CN111975231B - Laser micropore machining method - Google Patents
Laser micropore machining method Download PDFInfo
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- CN111975231B CN111975231B CN202010710607.4A CN202010710607A CN111975231B CN 111975231 B CN111975231 B CN 111975231B CN 202010710607 A CN202010710607 A CN 202010710607A CN 111975231 B CN111975231 B CN 111975231B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The invention provides a laser micropore machining method, which comprises the following steps: preparing a material to be processed; setting the diameter of the micropores to be processed and a marking pattern according to the thickness of the material to be processed, wherein the marking pattern is used for determining the distribution parameters of the micropores in a preset area; determining processing parameters of an ultraviolet laser, wherein the processing parameters comprise at least one of laser frequency, laser pulse width, processing times, scanning speed and pattern filling density; and processing the micropores on the material to be processed by using an ultraviolet laser according to the processing parameters, the diameter of the micropores and the marking pattern, so that the micropores corresponding to the diameter of the micropores are generated on the material to be processed. The laser micropore processing method can effectively improve the light transmission of the micropore array and reduce the damage degree of the oxide layer on the surface of the material, so that a workpiece with a smooth surface, no concave-convex hand feeling and good light transmission can be obtained after processing.
Description
Technical Field
The invention relates to the field of fine processing, in particular to a laser micropore processing method.
Background
With the progress of science and technology and the development of industrialization, micropores and micropores are more and more widely applied in the field of civil consumer products, the requirement on the processing quality of the micropores is higher and higher, and the traditional micropore processing technology cannot meet the requirement. Among the numerous special processing techniques, laser processing is commonly applied in the aspect of micro-hole processing due to the advantages of high efficiency, low cost, easiness in realizing multi-axis linkage control, no material limitation in processing and the like.
In many application fields, for example, in the field of wearable devices such as bluetooth headsets, bracelets, telephone watches, etc., the processed micropores are usually required to have the characteristics of smoothness, light transmission, water resistance, etc. However, when the existing laser marking machine is used for processing, the optical fiber laser with the wavelength of 1064nm is often used for processing, and the optical fiber laser is thermal laser, on one hand, the surface of a material is ablated when the optical fiber laser is processed by laser, so that the surface smoothness of a processed object cannot be ensured, and the processing requirement cannot be met; on the other hand, the traditional optical fiber laser processing can damage the oxide layer on the surface of the metal material and can expose the primary color of the bottom layer of the material, and the processing mode can not achieve the micropore perforation effect that the processed pattern keeps the primary color of the surface of the material and has no hand feeling. Therefore, how to improve the light transmittance of the micropore array and reduce the damage degree of the oxide layer on the surface of the material is the key research point of the micropore process.
Disclosure of Invention
Accordingly, there is a need for a laser micro-hole processing method that can effectively improve the light transmittance of the micro-hole array and reduce the damage degree of the oxide layer on the surface of the material.
The application provides a laser micropore machining method, which comprises the following steps: preparing a material to be processed; setting the diameter of the micropores to be processed and a marking pattern according to the thickness of the material to be processed, wherein the marking pattern is used for determining the distribution parameters of the micropores in a preset area; determining processing parameters of an ultraviolet laser, wherein the processing parameters comprise at least one of laser frequency, laser pulse width, processing times, scanning speed and pattern filling density; and processing the micropores on the material to be processed by using an ultraviolet laser according to the processing parameters, the diameter of the micropores and the marking pattern, so that the micropores corresponding to the diameter of the micropores are generated on the material to be processed.
According to the laser micropore processing method, the diameter of the micropore to be processed, the marking pattern and the processing parameters of the ultraviolet laser are set according to the thickness of the material to be processed, so that the light transmittance of the micropore pattern obtained after processing, the surface smoothness of the periphery of the micropore and the damage degree of surface oxide are controlled, the light transmittance of the micropore array is effectively improved, the damage degree of the oxide layer on the surface of the material is reduced, and the workpiece with a smooth surface, no concave-convex hand feeling and good light transmittance can be obtained after processing.
In one embodiment, the setting of the diameter of the micro-hole to be processed includes: determining a plurality of selectable diameters within a preset micropore diameter range according to the preset micropore diameter range; processing micropores of the test material according to the selectable diameters by using the ultraviolet laser, so that a plurality of first test micropores corresponding to the selectable diameters are generated on the test material; determining the diameter of the micropore to be machined from the plurality of selectable diameter values according to the size and the roundness of each first test micropore; the test material and the material to be processed are made of the same material and have the same thickness.
In one embodiment, said determining a diameter of a micro-hole to be machined from said plurality of selectable diameter values based on a size and a roundness of each of said first test micro-holes comprises; measuring the roundness of each first test micropore and the diameter of a first micropore and the diameter of a second micropore, which are formed on the upper surface and the lower surface of the test material, of each first test micropore; confirming whether the transmittance of the first test micropore meets a first preset condition or not according to the diameter of the first micropore, the diameter of the second micropore and the thickness of the test material; and determining the selectable diameter corresponding to at least one first test micropore with the transmittance meeting the first preset condition and the roundness meeting the second preset condition as the diameter of the micropore to be processed.
In one embodiment, the determining the processing parameters of the ultraviolet laser comprises: acquiring initial processing parameters of the ultraviolet laser; processing the micro holes of the test material by using the ultraviolet laser according to the initial processing parameters, the diameter of the micro holes and the marking pattern, so that second test micro holes corresponding to the initial processing parameters are generated on the test material; judging whether the parameters of the oxide layer on the surface of the test material at the periphery of the second test micropore meet third preset conditions or not; when the parameters of the oxide layer on the surface of the test material do not accord with the third preset conditions, adjusting the processing parameters of the ultraviolet laser until the parameters of the oxide layer on the surface of the test material, which is obtained by processing the micro-hole according to the adjusted processing parameters, on the periphery of the second test micro-hole accord with the third preset conditions; determining the processing parameter of the ultraviolet laser as the adjusted processing parameter; the test material and the material to be processed are made of the same material and have the same thickness.
In one embodiment, the determining whether the parameter of the surface oxidation layer of the test material around the second test micro-hole meets a third preset condition includes: judging whether the damage degree of the oxide layer on the surface of the test material at the periphery of the second test micropore is smaller than a first preset threshold value or not; and if the damage degree is smaller than the first preset threshold value, judging that the parameters of the oxide layer on the surface of the test material at the periphery of the second test micropore meet the third preset condition.
In one embodiment, the adjusting the processing parameter of the ultraviolet laser includes: when the damage degree is larger than the preset threshold value, executing at least one machining parameter adjustment strategy, wherein the at least one machining parameter adjustment strategy comprises the following steps: at least one of increasing the laser frequency of the ultraviolet laser, decreasing the laser pulse width of the ultraviolet laser, and decreasing the pattern fill density of the ultraviolet laser.
In one embodiment, the method further comprises: detecting the plugging rate of the second test micropores; and if the hole plugging rate of the second test micro hole is greater than a second preset threshold value, increasing the pattern filling density of the ultraviolet laser.
In one embodiment, the marking pattern is used for determining the distribution density or the distribution quantity of the micropores in the preset area.
In one embodiment, the material to be processed is a metal or metal oxide with a thickness of 0.15mm-0.2 mm; the diameter of the micropore to be processed is 0.06 mm; the marking pattern is used for determining that the distribution number of the micropores in a circular area with the diameter of 1mm is 60-80.
In one embodiment, the determining the processing parameters of the ultraviolet laser comprises: and determining the laser frequency of the ultraviolet laser to be 50KHz, the laser pulse width to be 9ns, the pattern filling density to be 0.005mm and the scanning speed to be 300 mm/S.
Drawings
FIG. 1 is a schematic flow chart of a laser micro-via machining method in one embodiment;
FIG. 2 is a schematic view of a marking pattern in one embodiment;
FIG. 3 is a cross-sectional view of a via formed according to the laser via machining method described above in one embodiment;
FIG. 4 is a schematic flow chart of a laser micro-via machining method according to another embodiment;
FIG. 5 is a schematic flow chart of a laser micro-via machining method in yet another embodiment.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
The present invention provides a laser micro-via machining method, as shown in fig. 1, which in one embodiment comprises the steps of:
and S110, preparing a material to be processed.
Wherein, the material to be processed is the material needing micro-pore processing. The laser micropore machining method of the embodiment is a method for generating micropores on a material to be machined through laser equipment such as an ultraviolet laser.
In this embodiment, the material to be processed is a metal or a metal oxide, and the material to be processed may be anodized aluminum, for example.
And S130, setting the diameter of the micropore to be processed and the marking pattern according to the thickness of the material to be processed.
Marking means marking various figures and characters on the surface of an object. In this embodiment, the marking pattern is used to enable the ultraviolet laser to generate a micropore pattern on the material to be processed, which is consistent with the marking pattern. Specifically, the marking pattern is used to determine the distribution parameters of the micropores within a predetermined area. For example, the marking pattern is used to determine the distribution density or the distribution number of the micropores in a predetermined area. The diameter of the micropore to be processed and the marking pattern are arranged according to the thickness of the material to be processed, so that the marking pattern and the diameter of the micropore are suitable for the thickness of the material to be processed, and the micropore obtained by processing is guaranteed to have good light transmittance.
As an embodiment, the marking pattern may be a pattern composed of a plurality of micro-hole patterns, and the distribution number, the distribution density, and the distribution position of each micro-hole of the plurality of micro-hole patterns may be directly determined according to the marking pattern. In addition, the diameter of each micro-hole can be determined according to the marking pattern. For example, fig. 2 is an example of a marking pattern which is a circle having a diameter of 1mm and is composed of 69 micro-hole patterns, and according to which it can be determined that the number of micro-holes distributed in the area of the circle having a diameter of 1mm is 69 and each micro-hole has a diameter of 0.08 mm.
S150, determining processing parameters of the ultraviolet laser, wherein the processing parameters comprise at least one of laser frequency, laser pulse width, processing times, scanning speed and pattern filling density.
In this embodiment, the ultraviolet laser generates the micro-holes on the material to be processed, wherein the destruction rate and the smoothness of the surface oxide around the micro-holes after the processing is completed are related to the processing parameters of the ultraviolet laser. For example, the lower the laser frequency of the ultraviolet laser during drilling, the higher the single-point laser pulse power, the more easily the oxide layer around the micro-hole is damaged; for another example, the larger the laser pulse width of the ultraviolet laser, the larger the laser power, the more easily the oxide layer around the hole is damaged; as another example, the higher the pattern fill density of the laser, the more likely it is to cause heat build-up and, therefore, damage to the oxide layer around the hole. Therefore, in order to control the degree of destruction of the surface oxide in the periphery of the micro-hole to a certain extent, suitable processing parameters are determined before the micro-hole processing is performed.
Optionally, the processing parameters of the ultraviolet laser can be determined according to the thickness of the material to be processed; or determining the processing parameters of the ultraviolet laser according to the material of the material to be processed; or determining the processing parameters of the ultraviolet laser according to the material and the thickness of the material to be processed; or, determining the processing parameters of the ultraviolet laser according to the material and the thickness of the material to be processed and the marking pattern.
And S170, processing the micropores on the material to be processed by using an ultraviolet laser according to the processing parameters, the diameter of the micropores and the marking pattern, so that the micropores corresponding to the diameters of the micropores are formed on the material to be processed.
After the diameter of the micropores, the marking patterns and the processing parameters are determined, the ultraviolet laser can be used for processing the micropores of the material to be processed, and micropores corresponding to the diameters of the micropores are generated on the material to be processed.
It should be noted that, since the laser energy changes during the process of penetrating the material to be processed, the sizes of the micro holes formed on the upper and lower surfaces of the material to be processed may be slightly different and may not be completely consistent with the diameter of the micro holes determined above. For example, as shown in fig. 3, when the set diameter of the micro-hole is 0.06mm, the micro-hole formed on the material to be processed having a thickness of 0,15mm according to the set processing parameters and the marking pattern may be a tapered micro-hole having a top diameter of 0.08mm and a bottom diameter of 0.05 mm.
In this embodiment, set up the micropore diameter of waiting to process, mark figure and ultraviolet laser's processing parameter according to the thickness of waiting to process the material for the luminousness of the micropore pattern that obtains after the processing, the peripheral surface smoothness of micropore and the surface oxide destruction degree obtain control, thereby effectively improve the light transmissivity of micropore array and reduce the destruction degree of material surface oxide layer, make and can obtain the work piece that the surface is level and smooth, unsmooth handle and the light transmissivity is good after the processing.
In one embodiment, to determine the appropriate pore diameter, a test material having the same material and thickness as the material to be processed may be tested to determine the appropriate pore diameter, and the determined pore diameter may be applied to the processing of the object to be processed. Specifically, as shown in fig. 4, the step of setting the diameter of the micro-hole to be processed in step S130 includes:
s131, determining a plurality of selectable diameters within the micropore diameter range according to the preset micropore diameter range.
In this embodiment, the predetermined diameter of the micro-holes may be in the range of 0.04mm to 0.08mm, and a plurality of selectable diameters within this range may include: 0.04mm, 0.05mm, 0.06mm, 0.07mm and 0.08 mm.
And S133, respectively carrying out micropore processing on the test material according to each selectable diameter by using an ultraviolet laser, so that a plurality of first test micropores corresponding to each selectable diameter are generated on the test material.
In this embodiment, an ultraviolet laser is used to process a test material according to diameters of 0.04mm, 0.05mm, 0.06mm, 0.07mm and 0.08mm, so that corresponding micropores are formed in the test material, and the micropores in the test material are referred to as first test micropores.
And S135, determining the diameter of the micropore to be processed from a plurality of selectable diameter values according to the size and the roundness of each first test micropore.
Specifically, the roundness of each first test micropore and the diameters of a first micropore and a second micropore formed by each first test micropore on the upper surface and the lower surface of the test material can be measured; confirming whether the transmittance of the first test micropore meets a first preset condition or not according to the diameter of the first micropore, the diameter of the second micropore and the thickness of the test material; and determining the selectable diameter corresponding to at least one first test micropore with the transmittance meeting a first preset condition and the roundness meeting a second preset condition as the diameter of the micropore to be processed.
In this embodiment, the test material and the material to be processed are made of the same material and have the same thickness, and therefore, under the condition that the processing parameters and the marking patterns are consistent, the micropores formed in the test material according to the same micropore diameter are approximately the same as the micropores formed in the material to be processed, and therefore, the diameter of the micropores suitable for the test material is set to be the diameter of the micropores of the material to be processed, and the light transmittance and the roundness of the micropores formed in the material to be processed can be improved.
In one embodiment, to determine the appropriate processing parameters, adjustments may be made to the initial processing parameters of the uv laser and the adjusted processing parameters verified using the same test material as the material to be processed to obtain the appropriate processing parameters. Specifically, as shown in fig. 5, the step S150 includes:
and S151, acquiring initial processing parameters of the ultraviolet laser.
Optionally, the initial processing parameter of the ultraviolet laser may be a parameter manually selected by a user, or may be a default processing parameter of the ultraviolet laser, or may be a processing parameter used last time by the ultraviolet laser.
And S153, processing the micropores of the test material by using an ultraviolet laser according to the initial processing parameters, the diameter of the micropores and the marking pattern, so that second test micropores corresponding to the initial processing parameters are generated on the test material.
The test material and the material to be processed are made of the same material and have the same thickness.
S155, judging whether the parameters of the surface oxidation layer of the test material at the periphery of the second test micropore meet third preset conditions.
The third preset condition is mainly used for judging whether the damage degree of the oxide layer on the surface of the test material at the periphery of the second test micropore meets the requirement or not. Specifically, whether the damage degree of the oxide layer on the surface of the test material around the second test micropore is smaller than a first preset threshold value or not can be judged; and if the damage degree is smaller than the first preset threshold value, judging that the parameters of the oxide layer on the surface of the test material at the periphery of the second test micropore meet a third preset condition. In other words, when the damage degree is smaller than the first preset threshold, it indicates that the current processing parameter meets the requirement, and the processing parameter may not be adjusted; on the contrary, when the damage degree reaches the first preset threshold, the current processing parameters of the surface do not meet the requirements, and the current processing parameters need to be adjusted to reduce the damage degree of the oxide layer on the surface of the processed material.
And S157, when the parameters of the oxide layer on the surface of the test material do not accord with the third preset condition, adjusting the processing parameters of the ultraviolet laser until the parameters of the oxide layer on the surface of the test material, which is obtained by processing the micro-hole according to the adjusted processing parameters, on the periphery of the second test micro-hole accord with the third preset condition.
In this embodiment, when the parameter of the oxide layer on the surface of the test material does not meet the third preset condition, that is, the damage degree of the laser micro-hole processing on the oxide layer on the surface of the test material is greater than the first preset threshold, the processing parameter of the ultraviolet laser needs to be adjusted to reduce the damage degree on the oxide layer on the surface of the processing material. Specifically, the lower the laser frequency of the ultraviolet laser is during punching, the higher the single-point laser pulse power is, the more easily the oxide layer around the micropore is damaged; the larger the laser pulse width of the ultraviolet laser is, the larger the laser power is, and the more easily the oxide layer around the hole is damaged; the larger the pattern filling density of the laser is, the more easily heat accumulation is caused, and therefore, the oxide layer around the hole is more easily damaged, and therefore, in order to make the surface oxide layer parameter satisfy the third preset condition, the method for adjusting the processing parameter of the ultraviolet laser may include at least one of the following: the laser frequency of the ultraviolet laser is increased, the laser pulse width of the ultraviolet laser is reduced, and the pattern filling density of the ultraviolet laser is reduced.
And S159, determining the processing parameters of the ultraviolet laser as the adjusted processing parameters.
In this embodiment, the test material and the material to be processed are made of the same material and have the same thickness, and therefore, under the condition that the diameter of the micropore is consistent with the marking pattern, the micropore generated on the test material according to the same processing parameter is approximately the same as the micropore generated on the material to be processed, and therefore, the processing parameter suitable for the test material is set as the processing parameter of the material to be processed, so that the damage to the surface oxide layer of the material to be processed in the micropore processing process can be reduced, and the thermal erosion effect in the micropore processing process is controlled, so that micropores with better smoothness, lower surface oxide layer damage degree and better quality are obtained.
In one embodiment, the laser micro-hole machining method further includes: detecting the plugging rate of the second test micropores; and if the hole plugging rate of the second test micro hole is larger than a second preset threshold value, increasing the pattern filling density of the ultraviolet laser. Specifically, when ultraviolet laser's figure packing density is lower, the perforating effect is relatively poor, leads to stifled hole easily, consequently, when detecting that the stifled hole rate of second test micropore is greater than the second and predetermines the threshold value, can increase ultraviolet laser's figure packing density in order to promote the perforating effect, reduce stifled hole rate to further promote micropore processingquality.
In one embodiment, the material to be processed is a metal or metal oxide having a thickness of 0.15mm to 0.2 mm; the diameter of the micropore to be processed is 0.06 mm; the marking pattern was used to determine the number of micro-holes distributed in a circular area having a diameter of 1mm to be 60-80.
In one embodiment, determining processing parameters of the ultraviolet laser comprises: the laser frequency of the ultraviolet laser is determined to be 50KHz, the laser pulse width is 9ns, the pattern filling density is 0.005mm, and the scanning speed is 300 mm/S.
The inventor repeatedly researches and discovers that for metal or metal oxide with the thickness of 0.15mm-0.2mm, the micropore with the diameter of 0.06mm and the number of 60-80 micropores in a circular area with the thickness of 1mm can generate micropores with better light transmittance on the material to be processed. On the basis, when the laser frequency is 50KHz, the laser pulse width is 9ns, the pattern filling density is 0.005mm, and the scanning speed is 300mm/S, the thermal etching effect can be effectively controlled, the damage degree to the metal oxide layer is reduced, and micropores with smooth hand feeling, good light transmission and consistent micropore color and oxide layer color are obtained.
The laser micro-hole processing method according to the embodiment of the present invention is described below by way of a specific example. Specifically, in this embodiment, the material to be processed is anodized aluminum, the thickness is 0.15mm to 0.20mm, and the ultraviolet laser processing technique uses ultraviolet laser with a wavelength of 355nm and a wavelength of 15W to process a workpiece, which is an anodized aluminum workpiece.
Firstly, designing a pattern with the diameter of a micropore of 0.04mm-0.08mm, and testing the size and the roundness of the micropore on the surface and the bottom of a material by using an ultraviolet laser; specifically, a biaxial high-speed scanning galvanometer system is adopted, and an F160mm optical scanning lens is used for micropore processing. In order to ensure the top and bottom rounding of the micro-holes, the pattern fill density of the UV laser was set to 0.005 mm. Specifically, for materials of 0.15mm to 0.2mm thickness, when different micropore diameters are selected, the workpiece produces micropores with tapered pore diameters as follows:
secondly, preparing a marking graph, wherein the diameter of the micropore of 0.06mm is selected as the marking graph, and the marking graph is designed to be a circular micropore array with 69 micropores within the diameter of 1mm, namely the marking graph is provided with 69 micropores distributed in the range of a circle with the diameter of 1 mm. As can be seen from the above table, when the work is processed according to the marking pattern, 69 micro-holes having a top diameter of 0.08mm and a bottom diameter of 0.045-0.05 can be formed in a circular range having a diameter of 1 mm.
Then, processing micropores on the metal/metal oxide material by using the marking pattern through an ultraviolet laser according to different laser frequencies, laser pulse widths and processing times, and finding out technological parameters which can puncture the metal/metal oxide material with the thickness of 0.15mm and can not damage an oxide layer on the surface of the metal. Through repeated research of the inventor, when the workpiece is anodized aluminum, the laser frequency is set to be 50KHz, the laser pulse width is set to be 9ns, the pattern filling density is 0.005mm, and the scanning speed is 300mm/S, so that a better effect can be realized.
And finally, cleaning the processed micropore product by using ultrasonic equipment, sealing the micropore by using transparent adhesive tape, polishing and observing the light transmission effect of the micropore, and observing the damage condition of the oxide layer at the periphery of the metal micropore by using a magnifier. The number of processing times is adjusted according to the light transmission effect, for example, the light transmission effect is detected for 40 times, 50 times, 60 times, 70 times, 80 times and 90 times respectively, when the number of processing times is 80 times, the conical aperture with the top surface diameter of 0.08mm and the conical aperture with the bottom surface diameter of 0.05mm are obtained, and the light transmission effect is optimal.
In the embodiment, the ultraviolet laser is adopted to process the metal oxide workpiece with the thickness of 0.15mm-0.2mm, 69 micropores are distributed in the area with the diameter of 1mm, the requirement on the roundness of the inlet and outlet of each micropore is met, the conical aperture with the diameter of 0.08mm at the bottom of each through hole is also met, the light transmission effect of each micropore is met, the marking frequency is adjusted during ultraviolet laser processing, the laser frequency, the laser pulse width and the scanning speed are adjusted, the processed metal workpiece has a smooth surface and no concave-convex hand feeling, the metal oxide layer is not damaged during observation under a magnifier, the color of each micropore is consistent with the color of the oxide layer, the whole processing process is convenient to operate, and is non-contact and pollution-free, the appearance quality of the processed product is ensured, and the additional value of the product is greatly improved.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
It should be noted that the terms "vertical," "horizontal," "up," "down," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A laser micro-hole machining method, comprising:
preparing a material to be processed;
setting the diameter of the micropores to be processed and a marking pattern according to the thickness of the material to be processed, wherein the marking pattern is used for determining the distribution parameters of the micropores in a preset area;
determining processing parameters of an ultraviolet laser, wherein the processing parameters comprise at least one of laser frequency, laser pulse width, processing times, scanning speed and pattern filling density;
processing the micropores on the material to be processed by using an ultraviolet laser according to the processing parameters, the diameter of the micropores and the marking pattern, so that the micropores corresponding to the diameter of the micropores are generated on the material to be processed;
the determining of the processing parameters of the ultraviolet laser comprises the following steps:
acquiring initial processing parameters of the ultraviolet laser;
processing the micro holes of the test material by using the ultraviolet laser according to the initial processing parameters, the diameter of the micro holes and the marking pattern, so that second test micro holes corresponding to the initial processing parameters are generated on the test material;
judging whether the parameters of the oxide layer on the surface of the test material at the periphery of the second test micropore meet third preset conditions or not;
when the parameters of the oxide layer on the surface of the test material do not accord with the third preset conditions, adjusting the processing parameters of the ultraviolet laser until the parameters of the oxide layer on the surface of the test material, which is obtained by processing the micro-hole according to the adjusted processing parameters, on the periphery of the second test micro-hole accord with the third preset conditions;
determining the processing parameter of the ultraviolet laser as the adjusted processing parameter;
the test material and the material to be processed are made of the same material and have the same thickness.
2. The laser micro-hole machining method of claim 1, wherein the setting of the diameter of the micro-hole to be machined comprises:
determining a plurality of selectable diameters within a preset micropore diameter range according to the preset micropore diameter range;
processing micropores of the test material according to the selectable diameters by using the ultraviolet laser, so that a plurality of first test micropores corresponding to the selectable diameters are generated on the test material;
determining the diameter of the micropore to be machined from the plurality of selectable diameter values according to the size and the roundness of each first test micropore;
the test material and the material to be processed are made of the same material and have the same thickness.
3. The laser micro-hole machining method of claim 2, wherein said determining a diameter of a micro-hole to be machined from said plurality of selectable diameter values based on a size and a roundness of each of said first test micro-holes comprises;
measuring the roundness of each first test micropore and the diameter of a first micropore and the diameter of a second micropore, which are formed on the upper surface and the lower surface of the test material, of each first test micropore;
confirming whether the transmittance of the first test micropore meets a first preset condition or not according to the diameter of the first micropore, the diameter of the second micropore and the thickness of the test material;
and determining the selectable diameter corresponding to at least one first test micropore with the transmittance meeting the first preset condition and the roundness meeting the second preset condition as the diameter of the micropore to be processed.
4. The laser micropore machining method of claim 1, wherein said determining whether the test material surface oxidation layer parameter around the second test micropore meets a third predetermined condition comprises
Judging whether the damage degree of the oxide layer on the surface of the test material at the periphery of the second test micropore is smaller than a first preset threshold value or not;
and if the damage degree is smaller than the first preset threshold value, judging that the parameters of the oxide layer on the surface of the test material at the periphery of the second test micropore meet the third preset condition.
5. The laser micro-hole machining method of claim 4, wherein the adjusting the machining parameters of the ultraviolet laser comprises:
when the damage degree is larger than the first preset threshold, executing at least one machining parameter adjustment strategy, wherein the at least one machining parameter adjustment strategy comprises the following steps: at least one of increasing the laser frequency of the ultraviolet laser, decreasing the laser pulse width of the ultraviolet laser, and decreasing the pattern fill density of the ultraviolet laser.
6. The laser micro-hole machining method of claim 1, 4 or 5, further comprising:
detecting the plugging rate of the second test micropores;
and if the hole plugging rate of the second test micro hole is greater than a second preset threshold value, increasing the pattern filling density of the ultraviolet laser.
7. The laser micropore machining method as claimed in any one of claims 1 to 5, wherein said marking pattern is used for determining a distribution density or a distribution number of micropores within a predetermined area.
8. The laser micro-hole machining method according to claim 7,
the material to be processed is metal or metal oxide with the thickness of 0.15mm-0.2 mm;
the diameter of the micropore to be processed is 0.06 mm;
the marking pattern is used for determining that the distribution number of the micropores in a circular area with the diameter of 1mm is 60-80.
9. The laser micro-hole machining method of claim 8, wherein determining the machining parameters of the ultraviolet laser comprises: and determining the laser frequency of the ultraviolet laser to be 50KHz, the laser pulse width to be 9ns, the pattern filling density to be 0.005mm and the scanning speed to be 300 mm/S.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003290956A (en) * | 2002-01-31 | 2003-10-14 | Kyocera Corp | Method for boring to ceramic substrate and mask for printing |
| CN102151997A (en) * | 2011-01-31 | 2011-08-17 | 华中科技大学 | Method for processing micropore of patch clamp chip |
| CN102645171A (en) * | 2012-05-14 | 2012-08-22 | 厦门理工学院 | Device and method for measuring size and roundness of tiny round hole at same time |
| CN103143841A (en) * | 2013-03-08 | 2013-06-12 | 西北工业大学 | Method for hole machining with picosecond laser |
| CN111215765A (en) * | 2018-11-26 | 2020-06-02 | 大族激光科技产业集团股份有限公司 | Processing method for processing precise photosensitive hole by ultraviolet laser and laser equipment |
| CN111347179A (en) * | 2020-03-17 | 2020-06-30 | 大族激光科技产业集团股份有限公司 | Ultraviolet laser processing technology and system for light-transmitting micropores of electronic equipment |
-
2020
- 2020-07-22 CN CN202010710607.4A patent/CN111975231B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003290956A (en) * | 2002-01-31 | 2003-10-14 | Kyocera Corp | Method for boring to ceramic substrate and mask for printing |
| CN102151997A (en) * | 2011-01-31 | 2011-08-17 | 华中科技大学 | Method for processing micropore of patch clamp chip |
| CN102645171A (en) * | 2012-05-14 | 2012-08-22 | 厦门理工学院 | Device and method for measuring size and roundness of tiny round hole at same time |
| CN103143841A (en) * | 2013-03-08 | 2013-06-12 | 西北工业大学 | Method for hole machining with picosecond laser |
| CN111215765A (en) * | 2018-11-26 | 2020-06-02 | 大族激光科技产业集团股份有限公司 | Processing method for processing precise photosensitive hole by ultraviolet laser and laser equipment |
| CN111347179A (en) * | 2020-03-17 | 2020-06-30 | 大族激光科技产业集团股份有限公司 | Ultraviolet laser processing technology and system for light-transmitting micropores of electronic equipment |
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