CN109894747A - Femtosecond chevilled silk is used for the hyperfine processing unit (plant) in surface and method backwards to shock wave - Google Patents
Femtosecond chevilled silk is used for the hyperfine processing unit (plant) in surface and method backwards to shock wave Download PDFInfo
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Abstract
The present invention relates to a kind of femtosecond chevilled silks to be used for the hyperfine processing unit (plant) in surface and method backwards to shock wave, the device includes laser light-source device, scan control section, light beam focus portion, material processing department, scheme control unit, scan control section input terminal are connected with the output end of laser light-source device, and the feedback signal of reception scheme control unit carries out monitoring in real time and adjusts；Scheme control unit is connect with the one-dimensional electricity driving displacement platform of the driving circuit of laser light-source device, the space reflection optical element combination of scan control section, light beam focus portion respectively by computer.This method can be with the higher transparent material of machining damage threshold value, it is controlled by the precision to laser parameter, focal spot radius and scan path, the processing and processing that various surface micro-structures can be carried out to material can get several microns of machining accuracy under the premise of not needing other accurate devices.Requirement to laser power can be reduced simultaneously, save laser purchase and use cost.
Description
Technical field
The present invention relates to a kind of laser processing devices, especially a kind of to be used for the hyperfine processing unit (plant) in surface and method.
Background technique
Laser processing is one most processed extensively with a kind of commonly effect using high-order harmonics spectrum
Class application.Laser can achieve very high instantaneous power density, be concentrated laser energy in size in the micron-scale by focusing,
Just the cutting of realization multiple material, deposition, etching etc..In recent years, use the method for laser processing to material table in liquid
Face micro-structure carries out processing and has become a kind of emerging method.Laser after focusing, can be in a liquid with material effect
The substance functioned is ionized, generates steam and plasma, therefore form micro-bubble, shock wave and light in liquid
Phenomena such as silk, has accumulated the steam ambient of high temperature and pressure in micro-bubble, thus realize modification to material surface structure and
Processing.
Although there is also other drawbacks however, there is the advantage that can form local high temperature and high pressure environment in liquid.
Since laser beam will first transmit a distance in liquid, the material surface contacted with liquid is got to, liquid can be to sharp
The transmission of light makes a big impact, even pure water solution, will also result in the decaying of laser power, molten according to nonlinear dielectric
Liquid influences surface processing efficiency and machining accuracy then since the non-linear absorption of solution will cause the further decaying of laser.More
The serious is focusing in laser on the surface of the material neighbouring liquid, the hot-zone of thousands of degree will be generated in micro-meter scale, in the hot-zone
Water by rapid vaporization, generate the bubble of micron dimension.Scattering of these bubbles to laser beam causes laser to reach material table
The energy in face only has original 10%, which is also to process to be most difficult to solve the problems, such as in current solution.The generation of micron bubble
The quality and precision for largely effecting on processing increase the defect rate and rejection rate of product.Therefore, field of material processing is badly in need of one kind
It can be improved processing efficiency and machining accuracy, and the manufacturing process of the energy attenuation of laser transmission process be greatly reduced.This is also
The hot spot and difficult point of our times range field of laser processing.
Summary of the invention
The present invention propose a kind of femtosecond chevilled silk backwards to shock wave for the hyperfine processing unit (plant) in surface and method, the device and
Method makes laser light material, and the laser pulse forward position of subsequent high-peak power is ionized solution molecule by multiphoton -effect,
And the electronics after ionizing is formed plasma channel by the rear along acceleration of pulse in solution.The core diameter 50 formed by chevilled silk
In the plasma channel of microns, temperature reaches thousands of degree > 3000K.Therefore there are a biggish temperature with surrounding medium for chevilled silk
Gradient is spent, the solution expanded by heating near chevilled silk is caused, impact is formed to the lattice of surrounding, ultimately forms chevilled silk shock wave, benefit
The micro-structure processing of material surface may be implemented with the ultrasonic wave.Laser can be substantially reduced in solution compared to original method
The problems such as power attenuation caused by when transmission and scattering, refraction, reach higher machining accuracy and better processing effect.We
Method can be controlled with the higher transparent material of machining damage threshold value by the precision to laser parameter, focal spot radius and scan path
System, the processing and processing that various surface micro-structures can be carried out to material can obtain under the premise of not needing other accurate devices
Obtain several microns of machining accuracy.Requirement to laser power can be reduced simultaneously, save laser purchase and use cost.
The technical scheme of the present invention is realized as follows: a kind of femtosecond chevilled silk is used for the fining-off of surface superfinishing backwards to shock wave
Device, for realizing micro-nano structure processing in high damage threshold transparent material surface, comprising: laser light-source device, scan control
Portion, light beam focus portion, material processing department, scheme control unit, the scan control section input terminal and laser light-source device it is defeated
Outlet is connected, and the feedback signal of reception scheme control unit carries out monitoring in real time and adjusts；The light beam focus portion is defeated
Enter end to be connected with the output end in scanning galvanometer portion；The output end in the material processing department connection scanning galvanometer portion；
The laser light-source device: include the laser aid for generating laser beam；By driving circuit, laser group
At；The power input of laser connects driving circuit, output end of the output end as laser light-source device；The laser function of output
Rate is inputted the current control of laser by driving circuit；
The scan control section: including fibre optic isolater, optical fiber and space optical path converter, space-focusing optical element group
It closes, space reflection optical element combination, for realizing laser beam to the motion scan of material surface: the fibre optic isolater
Input terminal connect with laser light-source device by optical fiber；The output end and optical fiber and space optical path of the fibre optic isolater turn
Parallel operation is connected by optical fiber；The output end of the optical fiber and space optical path converter passes through with space-focusing optical element combination
Space connection；The input terminal and space-focusing optical element combination of the spatial emission optical element combination are connected by space
It connects, output port of the output end as scan control section；
The light beam focus portion: including space-focusing lens combination, one-dimensional electricity driving displacement platform, for gathering laser beam
Coke arrives material surface；The input terminal of space-focusing lens combination and the output port of scan control section are connected by space, output
The output port as light beam focus portion is held, one-dimensional electricity driving displacement platform is for the combination of fixed and displacement space condenser lens；
The material processing department: including in the fixed device of material, CCD camera, microscopie unit, solution, material and solution
Chevilled silk, the material is fixed on the dustpan-shaped exit of the fixed device of material and the output port of light beam focus portion, molten
Liquid is put into the container of the fixed device of material；The microscope connecting with a CCD camera dress is arranged in the top of the fixed device of material
It sets, for monitoring the variation of material surface micro-structure, realizes the processing and real time monitoring of material；
The scheme control unit passes through the computer space with the driving circuit of laser light-source device, scan control section respectively
Reflective optical devices combination, the one-dimensional electricity driving displacement platform connection of light beam focus portion, and laser light-source device is controlled, scan control
Portion, light beam focus portion, material processing department be in communication with each other and co-ordination.
Further, the type of laser used in the laser light-source device be optical fiber laser, solid state laser,
One of gas laser and semiconductor laser；The output wavelength of used laser be ultraviolet 200-400nm,
It can be seen that 400-700nm, infrared 700-10000nm.
Further, the material processed is optically transparent material, material is in the dustpan-shaped exit of the fixed device of material
Using leakage-proof structure, prevent solution from revealing；Material processing department is surrounded by the partition for stopping scattering laser, to protect operator
The personal safety of member.
Further, the peak power P of the laser outputLaserGreater than the power threshold P for forming chevilled silk in materialC, Pc=
3.77λ2/8πn0n2, wherein λ is laser output wavelength, n0For linear refractive index, n2For solution second nonlinear refractive index,
The laser output pulse width is 0-500 picoseconds.
Further, the scheme control unit is the control device for controlling laser light-source device and scanning galvanometer portion；It is described
Scheme control unit by after the depth information and location information for observing surface micro-structure, feed back to respectively laser light source dress
Set with scanning galvanometer portion, in order to timely error correction and adjustment light beam power and bit set.
Further, the solution is the pure water metal of light transmission and the nano-solution of metal oxide.
A kind of processing method that the hyperfine processing unit (plant) in surface is used for backwards to shock wave using femtosecond chevilled silk, firstly, material
The material processed needed for processing department is fixed, and make material rear surface and light beam focal plane in the same plane；By swashing
Radiant device generates required laser beam；Scan control section controls the focal spot radius size of laser beam, adjusts light beam
Direction, and receive the feedback from scheme control unit, in order to be scanned processing according to existing plan；Light beam focus portion will fly
Second laser beam focusing is processed on the surface of the material；Scheme control unit inputs the specific processing sweeping scheme of surface micro-structure,
Then laser light-source device is controlled respectively according to the scheme of input and scan control section is processed；It is micro- to monitor material surface simultaneously
Signal is fed back to laser light-source device and scan control section by the variation of structure, it is made according to circumstances to adjust corresponding light beam function
Rate and light-beam position.
Further, the high power laser light of the laser light-source device output focuses in the solution, when the peak of laser output
It is worth power PLaserGreater than the power threshold P for forming chevilled silk in solutionCWhen, the laser causes chevilled silk phenomenon, peak in the solution
The laser pulse forward position of value power is ionized solution molecule by multiphoton -effect, and rear edge of the electronics after ionizing by pulse
Accelerating to form a plasma channel in the solution, in 50 microns of core diameter of the plasma channel formed by chevilled silk, temperature reaches >
3000K, chevilled silk and surrounding medium lead to the solution expanded by heating near chevilled silk, are formed to the lattice of surrounding there are temperature gradient
Ultrasonic impact, the ultrasonic impact finally push water flow to form shock wave, realize that the micro-structure of material surface adds using the shock wave
Work, simultaneously as the final self-defocusing effect of plasma and the self-focusing effect of laser will realize dynamic equilibrium in chevilled silk,
Light intensity in chevilled silk is clamped at a constant intensity, which can promote chevilled silk backwards to shock wave, for the steady of processing
It is qualitative.
The beneficial effects of the present invention are:
1, laser beam can be directed through material and reach the material surface contacted with liquid, laser beam will not be made to contact
The a large amount of micro-bubbles generated into liquid, reducing bubble leads to beam divergence, refraction, improves needed for processing
Precision and quality.
2, laser beam can be directed through material and reach the material surface contacted with liquid, not need to make laser beam in liquid
The problem of being transmitted in body, thus greatly reducing possible energy reduction when laser beam transmits in a liquid, reduce sharp
The energy loss of light light beam, improves processing efficiency.
3, since chevilled silk intensity clamps down on effect, the energy-flux density of chevilled silk in a liquid is limited in 1cm length range
One specific value, to the dependence of displacement accuracy during laser displacement when this has been greatly reduced processing.Reduce displacement essence
Degree is so that process velocity greatly promotes, therefore can realize across scale processing.Using the processing method at 1 square metre for theoretically
Vitreous silica whole surface, processing 1 micron accuracy fine structure only need 5 minutes.
Detailed description of the invention
Fig. 1 is used for the hyperfine processing unit (plant) general principles block diagram in surface backwards to shock wave for femtosecond chevilled silk；
Fig. 2 is the structure chart that femtosecond chevilled silk is used for the hyperfine processing unit (plant) in surface backwards to shock wave；
Fig. 3 is the work block diagram that femtosecond chevilled silk is used for the hyperfine processing unit (plant) in surface backwards to shock wave；
Fig. 4 is material processing department structural schematic diagram；
Fig. 5 is the material surface structure chart before processing under microscope；
Fig. 6 is the material surface structure chart after processing under microscope.
Specific embodiment
The invention will be further described with embodiment with reference to the accompanying drawing.
As shown in Figure 1, a kind of femtosecond chevilled silk is used for the hyperfine processing unit (plant) in surface backwards to shock wave, including laser light source fills
Set 100, scan control section 200, light beam focus portion 300,500 5 parts of material processing department 400 and scheme control unit.Laser light
Source device 100 is for laser beam needed for providing process；Scanning galvanometer portion 200 is for big to the focal spot radius of laser
Small, transmission direction and scan path are controlled；Focal plane position and depth of focus of the light beam focus portion 300 for controlling light beam are big
It is small；Material processing department 400 is for fixing material and observation material surface processing situation；Scheme control unit 500 is for inputting processing
Then scheme controls light source generating unit according to scheme and scanning galvanometer portion starts to process.
As shown in Fig. 2, laser beam is generated from laser light-source device 100 first, it is then communicated to scanning galvanometer portion 200,
Scanning galvanometer portion 200 carries out adjustment appropriate by focal spot radius of the space-focusing optical element group to light beam first, then sharp
Material surface machining locus is adjusted with space reflection optical element group, laser beam is subsequently communicated to light beam focus portion 300, passes through
Material processing department 400 is transferred to after space-focusing to be processed.Wherein, laser light-source device 100, scanning galvanometer portion 200, light
Beam focus portion 300 and material processing department 400 are separately connected scheme control unit 500.
As shown in figure 3, laser light-source device 100: including the laser aid for generating laser beam；By driving circuit
101, laser 102 forms；The power input of laser 102 connects driving circuit 101, and output end is as laser light-source device
100 output end；The laser power of output is inputted the current control of laser 102 by driving circuit 101.Laser light-source device
The type of laser used in 100 is in optical fiber laser, solid state laser, gas laser and semiconductor laser
One kind；The output wavelength of used laser is ultraviolet 200-400nm, visible 400-700nm, infrared 700-10000nm
The peak power P that laser 102 exportsLaserGreater than the power threshold P for forming chevilled silk in materialC, Pc=3.77 λ2/8πn0n2,
Middle λ is laser output wavelength, n0For 404 linear refractive index of solution, n2For 404 second nonlinear refractive index of solution, the laser
102 output pulse width of device is 0-500 picoseconds.
Scan control section 200: including fibre optic isolater 201, optical fiber and space optical path converter 202, space-focusing optics
Element combines 203, space reflection optical element combination 204, for realizing laser beam to the motion scan of material surface: described
The input terminal of fibre optic isolater 201 connect with laser light-source device 100 by optical fiber；The fibre optic isolater 201 it is defeated
Outlet is connect with optical fiber with space optical path converter 202 by optical fiber；The output end of the optical fiber and space optical path converter
It is connect with space-focusing optical element combination 203 by space；The input terminal of the spatial emission optical element combination 204 with
Space-focusing optical element combination 203 is connected by space, output port of the output end as scan control section 200.
Light beam focus portion 300: it including space-focusing lens combination 301, one-dimensional electricity driving displacement platform 302, is used for laser
Light beam focuses on material surface；The input terminal of space-focusing lens combination 301 and the output port of scan control section 200 pass through sky
Between connect, output port of the output end as light beam focus portion 300, one-dimensional electricity driving displacement platform 302 is empty for fixed and displacement
Between condenser lens combination 301.
Scheme control unit 500 by computer respectively with the driving circuit 101 of laser light-source device 100, scan control section
200 space reflection optical element combination 204, the one-dimensional electricity driving displacement platform 302 of light beam focus portion 300 connect, and control and swash
Radiant device 100, scan control section 200, light beam focus portion 300, material processing department 400 be in communication with each other and co-ordination.
Scheme control unit 500 is the control device for controlling laser light-source device 100 and scanning galvanometer portion 200；The scheme control unit
500 by after the depth information and location information for observing surface micro-structure, feeding back to laser light-source device 100 respectively and sweeping
Galvanometer portion 200 is retouched, in order to which the power and bit of timely error correction and adjustment light beam is set.
As shown in figures 3 and 4, material processing department 400 includes material fixed device 401, CCD camera 402, microscopie unit
403, the chevilled silk 406 in solution 404, material 405 and solution.Material 405 to be processed is fixed on the fixed device 401 of material and light
The output port of beam focus portion 300, solution 403 are put into the container of the fixed device 401 of material；Material fixes the upper of device 401
Setting one microscopie unit 403 connecting with CCD camera 402 in side's realizes material for monitoring the variation of material surface micro-structure
The processing and real time monitoring of material 405.Solution 404 is the pure water metal of light transmission and the nano-solution of metal oxide.Material
405 be optically transparent material, and material processing department 400 is surrounded by the partition for stopping scattering laser, to protect operator's
Personal safety.
Material 405 to be processed is fixed on the dustpan-shaped exit of the fixed device 401 of material, then carries out at edge anti-
After leakage measure, be added processing needed for solution 404 or colloid substance, then make focus after light beam 401 focal plane and to
The rear surface of rapidoprint 402 is overlapped, and is processed according to the scheme of input.It can be ionized in focal point after starting processing,
The environment of plasma and local high temperature and pressure is generated, and then micro-structure processing and processing are carried out to material surface, in processing
Surface processing situation is monitored in real time using microscopie unit 403 simultaneously, if it find that the shape difference of structure, it just will letter
Number scheme control unit 500 is fed back to, scheme control unit 500 is to the laser power of light source generating unit and sweeping for scanning galvanometer portion later
It retouches path and makes corresponding adjustment, until scheme completes the process.
Method of surface finish operating process of the femtosecond chevilled silk backwards to shock wave for material is as follows: running scheme control unit
500, open laser light-source device 100；Material is fixed on to the exit of the dustpan shaped device of material processing department 400, is taken anti-
Leakage measure；Suitable solution or colloid substance is added according to material type, the parameter of driving circuit 101 is set, as laser power,
The parameters such as pulse recurrence frequency and pulse width；By specific processing scheme input scheme control unit, make scanning galvanometer portion and light beam
Focus portion can work according to scheduled scan path and speed；CCD camera 402 and microscopie unit 403 are opened, and is adjusted
Whole good focal length, in order to monitor the variation of material surface micro-structure；In process, the specific knot of microscope meeting display material
Structure, and feed back and arrive laser light-source device 100, scan control section 200 and light beam focus portion 300；Fig. 5 and Fig. 6 are respectively shown
Surface texture variation before processing and after processing, focusing of the light beam into and can produce within material surface 5 seconds or so size is 900 μm
Microstructure change region；After processing is completed, driving circuit 101, laser light-source device 100, CCD camera 402 and micro- are closed
Lens device 403 takes out material, completes.
Claims (8)
1. a kind of femtosecond chevilled silk is used for the hyperfine processing unit (plant) in surface backwards to shock wave, in high damage threshold transparent material table
Realize micro-nano structure processing in face, comprising: laser light-source device (100), scan control section (200), light beam focus portion (300), material
Expect processing department (400), scheme control unit (500), it is characterised in that: scan control section (200) input terminal and laser light
The output end of source device (100) is connected, and the feedback signal of reception scheme control unit (500) carries out monitoring in real time and adjusts
Section；Light beam focus portion (300) input terminal is connected with the output end of scanning galvanometer portion (200)；The material processing
Portion (400) connects the output end of scanning galvanometer portion (200)；
The laser light-source device (100): include the laser aid for generating laser beam；By driving circuit (101), laser
Device (102) composition；The power input of laser (102) connects driving circuit (101), and output end is as laser light-source device
(100) output end；The laser power of output is inputted the current control of laser (102) by driving circuit (101)；
The scan control section (200): poly- including fibre optic isolater (201), optical fiber and space optical path converter (202), space
Burnt optical element combination (203), space reflection optical element combination (204), the shifting for realizing laser beam to material surface
Dynamic scanning: the input terminal of the fibre optic isolater (201) is connect with laser light-source device (100) by optical fiber；The light
The output end of fiber isolator (201) is connect with optical fiber with space optical path converter (202) by optical fiber；The optical fiber and space
The output end of optical path converter is connect with space-focusing optical element combination (203) by space；The spatial emission optics
The input terminal of element combination (204) is connect with space-focusing optical element combination (203) by space, and output end is as scanning control
The output port of portion (200) processed；
The light beam focus portion (300): it including space-focusing lens combination (301), one-dimensional electricity driving displacement platform (302), is used for
Focus the laser beam to material surface；The input terminal of space-focusing lens combination (301) and the output of scan control section (200)
Port is connected by space, output port of the output end as light beam focus portion (300), and one-dimensional electricity driving displacement platform (302) is used
In fixed and displacement space condenser lens combination (301)；
The material processing department (400): including material fixed device (401), CCD camera (402), microscopie unit (403), molten
Chevilled silk (406) in liquid (404), material (405) and solution, the material (405) are fixed on winnowing with a dustpan for material fixed device (401)
The exit of dustpan shape and the output port of light beam focus portion (300), solution (403) are put into the appearance of material fixed device (401)
In device；A microscopie unit (403) connecting with CCD camera (402) is arranged in the top of material fixed device (401), is used for
The variation of material surface micro-structure is monitored, realizes the processing and real time monitoring of material (405)；
The scheme control unit (500) by computer respectively with the driving circuit (101) of laser light-source device (100), scanning
The one-dimensional electricity driving displacement platform (302) of the space reflection optical element combination (204) of control unit (200), light beam focus portion (300)
Connection, and laser light-source device (100) are controlled, scan control section (200), light beam focus portion (300), material processing department (400)
Be in communication with each other and co-ordination.
2. femtosecond chevilled silk according to claim 1 is used for the hyperfine processing unit (plant) in surface backwards to shock wave, it is characterised in that:
The type of laser used in the laser light-source device (100) is optical fiber laser, solid state laser, gas laser
One of device and semiconductor laser；The output wavelength of used laser is ultraviolet 200-400nm, visible 400-
700nm, infrared 700-10000nm.
3. femtosecond chevilled silk according to claim 1 is used for the hyperfine processing unit (plant) in surface backwards to shock wave, it is characterised in that:
The material (405) processed is optically transparent material, dustpan-shaped exit of the material (405) in material fixed device (401)
Using leakage-proof structure, prevent solution (404) from revealing；Material processing department (400) is surrounded by the partition for stopping scattering laser, with
Protect the personal safety of operator.
4. femtosecond chevilled silk according to claim 1 is used for the hyperfine processing unit (plant) in surface backwards to shock wave, it is characterised in that:
The peak power P of laser (102) outputLaserGreater than the power threshold P for forming chevilled silk in materialC, Pc=3.77 λ2/8π
n0n2, wherein λ is laser output wavelength, n0For solution (404) linear refractive index, n2For the refraction of solution (404) second nonlinear
Rate, the laser (102) output pulse width are 0-500 picoseconds.
5. femtosecond chevilled silk according to claim 1 is used for the hyperfine processing unit (plant) in surface backwards to shock wave, it is characterised in that:
The scheme control unit (500) is the control device for controlling laser light-source device (100) and scanning galvanometer portion (200)；It is described
Scheme control unit (500) by feeding back to laser respectively after the depth information and location information for observing surface micro-structure
Light supply apparatus (100) and scanning galvanometer portion (200), in order to which the power and bit of timely error correction and adjustment light beam is set.
6. femtosecond chevilled silk according to claim 1 is used for the hyperfine processing unit (plant) in surface backwards to shock wave, it is characterised in that:
The solution (404) is the pure water metal of light transmission and the nano-solution of metal oxide.
7. a kind of be used for the hyperfine processing unit (plant) in surface backwards to shock wave using any femtosecond chevilled silk of claim 1-6
Processing method, it is characterised in that: firstly, running scheme control unit 500 and laser light-source device 100, material processing department (400) is solid
The material (405) processed needed for fixed, and make material (405) rear surface and light beam focal plane in the same plane；By
Laser light-source device (100) generates required laser beam；The focal spot radius that scan control section (200) controls laser beam is big
It is small, the direction of light beam is adjusted, and receive to come from the feedback of scheme control unit (500), in order to be scanned according to existing plan
Processing；Femtosecond laser beam is focused on material (405) surface and processed by light beam focus portion (300)；Scheme control unit (500)
The specific processing sweeping scheme for inputting surface micro-structure, then controls laser light-source device (100) according to the scheme of input respectively
It is processed with scan control section (200)；Signal is fed back to laser light source dress by the variation for monitoring material surface micro-structure simultaneously
(100) and scan control section (200) are set, it is made according to circumstances to adjust corresponding light beam power and light-beam position.
8. the method for processing according to claim 7, it is characterised in that: the height of laser light-source device (100) output
Power laser focuses in solution (404), as the peak power P of laser (102) outputLaserGreater than formation chevilled silk in solution
Power threshold PCWhen, the laser causes chevilled silk phenomenon in solution (404), and the laser pulse forward position of high-peak power passes through more
Photon effect is by solution (404) molecular ionization, and the electronics after ionizing is formed in solution (404) by the rear of pulse along acceleration
One plasma channel, in 50 microns of core diameter of the plasma channel formed by chevilled silk (406), temperature reaches > 3000K, makes light
There are temperature gradients for silk (406) and surrounding medium (404), lead to solution (404) expanded by heating of chevilled silk (406) nearby, to week
The lattice enclosed forms ultrasonic impact, which finally pushes water flow to form shock wave, realizes material table using the shock wave
The micro-structure in face is processed, simultaneously as the self-defocusing effect of final plasma and the self-focusing effect of laser will in chevilled silk
Realize dynamic equilibrium, the light intensity in chevilled silk (406) is clamped at a constant intensity, which can promote chevilled silk (406)
Stability backwards to shock wave, for processing.
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| CN114159761A (en) * | 2021-12-09 | 2022-03-11 | 长春理工大学 | Skate blade, preparation method thereof and ice skate |
| CN114654049A (en) * | 2022-02-28 | 2022-06-24 | 华南理工大学 | SiC module-based fast frequency and polarity-variable TIG welding power supply and system |
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| CN113446131A (en) * | 2021-06-18 | 2021-09-28 | 南京理工大学 | Application of space focusing microwave and micro-nano metal/polymer ignition device |
| CN113446131B (en) * | 2021-06-18 | 2022-03-18 | 南京理工大学 | Application of space focusing microwave and micro-nano metal/polymer ignition device |
| CN114159761A (en) * | 2021-12-09 | 2022-03-11 | 长春理工大学 | Skate blade, preparation method thereof and ice skate |
| CN114159761B (en) * | 2021-12-09 | 2024-03-26 | 长春理工大学 | Skates, preparation method thereof and skates |
| CN114654049A (en) * | 2022-02-28 | 2022-06-24 | 华南理工大学 | SiC module-based fast frequency and polarity-variable TIG welding power supply and system |
| CN114654049B (en) * | 2022-02-28 | 2023-08-22 | 华南理工大学 | Quick-frequency-change polarity TIG welding power supply and system based on SiC module |
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