CN109967896A - The hyperfine cutter device of short-pulse laser induced ultrasonic water flow plasma and method - Google Patents
The hyperfine cutter device of short-pulse laser induced ultrasonic water flow plasma and method Download PDFInfo
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- CN109967896A CN109967896A CN201910236699.4A CN201910236699A CN109967896A CN 109967896 A CN109967896 A CN 109967896A CN 201910236699 A CN201910236699 A CN 201910236699A CN 109967896 A CN109967896 A CN 109967896A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
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- Laser Beam Processing (AREA)
Abstract
The present invention relates to a kind of hyperfine cutter device of short-pulse laser induced ultrasonic water flow plasma and methods, the device includes laser cutting TRAJECTORY CONTROL portion, laser generates and focus portion, cutting material, water loop control portion, micro-structure feedback section, TRAJECTORY CONTROL portion is cut by laser by image identification system, logic controller, laser current controller, depth of focus controller, laser path controller, electronic control translation stage composition, image identification system signal input part connects micro-structure feedback section, output end is separately connected laser current controller by logic controller, depth of focus controller, laser path controller, depth of focus controller connects electronic control translation stage with laser path controller, electronic control translation stage is controlled by laser path controller, to control the movement routine of laser, and the structural information returned by micro-structure feedback section , the laser energy and the depth of focus of laser generation and focus portion are adjusted in real time, to realize the cutting of arbitrary shape.
Description
Technical field
The present invention relates to a kind of laser cutting devices, and in particular to a kind of hyperfine cutter device of plasma.
Background technique
Laser cutting is the high power density laser beam irradiation workpiece using line focus, melts illuminated material rapidly
Change, vaporization, ablation reach burning point, while blowing down melt substance by with the coaxial high-speed flow of light beam, with light beam and work
The purpose of cutting workpiece is realized in the movement of part relative position.Its essence is a kind of thermal cutting.Since precision is high, cutting is quick, section
Material saving, the various features such as notch is smooth, processing cost is low, laser cutting obtain extensively in machining especially Precision Machining field
General application.
However there are still some problems and deficiency for current laser cutting technique, for example more difficult cutting quartz, mica are contour
Damage threshold material.Quartz, the higher material of mica equivalent damage threshold value characteristic excellent due to certain unique, in many necks
Domain obtains very extensive application, and so its related cutting, is always the pain spot of industry.It is intended to cut such material, generally require more
The laser light source of high-power output, and the cost of light source accounts for 60% or more of whole system cost, high power is not only brought more
High cost also easily causes the unstability of system.Therefore solve the problems, such as that this will be a quantum leap of laser processing technology.
Summary of the invention
A kind of short-pulse laser induced ultrasonic proposed the present invention be directed to the deficiency of above-mentioned conventional laser cutting technique
The hyperfine cutter device of water flow plasma and method, the device and method can realize hard material under the premise of quickly free of contamination
The hyperfine cutting of material, can reduce an order of magnitude or so for the light source power of conventional laser diced system.Estimation System cost
It is reduced to the one third of original laser system or less.
To achieve the above object, the technical scheme is that a kind of short-pulse laser induced ultrasonic water flow plasma
Hyperfine cutter device, including laser cutting TRAJECTORY CONTROL portion, laser generate and focus portion, cutting material, water loop control portion,
Micro-structure feedback section,
The laser cutting TRAJECTORY CONTROL portion is by image identification system, logic controller, laser current controller, focusing
Depth controller, laser path controller, electronic control translation stage composition, described image identifying system signal input part connect micro-structure
Feedback section, output end are separately connected laser current controller, depth of focus controller, laser path by logic controller and control
Device, depth of focus controller connect electronic control translation stage with laser path controller, control automatically controlled translation by laser path controller
Platform, thus the structural information for controlling the movement routine of laser, and being returned by micro-structure feedback section, adjust in real time laser generate and
The laser energy and the depth of focus of focus portion, to realize the cutting of arbitrary shape；
The laser generates and focus portion includes laser light-source device, laser reflection microscope group, laser focusing system, described
The laser beam of laser light-source device outgoing is incident on laser focusing system through laser reflection microscope group and realizes focusing, makes laser light
Beam focusing focus is in the moisture film of cutting material surface；Wherein, the laser light-source device connects laser current controller, swashs
Light focusing system is mounted on electronic control translation stage；
Water loop control portion includes discharging device, moisture film, and liquid is flowed out from discharging device, through cutting material surface shape
At one layer of uniform moisture film, the liquids recovery of cutting material is flowed through to discharging device, constitutes water circulation；
The micro-structure feedback section includes optical microscopy, display, lifting platform, and the optical microscopy cuts material
It cuts situation to reflect in real time over the display, then feeds back to laser cutting TRAJECTORY CONTROL portion；
The cutting material is solid or colloidal materials, and the cutting material is placed on Cutting platform.
Further, the output wavelength of the laser light-source device be ultraviolet 200-400nm, visible 400-700nm or
Infrared band 700-10000nm, the pulsewidth of output are 0-500ps；The laser light-source device output laser energy receives to swash
The current feedback of laser current controller in light Self cleavage TRAJECTORY CONTROL portion.
Further, the laser reflection microscope group can be 45 degree of reflecting mirrors pair or any angle in addition to 45 degree of angles
Reflect the optical path adjusting system of microscope group composition.
Further, the laser focusing system can for convex lens, concavees lens, concave mirror, paraboloidal mirror composition general
Laser focuses on the optical system on cutting material；The feedback signal of the electronic control translation stage collectiong focusing depth controller, and
Control signal is exported to the laser focusing system, the depth of focus of the laser focusing system is controlled by electronic control translation stage, with
And cutting path, to realize control cutting profile.
Further, the partition of isolation scattering laser is installed, to ensure the peace of operator around the Cutting platform
Entirely.
Further, the liquid can be one of water, colloid, pure solution, doping suspended gel/particle solution.
A kind of cutting method using the hyperfine cutter device of short-pulse laser induced ultrasonic water flow plasma, firstly,
Cutting material is placed on the Cutting platform of tilt adjustable, water is flowed out from discharging device, and flows through to be formed on cutting material surface
One layer of hundred microns of thick moisture film, flow through the water of cutting material, are recycled to discharging device again by water circulation system, realize water
It recycles, then the short pulse femtosecond laser that laser generates and focus portion issues is squeezed into moisture film, in hundred microns of thick moisture films
Plasma is generated, promotes moisture film to expand using the high temperature hot-zone that plasma generates, to generate ultrasonic water impact cutting
Material surface realizes the hyperfine cutting of high damage threshold material.
Further, the laser light source peak power P of the laser light-source device outputLaserGreater than forming plasma in moisture film
The power threshold P of bodyc；Pc=3.77 λ2/8πn0n2, wherein λ is laser output wavelength, n0For linear refractive index, n2It is molten
Liquid second nonlinear refractive index.
The beneficial effects of the present invention are:
1. the hyperfine cutting method of laser of short-pulse laser induced ultrasonic water flow proposed by the present invention, light source power are big
About 900nJ, the 10 μ J of light source power peak value compared to conventional laser cutting reduce two orders of magnitude.Lower output power
Light source reduces cutting equipment cost.
2. the equipment cutting when there is high-velocity flow to flow through material surface, material disintegrating slag can be washed away in time, avoid disintegrating slag by
Machine component surface is attached in photothermy.
3. nano particle can be mixed in water, then it can adhere to nano particle on section after the completion of cutting, and surface is attached
The material of nano particle possess higher quantum efficiency, the preparation of multifunctional material can be realized while cutting.
4. the processing method does not need too high laser energy, therefore light-source system works under middle low-power mode, light
Source is more stable.For plasma, changes with the external world and fluctuate very little, therefore the cutting means precision is higher, it can be real
The now hyperfine cutting within 10 μm of floating.
Detailed description of the invention
Fig. 1 is the hyperfine cutter device structural schematic diagram of plasma of the invention；
Fig. 2 is that moisture film of the invention forms schematic diagram；
Fig. 3 is inside schematic diagram of the invention.
Specific embodiment
Feature of present invention and other correlated characteristics are described in further detail below in conjunction with attached drawing, to facilitate this field skill
Art personnel understand:
As shown in Figure 1, the hyperfine cutter device of plasma of short-pulse laser induced ultrasonic water flow of the invention, including
Be cut by laser TRAJECTORY CONTROL portion 100, laser generate and focus portion 200), cutting material 300, water loop control portion 400, micro-structure
500 5 parts of feedback section.Laser trace control unit 100 is for controlling material cutting profile；Laser is generated and is focused
Portion 200 is for issuing short-pulse laser；Cutting material 300 is placed on Cutting platform 301；Water loop control portion 400 is used for
Moisture film is constructed on the surface of the material；Micro-structure feedback section 500 is used to material cutting situation and structural information Real-time Feedback to cutting
TRAJECTORY CONTROL portion 100.
The laser cutting TRAJECTORY CONTROL portion 100 is by image identification system 101, logic controller 102, laser current control
Device 103 processed, depth of focus controller 104, laser path controller 105, electronic control translation stage 106 form, image identification system 101
Signal input part connects micro-structure feedback section 500), output end is separately connected laser current controller by logic controller 102
103, depth of focus controller 104, laser path controller 105, depth of focus controller 104 and laser path controller 105
Electronic control translation stage 106 is connected, electronic control translation stage 106 is controlled by laser path controller 105, to control the mobile road of laser
Diameter, and the structural information returned by micro-structure feedback section 500 adjust the laser energy of laser generation and focus portion 200 in real time
With the depth of focus, to realize the cutting of arbitrary shape.
The laser generates and focus portion 200 includes laser light-source device 201, laser reflection microscope group 202, laser focusing
System 203.The laser beam that laser light-source device 201 is emitted is incident on laser focusing system 203 through laser reflection microscope group 202,
It realizes and focuses.Laser beam focusing focus is in the moisture film of cutting material surface.Wherein, the connection of laser light-source device 201 swashs
Photoelectricity stream controller 103, laser focusing system 203 are mounted on electronic control translation stage 106.
The output wavelength of the laser light-source device 201 is ultraviolet, visible or infrared band.The pulsewidth of output is 0-
500ps.The laser reflection microscope group 202 can be 45 degree of reflecting mirrors pair or the optical path tune of other angles reflection microscope group composition
Section system.The laser focusing system 203 can be the compositions such as convex lens, concavees lens, concave mirror, paraboloidal mirror by laser
Focus on the optical system on cutting material.
The cutting material 300 can be solid or colloidal materials.Cutting material 300 is placed in 301 on Cutting platform.
The water loop control portion 400 includes discharging device 401, moisture film 402.Water is flowed out from discharging device 401, through cutting
It cuts 300 surface of material and forms one layer of uniform moisture film 402, the water for flowing through material 300 is recycled to discharging device 401, constitutes water and follows
Ring.
The micro-structure feedback section 500 includes optical microscopy 501, display 502, lifting platform 503.It is aobvious using optics
Material cutting situation is reflected on display 502 by micro mirror 501 in real time, then feeds back to laser cutting TRAJECTORY CONTROL portion 100.
As shown in Fig. 2, water is at the uniform velocity flowed out from discharging device 401, the uniform moisture film of a layer thickness is formed on the surface of the material
402, the water for flowing through material is recovered to again in discharging device 401, and water is recycled, and avoids the waste of water resource.Water
Flow velocity degree can be set by discharging device 401 or the pitch angle control of Cutting platform 301.
As shown in figure 3, internal physical process of the invention is as follows:
It is focused in moisture film 402 by the high power laser light that laser generation and focus portion 200 export, when its peak power is greater than
When forming the power threshold of plasma in water, laser will form plasma A in moisture film.The core formed by plasma
Temperature reaches thousands of degree in the plasma channel of diameter some tens of pm or so, therefore plasma and surrounding water film temperature gradient are larger,
Water expanded by heating near plasma forms impact to the lattice of water around, and final plasma-induced ambient water is formed
Shock wave B.Meanwhile the light intensity in plasma is clamped at a constant intensity, which is influenced to float by external environment
It is smaller, therefore the shock strength that plasma generates is also constant.The constant intensity also improves plasma-induced super
Sound hydro jet stability can cut out more even curface using this point.
Processing flow is as follows: the Cutting platform 301 of tilt adjustable is selected first, material 300 is placed on it.Water is from water outlet
Device 401 flows out, and flows through to form one layer of about hundred microns of thick moisture film 402 on the surface of the material, flows through the water of material, is followed by water
Loop system 400 is recycled to discharging device 401 again, realizes recycling for water.Then laser is generated and focus portion 200 issues
Short pulse femtosecond laser squeeze into moisture film 402, plasma is generated in hundred microns thick of moisture film 402, where plasma
Hot-zone induces water flow expansion nearby and forms ultrasonic water flow.Different from the thermal cutting principle of conventional method, which is to utilize
Gas ions are punched in the ultrasonic water flow of rapidoprint surface excitation, and power threshold is lower.Plasma core diameter about 100~
In 200 μ ms, thus the sphere of action of the ultrasound rivers shock wave on material is extremely small, minimum up to 10 μm, finally
So that material is punched.The moving rail of laser beam is changed by the real-time control to cutting track according to the difference of cutting demand
Mark, Continuous Breakdown surface can reach processing purpose.
In above-mentioned process, the peak power P for the laser light source output that laser light-source device 201 exportsLaserGreater than moisture film
The middle power threshold P for forming plasmac；Pc=3.77 λ2/8πn0n2, wherein λ is laser output wavelength, n0For solution (small) line
Property refractive index, n2For solution (water) second nonlinear refractive index.
Claims (8)
1. a kind of hyperfine cutter device of short-pulse laser induced ultrasonic water flow plasma, including laser cutting TRAJECTORY CONTROL portion
(100), laser generation and focus portion (200), cutting material (300), water loop control portion (400), micro-structure feedback section
(500), it is characterised in that:
The laser cutting TRAJECTORY CONTROL portion (100) is by image identification system (101), logic controller (102), laser current
Controller (103), depth of focus controller (104), laser path controller (105), electronic control translation stage (106) composition, it is described
Image identification system (101) signal input part connects micro-structure feedback section (500), and output end passes through logic controller (102) point
Not Lian Jie laser current controller (103), depth of focus controller (104), laser path controller (105), depth of focus control
Device (104) processed and laser path controller (105) connection electronic control translation stage (106) control electricity by laser path controller (105)
It controls translation stage (106), so that the structural information for controlling the movement routine of laser, and being returned by micro-structure feedback section (500), real
When adjustment laser generate and focus portion (200) laser energy and the depth of focus, to realize the cutting of arbitrary shape；
The laser generates and focus portion (200) includes that laser light-source device (201), laser reflection microscope group (202), laser are poly-
Burnt system (203), the laser beam of laser light-source device (201) outgoing, is incident on laser through laser reflection microscope group (202)
Focusing system (203), which is realized, to be focused, and makes laser beam focusing focus in the moisture film of cutting material surface；Wherein, described to swash
Radiant device (201) connects laser current controller (103), and laser focusing system (203) is mounted on electronic control translation stage
(106)；
Water loop control portion (400) includes discharging device (401), moisture film (402), and liquid is flowed out from discharging device (401),
One layer of uniform moisture film (402) is formed through cutting material (300) surface, the liquids recovery for flowing through cutting material (300) is extremely discharged
Device (401) constitutes water circulation；
The micro-structure feedback section (500) includes optical microscopy (501), display (502), lifting platform (503), the light
It learns microscope (501) material cutting situation is reflected in real time on display (502), then feeds back to laser cutting TRAJECTORY CONTROL portion
(100)；
The cutting material (300) is solid or colloidal materials, and the cutting material (300) is placed on Cutting platform (301).
2. the hyperfine cutter device of short-pulse laser induced ultrasonic water flow plasma according to claim 1, feature
Be: the output wavelength of the laser light-source device (201) is ultraviolet 200-400nm, visible 400-700nm or infrared waves
Section 700-10000nm, the pulsewidth of output are 0-500ps；Laser light-source device (201) the output laser energy, which receives, carrys out laser
The current feedback of laser current controller (103) in Self cleavage TRAJECTORY CONTROL portion (100).
3. the hyperfine cutter device of short-pulse laser induced ultrasonic water flow plasma according to claim 1, feature
Be: the laser reflection microscope group (202) can be 45 degree of reflecting mirrors pair or any angle reflection in addition to 45 degree of angles
The optical path adjusting system of microscope group composition.
4. the hyperfine cutter device of plasma of short-pulse laser induced ultrasonic water flow according to claim 1, special
Sign is: the laser focusing system (203) can for convex lens, concavees lens, concave mirror, paraboloidal mirror composition by laser
Focus on the optical system on cutting material (300)；Electronic control translation stage (106) the collectiong focusing depth controller (104)
Feedback signal, and control signal is exported to the laser focusing system (203), the laser is controlled by electronic control translation stage (106)
The depth of focus and cutting path of focusing system (203), to realize control cutting profile.
5. the hyperfine cutter device of short-pulse laser induced ultrasonic water flow plasma according to claim 1, feature
It is: the partition of isolation scattering laser is installed, to ensure the safety of operator around the Cutting platform (301).
6. the hyperfine cutter device of short-pulse laser induced ultrasonic water flow plasma according to claim 1, feature
Be: the liquid can be one of water, colloid, pure solution, doping suspended gel/particle solution.
7. a kind of filled using any hyperfine cutting of the short-pulse laser induced ultrasonic water flow plasma of claim 1-6
The cutting method set, it is characterised in that: firstly, cutting material (300) is placed on the Cutting platform (301) of tilt adjustable, water
It is flowed out from discharging device (401), and flows through to form one layer of hundred microns of thick moisture film (402) on cutting material (300) surface, flowed through
The water of cutting material (300) is recycled to discharging device (401) by water circulation system (400) again, realizes the circulation benefit of water
With, then by laser generate and focus portion (200) issue short pulse femtosecond laser squeeze into moisture film (402), in hundred microns of thick water
Plasma is generated in film (402), promotes moisture film (402) to expand using the high temperature hot-zone that plasma generates, to generate super
The hyperfine cutting of high damage threshold material is realized on sound water impact cutting material (300) surface.
8. cutting method according to claim 7, it is characterised in that: the laser of laser light-source device (201) output
The peak power P of light source outputLaserGreater than the power threshold P for forming plasma in moisture filmc；Pc=3.77 λ2/8πn0n2, wherein λ
For laser output wavelength, n0For linear refractive index, n2For solution second nonlinear refractive index.
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Cited By (2)
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| CN111702353A (en) * | 2020-06-30 | 2020-09-25 | 松山湖材料实验室 | Laser wafer peeling device and laser wafer peeling method |
| CN114799572A (en) * | 2022-06-14 | 2022-07-29 | 广东宏石激光技术股份有限公司 | Laser cutting machining method based on scanning path control energy distribution |
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| CN114799572A (en) * | 2022-06-14 | 2022-07-29 | 广东宏石激光技术股份有限公司 | Laser cutting machining method based on scanning path control energy distribution |
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Application publication date: 20190705 |