely applied to surface processing of various materials, including ultra-precision polishing processing of hard and brittle materials such as diamond, ceramic materials, optical glass and the like.
At present, laser polishing of ceramics is mainly carried out through the thermal effect of short pulse laser, and the laser thermal effect polishing process is to polish by means of melting flow, vaporization removal or thermal stress removal through absorption of laser energy by materials. However, because the ceramic material is brittle, the ceramic surface rapidly reaches the melting point under the action of instantaneous laser heat, and cracks are easily generated due to temperature shock. Although the degree of cracking of the ceramic can be reduced by optimizing the laser polishing process to achieve the polishing process, this phenomenon cannot be eradicated all the time, and thus the polishing by the laser thermal effect easily causes microcracks on the surface of the ceramic, thereby reducing the polishing quality.
Disclosure of Invention
The invention mainly aims to provide a double-laser-beam coupling polishing method for a ceramic surface, and aims to solve the technical problems in the background technology.
In order to achieve the above object, the method for polishing the ceramic surface by coupling two laser beams provided by the invention comprises the following steps:
acquiring a three-dimensional model of a workpiece to be polished;
generating a laser processing track according to the three-dimensional model;
and preheating the surface of the workpiece to be polished by using infrared laser, and after preheating is finished, performing laser cold polishing on the workpiece to be polished by using ultrafast laser according to the laser processing track.
In some embodiments, said generating a laser machining trajectory from said three-dimensional model comprises:
identifying the highest layer of the surface to be polished of the three-dimensional model;
and layering the surface to be polished based on the highest layer, and generating corresponding laser processing tracks layer by layer.
In some embodiments, the delaminating the surface to be polished comprises:
obtaining the layering thickness and the layering number of the surface to be polished;
and according to the thickness and the layering number of the layering layers, layering from the highest layer of the surface to be polished to generate a layering polishing model which is downward layer by layer.
In some embodiments, before the step of preheating the surface of the workpiece to be polished using an infrared laser, the method further comprises:
acquiring laser polishing parameters and delay time of a workpiece to be polished;
the laser polishing parameters comprise laser power, pulse repetition frequency, pulse width, laser scanning speed, spot diameter, spot overlapping degree, defocusing amount, beam incident angle and spot coupling mode, and the delay time is the duration of auxiliary preheating of the infrared laser on the workpiece to be polished.
In some embodiments, the ceramic surface double laser beam coupling polishing method is carried out on a workbench with two-axis rotational freedom, the infrared laser is controlled by a first galvanometer, the ultrafast laser is controlled by a second galvanometer, and the first galvanometer and the second galvanometer respectively have three-axis freedom;
the method for carrying out laser cold polishing on the workpiece to be polished by using the ultra-fast laser according to the laser processing track comprises the following steps of preheating the surface of the workpiece to be polished by using the infrared laser, and after the preheating is finished:
judging whether the workpiece to be polished is a three-dimensional curved surface;
if so, controlling the workbench, the first galvanometer and the second galvanometer to carry out five-axis numerical control polishing on the workpiece to be polished;
and if not, controlling the first vibrating mirror and the second vibrating mirror to carry out three-axis numerical control polishing on the workpiece to be polished.
According to the technical scheme provided by the invention, a three-dimensional model of a workpiece to be polished is obtained, a laser processing track is generated according to the three-dimensional model of the workpiece to be polished, then infrared laser is used for preheating the workpiece to be polished, so that the temperature of the workpiece to be polished is close to the melting point temperature of the workpiece to be polished, after the preheating is finished, ultrafast laser is used for cold polishing the workpiece to be polished according to the generated laser processing track, when the laser cold polishing is realized, the action time of the laser and the workpiece to be polished is short, the heat affected zone is very small, the obtained processing section is relatively flat, and therefore, relatively low surface roughness and relatively high surface quality can be obtained.
Drawings
FIG. 1 is a flow chart of a first embodiment of the double laser beam coupling polishing method for ceramic surface according to the present invention;
FIG. 2 is a flow chart of a second embodiment of the double laser beam coupling polishing method for ceramic surface according to the present invention;
FIG. 3 is a flow chart of a third embodiment of the double laser beam coupling polishing method for ceramic surface according to the present invention;
FIG. 4 is a flow chart of a fourth embodiment of the double laser beam coupling polishing method for ceramic surface according to the present invention;
FIG. 5 is a flow chart of a fifth embodiment of the double laser beam coupling polishing method for ceramic surface according to the present invention;
FIG. 6 is a schematic diagram of a laser polishing system in accordance with one embodiment of the present invention;
FIG. 7 is a schematic diagram of an infrared laser and ultraviolet picosecond laser polishing of ceramic parts;
FIG. 8 is a schematic diagram of a short pulse laser polishing of a ceramic part.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
In the following, the embodiments of the present invention will be described in detail with reference to the drawings in the following, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
It will also be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
In order to overcome the defects of the existing laser polishing ceramic technology, the invention provides a double-laser-beam coupling polishing method which can avoid the thermal side effect of a ceramic part, can realize the fine polishing of the surface of the ceramic and can solve the problem of polishing efficiency to a certain extent. The method is not only limited to polishing of plane parts, but also applicable to laser polishing of parts with complex free-form surface shapes, and can solve the problem of 3D curved surface polishing of hard and brittle materials such as ceramics and the like so as to further meet the actual requirements in industrial production.
The basic principle of the ceramic surface double-laser-beam coupling polishing method of the invention is described as follows:
the laser single photon energy formula is E ═ h/lambda, wherein h is Planck constant, and lambda is laser wavelength. According to the formula, the shorter the wavelength, the higher the energy of a single photon, and the easier it is to realize cold polishing by photochemical decomposition, so short-wavelength laser is often used for fine polishing. For long wavelength laser, the laser polishing surface has a large heat affected zone and thermal stress due to less energy of single photon, and cracks are easy to generate. In order to achieve laser cold polishing, polishing is carried out by a photochemical process. The necessary condition for photochemical reactions to occur is that the single photon energy of the incident beam is greater than the chemical binding energy of the material being processed. When a laser photochemically removes a material, the laser photons can directly break the chemical bonds of the material and cause the material to dissociate. When the rate of breaking of chemical bonds is greater than its binding rate, the local gas pressure in the processed area of the material will rise and cause the material to expand rapidly after dissociation, eventually breaking free of the matrix in the form of an explosion and carrying away the remaining heat. In the processing process, the action time of the laser and the material is usually very short, the heat affected zone is very small, and the obtained processing section is relatively flat, so that higher laser processing precision and surface quality can be obtained.
However, since the bond energy of hard and brittle materials such as ceramics is large, the critical wavelength for generating single-photon absorption photochemical reaction is low 266 (less than 355nm), the wavelength of ultraviolet laser is 355nm, and the condition of single-photon absorption photochemical reaction is not satisfied, but the photochemical reaction can be realized through multi-photon absorption, and the probability of generating multi-photon absorption by the material can be increased by increasing the laser energy density (rapid temperature rise, large energy density of light spot). The energy density of the pulse laser is high, infrared nanosecond (wavelength of 1064nm) laser is adopted for auxiliary polishing, the photochemical effect of multiphoton absorption in the polishing process is increased, namely the photon energy absorbed by the material is far greater than the chemical bond energy of the material, the chemical bond breaking speed of the material is accelerated, the material is quickly separated from a matrix in a dissociation mode and takes away redundant heat, the photothermal effect cannot occur or a small effect is generated, and the photochemical effect is dominant in the polishing process. Preheat through infrared nanosecond for the chemical bond is not hard up, and is more not hard up, breaks more easily, and two effects preheat, do not let ceramic temperature produce the snap, break easily, reach seventy percent of melting point temperature about, are favorable to absorbing the probability of multiphoton.
In summary, the present invention selects ultra-fast ultraviolet picosecond (355nm) laser for polishing, and performs coupled polishing of dual laser beams by using infrared laser for auxiliary pre-heating polishing (increasing the probability of multiphoton absorption during material polishing). When ultraviolet picosecond laser interacts with the surface of a material, free electrons are generated through avalanche ionization or multiphoton ionization and the like, multiphoton absorption is generated in the polishing process, after the material absorbs laser photon energy, the laser photon energy absorbed by the material is far larger than the chemical bond energy of the material, the chemical bond fracture speed of the material is accelerated, the surface components of the material are quickly removed, the heat affected zone generated by the photochemical action in the dominant position in the process is less, and laser cold polishing can be realized.
Referring to fig. 1 and fig. 6-8, the present invention provides a method for polishing a ceramic surface by coupling two laser beams, comprising:
step S10, acquiring a three-dimensional model of a workpiece to be polished;
step S20, generating a laser processing track according to the three-dimensional model;
and step S30, preheating the surface of the workpiece to be polished by using infrared laser, and after preheating is finished, performing laser cold polishing on the workpiece to be polished by using ultrafast laser according to a laser processing track.
In this embodiment, the model of the workpiece to be polished can be drawn by 3D drawing software, such as SW, CREO, UG, and the like, and can also be drawn by a three-dimensional scanner, the three-dimensional scanner can detect the shape and appearance data of the workpiece to be polished, and the three-dimensional reconstruction of the workpiece to be polished can be performed by the shape and appearance data, so as to obtain the three-dimensional model of the workpiece to be polished. And importing the three-dimensional model of the workpiece to be polished into a computer system, and generating a corresponding laser processing track by the computer system according to the three-dimensional model.
After the laser processing track is generated, the surface of the workpiece to be polished is preheated by using the infrared laser, so that the temperature of the workpiece to be polished is increased to be close to the melting point temperature of the workpiece to be polished, for example, to be about 80% of the melting point temperature, but the temperature is not more than the melting point temperature of the workpiece to be polished, so that the chemical bond of the workpiece to be polished is looser and is easier to break. After preheating is finished, ultrafast laser (such as ultraviolet picosecond laser) is used for carrying out laser cold polishing on the workpiece to be polished according to the generated laser processing track, the action time of the laser and the workpiece to be polished is short, the heat affected zone is very small, the obtained processing section is relatively flat, and therefore the surface roughness can be relatively low and the surface quality can be relatively high.
The infrared laser mainly plays a role in assisting in preheating the surface of a polished workpiece due to high power density, the probability of generating a multi-photon absorption mechanism is increased, and the ultraviolet picosecond laser can be combined with the advantages of ultraviolet wavelength laser and ultrafast laser to perform photochemical polishing on the workpiece to be polished, so that the effect of laser cold polishing is realized.
In some embodiments, referring to fig. 2, the generating the laser processing trajectory according to the three-dimensional model proposed by the present invention includes:
step S21, identifying the highest layer of the surface to be polished of the three-dimensional model;
and step S22, layering the surface to be polished based on the highest layer, and generating corresponding laser processing tracks layer by layer.
In this embodiment, after the three-dimensional model of the workpiece to be polished is obtained, the highest layer of the surface to be polished of the three-dimensional model, that is, the first layer removed by layered polishing, is identified by computer software. And then, layering the surface to be polished based on the highest layer, generating corresponding laser processing tracks layer by layer, and controlling ultrafast laser to carry out laser cold polishing according to the corresponding laser processing tracks when each layer is subjected to laser polishing.
After the highest layer of the surface to be polished of the three-dimensional model is identified, the preset height is increased upwards relative to the identified highest layer, so that the situation that a certain part of materials are missed and polished due to identification errors is avoided. For example, assuming that the highest layer of the surface to be polished of the identified three-dimensional model is 1.5 μm, the corresponding increase in height of the identified surface is 0.5 μm, and thus the highest layer of the surface to be polished is finally obtained to be 2.0 μm.
In some embodiments, referring to fig. 3, the present invention provides a method for delaminating the surface to be polished, including:
step S221, obtaining the layering thickness and the layering number of the surface to be polished;
step S222, according to the thickness and the number of the layering layers, layering is carried out from the highest layer of the surface to be polished, and a layering polishing model which is downward layer by layer is generated.
In this embodiment, after the three-dimensional model of the workpiece to be polished is obtained, the highest layer of the surface to be polished of the three-dimensional model, that is, the first layer removed by layered polishing, is identified by computer software. And then, layering the surface to be polished based on the highest layer, setting the number of layering layers and the thickness of the layering layers to obtain a layering polishing model which is downward layer by layer, and filling and scanning each layer to realize the effect of layering and polishing the surface of the workpiece (ceramic) to be polished.
In some embodiments, referring to fig. 4, before the step of preheating the surface of the workpiece to be polished by using the infrared laser, the method further includes:
step S40, obtaining laser polishing parameters and delay time of a workpiece to be polished;
the laser polishing parameters comprise laser power, pulse repetition frequency, pulse width, laser scanning speed, spot diameter, spot overlapping degree, defocusing amount, beam incident angle and spot coupling mode, and the delay time is the duration of auxiliary preheating of the workpiece to be polished by the infrared laser.
In this embodiment, in order to realize the laser cold polishing effect of the photochemical action, the process parameters of the laser polishing must be optimized for different characteristics of the processing material. The technological parameters of laser polishing mainly include laser power pulse repetition frequency, pulse width, laser scanning speed, spot diameter, two-spot overlap degree, defocusing amount, beam incident angle, spot coupling mode and other technological parameters. And controlling the ultrafast laser to carry out laser cold polishing on the surface of the preheated workpiece to be polished after the infrared laser acts for 3 seconds, wherein the delay time is the preheating time of the infrared laser, for example, the delay time is 3 seconds.
In some embodiments, referring to fig. 5-8, the method for polishing a ceramic surface by coupling two laser beams is performed on a worktable with two-axis degrees of freedom, the infrared laser is controlled by a first galvanometer, the ultrafast laser is controlled by a second galvanometer, and the first galvanometer and the second galvanometer have three-axis degrees of freedom respectively;
the surface of the workpiece to be polished is preheated by using infrared laser, and after preheating is completed, the workpiece to be polished is subjected to laser cold polishing by using ultrafast laser according to a laser processing track, wherein the laser cold polishing comprises the following steps:
step S31, judging whether the workpiece to be polished is a three-dimensional curved surface;
step S32, if yes, controlling the workbench, the first galvanometer and the second galvanometer to carry out five-axis numerical control polishing on the workpiece to be polished;
and step S33, if not, controlling the first galvanometer and the second galvanometer to carry out three-axis numerical control polishing on the workpiece to be polished.
In this embodiment, the first galvanometer and the second galvanometer form a galvanometer system of a dual laser beam and have three degrees of freedom (X, Y, Z), respectively, the first galvanometer is used for controlling infrared laser, and the second galvanometer is used for controlling ultrafast laser, such as ultraviolet picosecond laser. The table has A, C two degrees of freedom of rotation, which may be (A, C).
After the laser processing track is obtained, whether a workpiece to be polished is a three-dimensional curved surface is judged, if the workpiece to be polished is the three-dimensional curved surface, the workbench, the first galvanometer and the second galvanometer are controlled to carry out five-axis numerical control polishing on the workpiece to be polished, namely two degrees of freedom (A and C) of the workbench and three degrees of freedom (X, Y and Z) of the first galvanometer and the second galvanometer. And if the three-dimensional curved surface is not the three-dimensional curved surface, controlling the first galvanometer and the second galvanometer to carry out three-axis numerical control polishing on the workpiece to be polished, namely controlling the three degrees of freedom (X, Y and Z) of the first galvanometer and the second galvanometer.
The invention has the main beneficial technical effects that:
firstly, the method adopts infrared laser and ultraviolet picosecond laser to carry out double-laser-beam coupling polishing processing on hard and brittle materials such as ceramics, so that the laser can realize the precise polishing of the surfaces of the hard and brittle materials such as ceramics in a short action and obtain high-quality surfaces. The industrial problem and the requirement of polishing the surface of the hard and brittle material part are solved;
secondly, the laser used for polishing adopts an ultraviolet picosecond laser, and as the pulse width of the ultraviolet picosecond laser is far shorter than the electron-phonon coupling time and the thermal diffusion time of the material, the processing range is strictly limited in a very small range, the heat affected zone is less, and the influence of the side effect (larger heat affected zone, thermal crack and the like) of heat which is easy to generate in the process of polishing the ceramic material by continuous wave laser and pulse laser can be effectively avoided;
thirdly, the invention carries out layered polishing on the ceramic surface by short pulses, and removes the microscopic rough wave crest structure of the surface layer by layer so as to obtain the surface with high quality. The method can accurately and effectively control the depth of surface polishing removal by setting the required layer thickness and the required layering number, thereby avoiding material waste or substrate material damage;
fourthly, the method is not limited to polishing of parts with 2D planes, can be combined with a five-axis motion system, is suitable for laser polishing of parts with complex free-form surface shapes, and can solve the problem of polishing of 3D curved surfaces of hard and brittle materials so as to further meet the actual requirements in industrial production.
The above is only a part or preferred embodiment of the present invention, and neither the text nor the drawings should limit the scope of the present invention, and all equivalent structural changes made by the present specification and the contents of the drawings or the related technical fields directly/indirectly using the present specification and the drawings are included in the scope of the present invention.
Claims (5)
1. A double laser beam coupling polishing method for a ceramic surface is characterized by comprising the following steps:
acquiring a three-dimensional model of a workpiece to be polished;
generating a laser processing track according to the three-dimensional model;
and preheating the surface of the workpiece to be polished by using infrared laser, and after preheating is finished, performing laser cold polishing on the workpiece to be polished by using ultrafast laser according to the laser processing track.
2. The ceramic surface dual laser beam coupling polishing method according to claim 1, wherein the generating a laser processing trajectory according to the three-dimensional model comprises:
identifying the highest layer of the surface to be polished of the three-dimensional model;
and layering the surface to be polished based on the highest layer, and generating corresponding laser processing tracks layer by layer.
3. The ceramic surface double laser beam coupling polishing method according to claim 2, wherein the layering the surface to be polished comprises:
obtaining the layering thickness and the layering number of the surface to be polished;
and according to the thickness and the layering number of the layering layers, layering from the highest layer of the surface to be polished to generate a layering polishing model which is downward layer by layer.
4. The ceramic surface double laser beam coupling polishing method according to claim 1, characterized by further comprising, before the step of preheating the surface of the workpiece to be polished using an infrared laser:
acquiring laser polishing parameters and delay time of a workpiece to be polished;
the laser polishing parameters comprise laser power, pulse repetition frequency, pulse width, laser scanning speed, spot diameter, spot overlapping degree, defocusing amount, beam incident angle and spot coupling mode, and the delay time is the duration of auxiliary preheating of the infrared laser on the workpiece to be polished.
5. The method for polishing the ceramic surface by coupling two laser beams according to claim 1, wherein the method for polishing the ceramic surface by coupling two laser beams is carried out on a workbench with two rotational degrees of freedom, the infrared laser is controlled by a first galvanometer, the ultrafast laser is controlled by a second galvanometer, and the first galvanometer and the second galvanometer have three rotational degrees of freedom respectively;
the method for carrying out laser cold polishing on the workpiece to be polished by using the ultra-fast laser according to the laser processing track comprises the following steps of preheating the surface of the workpiece to be polished by using the infrared laser, and after the preheating is finished:
judging whether the workpiece to be polished is a three-dimensional curved surface;
if so, controlling the workbench, the first galvanometer and the second galvanometer to carry out five-axis numerical control polishing on the workpiece to be polished;
and if not, controlling the first vibrating mirror and the second vibrating mirror to carry out three-axis numerical control polishing on the workpiece to be polished.
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| WO2024032054A1 (en) * | 2022-08-08 | 2024-02-15 | 深圳信息职业技术学院 | Multi-axis linkage laser superfinishing method and device |
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