CN107613646A - A kind of wiring board V cut processing methods - Google Patents
A kind of wiring board V cut processing methods Download PDFInfo
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- CN107613646A CN107613646A CN201710608247.5A CN201710608247A CN107613646A CN 107613646 A CN107613646 A CN 107613646A CN 201710608247 A CN201710608247 A CN 201710608247A CN 107613646 A CN107613646 A CN 107613646A
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Abstract
The present invention discloses a kind of wiring board V cut processing methods, comprises the following steps：S1, the depth of cut according to the thickness of wiring board setting cutting machine and the position of cutting times and wiring board Cutting Road.S2, according to the depth of cut that step S1 is set the two sides of wiring board is cut simultaneously, after completing the cutting of the first knife, second is carried out using same depth of cut to the same cutting position of wiring board to cut, by that analogy, until completing the cutting times set described in step 1.S3, after completing step S2 cutting operation, the depth of cut of wiring board is measured, according to the depth data of measurement compared with total depth of cut of setting, carry out mending knife according to the difference after comparison and cut, so as to reach the depth of cut of setting.The wiring board V cut processing methods of the present invention carry out V cut processing using multiple cutting mode is segmented, so as to be more than 2.0mm wiring board, the needs produced suitable for sample line plate and small lot using conventional V cut equipment production thickness.
Description
Technical field
The present invention relates to wiring board cutting technique field, more particularly to a kind of wiring board V-cut processing methods.
Background technology
As electronic product development is fast changing, people are intelligentized to electronic product to require more and more higher, to wiring board
It is required that configuration it is more accurate, it is desirable to the number of plies is higher.The circuit board pressing number of plies is higher, and inevitable circuit plate thickness is thicker.
Thicker wiring board is more difficult, it is necessary to purchase the special powerful devices of V-cut and thicken more sawtooth when being molded V-cut and making
Blade carries out wiring board V-cut processing, and conventional V-cut equipment can not generally make wiring board of the thickness of slab more than 2.5mm thickness.
Conventional line plate designs its thickness within 0.5mm-2.0mm, beyond the general pole of the wiring board of this scope
Few enterprise makes inquiries, because thickness is higher, loss of the material to cutter is bigger, and also can be very on the precision influence of cutter cutting
Greatly.Such as length 15.9mm* width 2.5mm* thickness 3.5mm wiring board, only its design thickness nearly exceeds conventional design mark
Accurate 2 times, can directly cause to cut that groove is deep mixed, it is motionless to cut, in insert pocket or cuts off wiring board during shaping V-cut processing
Phenomenon, cause product rejection, to guarantee the wiring board of more than V-cut2.0mm thickness, most of enterprise is all in accordance with slab
Order share decides whether to purchase high-power, double-deck cutter (thickening), cut more tooth V-cut machining equipments replace it is normal
Advise V-cut equipment.However, production cost can not only be increased using powerful device special V-cut, and V-cut is special
Powerful device can only be processed to wiring board of the thickness more than more than 2.0mm, and the cutting of its conventional line plate, effect is without one
As cutting machine effect it is good, therefore cause the wasting of resources, be unfavorable for the production development of enterprise.Therefore, using the forming machine of routine
It is that those skilled in the art need to solve the problems, such as that equipment makes to wiring board processing V-cut of the thickness more than more than 2.0mm.
The content of the invention
The purpose of the present invention is to overcome weak point of the prior art, there is provided a kind of wiring board V-cut processing methods, is made
Conventional forming machine equipment can be used to carrying out V-cut processing to wiring board of the thickness more than more than 2.0mm by obtaining.
The purpose of the present invention is achieved through the following technical solutions：
A kind of wiring board V-cut processing methods, comprise the following steps：
S1, the depth of cut according to the thickness of wiring board setting cutting machine and the position of cutting times and wiring board Cutting Road
Put；
S2, according to the depth of cut that step S1 is set the two sides of wiring board is cut simultaneously, complete the cutting of the first knife
Afterwards, carry out second to the same cutting position of wiring board using same depth of cut to cut, by that analogy, until completing step
The cutting times of 1 setting；
S3, after completing step S2 cutting operation, the depth of cut of wiring board is measured, according to the depth number of measurement
Compared with according to total depth of cut with setting, carried out mending knife cutting according to the difference after comparison, so as to reach cutting for setting
Cut depth.
As a kind of preferable scheme of the present invention, the depth of cut of the step S1 is in the range of 0.4mm-0.8mm.
As a kind of preferable scheme of the present invention, the cutting times of the step S1 are in the scope of 3-5/ times.
As a kind of preferable scheme of the present invention, the cutting machine of the step S1 is V-cut cutting machines.
Compared with prior art, the present invention has advantages below：
The wiring board V-cut processing methods of the present invention carry out V-cut processing using multiple cutting mode is segmented, so as to
It is more than 2.0mm wiring board, the need produced suitable for sample line plate and small lot using conventional V-cut equipment production thickness
Will.Solve the problems, such as to need to purchase special V-cut equipment progress specific thicknesses wiring board processing, prevent the wasting of resources, have
Very strong practicality.
Brief description of the drawings
Fig. 1 is the structure chart of the wiring board of one embodiment of the invention.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give the better embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make to understand more the disclosure
Add thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more
The arbitrary and all combination of related Listed Items.
As shown in figure 1, the structure chart of the wiring board 100 for one embodiment of the invention.
A kind of wiring board V-cut processing methods, comprise the following steps：
S1, the depth of cut according to the thickness of wiring board setting cutting machine and the position of cutting times and wiring board Cutting Road
Put；
S2, according to the depth of cut that step S1 is set the two sides of wiring board is cut simultaneously, complete the cutting of the first knife
Afterwards, carry out second to the same cutting position of wiring board using same depth of cut to cut, by that analogy, until completing step
The cutting times of 1 setting；
S3, after completing step S2 cutting operation, the depth of cut of wiring board is measured, according to the depth number of measurement
Compared with according to total depth of cut with setting, carried out mending knife cutting according to the difference after comparison, so as to reach cutting for setting
Cut depth.
S4. the circuit test of correlation is entered to the wiring board after completion cutting processing.
S5. use whether the artificial visual condition for carrying out sight check wiring board meets production and processing after completing circuit test
It is required that.
S6. after completing visual detection, qualified wiring board is subjected to packaging and storage.
In the present embodiment, step S1 depth of cut is in the range of 0.4mm-0.8mm.Step S1 cutting times exist
In the scope of 3-5/ times.Step S1 cutting machine is V-cut cutting machines.In practical operation, because can be real after cutting per knife
Border measures, and is unified in last knife and mends knife, if the control of last knife in 0.4-0.8mm scope cans, under normal circumstances
It is exactly 0.4mm, because the precision of equipment can ensure 10% deviation in 0.4mm, and CPK can control the ability mark 1.67
Standard, therefore, the depth of cut wiring board precision that institute's cutting processing comes out in the range of 0.4mm-0.8mm are of a relatively high.And
Per knife, the size of cutting is in the range of 0.4mm-0.8mm so that resistance and depth accuracy deviation suffered by equipment all can be very
It is small, therefore cutter rotating velocity can suitably tune up 20%-30%, cutter speed lifts 1 times.
Referring to Fig. 1, one embodiment of the invention provides the wiring board 100 that a kind of thickness is 3.5mm, cuts as defined in it
It is 0.3mm that the thickness of plate 110 is remained after cutting, and according to above-mentioned cutting method, sets cutter 200 per knife depth of cut as 0.4mm, altogether
Five knives are cut, then the 5th knife is the benefit knife after measurement.Cut by the way of positive and negative is cut simultaneously, then cut above four
Depth after knife is less than or equal to 1.6mm, and then mending knife operation by the 5th knife again makes depth of cut reach 1.6mm, and positive and negative two
It is then 3.2mm that the depth of cut in face, which adds up, so as to remain the requirement that the thickness of plate 110 is 0.3mm after cutting as defined in reaching.
Compared with prior art, the present invention has advantages below：
The wiring board V-cut processing methods of the present invention carry out V-cut processing using multiple cutting mode is segmented, so as to
It is more than 2.0mm wiring board, the need produced suitable for sample line plate and small lot using conventional V-cut equipment production thickness
Will.Solve the problems, such as to need to purchase special V-cut equipment progress specific thicknesses wiring board processing, prevent the wasting of resources, have
Very strong practicality.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (4)
1. a kind of wiring board V-cut processing methods, it is characterised in that comprise the following steps：
S1, the depth of cut according to the thickness of wiring board setting cutting machine and the position of cutting times and wiring board Cutting Road；
S2, according to the depth of cut that step S1 is set the two sides of wiring board is cut simultaneously, after completing the cutting of the first knife, adopted
Second is carried out to the same cutting position of wiring board with same depth of cut to cut, by that analogy, until completing described in step 1
The cutting times of setting；
S3, after completing step S2 cutting operation, the depth of cut of wiring board is measured, according to the depth data of measurement with
Total depth of cut of setting is compared, and is carried out mending knife cutting according to the difference after comparison, so as to reach the cutting of setting depth
Degree.
2. wiring board V-cut processing methods according to claim 1, it is characterised in that the depth of cut of the step S1
In the range of 0.4mm-0.8mm.
3. wiring board V-cut processing methods according to claim 1, it is characterised in that the cutting times of the step S1
In the scope of 3-5/ times.
4. wiring board V-cut processing methods according to claim 1, it is characterised in that the cutting machine of the step S1 is
V-cut cutting machines.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710608247.5A CN107613646A (en) | 2017-07-24 | 2017-07-24 | A kind of wiring board V cut processing methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710608247.5A CN107613646A (en) | 2017-07-24 | 2017-07-24 | A kind of wiring board V cut processing methods |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107613646A true CN107613646A (en) | 2018-01-19 |
Family
ID=61059783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710608247.5A Pending CN107613646A (en) | 2017-07-24 | 2017-07-24 | A kind of wiring board V cut processing methods |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107613646A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110769600A (en) * | 2019-09-24 | 2020-02-07 | 惠州市金百泽电路科技有限公司 | Processing method of V-shaped groove of super-thick metal substrate printed board |
| CN111113238A (en) * | 2019-12-31 | 2020-05-08 | 太仓市何氏电路板有限公司 | V-CUT processing technology for forming and processing V-shaped groove of aluminum substrate |
| CN113923897A (en) * | 2021-09-23 | 2022-01-11 | 依利安达(广州)电子有限公司 | PCB manufacturing method and PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02119198A (en) * | 1988-10-28 | 1990-05-07 | Tanaka Kikinzoku Kogyo Kk | Outside forming method of printed board |
| CN102438399A (en) * | 2011-09-30 | 2012-05-02 | 景旺电子科技(龙川)有限公司 | Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof |
| CN106714456A (en) * | 2016-12-06 | 2017-05-24 | 深圳市深联电路有限公司 | Method of high-precision numerical control V-CUT de-capping on metal copper substrate |
-
2017
- 2017-07-24 CN CN201710608247.5A patent/CN107613646A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02119198A (en) * | 1988-10-28 | 1990-05-07 | Tanaka Kikinzoku Kogyo Kk | Outside forming method of printed board |
| CN102438399A (en) * | 2011-09-30 | 2012-05-02 | 景旺电子科技(龙川)有限公司 | Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof |
| CN106714456A (en) * | 2016-12-06 | 2017-05-24 | 深圳市深联电路有限公司 | Method of high-precision numerical control V-CUT de-capping on metal copper substrate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110769600A (en) * | 2019-09-24 | 2020-02-07 | 惠州市金百泽电路科技有限公司 | Processing method of V-shaped groove of super-thick metal substrate printed board |
| CN111113238A (en) * | 2019-12-31 | 2020-05-08 | 太仓市何氏电路板有限公司 | V-CUT processing technology for forming and processing V-shaped groove of aluminum substrate |
| CN111113238B (en) * | 2019-12-31 | 2021-05-18 | 太仓市何氏电路板有限公司 | V-CUT processing technology for forming and processing V-shaped groove of aluminum substrate |
| CN113923897A (en) * | 2021-09-23 | 2022-01-11 | 依利安达(广州)电子有限公司 | PCB manufacturing method and PCB |
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Application publication date: 20180119 |
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