CN110253216A - A kind of processing method of earpiece dust cover - Google Patents
A kind of processing method of earpiece dust cover Download PDFInfo
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- CN110253216A CN110253216A CN201910461102.6A CN201910461102A CN110253216A CN 110253216 A CN110253216 A CN 110253216A CN 201910461102 A CN201910461102 A CN 201910461102A CN 110253216 A CN110253216 A CN 110253216A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
Abstract
The present invention is suitable for mobile phone component processing technique field, provides a kind of processing method of earpiece dust cover, including S1, acquisition stainless steel substrates, and identify the thickness of stainless steel substrates；S2, stainless steel substrates are processed as earpiece dust cover by punch forming, earpiece dust cover include dust-proof bottom and with the dust-proof main body of the dust-proof integrally formed earpiece in bottom；Wherein, the surface of dust-proof bottom is a surface of stainless steel substrates, and the surface of the dust-proof main body of earpiece is another surface of stainless steel substrates, and the distance between two surfaces are the thickness of stainless steel substrates；S3, the thickness according to stainless steel substrates mark processing stand in dust-proof bottom surface；S4, laser processing mode is selected according to the thickness of stainless steel substrates, makes laser spot and processing point contact；S5, loading simultaneously execute the capillary processing program write in advance, form micropore in dust-proof bottom and the dust-proof main body of earpiece.The processes such as Air Filter braiding, stickup or welding can be saved through the invention, are improved product yield, are integrally formed product.
Description
Technical field
The present invention relates to mobile phone component processing technique field more particularly to a kind of processing methods of earpiece dust cover.
Background technique
The dustproof part of traditional abnormal shape earpiece dust cover is divided into reticular structure, weaving is used, to producer
It is technical to require relatively high, it needs to make by know-how training, complex manufacturing technology, the production cycle is long, therefore
Product yield is lower.Develop with industrial technology, the processing method now for earpiece dust cover mainly include the following types:
1. plane mesh structure: main metal mesh or web made of braiding, but the screen of mainstream mobile phone products
There is certain thickness, will cause the significant depressions at earpiece using metal mesh or web, cause appearance bad, and easily produces
Raw dust accretions are in recess.
2. plane cavernous structure: generally metal stamping or the intensive circular hole of corrosion formation can not carry out secondary operation,
Be stamped and formed out U-shaped structure, it is also difficult to strike out it is abnormally-structured after again punching press or corrosion form intensive circular hole, circular hole and dust-proof
Part is easily deformed, and aperture is larger, and dust easily enters earpiece sounding device.
3. special-shaped reticular structure: structure is reticulated using metal wire knitted first, be pressed into using fixture it is U-shaped, after by U-shaped net
Welding is viscous and on the metab being stamped to form, and due to being related to craft woven, process yields are lower, and subsequent handling
It is complicated.
In the processing method of three kinds of above-mentioned earpiece dust covers, second and the third processing method are substantially better than the
A kind of processing method, but still Air Filter braiding, stickup or welding etc. are not being avoided in second and the third processing method
While influencing the process of product yield, overcome the problems, such as that reticular structure is easily deformed, therefore, current earpiece dust cover
There are still manufacturing process's complexity, the problem that reticular structure is unstable, product yield is low for processing method.
Summary of the invention
It is a primary object of the present invention to propose a kind of processing method of earpiece dust cover, to solve existing earpiece
The problem that dust cover manufacturing procedure is complicated, reticular structure is unstable, product yield is low.
To achieve the above object, first aspect of the embodiment of the present invention provides a kind of processing method of earpiece dust cover, comprising:
S1, stainless steel substrates are obtained, and identifies the thickness of the stainless steel substrates；
S2, the stainless steel substrates are processed as earpiece dust cover by punch forming, the earpiece dust cover includes dust-proof
Bottom and with the dust-proof main body of the dust-proof integrally formed earpiece in bottom；
Wherein, the surface of dust-proof bottom is a surface of the stainless steel substrates, and the surface of the dust-proof main body of earpiece is
Another surface of the stainless steel substrates, the distance between two surfaces are the thickness of the stainless steel substrates；
S3, according to the thickness of the stainless steel substrates, mark processing stand in the dust-proof bottom surface；
S4, laser processing mode is selected according to the thickness of the stainless steel substrates, makes laser spot and the processing stand
Contact；
S5, loading simultaneously execute the capillary processing program write in advance, in the dust-proof bottom and the dust-proof main body of the earpiece
Form micropore.
In conjunction with the embodiment of the present invention in a first aspect, in first embodiment of the embodiment of the present invention, the step S3, comprising:
Using the processing stand as the central point of the micropore；
In the dust-proof bottom surface label processing stand, according to the thickness of the stainless steel substrates, add described in adjustment two
The distance between work point；
Wherein, the distance between two described processing stands are the diameter and the sum of default spacing of the micropore, described to preset
The diameter of spacing and the micropore is corresponding with the thickness of the stainless steel substrates.
In conjunction with the first embodiment of first aspect of the embodiment of the present invention, in second embodiment of the embodiment of the present invention, institute
State stainless steel substrates with a thickness of 0.07mm~0.15mm when, the diameter of the micropore is greater than 0.03mm, and the default spacing is
0.04mm；
The stainless steel substrates with a thickness of 0.08mm~0.2mm when, the diameter of the micropore is greater than 0.04mm, described default
Spacing is 0.04mm.
In conjunction with the first embodiment of first aspect of the embodiment of the present invention, in institute in third embodiment of the embodiment of the present invention
When stating dust-proof bottom surface label processing stand, the processing stand is also controlled, make the micropore in the dust-proof bottom and described is listened
In cellular arrangement in the dust-proof main body of cylinder.
In conjunction with the embodiment of the present invention in a first aspect, in the 4th embodiment of the embodiment of the present invention, the step S4, comprising:
The stainless steel substrates with a thickness of 0.07mm~0.15mm when, using wavelength be 355nm ultraviolet picosecond laser；
Adjust the laser processing parameter of the ultraviolet picosecond laser；
The laser focal for adjusting the ultraviolet picosecond laser makes laser spot and the processing point contact；
The ultraviolet picosecond laser, for successively removing the stainless steel material of the processing stand.
In conjunction with the embodiment of the present invention in a first aspect, step S4 described in the 5th embodiment of the embodiment of the present invention, comprising:
The stainless steel substrates with a thickness of 0.08mm~0.2mm when, using wavelength be 1064nm optical fiber nanosecond laser；
And adjust the laser processing parameter of the optical fiber nanosecond laser；
The laser focal for adjusting the optical fiber nanosecond laser makes laser spot and the processing point contact；
The optical fiber nanosecond laser, for the stainless steel material of the processing stand to be warming up to molten condition.
In conjunction with the 4th embodiment of first aspect of the embodiment of the present invention and the 5th embodiment, the embodiment of the present invention the 6th
In embodiment, the laser processing parameter includes mark speed, empty hop rate degree, Q frequency and Q pulsewidth.
In conjunction with the 4th embodiment of first aspect of the embodiment of the present invention and the 5th embodiment, the embodiment of the present invention the 7th
In embodiment, dust-proof bottom described in the optical fiber nanosecond laser face, laser passes through the earpiece by the dust-proof bottom
Dust-proof main body；
Dust-proof bottom described in the ultraviolet picosecond laser face, laser are dust-proof across the earpiece by the dust-proof bottom
Main body.
In conjunction with the embodiment of the present invention in a first aspect, in the 8th embodiment of the embodiment of the present invention, the step S5, comprising:
The capillary processing program is write according to punching figure；
It processes laser to each processing stand according to the punching figure, in the dust-proof bottom and described listens
The dust-proof main body of cylinder forms the micropore；
In the punching figure, the inside of each micropore is helically linear.
In conjunction with the embodiment of the present invention in a first aspect, in the 9th embodiment of the embodiment of the present invention, after the step S5, packet
It includes:
Removing surface is carried out to the dust-proof bottom and the dust-proof main body of the earpiece.
The processing method that the embodiment of the present invention proposes a kind of earpiece dust cover is basic material with stainless steel substrates, passes through punching
The basic earpiece dust cover structure of molded acquisition uses laser then in the dust-proof bottom marker processing stand of earpiece dust cover
It works on processing stand, so that forming micropore in the dust-proof bottom of earpiece dust cover structure and the dust-proof main body of earpiece, wherein
The mode of arrangement and the laser processing of processing stand is related with the thickness of stainless steel substrates, it is ensured that the micropore of formation can reach dust-proof
With the function of entrant sound, for plane mesh structure, the microcellular structure formed in dust-proof bottom and the dust-proof main body of earpiece is more
Stablize；For traditional handicraft, the processes such as Air Filter braiding, stickup or welding are saved, product yield is improved, makes to produce
Product are integrally formed, and realize the automation processing of earpiece dust cover.
Detailed description of the invention
Fig. 1 is the implementation process schematic diagram of the processing method for the earpiece dust cover that the embodiment of the present invention one provides；
Fig. 2 is the structural schematic diagram for the earpiece dust cover that the embodiment of the present invention one provides；
Fig. 3 is the structural schematic diagram for another earpiece dust cover that the embodiment of the present invention one provides；
Fig. 4 is the detailed implementation process schematic diagram of step S3 in embodiment one provided by Embodiment 2 of the present invention；
The detailed implementation process schematic diagram of step S5 in the embodiment one that Fig. 5 provides for the embodiment of the present invention four；
Fig. 6 is the punching figure that the embodiment of the present invention four provides.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or the device that include a series of elements not only include those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
There is also other identical elements in the process, method of element, article or device.
Herein, using the suffix for indicating such as " module ", " component " or " unit " of element only for advantageous
In explanation of the invention, there is no specific meanings for itself.Therefore, " module " can be used mixedly with " component ".
In subsequent description, inventive embodiments serial number is for illustration only, does not represent the advantages or disadvantages of the embodiments.
Embodiment one
As shown in Figure 1, the embodiment of the invention provides a kind of processing methods of earpiece dust cover, comprising:
S1, stainless steel substrates are obtained, and identifies the thickness of the stainless steel substrates.
In above-mentioned steps S1, basic material of the stainless steel substrates as earpiece dust cover, one of surface will be as anti-
Surface as the dust-proof main body of earpiece, two above-mentioned surfaces are by the surface of dirt bottom, another surface in stainless steel substrates
Two opposite surfaces, and above-mentioned the distance between two surfaces, the as thickness of stainless steel substrates.
S2, the stainless steel substrates are processed as earpiece dust cover by punch forming, the earpiece dust cover includes dust-proof
Bottom and with the dust-proof main body of the dust-proof integrally formed earpiece in bottom.
In above-mentioned steps S2, stainless steel material type selecting needed for punching press be should be noted.Want it with good machining property
The characteristics such as energy, toughness is high, and corrosion resistance is good, easily stamping, and Pressing Deformation amount is small.
In one embodiment, anti-impact buckling can preferably be taken into account in the stainless steel substrates of 0.8mm~0.2mm using thickness
Shape ability and highly-efficient processing, and there is certain thickness to be unlikely to be generated thermal stress deformation by laser heat affecting.
In a particular application, the step of laser processing being formed micropore is placed on punching press back segment, avoid generating when punching press because
Stress deforms micropore.
As shown in Fig. 2, the embodiment of the invention also provides the finished product of punch forming processing, i.e. the structure of earpiece dust cover is shown
It is intended to, in Fig. 2,1 is dust-proof bottom, and 2 be the dust-proof main body of earpiece.In practical applications, earpiece dust cover includes but is not limited to Fig. 2
Shown shape needs for cooperation appearance and structure design, and final shape determines according to actual needs.
S3, according to the thickness of the stainless steel substrates, mark processing stand in the dust-proof bottom surface.
In above-mentioned steps S3, processing stand is the central point of laser beam, then processing stand is also in the embodiment of the present invention
The central point of micropore.
In a particular application, the quantity of processing stand has corresponded to the quantity of micropore, micropore as radiate in earpiece dust cover, it is anti-
The important feature of dirt, entrant sound, the quantity of micropore and the arrangement mode in dust-proof bottom surface, also will affect the function of earpiece dust cover
Energy.
S4, laser processing mode is selected according to the thickness of the stainless steel substrates, makes laser spot and the processing point contact.
In above-mentioned steps S4, according to the mechanism of laser beam and material interaction, laser processing can be substantially divided into sharp
Photo-thermal processing and photochemical reaction process two classes.Laser heat processing refers to the thermal effect generated using laser beam projects to material surface
It should complete process, including the cutting of laser welding, laser engraving, surface modification, laser mark, laser drill and micro-
Processing etc.；Photochemical reaction processing refers to that laser beam is irradiated to object, causes or control light by high-density laser high-energy photon
The process of chemical reaction.Including photochemical precipitation, stereolithography, laser engraving etching etc..Different laser processing modes
Stainless steel substrates suitable for different-thickness.
In a particular application, while the position of laser spot, spot size and shape and laser laser carving parameter imitate processing
Fruit has a major impact, and therefore, before being laser machined, must find the position of laser spot accurately, make laser spot and processing stand
Contact.
S5, loading simultaneously execute the capillary processing program write in advance, in the dust-proof bottom and the dust-proof main body of the earpiece
Form micropore.
In above-mentioned steps S5, capillary processing program determines the forming process and final form of micropore.
In a particular application, after being loaded into and executing the capillary processing program write in advance, then dust-proof bottom and earpiece are dust-proof
Main body forms micropore, and dust-proof bottom and the dust-proof main body of earpiece with micropore are then the entire infrastructures of earpiece dust cover, it is seen that this
In inventive embodiments, the entire infrastructure of earpiece dust cover can be directly obtained by laser machining, and saved Air Filter braiding, glued
The processes such as patch or welding, and whole process automations, it is ensured that the consistency of product.
As shown in figure 3, the embodiment of the present invention also shows the structural schematic diagram of earpiece dust cover after processing is completed, Fig. 3
In, 1 is dust-proof bottom, and 2 be the dust-proof main body of earpiece, and 3 be micropore.
The processing method of earpiece dust cover provided in an embodiment of the present invention, realization process in practical applications are as follows: will rush
It presses and the earpiece dust cover of completion is marked to be placed on Precision Machining platform, fixed using fixture, be then turned on laser equipment, adjust
Laser focal makes laser spot and processing point contact to suitable position, by and execute the capillary processing program write in advance and import
Onto precise laser processing equipment, the machined parameters of precise laser marking arrangement are configured, are generated using laser equipment
Laser is had an effect at laser spot with stainless steel material, and controls laser spot position by high-precision high-speed galvanometer, according to
Micropore designed graphic document in capillary processing program processes stainless steel material, is formed in dust-proof bottom and the dust-proof main body of earpiece
Required micropore, then above-mentioned micropore is also presented in the surface of earpiece dust cover.
The processing method of earpiece dust cover provided in an embodiment of the present invention is basic material with stainless steel substrates, passes through punching press
Molding is obtained basic earpiece dust cover structure and is existed then in the dust-proof bottom marker processing stand of earpiece dust cover using laser
It works on processing stand, so that forming micropore in the dust-proof bottom of earpiece dust cover structure and the dust-proof main body of earpiece, wherein add
The mode of arrangement and the laser processing of work point is related with the thickness of stainless steel substrates, it is ensured that the micropore of formation can reach it is dust-proof and
The function of entrant sound, for plane mesh structure, the microcellular structure formed in dust-proof bottom and the dust-proof main body of earpiece is more steady
It is fixed；For traditional handicraft, the processes such as Air Filter braiding, stickup or welding are saved, product yield is improved, makes product
It is integrally formed, realizes the automation processing of earpiece dust cover.
Embodiment two
As shown in figure 4, the embodiment of the present invention is also shown in the processing method of earpiece dust cover provided by embodiment one,
The detailed implementation process schematic diagram of step S3.
In embodiments of the present invention, step S3 may include:
S31, using the processing stand as the central point of the micropore.
S32, in the dust-proof bottom surface label processing stand, according to the thickness of the stainless steel substrates, adjust two institutes
State the distance between processing stand.
In above-mentioned steps S31 and step S32, the distance between two described processing stands are the diameter of the micropore and pre-
If the sum of spacing, the diameter of the default spacing and the micropore is corresponding with the thickness of the stainless steel substrates.
In a particular application, the distance between two processing stands are the distance between two micropore centers, it is assumed that it is d,
Assume again that micro-pore diameter is D, presetting spacing is a, then in embodiments of the present invention, d=D+a, wherein the value of D and taking for a
Value is related with the thickness of stainless steel substrates, and the thickness of stainless steel substrates has an effect on laser processing mode.
In one embodiment, the stainless steel substrates with a thickness of 0.07mm~0.15mm when, the diameter of the micropore is big
In 0.03mm, the default spacing is 0.04mm.
Wherein, stainless steel substrates with a thickness of 0.07mm~0.15mm when, can preferably take into account anti-impact compressive strain and laser heat
Deformation is influenced, and the small laser processing of thickness is high-efficient, suitable for the processing method of laser engraving cutting class, and micropore at this time is straight
Diameter is greater than 0.03mm, just can guarantee that processing back aperture is more round and smooth, and in addition presetting spacing is 0.04mm, can guarantee and is laser machining
Shi Buhui gets through adjacent two hole.
The stainless steel substrates with a thickness of 0.08mm~0.2mm when, the diameter of the micropore is greater than 0.04mm, described default
Spacing is 0.04mm.
Wherein, stainless steel substrates with a thickness of 0.08mm~0.2mm when, can preferably take into account anti-impact compressive strain ability and efficiently
Processing, and there is certain thickness to be unlikely to be generated thermal stress deformation by laser heat affecting, it is suitable for hot worked laser processing side
Formula, and the diameter of micropore is greater than 0.04mm at this time, just can guarantee that processing back aperture is more round and smooth, in addition presetting spacing is
0.04mm, can guarantee will not get through adjacent two hole in laser processing.
In embodiments of the present invention, in the dust-proof bottom surface label processing stand, the processing stand is also controlled, institute is made
Micropore is stated on the dust-proof bottom and the dust-proof main body of the earpiece in cellular arrangement.
Micropore can be increased, in cellular arrangement, by hole density on dust-proof bottom and the dust-proof main body of earpiece.
Embodiment three
The embodiment of the present invention illustratively shows two kinds of specific embodiments of step S4 in embodiment one, the first tool
Body embodiment are as follows:
The stainless steel substrates with a thickness of 0.07mm~0.15mm when, using wavelength be 355nm ultraviolet picosecond laser；
Adjust the laser processing parameter of the ultraviolet picosecond laser；
The laser focal for adjusting the ultraviolet picosecond laser makes laser spot and the processing point contact；
The ultraviolet picosecond laser, for successively removing the stainless steel material of the processing stand.
In a particular application, the maximum power of ultraviolet picosecond laser be 8W, laser labelling range 100mm × 100mm, this
Laser action principle is to be repeated several times to act on metal surface, removes metal successively, finally reaches required effect, advantage is
Processing effect is good, and heat affected area is small, but efficiency is general.Position, spot size and the shape and laser laser carving of laser spot simultaneously
Parameter has a major impact processing effect, must find the position of laser spot in laser mark process accurately.
Second of specific embodiment are as follows:
The stainless steel substrates with a thickness of 0.08mm~0.2mm when, using wavelength be 1064nm optical fiber nanosecond laser；
And adjust the laser processing parameter of the optical fiber nanosecond laser；
The laser focal for adjusting the optical fiber nanosecond laser makes laser spot and the processing point contact；
The optical fiber nanosecond laser, for the stainless steel material of the processing stand to be warming up to molten condition.
In a particular application, the maximum power of optical fiber nanosecond laser be 200W, laser labelling range 100mm × 100mm,
This laser action principle is to act on laser labelling regional metal being warming up to molten condition by instantaneous energy, is then repeatedly made
With by outside molten condition metal impact to laser action region, advantage is that processing efficiency is fast, and processing efficiency can be controlled in the hole 0.1s/
In range, but appearance need to be optimized by subsequent processing.Position, spot size and the shape and laser radium of laser spot simultaneously
Carving parameter has a major impact processing effect, must find the position of laser spot in laser mark process accurately.
In two kinds of above-mentioned specific embodiments, the focal position of laser is orthogonal.
In two kinds of above-mentioned specific embodiments, laser processing parameter includes mark speed, empty hop rate degree, Q frequency and Q arteries and veins
It is wide.
Wherein, the laser parameter using ultraviolet picosecond laser is as shown in the table:
Laser processing parameter using optical fiber nanosecond laser is as shown in the table:
In two kinds of above-mentioned specific embodiments, dust-proof bottom described in the optical fiber nanosecond laser face, laser by
The dust-proof bottom passes through the dust-proof main body of the earpiece；
Dust-proof bottom described in the ultraviolet picosecond laser face, laser are dust-proof across the earpiece by the dust-proof bottom
Main body.
Example IV
As shown in figure 5, the embodiment of the present invention also shows the detailed implementation process signal of step S5 in above-described embodiment one
Figure, above-mentioned steps S5 may include:
S51, the capillary processing program is write according to punching figure；
S52, process laser to each processing stand according to the punching figure, in the dust-proof bottom and institute
It states the dust-proof main body of earpiece and forms the micropore；
In the punching figure, the inside of each micropore is helically linear.
As shown in fig. 6, the embodiment of the present invention also shows the punching figure based on single micropore.
In a particular application, it is laser machined by the micropore of automation, product consistency with higher can be made, this
Outside, the microcellular structure of zigzag shape is rounder and more smooth relative to circle mode aperture circularity, releases relative to round filling mode heat
Put more uniform, high-efficient, circularity is good.
In one embodiment, also product can be promoted according to sounding demand customed product micropore number of aperture and micro-pore diameter
Performance.
In one embodiment, after step S5, may include:
Removing surface is carried out to the dust-proof bottom and the dust-proof main body of the earpiece.
In a particular application, above-mentioned removing surface process is mainly metal surface treatment process, and implementation step can be with
Including ungrease treatment, pure water cleaning, pickling, pure water cleaning, electropolishing processing, pure water cleaning and the baking step successively carried out.
Since earpiece dust cover is product appearance part, need to be optimal appearance by above-mentioned steps.Degreasing
It handles and can remove the greasy dirt that product surface may adhere to, avoid pollution subsequent pickling, electropolishing solution.Acid pickling step, which can remove, to be produced
The obvious oxide in product surface and attachment residue.Electropolishing program can reduce surface roughness, advanced optimize product appearance.Acid
Washing lotion and electropolishing liquid are low-concentration liquid, repeated multiple times can be used, by subsequent processing, to environment fanout free region.
Embodiment described above is merely illustrative of the technical solution of the present invention, rather than its limitations；Although previous embodiment
Invention is explained in detail, those skilled in the art should understand that: it still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features；And these modification or
Replacement, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution should all include
Within protection scope of the present invention.
Claims (10)
1. a kind of processing method of earpiece dust cover characterized by comprising
S1, stainless steel substrates are obtained, and identifies the thickness of the stainless steel substrates；
S2, the stainless steel substrates are processed as earpiece dust cover by punch forming, the earpiece dust cover includes dust-proof bottom
With with the dust-proof main body of the dust-proof integrally formed earpiece in bottom；
Wherein, the surface of dust-proof bottom is a surface of the stainless steel substrates, and the surface of the dust-proof main body of earpiece is described
Another surface of stainless steel substrates, the distance between two surfaces are the thickness of the stainless steel substrates；
S3, according to the thickness of the stainless steel substrates, mark processing stand in the dust-proof bottom surface；
S4, laser processing mode is selected according to the thickness of the stainless steel substrates, makes laser spot and the processing point contact；
S5, loading simultaneously execute the capillary processing program write in advance, are formed in the dust-proof bottom and the dust-proof main body of the earpiece
Micropore.
2. the processing method of earpiece dust cover as described in claim 1, which is characterized in that the step S3, comprising:
Using the processing stand as the central point of the micropore；
In the dust-proof bottom surface label processing stand, according to the thickness of the stainless steel substrates, two processing stands are adjusted
The distance between；
Wherein, the distance between two described processing stands are the sum of the diameter of the micropore and default spacing, the default spacing
It is corresponding with the thickness of the stainless steel substrates with the diameter of the micropore.
3. the processing method of earpiece dust cover as claimed in claim 2, which is characterized in that the stainless steel substrates with a thickness of
When 0.07mm~0.15mm, the diameter of the micropore is greater than 0.03mm, and the default spacing is 0.04mm；
The stainless steel substrates with a thickness of 0.08mm~0.2mm when, the diameter of the micropore is greater than 0.04mm, the default spacing
For 0.04mm.
4. the processing method of earpiece dust cover as claimed in claim 2, which is characterized in that marked in the dust-proof bottom surface
When processing stand, the processing stand is also controlled, makes the micropore on the dust-proof bottom and the dust-proof main body of the earpiece in honeycomb
Formula arrangement.
5. the processing method of earpiece dust cover as described in claim 1, which is characterized in that the step S4, comprising:
The stainless steel substrates with a thickness of 0.07mm~0.15mm when, using wavelength be 355nm ultraviolet picosecond laser；
Adjust the laser processing parameter of the ultraviolet picosecond laser；
The laser focal for adjusting the ultraviolet picosecond laser makes laser spot and the processing point contact；
The ultraviolet picosecond laser, for successively removing the stainless steel material of the processing stand.
6. the processing method of earpiece dust cover as described in claim 1, which is characterized in that the step S4, comprising:
The stainless steel substrates with a thickness of 0.08mm~0.2mm when, using wavelength be 1064nm optical fiber nanosecond laser；
And adjust the laser processing parameter of the optical fiber nanosecond laser；
The laser focal for adjusting the optical fiber nanosecond laser makes laser spot and the processing point contact；
The optical fiber nanosecond laser, for the stainless steel material of the processing stand to be warming up to molten condition.
7. such as the processing method of the described in any item earpiece dust covers of claim 5 or 6, which is characterized in that the laser processing
Parameter includes mark speed, empty hop rate degree, Q frequency and Q pulsewidth.
8. such as the processing method of the described in any item earpiece dust covers of claim 5 or 6, which is characterized in that the optical fiber nanosecond
Dust-proof bottom described in laser face, laser pass through the dust-proof main body of the earpiece by the dust-proof bottom；
Dust-proof bottom described in the ultraviolet picosecond laser face, laser pass through the dust-proof master of the earpiece by the dust-proof bottom
Body.
9. the processing method of earpiece dust cover as described in claim 1, which is characterized in that the step S5, comprising:
The capillary processing program is write according to punching figure；
Process laser to each processing stand according to the punching figure, it is anti-in the dust-proof bottom and the earpiece
Dirt main body forms the micropore；
In the punching figure, the inside of each micropore is helically linear.
10. the processing method of earpiece dust cover as described in claim 1, which is characterized in that after the step S5, comprising:
Removing surface is carried out to the dust-proof bottom and the dust-proof main body of the earpiece.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN110253216B (en) | 2020-11-06 |
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