CN206169491U - System for laser scribing - Google Patents
System for laser scribing Download PDFInfo
- Publication number
- CN206169491U CN206169491U CN201621169904.8U CN201621169904U CN206169491U CN 206169491 U CN206169491 U CN 206169491U CN 201621169904 U CN201621169904 U CN 201621169904U CN 206169491 U CN206169491 U CN 206169491U
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- Prior art keywords
- pulse
- train
- scribing
- laser
- polarization
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Abstract
The utility model provides a system for laser scribing, include: a laser instrument for generating the envelope is adjustable, linear polarization, homology and relevant first pulse string and the second pulse string that comprises ultrashort laser pulse, be used for changing the polarization state of first pulse string or second pulse string, make one to have horizontal polarization, another polarization modifier who has the vertical polarization, make first pulse string and second pulse string have the angle of divergence processing apparatus of the different angles of divergence, a close and restraint processing apparatus for inciting somebody to action first pulse string and second pulse string close to be restrainted, a focusing arrangement for distinguishing focus on the two -layer cutting layer of constituteing by a plurality of focus points respectively about forming with first pulse string and second pulse string on treating the scribing thing and on treating the scribing thing. The utility model discloses a system for laser scribing adopts two way pulse strings to carry out laser scribing, is applicable to thick wafer (> 150um), disposable cutting improves outward appearance straightness accuracy and outward appearance effect that the sheet was processed, still can improve the electrical property yield.
Description
Technical field
This utility model is related to laser instrument processed and applied technical field, specially a kind of system of laser scribing.
Background technology
Cut is cut relative to the traditional saw blade of industry, and the novel dicing technology for developing, it typically will swash
Light beam focuses on chip surface or inside, and ditch flute mark is marked in chip surface or inside by laser, and sliver technology is then used again
Split along cut.Cut have production capacity height, high yield rate, be easily operated automatically, the low advantage of cost, it is (luminous in LED
Diode) chip, RFID (RF identification), it is widely used in Flash (flash memory) etc. the preparation field of product, especially half
In the substrate scribing process of conductor LED chip, diamond cutter cutting has been instead of completely.
LED wafer scribing is carried out using laser stealth process technology, the manufacturing standard technologies of LED are had become.Compare
Cut in traditional diamond blade, cut speed is fast, quality is good, efficiency high.It is main at present to pass through the single skin of single focus
Pulse per second (PPS), focuses on material internal, and using its high power density laser scribing is carried out.
As the LED illumination market competition is increasingly fierce, LED manufacturing process and manufacturing cost are constantly compressed, the thickness of wafer
Degree is increasingly thicker.Traditional single focus, individual pulse is adopted repeatedly to process by multilamellar at present>150um thick slice, thin piece, efficiency compared with
It is low.And can cause the decline of presentation quality and yield.Especially with a pulse rather than train of pulse, when carrying out scribing, it is limited
In the production technique of current object lens, and the influence factor such as various aberrations, individual pulse focus on after easy injury backplate, cause
The electrical yield of wafer declines.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model be a kind of laser scribing is provided be
System, for solving prior art in laser dicing is low for thicker wafer dicing efficiency, presentation quality and electrical yield decline
Problem.
For achieving the above object and other related purposes, this utility model provides a kind of system of laser scribing, described to swash
The system of light scribing includes：For generating adjustable envelope, linear polarization, homologous and relevant the first arteries and veins being made up of ultrashort laser pulse
The laser instrument of punching string and the second train of pulse；For changing the polarization state of first train of pulse or second train of pulse, institute is made
State in the first train of pulse and second train of pulse one and there is horizontal polarization, another polarization with vertical polarization changes dress
Put；The angle of divergence for changing first train of pulse or second train of pulse makes first train of pulse and second arteries and veins
Punching angle of divergence processing meanss of the string with the different angles of divergence；For changing first train of pulse or second train of pulse
The angle of divergence after by first train of pulse and second train of pulse carry out close beam conjunction beam processing apparatus；For described
One train of pulse and second train of pulse close respectively to focus on first train of pulse and second train of pulse after beam and wait to draw
On piece thing and in the focusing arrangement for treating to form the incised layer that upper and lower two-layer is made up of respectively some focus points on scribing thing, with
For treating that scribing thing carries out scribing to described in the stroke treated on scribing thing using focus point in two incised layers.
In an embodiment of the present utility model, the polarisation modifying device is installed in inside or outside the laser instrument.
In an embodiment of the present utility model, the polarisation modifying device is half-wave plate.
In an embodiment of the present utility model, the angle of divergence processing meanss are installed in the laser instrument inside or outer
Portion.
In an embodiment of the present utility model, the angle of divergence processing meanss are beam expanding lens or lens group.
In an embodiment of the present utility model, the conjunction beam processing apparatus include polarization beam combiner.
In an embodiment of the present utility model, the conjunction beam processing apparatus also include being arranged at after the polarization beam combiner
For changing the half-wave plate of polarization direction.
As described above, a kind of system of laser scribing of the present utility model, has the advantages that：
1st, this utility model using two-way train of pulse laser scribing system, in treating to be formed on scribing thing upper and lower two-layer difference
The incised layer being made up of some focus points (demolition point), using bifocuses low-energy laser scribing, it is adaptable to thicker wafer (>
Disposable cutting 150um), improves the outward appearance linearity and appearance of sheet processing, effectively improves the quality of laser scribing.
2nd, this utility model adopts burst mode laser processing mode, is prevented effectively from pulse peak power too high to wafer
The damage that backplate is caused, improves the electrical yield of microsection manufacture LED chip.
3rd, this utility model directly exports two-way laser by laser instrument, and compared to conventionally by lens light splitting bifocuses are realized
Mode, laser output power is relatively low, it is to avoid damage of the high power to laser instrument, and the power per road laser can be directly only
Vertical control, it is simple and sensitive without the need for being realized by light-dividing device, while reducing the cost of making.
Description of the drawings
Fig. 1 is shown as the theory diagram of the system of laser scribing of the present utility model.
Fig. 2 is shown as the schematic diagram of train of pulse in the system of laser scribing of the present utility model.
Component label instructions
The system of 100 laser scribings
101 laser instrument
102 polarisation modifying devices
103 angle of divergence processing meanss
104 close beam processing apparatus
105 focusing arrangements
200 treat scribing thing
201 ground floor focus points
202 second layer focus points
Specific embodiment
Embodiment of the present utility model is illustrated below by way of specific instantiation, those skilled in the art can be by this theory
Content disclosed by bright book understands easily other advantages of the present utility model and effect.This utility model can also be by addition
Different specific embodiments is carried out or applies, and the every details in this specification can also be based on different viewpoints and answer
With, without departing from it is of the present utility model spirit under carry out various modifications and changes.
The purpose of the present embodiment is to provide a kind of system of laser scribing, using the femtosecond or picosecond laser of train of pulse
Light beam carries out the substrate scribing such as LED chip substrate, and the present embodiment provides a kind of femtosecond or picosecond laser light of application train of pulse
The system of various types of materials cutting, is a kind of ultrafast pulse string data bifocuses in Shu Jinhang RFID, Flash etc. chip preparing process
The system that laser is applied to LED scribings, it is intended to solve the quality of the thicker wafer scribing of LED field, efficiency and yield issues.
The system of the laser scribing of the present embodiment adopts burst mode, two-way, picosecond laser beam to focus on LED sapphires
Inside substrate, silicon substrate or SIC substrate wafers, upper and lower two-layer focus point (demolition point) is formed, carry out disposable laser high-quality
Scribing.Burst mode laser processing mode will be prevented effectively from the too high damage caused to wafer rear electrode of pulse peak power
Wound, improves the electrical yield that LED chip makes.Using the scribing of bifocuses low-energy laser will mainly solve thicker wafer (>
Disposable cutting problem 150um), improves the outward appearance linearity and appearance of sheet processing.
The system of the laser scribing of the present embodiment directly exports two-beam, and outer light path is without the need for lens light splitting, and light path is simpler
Just.So the system of the laser scribing of the present embodiment can solve laser dicing in prior art for thicker wafer scribing is imitated
Rate is low, the problem that presentation quality and electrical yield decline.A kind of system of the laser scribing of the present embodiment described in detail below
Principle and embodiment, make those skilled in the art not need creative work to be appreciated that a kind of laser scribing of the present embodiment
The system of piece.
The present embodiment also provides a kind of system of laser scribing, as shown in figure 1, the system 100 of the laser scribing includes：
Laser instrument 101, polarisation modifying device 102, angle of divergence processing meanss 103 close beam processing apparatus 104 and focusing arrangement 105.
In the present embodiment, the laser instrument 101 is adjustable homologous and relevant by ultrashort laser pulse for generating envelope
The first train of pulse for constituting and the second train of pulse.
In the present embodiment, the laser instrument 101 directly produces the homologous and relevant psec of two beams or femtosecond laser, described
Train of pulse, the pulse being made up of certain repetition rate, 2 or more than 2 identical energies, the psec of same pulse width or femtosecond pulses
String composition, and it is arbitrarily adjustable in scope.
For example, directly exported using psec/femto-second laser 101：Certain wavelength, certain repetition rate, certain pulsewidth, line
Polarization (horizontal polarization or vertical polarization), the beam common source coherent laser of burst mode (umber of pulse is adjustable) two.First train of pulse
With the laser power Independent adjustable of second train of pulse.
Wherein, as shown in Fig. 2 the umber of pulse included in first train of pulse and second train of pulse is 2 or 2
More than；The wave-length coverage of the ultrashort laser pulse is 355nm~1550nm；Pulse duration range is 100fs~200ps；Repeat frequency
Rate 50K-1MKZ is adjustable, and power 0-20W is adjustable, horizontal polarization.Wherein, t is time coordinate, and T is train of pulse or pulse envelope
Time width, F is the repetition frequency of train of pulse.In the present embodiment, the polarisation modifying device 102 is used to change described first
The polarization state of train of pulse or second train of pulse, makes in first train of pulse and second train of pulse one to have level
Polarization, another has vertical polarization.
Wherein, described polarisation modifying device 102 is installed in inside or outside the laser instrument.In the present embodiment, institute
Polarisation modifying device 102 is stated for half-wave plate.
In the present embodiment, the angle of divergence processing meanss 103 are used to change first train of pulse or second arteries and veins
The angle of divergence of punching string makes first train of pulse and second train of pulse have the different angles of divergence.Wherein, the angle of divergence
Processing meanss 103 are installed in inside or outside the laser instrument 101.
In the present embodiment, the angle of divergence processing meanss 103 are beam expanding lens or lens group.I.e. all the way laser pulse is ganged up
Cross beam expanding lens, make angle of divergence size variation, due to first train of pulse it is different with the angle of divergence of second train of pulse, it is described
The focus of first train of pulse or second train of pulse after focusing not on same height, thus equivalent to treating scribing
Form two scribing cutting lines on thing 200 simultaneously.
In the present embodiment, the conjunction beam processing apparatus 104 are used to change first train of pulse or second arteries and veins
First train of pulse and second train of pulse are carried out into conjunction beam after the angle of divergence of punching string.
After the angle of divergence of first train of pulse or second train of pulse is changed, two-way laser needs to close beam, described
Closing beam processing apparatus 104 includes realizing the various related devices and various functions system that close beam, and preferably described conjunction beam processes dress
Put 104 carries out conjunction beam by polarization beam combiner.
Specifically, in the present embodiment, the conjunction beam processing apparatus 104 can only include polarization beam combiner.The conjunction beam
Processing meanss 104 can also be used to change the various of polarization direction by polarization beam combiner with being arranged at before and after the polarization beam combiner
Wave plate is constituted.
Wherein described first train of pulse or second train of pulse change 90 degree of polarization direction, horizontal polarization by half-wave plate
Light and orthogonal polarized light carry out conjunction beam by polarization beam combiner.
In the present embodiment, the focusing arrangement 105 is used to close beam in first train of pulse and second train of pulse
Afterwards first train of pulse and second train of pulse are focused on respectively and treat on scribing thing 200 and treat scribing thing 200 in described
It is upper to form the incised layer that upper and lower two-layer is made up of respectively some focus points, i.e. ground floor focus point 201 and second layer focus point
202, for treating scribing thing 200 to described in the stroke treated on scribing thing 200 using focus point in two incised layers
Carry out scribing.
Wherein, the focusing arrangement 105 is focus lamp, for example, object lens.I.e. described first train of pulse and second arteries and veins
Punching is gone here and there to be focused in Jing object lens and is treated inside scribing thing 200, is treating that the different-thickness position of scribing thing 200 forms upper and lower two-layer and be by one
The incised layer of row focus point (demolition point) composition, that is, form two-layer focus, i.e. ground floor focus point 201 and second layer focus point
202, the position of ground floor focus point 201 and second layer focus point 202 in terms of Z axis is adjustable.Then apply external force, treat along described
The cutting path that two-layer incised layer is formed on scribing thing 200 splits.
The specific implementation process of the system of laser dicing is as follows in the present embodiment：
Laser instrument is opened, the picopulse string of two-way horizontal polarization is directly exported, all the way multi-pulsed laser passes through beam expanding lens,
In addition all the way laser changes into vertical polarization by half-wave plate, is then again closed two-way train of pulse by polarization beam combiner
Beam, afterwards by two-way train of pulse line focus mirror, in treating to form upper and lower two-layer by a series of in different-thickness position inside scribing thing
Focus point (demolition point), forms ground floor focus point 201, and second layer focus point 202 applies external force, focuses on along ground floor respectively
The cutting path that point 201 and second layer focus point 202 are formed splits.
In sum, this utility model using two-way train of pulse laser scribing system, in treat on scribing thing formed on
The incised layer that lower two-layer is made up of respectively some focus points (demolition point), using bifocuses low-energy laser scribing, it is adaptable to compared with
Thick wafer (>Disposable cutting 150um), improves the outward appearance linearity and appearance of sheet processing, effectively improves laser
The quality of scribing；This utility model adopts burst mode laser processing mode, is prevented effectively from pulse peak power too high to crystalline substance
The damage that circle backplate is caused, improves the electrical yield of microsection manufacture LED chip；This utility model is directly exported by laser instrument
Two-way laser, compared to conventionally by lens light splitting bifocal mode is realized, laser output power is relatively low, it is to avoid Gao Gong
Damage of the rate to laser instrument, and the power per road laser can direct independent control, it is simple and clever without the need for being realized by light-dividing device
It is quick, while reducing the cost of making.So, this utility model effectively overcomes various shortcoming of the prior art and has height
Industrial utilization.
Above-described embodiment only illustrative principle of the present utility model and its effect are new not for this practicality is limited
Type.Any person skilled in the art all can be carried out under without prejudice to spirit and the scope of the present utility model to above-described embodiment
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the essence disclosed in this utility model
All equivalent modifications completed under god and technological thought or change, should be covered by claim of the present utility model.
Claims (6)
1. a kind of system of laser scribing, it is characterised in that：The system of the laser scribing includes：
For generating adjustable envelope, linear polarization, homologous and relevant the first train of pulse being made up of ultrashort laser pulse and the second arteries and veins
The laser instrument of punching string；
For changing the polarization state of first train of pulse or second train of pulse, first train of pulse and described second are made
One has horizontal polarization in train of pulse, and another has the polarisation modifying device of vertical polarization；
The angle of divergence for changing first train of pulse or second train of pulse makes first train of pulse and described second
Train of pulse has the angle of divergence processing meanss of the different angles of divergence；
For after the angle of divergence for changing first train of pulse or second train of pulse by first train of pulse and described
Second train of pulse carries out closing the conjunction beam processing apparatus of beam；
For after first train of pulse and second train of pulse close beam respectively by first train of pulse and described second
Train of pulse is focused on to be treated on scribing thing and treats that upper and lower two-layer is formed on scribing thing respectively by cutting that some focus points are constituted in described
The focusing arrangement of layer is cut, for waiting to draw to described in the stroke treated on scribing thing using focus point in two incised layers
Piece thing carries out scribing.
2. the system of laser scribing according to claim 1, it is characterised in that：The polarisation modifying device is installed in described
Inside or outside laser instrument.
3. the system of laser scribing according to claim 1 and 2, it is characterised in that：The polarisation modifying device is half-wave
Piece.
4. the system of laser scribing according to claim 1, it is characterised in that：The angle of divergence processing meanss are installed in institute
State inside or outside laser instrument.
5. the system of the laser scribing according to claim 1 or 4, it is characterised in that：The angle of divergence processing meanss are expansion
Beam mirror or lens group.
6. the system of laser scribing according to claim 1, it is characterised in that：The conjunction beam processing apparatus include that polarization is closed
Beam device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621169904.8U CN206169491U (en) | 2016-11-02 | 2016-11-02 | System for laser scribing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621169904.8U CN206169491U (en) | 2016-11-02 | 2016-11-02 | System for laser scribing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206169491U true CN206169491U (en) | 2017-05-17 |
Family
ID=58680713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621169904.8U Withdrawn - After Issue CN206169491U (en) | 2016-11-02 | 2016-11-02 | System for laser scribing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206169491U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106425112A (en) * | 2016-11-02 | 2017-02-22 | 国神光电科技（上海）有限公司 | Method and system for laser scribing |
| CN108747053A (en) * | 2018-07-13 | 2018-11-06 | 苏州福唐智能科技有限公司 | A kind of self-calibration laser cutting device |
| US10850349B2 (en) | 2017-06-12 | 2020-12-01 | Central South University | Method for machining micro-holes in metal or alloy product |
-
2016
- 2016-11-02 CN CN201621169904.8U patent/CN206169491U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106425112A (en) * | 2016-11-02 | 2017-02-22 | 国神光电科技（上海）有限公司 | Method and system for laser scribing |
| CN106425112B (en) * | 2016-11-02 | 2018-11-06 | 国神光电科技（上海）有限公司 | A kind of method and system of laser scribing |
| US10850349B2 (en) | 2017-06-12 | 2020-12-01 | Central South University | Method for machining micro-holes in metal or alloy product |
| CN108747053A (en) * | 2018-07-13 | 2018-11-06 | 苏州福唐智能科技有限公司 | A kind of self-calibration laser cutting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20170517 Effective date of abandoning: 20181106 |