WO2024032054A1

WO2024032054A1 - Multi-axis linkage laser superfinishing method and device

Info

Publication number: WO2024032054A1
Application number: PCT/CN2023/092797
Authority: WO
Inventors: 肖海兵; 周泳全; 刘明俊; 刘焯琛
Original assignee: 深圳信息职业技术学院
Priority date: 2022-08-08
Filing date: 2023-05-08
Publication date: 2024-02-15
Also published as: CN115609154A

Abstract

The present application is suitable for the technical field of laser precision processing, and provides a multi-axis linkage laser superfinishing method and device. The method comprises: determining a first laser trajectory and a second laser trajectory according to a processing demand of micro-nano texture processing or hard and brittle material polishing; and performing infrared and ultraviolet double-beam ultrafast laser layer-by-layer removal processing on a target curved surface by using first laser moving along the first laser trajectory and second laser moving along the second laser trajectory to obtain a polished hard and brittle material workpiece or a workpiece subjected to the micro-nano texture processing. According to the present application, the infrared and ultraviolet double-beam ultrafast laser layer-by-layer removal processing is compatible with laser precision polishing and micro-nano texture processing for a high-brittleness/hardness material; by means of infrared laser preheating and rough processing and ultraviolet laser cold processing, the problem in the prior art of insufficient processing precision is solved, and superfinishing is achieved; and in addition, the texture processing part solves a Poisson equation by means of parameterized curved surface mapping and gradient field coding, such that less-distortion and controllable texture processing can be implemented.

Description

Multi-axis linkage laser super-finishing method and equipment

This application claims priority to the Chinese patent application filed with the China Patent Office on August 8, 2022, with the application number 202210945988.3 and the invention title "Multi-axis linkage laser superfinishing method and equipment", the entire content of which is incorporated by reference. incorporated in this application.

Technical field

This application belongs to the field of laser processing technology, and particularly relates to multi-axis linkage laser ultra-finishing methods and equipment.

Background technique

Such as ceramics, optical lenses, sapphire, third-generation semiconductor SiC ceramic substrates, etc., which are widely used in 5G communications, aerospace, semiconductors, machinery manufacturing, smartphones and other defense and civilian fields; in 2020, global polishing equipment and services The market cake exceeds US$30 billion, and the polishing market for high-brittle hard materials alone reaches more than US$10 billion.

Cutting tools are the teeth of industry. With the advent of the 5G era, hard and brittle parts represented by graphite, ceramics, optical glass, sapphire, etc. are increasingly used, and processing requirements are constantly increasing. New materials, new products and new demands force cutting tools to be super-hardened and have complex profiles. The market is in great demand for passivation polishing technology and processes for gradient ceramic materials for milling tools.

The 3D curved surfaces of consumer electronics, household and industrial products can be precision processed with various three-dimensional textures to beautify the appearance of the product and give the product a "high-end" quality image. Texture can beautify products, prevent surface scratches, and has anti-slip effects. In 2020, my country's plastic mold texture processing market alone will reach 12 billion yuan.

5G technology has led to the arrival of a new information era. High-brittle hard material parts represented by artificial diamond, ceramics, optical glass, sapphire, etc. are increasingly used, and processing requirements are constantly increasing. For example, the surface polishing of such parts is in great demand. exuberant. Precision polishing of highly brittle hard material parts (polishing here can be understood as processing the workpiece surface into a specific texture structure) is essentially a super-finishing technology.

Existing planar texture mapping technology usually only targets image textures. Since the image is a two-dimensional plane without "height", once the parameterization is established, it can be interpolated on the surface according to the texture coordinates to synthesize the surface texture. However, for three-dimensional geometric textures, its "geometric details" are difficult to synthesize directly. The methods provided by the existing technology have problems such as difficulty in achieving seamless texture mapping of the entire surface, and/or large deformation (detailed texture distortion), as shown in Figure 5.

Therefore, how to provide an overall seamless and small deformation laser micro-nano texture processing method and device has become an urgent technical problem that needs to be solved in the industry.

technical problem

Embodiments of the present application provide multi-axis linkage laser ultra-finishing methods and equipment, which can solve the problems of difficult seamless texture mapping and large deformation of the entire curved surface.

Technical solutions

In the first aspect, embodiments of the present application provide a multi-axis linkage laser super-finishing method, including:

Precision processing of micro-nano three-dimensional textures and ultra-precision polishing methods for hard and brittle materials. If the processing requirements are determined to be micro-nano texture processing, then:

Obtain the geometric texture and the target surface; the target surface refers to the surface of the set area to be processed into the target texture on the workpiece; the target texture is obtained based on the geometric texture, and is a three-dimensional one-to-one corresponding to the geometric texture. Texture; the target texture includes micro-nano three-dimensional processing texture;

Extract texture information from the geometric texture, and perform gradient encoding to obtain texture gradient information;

Parameterize the surface information in the geometric texture and the target surface, and establish a surface mapping relationship from the geometric three-dimensional texture to the target surface;

The Poisson equation is solved according to the surface mapping relationship and the texture gradient information, and the Poisson reconstruction result is obtained as the processing target structure, and based on the processing target structure, the first laser trajectory of the first laser and the second laser trajectory of the second laser are determined. Two laser trajectories;

To determine the processing requirements for hard and brittle material workpiece polishing, then:

According to the material parameters of the workpiece and the microstructure of the workpiece on the target curved surface, a polished surface is obtained as the processing target structure;

According to the processing target structure, the first laser trajectory of the first laser and the second laser trajectory of the second laser are determined; the first laser is an infrared laser; the second laser is an ultraviolet laser; and the The power is greater than that of the second laser; the shortest pulse duration of the second laser is on the order of femtoseconds or picoseconds.

In a possible implementation of the first aspect, the step of parameterizing the surface information in the geometric texture and the target surface, and establishing a surface mapping relationship from the geometric texture to the target surface includes:

Extract the surface information in the geometric texture and parameterize it to obtain a basic surface parameter domain;

Globally parameterize the target surface to obtain the target surface parameter domain;

Determine the corresponding relationship between surface boundaries and vertices as boundary constraints according to the basic surface parameter domain and the target surface parameter domain;

Under the boundary constraints, determine the local transformation from any area in the basic surface parameter domain to the corresponding area in the target surface parameter domain; the local transformation includes rotation transformation and/or scale transformation; the basic surface A set of local transformations from at least a portion of the curved surface in the parameter domain to at least a portion of the curved surface in the target surface parameter domain constitutes the surface mapping relationship;

The step of solving the Poisson equation according to the surface mapping relationship and the texture gradient information to obtain the Poisson reconstruction result includes:

Under the constraints of the surface mapping relationship, the Poisson equation is used to integrate the texture gradient information, and the gradient information under the target surface is obtained as a Poisson reconstruction result.

In a possible implementation of the first aspect, the target surface is composed of a constrained area and an unconstrained area; the constrained area refers to a set rotation transformation and/or scale transformation of the local transformation that satisfies a preset distortion. parameter area;

Under the constraints of the curved surface mapping relationship and the distortion parameter corresponding to the constrained area, the Poisson equation is used to integrate the three-dimensional texture gradient information to obtain the gradient information under the target curved surface as a Poisson reconstruction result.

In a possible implementation of the first aspect, the three-dimensional texture is a microscopic micro-nano structure, and the aliasing rate mapped on the curved surface is <5%, and the geometric texture after shell extraction and mapping is generated, making it a laser beam processing trajectory. Planning objects; low deformation control, boundary texture processing, texture continuation, algorithm efficiency, algorithm robustness, rendering and interactive interface;

After the texture is mapped on the curved surface, multi-layer laser processing trajectories can be generated, and three-dimensional textures can be formed through subtractive manufacturing.

In a possible implementation of the first aspect, the ultra-precision polishing method for hard and brittle materials is a dual laser beam precision polishing method for highly brittle hard materials. The infrared pulse laser preheats the surface of the part to an optimized temperature below the melting point to improve the material quality. The ultraviolet laser multi-photon absorption rate. After first preheating the surface of highly brittle hard material parts to the optimized temperature, the material's multi-photon absorption rate is greatly improved. Most of the local wave peaks are removed by "cold processing", and only a few are "cold worked". "Hot working" gasification, therefore, various defects caused by "hot working" are greatly reduced, mainly cold working completes the polishing, thus achieving precision polishing of highly brittle hard materials.

In a possible implementation of the first aspect, the hard and brittle material refers to any one or any combination of photovoltaic silicon materials, semiconductor silicon materials, sapphire materials, magnetic materials, optical glass and ceramic materials; Polishing semiconductor SiC ceramic substrates, cold processing polishing, greatly reduces the influence of thermal effects, and can perform semi-finish polishing of SiC ceramic substrates, which can greatly save polishing time and greatly improve the overall polishing efficiency of SiC ceramic substrates.

In a possible implementation of the first aspect, it includes: dual laser beam processing, the first laser is an infrared laser; the second laser is an ultraviolet laser; the power of the first laser is greater than that of the second laser. Laser; the shortest pulse duration of the second laser is on the order of femtoseconds or picoseconds;

The first laser trajectory and the second laser trajectory are both multi-axis linkage trajectories; the multi-axis linkage refers to the workpiece, the first laser source that emits the first laser and the second laser that emits the second laser. Each of the second laser sources has three translational degrees of freedom and at least two rotational degrees of freedom.

In a possible implementation of the first aspect, the method includes: the first laser trajectory and the second laser trajectory of the dual laser are trajectories optimized under functional constraints; the functional constraints refer to: the third laser trajectory One laser is used to heat the current processing layer to a preset temperature and perform preliminary processing; the second laser emitted by the second laser source is used to perform secondary cold processing on the current processing layer at the preset temperature; the cold processing It refers to laser processing that uses high-energy photons to detach at least some of the molecules on the current processing layer from the main body of the material without generating additional heat;

The first laser moving along the first laser trajectory and the second laser moving along the second laser trajectory are used to perform red-ultraviolet dual-beam ultrafast laser layer-by-layer removal processing on the target curved surface to obtain polished hard and brittle surfaces. Material workpiece, or workpiece after micro-nano texture processing.

In a possible implementation of the first aspect, it includes: dual laser beam processing compound scanning, the first laser trajectory and the second laser trajectory are both multi-axis linkage trajectories; the multi-axis linkage refers to the The workpiece, the first laser source that emits the first laser, and the second laser source that emits the second laser all have three translational degrees of freedom and at least two rotational degrees of freedom;

The first laser trajectory and the second laser trajectory are both trajectories optimized under functional constraints; the functional constraints mean that the first laser is used to heat the current processing layer to a preset temperature and perform preliminary processing. ; The second laser emitted by the second laser source is used to perform secondary cold processing on the current processing layer at a preset temperature; the cold processing refers to using high-energy photons to remove at least a portion of the molecules on the current processing layer from Laser processing that removes the material from the main body and does not generate additional heat.

In a second aspect, embodiments of the present application provide a multi-axis linkage laser super-finishing equipment, which can be used to perform the multi-axis linkage laser super-finishing method described in any one of the above-mentioned first aspects, including:

A turntable, used to fix the workpiece and capable of driving the workpiece to rotate with the x, y or z axis as the rotation axis in a preset Cartesian coordinate system;

A moving guide rail mechanically connected to the turntable, used to drive the turntable and the workpiece fixed on the turntable to translate along the x, y or z axis direction under the preset Cartesian coordinate system;

A first laser source configured to emit a first laser to the workpiece at a preset first frequency, first pulse width and first power to perform processing and/or preheating;

A first moving mechanism mechanically connected to the first laser source, used to drive the first laser source to rotate with the x, y or z axis as the rotation axis in a preset Cartesian coordinate system, and/or, in Translate along the x, y or z axis in the preset Cartesian coordinate system;

a second laser source, configured to emit a second laser to the workpiece at a preset second frequency, second pulse width and second power to perform processing;

A second moving mechanism that is mechanically connected to the second laser source is used to drive the second laser source to rotate with the x, y or z axis as the rotation axis in a preset Cartesian coordinate system, and/or, in Translate along the x, y or z axis in the preset Cartesian coordinate system;

Driven by the first moving mechanism and the second moving mechanism, the first laser source and the second laser source can move or rotate independently of the turntable.

beneficial effects

The beneficial effects of this application are:

The ultra-fast laser layer-by-layer removal processing using red and ultraviolet dual laser beams is compatible with laser precision polishing and micro-nano texture processing of highly brittle hard materials. It overcomes the existing technology by means of infrared laser preheating and rough processing, and ultraviolet laser cold processing. In order to solve the problem of insufficient processing precision, ultra-finishing is achieved; in addition, the texture processing part solves the Poisson equation through parametric surface mapping and gradient field encoding, which can achieve low distortion and controllable texture processing.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the purpose of the present application. For some embodiments, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts.

Figure 1 is a schematic flow chart of a multi-axis linkage laser super-finishing method provided by an embodiment of the present application;

Figure 2 is a schematic structural diagram of a multi-axis linkage laser superfinishing equipment provided by an embodiment of the present application;

(a) in Figure 3 is a schematic structural diagram of the OEM surface provided by the embodiment of the present application;

(b) in Figure 3 is a schematic structural diagram of the layer-by-layer processing of the OEM surface provided by the embodiment of the present application;

(a) in Figure 4 is a schematic diagram of the three-dimensional texture processing effect provided by the embodiment of the present application;

(b) in Figure 4 is a schematic diagram of the three-dimensional texture processing scale provided by the embodiment of the present application;

(c) in Figure 4 is a schematic diagram of the details of three-dimensional texture processing provided by the embodiment of the present application;

Figure 5 is a schematic diagram of the texture mapping distortion problem in existing methods;

Figure 6 is a schematic flowchart of a three-dimensional texture mapping method provided by an embodiment of the present application;

Figure 7 is a schematic diagram of using a method according to an embodiment of the present application to perform a texture mapping task;

Figure 8 is a schematic diagram of layered processing provided by the embodiment of the present application.

Reference signs:

The first robot 2011;

The first beam expander 2012;

First focusing mirror 2013;

Second Robot 2021;

second beam expander 2022;

second focusing lens 2023;

Rotary table 203;

Sealed cavity 204.

Embodiments of the invention

In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures and technologies are provided to provide a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

It will be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integers, steps, operations, elements and/or components but does not exclude one or more other The presence or addition of features, integers, steps, operations, elements, components and/or collections thereof.

It will also be understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

As used in this specification and the appended claims, the term "if" may be interpreted as "when" or "once" or "in response to determining" or "in response to detecting" depending on the context. ". Similarly, the phrase "if determined" or "if [the described condition or event] is detected" may be interpreted, depending on the context, to mean "once determined" or "in response to a determination" or "once the [described condition or event] is detected ]" or "in response to detection of [the described condition or event]".

In addition, in the description of this application and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

Reference in this specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Therefore, the phrases "in one embodiment", "in some embodiments", "in other embodiments", "in other embodiments", etc. appearing in different places in this specification are not necessarily References are made to the same embodiment, but rather to "one or more but not all embodiments" unless specifically stated otherwise. The terms “including,” “includes,” “having,” and variations thereof all mean “including but not limited to,” unless otherwise specifically emphasized.

The embodiment of the present application provides a multi-axis linkage laser ultra-finishing method, as shown in Figure 1, including: micro-nano three-dimensional texture precision processing and ultra-precision polishing method for hard and brittle materials;

Step 1022, determine that the processing requirement is micro-nano texture processing, then:

Step 1024, extract texture information from the geometric texture, and perform gradient encoding to obtain texture gradient information;

Step 1026, parameterize the surface information in the geometric texture and the target surface, and establish a surface mapping relationship from the geometric three-dimensional texture to the target surface;

Step 1028: Solve the Poisson equation according to the surface mapping relationship and the texture gradient information, obtain the Poisson reconstruction result as the processing target structure, and determine the first laser trajectory and the second laser trajectory of the first laser based on the processing target structure. the second laser trajectory of the laser;

Step 1042, determine the processing requirement for hard and brittle material workpiece polishing, then:

Step 1044: Determine the first laser trajectory of the first laser and the second laser trajectory of the second laser according to the processing target structure; the first laser is an infrared laser; the second laser is an ultraviolet laser; The power of one laser is greater than that of the second laser; the shortest pulse duration of the second laser is on the order of femtoseconds or picoseconds.

Step 106, multi-axis linkage laser super-finishing.

In an optional embodiment, the scale definition of micro-nano is defined based on micro-nano manufacturing technology. Micro-nano manufacturing technology refers to parts with dimensions of millimeters, microns, and nanometers, and components composed of these parts. Design, processing, assembly, integration and application technology of components or systems.

The essence of polishing is to smooth the microscopic topography of the surface of the part and reduce the surface roughness to a certain level. Observed from the 3D microscopic topography, the surface of the parts is composed of "undulating" wave peaks and wave troughs. The current mainstream automated polishing process uses micro-subtractive manufacturing technology to reduce surface roughness by removing wave peaks and even wave troughs. Commonly used polishing processes include magnetic polishing, mechanical polishing, ultrasonic polishing, wheel polishing, electrolytic polishing, fluid polishing and chemical polishing.

The above-mentioned common polishing processes all have certain common or specific defects when processing highly brittle hard material parts. A common problem is the pollution of the processing environment. Because micro-material reduction methods such as mechanical movement of abrasive grains, chemical or electrolytic corrosion, etc. remove the wave crests of microstructure, a large amount of harmful residual powder or chemical residual liquid will inevitably be produced, making the polishing sites of many micro and small enterprises unsightly. The above-mentioned common polishing processes also have specific flaws related to processing efficiency, polishing consistency, and polished workpiece shape limitations.

As an example and not a limitation, this embodiment can be applied to the following scenarios:

1. Suitable for automatic generation of grinding and polishing workstations and automated production lines in water hardware, medical, sports equipment, automobile and other industries;

2. Automatic grinding and polishing scenarios, and can be combined with robot vision and other applications for further applications;

3. Non-standard design can be carried out based on customer product needs;

Specifically, taking robot polishing as an example, this embodiment:

1. One-stop automated production line from coarse grinding to fine grinding and polishing;

2. Automatic grinding can control the grinding weight, thickness and appearance shape;

3. The programming path can automatically generate grinding paths offline;

4. It can be used with precise positioning sensor system and robotic arm to promote in the market.

It is worth noting that in this embodiment, the geometric texture may be a three-dimensional geometric texture or a two-dimensional geometric texture.

For three-dimensional geometric textures, the surface information and gradient information in the geometric texture can be directly extracted.

For two-dimensional geometric textures, it is also necessary to construct a gradient field based on the non-surface information of the geometric texture (such as color/depth data, etc.), and then extract the texture gradient information.

The beneficial effects of this embodiment are:

According to the above embodiment, in this embodiment:

The step of parameterizing the surface information in the geometric texture and the target surface, and establishing a surface mapping relationship from the geometric texture to the target surface includes:

As an example and not a limitation, the curved surface boundaries and vertices may refer to the entire boundaries and vertices of the curved surface corresponding to the target curved surface/geometric texture, or may be the boundaries and vertices of any region.

For the latter, the partitions of the target surface and the surface corresponding to the geometric texture should be in one-to-one correspondence. Naturally, the number of partitions of the target surface and the surface corresponding to the geometric texture is also the same.

Consider the i-th partition of the target surface, that is, the i-th area, and the j-th partition of the surface corresponding to the geometric texture, that is, the j-th area. The one-to-one correspondence between the two is based on the constraints of its boundaries and vertices. (i.e., boundary constraints). Under the boundary constraints, the local transformation from the i-th partition of the target surface to the j-th partition of the surface corresponding to the geometric texture is strictly corresponding. The error of the Poisson equation at the boundary is Zero, the adjacent continuous and one-to-one corresponding target surface partitions and the surface partitions corresponding to the geometric texture overlap because their boundaries and vertices overlap, so the geometry of these local transformations is naturally continuous and smooth, which can effectively ensure the Poisson reconstruction results. Seamlessness.

This embodiment maps the designed three-dimensional geometric texture to the surface of the target three-dimensional model to reconstruct the texture details as faithfully as possible, and extracts the mapped geometric texture on the target model to make it a plan for the laser beam processing trajectory. object. To this end, this project will focus on overcoming the defects such as large deformation and distortion of the mapped texture shown in Figure 5, and propose a low-deformation, seamless three-dimensional geometric texture mapping technology based on global parameterization: decompose the three-dimensional geometric texture into basic For surface and texture details, the geometric gradient field is used to encode the three-dimensional texture details, and the corresponding relationship between the target surface and the basic surface is established based on the global parameterization method. The rotation field and scale field are reconstructed through the normal information and geometric deformation error of the two. Finally, The geometric texture is reconstructed on the target surface through Poisson's equation, and the texture aliasing rate is controlled within 5% when the Gaussian curvature is low. The technical method of the texture mapping process proposed in this embodiment is shown in Figure 6.

Through the method of this embodiment, as shown in Figure 7, the three-dimensional texture designed on the plane is mapped on the target curved surface model shown, and the three-dimensional texture after mapping on the target curved surface without distortion can be obtained.

The beneficial effects of this embodiment are:

By determining local transformations for each region under boundary constraints and merging the set of local transformations into surface mapping relationships, the computational complexity can be reduced and efficiency improved while ensuring overall seamlessness.

By integrating the texture gradient information using the Poisson equation under the constraints of the surface mapping relationship, a Poisson reconstruction result with zero error at the boundary and vertices can be obtained. The Poisson reconstruction result does not have false bounding boxes, which can make The target texture quality of the workpiece surface obtained by laser micro-nano texturing based on Poisson reconstruction results is higher.

According to any of the above embodiments, in this embodiment:

The target surface is composed of a constrained area and an unconstrained area; the constrained area refers to an area where the set rotation transformation and/or scale transformation of the local transformation satisfy the preset distortion parameters;

In an optional implementation, the constraints on the distortion parameters may also be in the parameterization stage, that is, the geometric texture and the surface information in the target surface are parameterized, and the geometric texture is established to The surface mapping relationship of the target surface is realized in the step of using different parameterized models for the constrained area and the non-constrained area in the parameterization process, so that the mapping process of the parameter domain naturally satisfies the distortion parameter restrictions of the constrained area, and similarly It is also a feasible solution.

Texture mapping technology is an important research direction in computer graphics and is widely used in the fields of computer graphics and image processing. However, it is rarely used in industrial manufacturing. Different from the generalized texture mapping technology that emphasizes color and grayscale rendering characteristics, the texture mapping technology for five-axis CNC laser processing focuses on accurately "sticking" the shape of the plane texture according to the specified size ratio, angle and orientation. "At the specified position on the three-dimensional surface of the part to be processed. To achieve this goal, achieving parametric expansion of the three-dimensional surface of the processed part is the key to texture mapping technology. This embodiment is based on the research on the length-preserving parameterization algorithm in the texture mapping parameterization process. It has the following characteristics and beneficial effects according to the specific application requirements of laser processing:

1) The parametric method should be able to flexibly adjust the position, orientation, and size of the pattern on the surface according to needs, rather than completely mapping with minimal distortion;

2) The parameterized distortion distribution takes into account the specific content of the texture pattern and minimizes distortion at important locations instead of completely uniformly distributing distortion;

3). The parameterized results need to be further transformed into the geometric model required for laser processing, not just in the form of expressions such as mapping functions.

This embodiment explores a parametric solution numerical method for texture mapping of three-dimensional surfaces for five-axis CNC laser processing. It can constrain and control the position, size, and orientation of texture mapping, and reduce the loss of three-dimensional textures in the effective laser processing area. degree of deformation. This texture mapping technology enables laser processing equipment based on a five-axis CNC laser processing system to complete the mold cavity texture processing function. The proposed numerical method of vector surface mapping fully considers the characteristics of vector graphics and proposes an adaptive vector discretization numerical method to meet the requirements of laser processing in terms of accuracy and display speed.

The key to clearly and continuously etching the specified texture on the three-dimensional surface of the mold through a three-dimensional galvanometer laser is to establish a three-dimensional texture mathematical vector model of the three-dimensional surface of the mold. The establishment process of the mathematical model is as follows: (1) First design the two-dimensional plane texture (Bitmap or vector format); (2) Determine the three-dimensional cavity model of the mold to be etched; (3) Map the two-dimensional plane texture to the three-dimensional cavity surface of the mold through a specific algorithm; (4) Remove the original model , what remains is the corresponding three-dimensional texture mathematical vector model for laser processing. The system processing software of the three-dimensional galvanometer laser can read the three-dimensional texture vector and convert it into the coordinates of the galvanometer scanning path for three-dimensional processing of the texture.

Figure 4 is the actual effect of laser processing texture. The figure shows that Area A is close to a plane, and the hexagonal processing shape is naturally very accurate, while Area B is an area with very large Gaussian curvature. The distortion deformation caused by texture mapping and processing is relatively large, but through comparison of scanned data, the distortion can be obtained Inspection data of deformation degree. The actual aliasing rate of Area B in Figure 4 is only 2.3%.

One of the cores of this embodiment lies in the parameterized low-deformation three-dimensional texture mapping method. This embodiment is based on a globally parameterized low-deformation, seamless three-dimensional geometric texture mapping method to achieve control and optimization of the texture mapping position and size based on the characteristics of the three-dimensional surface model. The aliasing rate of the texture after Gaussian surface mapping can be controlled within 5 %the following.

The beneficial effects of this embodiment are:

By introducing the constrained region and the non-constrained region, the integration process of the Poisson equation is no longer strictly uniformly distorted, but provides more stringent parameter requirements for the key region of concern, that is, the constrained region, and averages it in other non-constrained regions. The texture distortion caused by the surface shape results in a more customized Poisson reconstruction result. Based on the Poisson reconstruction result, additional constraints can be implemented on key areas of the workpiece surface, such as areas with large Gaussian curvature, to obtain quality Higher target texture.

According to any of the above embodiments, in this embodiment:

The three-dimensional texture is a microscopic micro-nano structure. The aliasing rate mapped on the curved surface is <5%, and the geometric texture after shell extraction and mapping is generated, making it a planning object for the laser beam processing trajectory; low deformation control, boundary texture processing, Texture continuation, algorithm efficiency, algorithm robustness, rendering and interactive interface;

In this embodiment, the three-dimensional texture can be a macroscopic structure or a microscopic micro-nano structure. The aliasing rate mapped on the curved surface is <5%, and the geometric texture after shell extraction and mapping is generated, making it a laser beam processing The trajectory planning object.

The execution of this embodiment can be based on the program software corresponding to the method. After mapping using the software, the three-dimensional texture can be processed according to the planned object, and redundant materials can be removed through layer-by-layer processing trajectories while retaining the structure of the three-dimensional texture. The three-dimensional texture processing method is to use software to layer the texture, and the generated DXF file is the scanning path for laser processing. Through laser scanning layer by layer, laser texture subtraction processing is achieved.

The beneficial effects of this embodiment are:

As shown in Figure 8, through layered processing, the target texture can be processed more precisely and a better quality target texture can be obtained.

According to any of the above embodiments, in this embodiment:

The ultra-precision polishing method for hard and brittle materials is a dual-laser beam precision polishing method for high-brittle hard materials. Infrared pulse laser preheats the surface of the part to an optimized temperature below the melting point to increase the ultraviolet laser multi-photon absorption rate of the material. First, the high-brittle hard material is polished. After the surface of the material part is preheated to the optimized temperature, the material's absorption rate of multi-photons is greatly increased. Most of the local wave peaks are removed by "cold processing", and only a few are vaporized by "hot processing". Therefore, "hot processing" produces Various defects are greatly reduced, mainly due to the completion of cold working and polishing, thus achieving precision polishing of highly brittle hard materials.

Specifically, dual laser beam processing, the first laser is an infrared laser; the second laser is an ultraviolet laser; the power of the first laser is greater than the second laser; the shortest pulse duration of the second laser It is femtosecond level or picosecond level;

The first laser trajectory and the second laser trajectory of the dual laser are trajectories optimized under functional constraints; the functional constraints refer to: the first laser is used to heat the current processing layer to a preset temperature and execute Preliminary processing; the second laser emitted by the second laser source is used to perform secondary cold processing on the current processing layer at a preset temperature; the cold processing refers to using high-energy photons to remove at least a portion of the current processing layer Laser processing in which molecules are detached from the main body of the material and does not generate additional heat;

Dual laser beam processing compound scanning, the first laser trajectory and the second laser trajectory are both multi-axis linkage trajectories; the multi-axis linkage refers to the workpiece, the first laser source that emits the first laser, and The second laser sources emitting the second laser light each have three translational degrees of freedom and at least two rotational degrees of freedom;

Precision polishing of highly brittle hard materials, passivation polishing of ceramic-coated tools, and micro-nano texture (including micro-nano texture) processing of mold cavities and product surfaces are all ultra-finishing and are the current bottleneck of laser precision processing. . To overcome this bottleneck, it is necessary to significantly increase the proportion of "cold processing" in "hot" and "cold" mixed mode processing.

The infrared pulse ultraviolet picosecond dual laser beam ultra-finishing equipment of this embodiment effectively overcomes this ultra-finishing bottleneck. Through the preheating of infrared pulses, the absorption rate of multi-photon energy is increased, and the proportion of "cold processing" is greatly increased;

The infrared pulse laser scans in front to preheat the material, and the ultraviolet picosecond laser scans immediately afterwards for cold processing, which can maximize the proportion of "cold processing" and reduce thermal effect defects. By optimizing the scanning paths of the infrared pulse laser and the ultraviolet picosecond laser, the purpose of optimizing the coupling of the pulse laser and the ultraviolet picosecond laser is achieved, that is, the material to be processed is preheated to the optimal temperature, and the ultraviolet picosecond laser multi-photon is just right. is absorbed in the optimized temperature zone. In this way, the absorption rate of multi-photon energy will be greatly improved, and the purpose of ultra-finishing can be achieved.

When applying the method of this embodiment, a dual-laser beam ultra-finishing system consisting of two sets of three-dimensional galvanometers and a two-axis CNC rotary table can be used, as shown in Figure 2, using infrared pulse laser (50-300W) and ultra-fast ultraviolet Picosecond laser (50W) dual laser beams perform processing. Taking the texture processing of a complex mold cavity part as an example, infrared pulse laser and ultraviolet picosecond laser enter the three-dimensional galvanometer of their respective front focusing systems. The Z-axis moving lens and XY-axis rotating lens of the galvanometer can control the movement of the focused laser spot on the three-dimensional cavity surface of the mold. The rotation of the two-axis (A, C) CNC rotary table can expose the laser processing blind area of the mold cavity to the processing range of the three-dimensional galvanometer, and the galvanometer can process the blind area. If processing heterogeneous curved surfaces, five-axis linkage is required. The galvanometer only outputs a spot similar to the diameter of the machining tool. The five-axis CNC system controls the linkage of the mechanical axis XYZ and the AC turntable AC with a total of five axes, so that the laser spot can be processed on the heterogeneous surface. Precision machining of any area of the curved surface.

Furthermore, for other optional examples of the processing system, please refer to the relevant descriptions of subsequent equipment embodiments.

The ideal "cold polishing" of ultraviolet picosecond laser is to "peak" through cold processing to transform its microscopic morphology into the target shape to achieve the purpose of local finishing. Traditional mechanical polishing removes local peaks (removed layer by layer). The method is as shown in Figure 3, but the focal depth after focusing of the ultraviolet picosecond laser is between 0.5-1.0mm, and the height of some wave peaks is below 0.1mm (in fact, there are few roughnesses greater than 0.2mm. Large ceramic parts need to be polished) Therefore, if the ultraviolet picosecond laser can perform 100% "cold polishing", it will be done overnight and local wave peaks will be removed at one time.

However, the single photon energy of ultraviolet laser does not completely match the chemical bond energy of highly brittle hard materials. It can only rely on limited multi-photons to perform low-level "cold polishing". Therefore, only a few parts of the local wave peaks are cut off and formed. The highly brittle hard material powder is removed, and most of the wave peaks are still retained. Through the accompanying "thermal processing", they are quickly melted by the laser energy and finally "vaporized", thus also producing various defects of "thermal processing".

However, in this embodiment, after the surface of the highly brittle hard material part is first preheated to the optimized temperature using an infrared pulse laser, the multi-photon absorption rate of the material is greatly increased. Therefore, most of the local wave peaks are removed by "cold processing", and only a few are removed. It is vaporized by "hot processing". Therefore, various defects caused by "hot processing" are greatly reduced, achieving precision polishing of highly brittle hard materials.

Furthermore, combined with the solution of optimizing the scanning path of the dual laser beams mentioned in the above embodiment, the "cold working" polishing proportion can be further improved. Different materials require different scanning paths to ensure the optimization of preheating temperature.

In other words, as long as the 3D model of the micro-nano texture is obtained (i.e., the Poisson reconstruction result or the 3D structure of the polished surface), the micro-nano texture can be realized through the method of this embodiment (infrared pulse laser preheating, ultraviolet picosecond laser cold processing). Ultra-finishing of nano textures (including micro-nano textures).

This embodiment uses innovative infrared pulse and ultraviolet picosecond dual laser processing technologies to fully maximize laser "cold processing", enabling precision polishing of the above-mentioned highly brittle hard materials, passivation polishing of ceramic tools, and micro-nano texture processing of molds and products.

Infrared pulse + ultraviolet picosecond laser beam precision processing technology, dual laser beam composite scanning path technology and parameterized low-deformation three-dimensional texture mapping method. The infrared pulse and ultraviolet picosecond dual laser superfinishing equipment of this embodiment can not only perform precision polishing of highly brittle hard materials, but also process the micro-nano texture of mold cavities and products. The principle is to use infrared pulse laser Preheat the material to be processed so that it can fully absorb the multi-photons generated by the ultraviolet laser. Then, the ultraviolet laser multi-photon is used in the ultra-narrow pulse width time domain to perform micro-nano processing through cold processing to achieve precision polishing or micro-nano texture. Purpose of processing.

One of the cores of the dual laser source solution is to increase the material's absorption rate of ultraviolet laser multi-photons by optimizing the preheating temperature of the material to be processed, thereby increasing the proportion of laser "cold processing".

On this basis, combined with the dual laser beam composite scanning path mentioned in the above embodiment, by optimizing the scanning paths of the infrared pulse laser and the ultraviolet picosecond laser, the purpose of optimizing the coupling of the pulse laser and the ultraviolet picosecond laser is achieved, that is, both The material to be processed is preheated to the optimal temperature, and the ultraviolet picosecond laser multi-photons are absorbed in the optimized temperature region just right.

Specifically, the hard and brittle material refers to any one or any combination of photovoltaic silicon materials, semiconductor silicon materials, sapphire materials, magnetic materials, optical glass and ceramic materials; polishing the semiconductor SiC ceramic substrate, cold processing polishing, It is significantly less affected by thermal effects and can perform semi-finish polishing of SiC ceramic substrates, which can greatly save polishing time and greatly improve the overall polishing efficiency of SiC ceramic substrates.

In an optional implementation of this embodiment, the first laser emitted by the first laser source has higher power and wider pulses, which on the one hand is beneficial to removing large and unnecessary bulges on the material surface. , on the other hand, it can adjust the temperature of the material surface by controlling the pulse width, power and irradiation time to raise the temperature to a set temperature that is conducive to the "cold processing" of the second laser emitted by the second laser source. At this temperature, the absorption efficiency of the material on the workpiece surface for the second laser is more satisfactory.

Considering that the heating process requires high input energy, the first laser source needs to provide higher power and wider pulses. On this basis, the first laser cannot process the workpiece surface to the expected degree of precision. Therefore, the processing of the first laser is defined as "preliminary processing".

In a preferred embodiment, the first laser source is an infrared laser source; the second laser source is an ultraviolet laser source; the power of the first laser source is greater than that of the second laser source; the second laser source The shortest pulse duration of the laser source is on the order of femtoseconds or picoseconds.

The beneficial effects of this embodiment are:

Using the first laser source and the second laser source to respectively perform temperature control and processing control on the workpiece surface, the target texture can be accurately processed at a finer granularity and a better quality target texture can be obtained. At the same time, using infrared laser sources to achieve better temperature control effects and using ultraviolet laser sources to achieve more precise processing control can achieve better quality target textures.

It should be understood that the sequence number of each step in the above embodiment does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application.

The embodiment of the present application also provides a multi-axis linkage laser super-finishing equipment, which can be used to perform the above-mentioned multi-axis linkage laser super-finishing method, as shown in Figure 2, including:

Figure 2 shows a feasible multi-axis linkage laser ultra-finishing equipment, including:

The first manipulator 2011 constituting the first moving mechanism;

The first laser generator (not shown in the figure), the first beam expander 2012 and the first focusing mirror 2013 that constitute the first laser source;

The second manipulator 2021 constituting the second moving mechanism;

A second laser generator (not shown in the figure), a second beam expander 2022 and a second focusing mirror 2023 that constitute the second laser source;

The preferred embodiment of the turntable, sealed cavity 204; and,

The preferred implementation of the mobile guide rail is a rotating worktable 203.

In a preferred embodiment, the device further includes a robotic arm, which is used for:

Move the workpiece from the loading area to the turntable and fix it; or,

Adjust the fixed posture of the workpiece fixed on the turntable; or,

The workpiece fixed on the turntable is moved to the unloading area.

The following will give a relatively comprehensive description of the innovation points of each embodiment of the present application, specifically:

(1) Laser processing equipment that combines infrared laser + ultraviolet picosecond dual laser beam polishing system will be successfully industrialized. It can not only realize laser precision polishing of highly brittle hard materials, but also can be used in the fields of mold texture and micro-nano texture processing. Show off your skills.

(2) Alternate dual laser beams are used for polishing processing. The infrared pulse laser plays the role of preheating and rough processing (only for conventional texture processing); the ultraviolet picosecond laser plays the role of maintaining temperature and playing the main "cold processing" role. The key to achieving ultra-finishing.

(3) A new method of low deformation and seamless three-dimensional geometric texture mapping based on global parameterization to achieve control and optimization of texture mapping position and size based on the characteristics of the three-dimensional surface model to meet the processing requirements of the mold cavity and product three-dimensional texture.

The advantages of each of the above embodiments are mainly reflected in:

(1) The laser processing equipment based on the methods of the above embodiments combined with the infrared pulse laser + ultraviolet picosecond dual laser beam polishing system can improve the polishing accuracy of highly brittle hard material parts to the level of Ra<0.15μm, reaching a sub-mirror surface. Close to the mirror surface, achieving a breakthrough in laser polishing accuracy of highly brittle hard materials, which can effectively meet the requirements of 5G base station parts, ceramic coating tools, artificial diamond tools, drones, medical equipment (including scalpels and implantable equipment), aviation Requirements for precision polishing of highly brittle hard materials such as aerospace and aerospace.

(2) The laser processing equipment based on the methods of the above embodiments can not only achieve sub-mirror or even mirror polishing effects, but also achieve extremely high polishing efficiency.

(3) In addition to high precision and high efficiency, another advantage of the equipment using the methods of the above embodiments is that the laser processing equipment can have a highly competitive price due to the innovative technical route.

Combined with the above embodiments, the core solutions of this application include:

1. A multi-axis linkage laser super-finishing method, including:

It is determined that the processing requirement is micro-nano texture processing, then:

Obtain the geometric texture and the target surface; the target surface refers to the surface of the set area to be processed into the target texture on the workpiece; the target texture is obtained based on the geometric texture, and is a three-dimensional one-to-one corresponding to the geometric texture. Texture; the target texture includes polished texture or micro-nano processing texture;

Extract the gradient field of the texture information in the geometric texture, and perform gradient encoding to obtain the texture gradient information;

Parameterize the surface information in the geometric texture and the target surface, and establish a surface mapping relationship from the geometric texture to the target surface;

The Poisson equation is solved according to the surface mapping relationship and the texture gradient information, and the Poisson reconstruction result is obtained as the processing target structure, and based on the processing target structure, the first laser trajectory of the first laser and the second laser trajectory of the second laser are determined. 2 laser trajectories;

According to the processing target structure, the first laser trajectory of the first laser and the second laser trajectory of the second laser are determined; the first laser is an infrared laser; the second laser is an ultraviolet laser; and the The power is greater than that of the second laser; the shortest pulse duration of the second laser is on the order of femtoseconds or picoseconds;

The first laser trajectory and the second laser trajectory are both multi-axis linkage trajectories; the multi-axis linkage refers to the workpiece, the first laser source that emits the first laser and the second laser that emits the second laser. Each of the second laser sources has three translational degrees of freedom and at least two rotational degrees of freedom;

The first laser trajectory and the second laser trajectory are both trajectories optimized under functional constraints; the functional constraints mean that the first laser is used to heat the current processing layer to a preset temperature and perform preliminary processing. ; The second laser emitted by the second laser source is used to perform secondary cold processing on the current processing layer at a preset temperature; the cold processing refers to using high-energy photons to remove at least a portion of the molecules on the current processing layer from Laser processing that breaks away from the main body of the material and does not generate additional heat;

The multi-axis linkage laser super-finishing method also includes:

The first laser moving along the first laser trajectory and the second laser moving along the second laser trajectory are used to perform red-ultraviolet dual-beam ultrafast laser layer-by-layer removal processing on the target curved surface to obtain polished hard and brittle surfaces. Material workpiece, or workpiece after micro-nano texture processing;

The hard and brittle material refers to any one or any combination of photovoltaic silicon materials, semiconductor silicon materials, sapphire materials, magnetic materials, optical glass and ceramic materials.

2. The multi-axis linkage laser super-finishing method as described in 1, parameterizing the surface information in the geometric texture and the target surface, and establishing a surface mapping relationship from the geometric texture to the target surface. Steps include:

3. The multi-axis linkage laser ultra-finishing method as described in 2, the target surface is composed of a constrained area and a non-constrained area; the constrained area refers to the rotation transformation and/or scale transformation of the set local transformation that satisfies the predetermined The area where the distortion parameters are set;

Under the constraints of the curved surface mapping relationship and the distortion parameter corresponding to the constrained area, the Poisson equation is used to integrate the texture gradient information to obtain the gradient information under the target curved surface as a Poisson reconstruction result.

4. A laser micro-nano texture processing device based on texture mapping, including:

The texture module is used to determine the processing requirements for micro-nano texture processing, then:

The polishing module is used to determine the processing requirements for polishing hard and brittle material workpieces, then:

The first laser trajectory and the second laser trajectory are both multi-axis linkage trajectories; the multi-axis linkage refers to the workpiece, the first laser source that emits the first laser, and the second laser that emits the second laser. Each of the second laser sources has three translational degrees of freedom and at least two rotational degrees of freedom;

A processing module configured to perform red-ultraviolet dual-beam ultrafast laser layer-by-layer removal processing on the target curved surface using the first laser moving along the first laser trajectory and the second laser moving along the second laser trajectory to obtain Polished hard and brittle material workpieces, or workpieces processed with micro-nano textures;

5. A multi-axis linkage laser super-finishing equipment that can be used to perform the multi-axis linkage laser super-finishing method as described in any one of 1 to 3, including:

The turntable () is used to fix the workpiece and can drive the workpiece to rotate with the x, y or z axis as the rotation axis in the preset Cartesian coordinate system;

In the above embodiments, each embodiment is described with its own emphasis. For parts that are not detailed or documented in a certain embodiment, please refer to the relevant descriptions of other embodiments.

Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented with electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may implement the described functionality using different methods for each specific application, but such implementations should not be considered beyond the scope of this application.

The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or they may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

The above-described embodiments are only used to illustrate the technical solutions of the present application, but not to limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still implement the above-mentioned implementations. The technical solutions described in the examples are modified, or some of the technical features are equivalently replaced; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions in the embodiments of this application, and should be included in within the protection scope of this application.

Claims

A multi-axis linkage laser ultra-finishing method, which is characterized by including: micro-nano three-dimensional texture precision processing and hard and brittle material ultra-precision polishing method. If the processing requirement is determined to be micro-nano texture processing, then:

Obtain the geometric texture and the target surface; the target surface refers to the surface of the set area on the workpiece to be processed into the target texture; the target texture is obtained based on the geometric texture, and is a three-dimensional one-to-one corresponding to the geometric texture. Texture; the target texture includes micro-nano three-dimensional processing texture;

Extract texture information from the geometric texture, and perform gradient encoding to obtain texture gradient information;

Parameterize the surface information in the geometric texture and the target surface, and establish a surface mapping relationship from the geometric three-dimensional texture to the target surface;

The Poisson equation is solved according to the surface mapping relationship and the texture gradient information, and the Poisson reconstruction result is obtained as the processing target structure, and based on the processing target structure, the first laser trajectory of the first laser and the second laser trajectory of the second laser are determined. 2 laser trajectories;

To determine the processing requirements for hard and brittle material workpiece polishing, then:

According to the material parameters of the workpiece and the microstructure of the workpiece on the target curved surface, a polished surface is obtained as the processing target structure;

According to the processing target structure, the first laser trajectory of the first laser and the second laser trajectory of the second laser are determined; the first laser is an infrared laser; the second laser is an ultraviolet laser; and the The power is greater than that of the second laser; the shortest pulse duration of the second laser is on the order of femtoseconds or picoseconds.
The multi-axis linkage laser super-finishing method according to claim 1, characterized in that, the geometric texture and the surface information in the target curved surface are parameterized, and the geometric texture is established to the target curved surface. The steps for surface mapping include:

Extract the surface information in the geometric texture and parameterize it to obtain a basic surface parameter domain;

Globally parameterize the target surface to obtain the target surface parameter domain;

Determine the corresponding relationship between surface boundaries and vertices as boundary constraints according to the basic surface parameter domain and the target surface parameter domain;

Under the boundary constraints, determine the local transformation from any area in the basic surface parameter domain to the corresponding area in the target surface parameter domain; the local transformation includes rotation transformation and/or scale transformation; the basic surface A set of local transformations from at least a portion of the curved surface in the parameter domain to at least a portion of the curved surface in the target surface parameter domain constitutes the surface mapping relationship;

The step of solving the Poisson equation according to the surface mapping relationship and the texture gradient information to obtain the Poisson reconstruction result includes:

Under the constraints of the surface mapping relationship, the Poisson equation is used to integrate the texture gradient information, and the gradient information under the target surface is obtained as a Poisson reconstruction result.
The multi-axis linkage laser superfinishing method according to claim 2, wherein the target curved surface is composed of a constrained area and a non-constrained area; the constrained area refers to the rotation transformation and/or the set local transformation. The scale transformation satisfies the area of the preset distortion parameters;

The step of solving the Poisson equation according to the surface mapping relationship and the texture gradient information to obtain the Poisson reconstruction result includes:

Under the constraints of the curved surface mapping relationship and the distortion parameter corresponding to the constrained area, the Poisson equation is used to integrate the three-dimensional texture gradient information to obtain the gradient information under the target curved surface as a Poisson reconstruction result.
The multi-axis linkage laser ultra-finishing method according to claim 2, characterized in that the three-dimensional texture is a microscopic micro-nano structure, the aliasing rate mapped on the curved surface is <5%, and a geometric texture after shell extraction and mapping is generated, Make it a planning object for laser beam processing trajectory; low deformation control, boundary texture processing, texture continuation, algorithm efficiency, algorithm robustness, rendering and interactive interface;

After the texture is mapped on the curved surface, multi-layer laser processing trajectories can be generated, and three-dimensional textures can be formed through subtractive manufacturing.
The multi-axis linkage laser ultra-finishing method according to claim 1, characterized in that the ultra-precision polishing method for hard and brittle materials is a dual laser beam precision polishing method for highly brittle hard materials, and the infrared pulse laser preheats the surface of the part to the melting point The following optimization temperature improves the UV laser multi-photon absorption rate of the material. First, after the surface of the highly brittle hard material parts is preheated to the optimized temperature, the material's multi-photon absorption rate is greatly improved. Most of the local peaks are "cold processed" "Excision, only a few are vaporized by "hot processing", therefore, various defects caused by "hot processing" are greatly reduced, mainly cold processing completes the polishing, thus achieving precision polishing of highly brittle hard materials.
The multi-axis linkage laser superfinishing method according to claim 4, wherein the hard and brittle material refers to any one of photovoltaic silicon materials, semiconductor silicon materials, sapphire materials, magnetic materials, optical glass and ceramic materials. Or any combination of more; polishing semiconductor SiC ceramic substrates, cold processing polishing, greatly reduces the influence of thermal effects, can perform semi-finishing polishing of SiC ceramic substrates, can greatly save polishing time, and greatly improve the overall quality of SiC ceramic substrates Polishing efficiency.
A multi-axis linkage laser superfinishing method according to claim 1, characterized in that it includes: dual laser beam processing, the first laser is an infrared laser; the second laser is an ultraviolet laser; the first The power of the laser is greater than that of the second laser; the shortest pulse duration of the second laser is on the order of femtoseconds or picoseconds;

The first laser trajectory and the second laser trajectory are both multi-axis linkage trajectories; the multi-axis linkage refers to the workpiece, the first laser source that emits the first laser and the second laser that emits the second laser. Each of the second laser sources has three translational degrees of freedom and at least two rotational degrees of freedom.
A multi-axis linkage laser super-finishing method according to claim 7, characterized in that it includes: the first laser trajectory and the second laser trajectory of dual lasers are trajectories optimized under functional constraints; Functional constraints refer to: the first laser is used to heat the current processing layer to a preset temperature and perform preliminary processing; the second laser emitted by the second laser source is used to heat the current processing layer at a preset temperature. Perform secondary cold processing; the cold processing refers to laser processing that uses high-energy photons to detach at least some of the molecules on the current processing layer from the main body of the material without generating additional heat;

The first laser moving along the first laser trajectory and the second laser moving along the second laser trajectory are used to perform red-ultraviolet dual-beam ultrafast laser layer-by-layer removal processing on the target curved surface to obtain polished hard and brittle surfaces. Material workpiece, or workpiece after micro-nano texture processing.
A multi-axis linkage laser super-finishing method according to claim 8, characterized in that it includes: dual laser beam processing compound scanning, and the first laser trajectory and the second laser trajectory are both multi-axis linkage trajectories; The multi-axis linkage means that the workpiece, the first laser source that emits the first laser, and the second laser source that emits the second laser all have three translational degrees of freedom and at least two rotational degrees of freedom;

The first laser trajectory and the second laser trajectory are both trajectories optimized under functional constraints; the functional constraints mean that the first laser is used to heat the current processing layer to a preset temperature and perform preliminary processing. ; The second laser emitted by the second laser source is used to perform secondary cold processing on the current processing layer at a preset temperature; the cold processing refers to using high-energy photons to remove at least a portion of the molecules on the current processing layer from Laser processing that removes the material from the main body and does not generate additional heat.
A multi-axis linkage laser super-finishing equipment, which is characterized by including:

A turntable, used to fix the workpiece and capable of driving the workpiece to rotate with the x, y or z axis as the rotation axis in a preset Cartesian coordinate system;

A moving guide rail mechanically connected to the turntable, used to drive the turntable and the workpiece fixed on the turntable to translate along the x, y or z axis direction under the preset Cartesian coordinate system;

A first laser source configured to emit a first laser to the workpiece at a preset first frequency, first pulse width and first power to perform processing and/or preheating;

A first moving mechanism mechanically connected to the first laser source, used to drive the first laser source to rotate with the x, y or z axis as the rotation axis in a preset Cartesian coordinate system, and/or, in Translate along the x, y or z axis in the preset Cartesian coordinate system;

a second laser source, configured to emit a second laser to the workpiece at a preset second frequency, second pulse width and second power to perform processing;

A second moving mechanism that is mechanically connected to the second laser source is used to drive the second laser source to rotate with the x, y or z axis as the rotation axis in a preset Cartesian coordinate system, and/or, in Translate along the x, y or z axis in the preset Cartesian coordinate system;

Driven by the first moving mechanism and the second moving mechanism, the first laser source and the second laser source can move or rotate independently of the turntable.