CN104582292B - A kind of processing method of heavy copper circuit board - Google Patents
A kind of processing method of heavy copper circuit board Download PDFInfo
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- CN104582292B CN104582292B CN201310493292.2A CN201310493292A CN104582292B CN 104582292 B CN104582292 B CN 104582292B CN 201310493292 A CN201310493292 A CN 201310493292A CN 104582292 B CN104582292 B CN 104582292B
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- groove
- copper coin
- line pattern
- face
- controlled depth
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The invention discloses a kind of processing method of heavy copper circuit board, including：In the first face of copper coin, the first groove is etched in the region that need not form line pattern using etch process；Insulating barrier is pressed in the first surface layer of the copper coin；In second face relative with the first face of the copper coin, the second groove of first groove is connected in the region processing that need not form line pattern using controlled depth milling technique, so as to form line pattern.The influence of lateral erosion can be greatly decreased in technical solution of the present invention, be able to produce the fine and closely woven circuit with enough accuracy, solve the technical problem that prior art is difficult to make fine-line on heavy copper circuit board.
Description
Technical field
The present invention relates to circuit board technology field, and in particular to a kind of processing method of heavy copper circuit board.
Background technology
As power supply product walks the increase of high current demand, its copper thickness is more and more thicker, and carrying electric current is increasing, proof voltage
It is required that more and more higher, meanwhile, circuit is also more and more intensive；After copper thickness is more than 1mm, made using the etch process of routine fine
More difficulties and problems occur in circuit and figure, are primarily due to the serious lateral erosion problem caused by etching factor limits, add
Easily occur the situation for owing corrosion or excessive erosion during work fine-line, so as to cause, fine-line can not be made substantially.
The content of the invention
The embodiment of the present invention provides a kind of processing method of heavy copper circuit board, is difficult to solving existing prior art in thick copper
The technical problem of fine-line is made on circuit board.
First aspect present invention provides a kind of processing method of heavy copper circuit board, including：
In the first face of copper coin, the first groove is etched in the region that need not form line pattern using etch process；
The first surface layer pressure insulating barrier of the copper coin；In second face relative with the first face of the copper coin, existed using controlled depth milling technique
The region processing that line pattern need not be formed connects the second groove of first groove, so as to form line pattern.
The processing method that first aspect present invention provides another heavy copper circuit board, including：
It is recessed in the region etching first that need not form line pattern using etch process in the first face of the first copper coin
Groove；And in the first face of the second copper coin, it is recessed in the region that need not form line pattern to etch second using etch process
Groove；Insulating barrier is provided, will first copper coin and the insulating barrier and second copper plate layer pressing integrally, and described the
First face of one copper coin and the second copper coin is towards the insulating barrier；In second relative with the first face of first copper coin
Face, the 3rd groove of first groove is connected in the region processing that need not form line pattern using controlled depth milling technique, from
And form first line figure；And in second face relative with the first face of second copper coin, existed using controlled depth milling technique
The region processing that line pattern need not be formed connects the 4th groove of second groove, so as to form the second line pattern.
The embodiment of the present invention is etched using one side, the technical scheme of another side controlled depth milling so that etch depth is relative to normal
Rule etch process can reduce about half, therefore, the influence of lateral erosion can be greatly decreased, be able to produce with enough accuracy
Fine and closely woven circuit, solves the technical problem that prior art is difficult to make fine-line on heavy copper circuit board.
Brief description of the drawings
Fig. 1 is the flow chart of the processing method for the heavy copper circuit board that one embodiment of the invention provides；
Fig. 2 is the schematic diagram that one side etching is carried out to copper coin；
Fig. 3 is the schematic diagram that insulating barrier is laminated on copper coin；
Fig. 4 is the schematic diagram that controlled depth milling is carried out to copper coin another side；
Fig. 5 is the flow chart of the processing method for the heavy copper circuit board that another embodiment of the present invention provides；
Fig. 6 is the schematic diagram that one side etching is carried out to copper coin；
Fig. 7 is the schematic diagram that insulating barrier is laminated on copper coin；
Fig. 8 is the schematic diagram that controlled depth milling is carried out to copper coin another side.
Embodiment
The embodiment of the present invention provides a kind of processing method of heavy copper circuit board, is difficult to solving existing prior art in thick copper
The technical problem of fine-line is made on circuit board.In order that those skilled in the art more fully understand the present invention program, under
The accompanying drawing that face will be combined in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, and shows
So, described embodiment only a part of embodiment of the present invention, rather than whole embodiments.Based in the present invention
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
The scope of protection of the invention should be belonged to.
At present, for the thick circuit board for exceeding 1mm of copper, the processing of the technique of two-sided etching or Double Milling can be used.But
It is that both techniques all have the problem of certain.
Double Milling technique in the one side of copper coin, it is necessary to first carry out controlled depth milling, then carry out controlled depth milling in another side, i.e. control is deep
Twice, thus, easily there is Burr Problem, also, the process velocity of controlled depth milling is slower in milling.In addition, the lower knife precision of controlled depth milling
It is not easily controlled, it is too deep and hurt tree to being easy to lower knife during the second face controlled depth milling when the complete face of copper coin first of milling and after be laminated
Lipid layer, also, if thick copper coin is designed in internal layer, also easily cause the starved after being laminated again and layering.
Double-sided etching process is, it is necessary to first in a facet etch certain depth of copper coin, then in another side loses remaining part
Carve and remove, so as to remove the region that need not form line pattern completely.It can all be influenceed during due to two facet etches by lateral erosion,
Easily there is the problem of owing corrosion or excessive erosion, in order to ensure that neighbouring line pattern will not be short-circuit, can not just make line spacing
The fine-line of very little.
In addition, the alignment mode that Double Milling and two-sided etching use at present is：Directly made on copper coin of inner figure
Target aligning graph, after etching target patterns, Double Milling or two-sided etching registration holes are done using target patterns.Positioning side above
Method is with general thick copper, such as below 12OZ can also be realized, but if during used in more than 20OZ copper thickness, because copper is too
Thickness, etching one side or during mill off after be laminated, bore target machine and can not penetrate thick copper and identify target point, alignment system can be caused
It is abnormal.Target is bored again in addition, the above method is first figure, thus two sets of different alignment systems can also have a strong impact on contraposition essence
Degree.
To sum up, for the heavy copper circuit board more than more than 12OZ, it is more burr to be present in Double Milling technique, easily injures resin
Layer, and can cause starved and layering the problem of, double-sided etching process then exist processing fine-line it is limited in one's ability the problem of,
The problem of positioning precision above two technique also has the two-sided processing of same layer simultaneously when and when different layers are processed is not high.
In view of the above-mentioned problems, the invention provides the processing method of following thick copper circuits.
Embodiment one,
Fig. 1 is refer to, the embodiment of the present invention provides a kind of processing method of heavy copper circuit board, including：
110th, it is recessed in the region etching first that need not form line pattern using etch process in the first face of copper coin
Groove.
Copper coin described in the present embodiment is usually the copper coin of more than 1mm thickness, and its specific thickness can be according to required
Current capacity determines.Because copper coin is thicker, if in copper coin one side circuit etching figure, understand because of serious impact of side etching, and nothing
Method processes qualified precise circuit.In the present embodiment, processed respectively on the two sides of copper coin, to obtain qualified precise circuit.
As shown in Fig. 2 in the present embodiment, in the first face of copper coin 210, processed using etch process, line pattern need not be formed
Region etching remove certain depth, formed the first groove 2101.First groove 2101 is of a depth approximately equal to the thickness of copper coin 210
Half, can be specifically the thickness of copper coin 210 40%-60%.
For the ease of following process, before etching step, first copper coin surface can be cleaned, cleaning includes removing
Oil, microetch and rough surface processing.The step of the first groove of etching and processing, can include：According to surface line demand, using interior
Layer pattern and etch process carry out pattern transfer, and surface line figure is according to depending on customer requirement；Pattern transfer step includes patch
Dry film, it is exposed and developed, after development, only needing to form the region of circuitous pattern reservation dry film；Then, one side erosion is carried out
Carve, the region etching that need not form line pattern is removed into certain depth, forms the first groove；Then, dry film is removed.
In practical application, the copper coin of generally use 1-1.2mm thickness processes heavy copper circuit board, then, and in the etching step,
The first groove that depth is 0.4-0.6 millimeters can be etched, to reduce the influence of lateral erosion.
120th, insulating barrier is pressed in the first surface layer of the copper coin.
As shown in figure 3, after being etched to the first face of copper coin 210, insulating barrier 220 is pressed in the first surface layer, this is exhausted
Edge layer 220 can play a supporting role, so that next step is processed to the second face of copper coin 210.Described insulating barrier 220 can
With including more than one layer prepreg（PP pieces）, the factor such as the etch depth of the PP configuration number of plies according to previous step and determine, one
As it is ensured that insulating barrier 220 thickness at least over the first groove 2101 depth.After lamination, the first groove 2101 is insulated
Material is filled.
130th, in second face relative with the first face of the copper coin, line map need not formed using controlled depth milling technique
The region processing of shape connects the second groove of first groove, so as to form line pattern.
As shown in figure 4, in this step copper coin 210 the second face process, by need not be formed line pattern it is region,
The part of removal is not etched, is removed completely, to obtain required line pattern；Processing technology selection uses controlled depth milling work
Skill, directly the part for needing to remove is pruned, process the second groove 2102 of the first groove 2101 of connection, that is to say, that will
The copper coin that line pattern region need not be formed all removes., typically should be at least by milling cutter for the copper coin that thickness is 1-1.2mm
Controlled depth milling depth determine in more than 0.6mm, i.e. process depth be not less than 0.6mm the second groove.The diameter of milling cutter can
To be selected by standard of diameter 0.1-0.3 millimeters smaller than the spacing of line pattern, set to meet the circuit spacing processed
Meter requires.
The precision contraposition of the steps such as accurate contraposition and lamination in order to preferably realize two-sided processing, and avoid succeeding layer
Starved and layering during pressure, the present embodiment can also include the locating and machining on the copper coin 210 in advance before step 110
The step of hole.The positioning hole processed can include double rivet positioning holes, and inner figure makes positioning hole and controlled depth milling positioning hole
Three kinds.Accordingly, follow-up etching step can use inner figure to make positioning hole and be positioned, and lamination step can use
Double rivet positioning holes are positioned, and controlled depth milling step can be positioned using controlled depth milling positioning hole.
Preferably, above-mentioned three kinds of positioning holes can be drilled out simultaneously using same software control system, to protect well
Demonstrate,prove layer and layer and the contraposition with sandwich circuit.The application flow positioned using above-mentioned positioning hole is included：Three of the above positioning hole drills out
Afterwards, pattern transfer is carried out in the face of copper coin first using inner figure registration holes, other positioning holes is covered with dry film, lost
Carve；After the completion of etching, using double rivet positioning holes as lamination positioning hole, it is laminated；After the completion of lamination, controlled depth milling positioning hole
It can be filled by dielectric；In controlled depth milling step, boring target drone needs to position hole pattern in the controlled depth milling positioning hole according to controlled depth milling
On punch positioned again, if the controlled depth milling registration holes of the first copper coin and the second copper coin do not have deviation, will be easy to be drilled
Target drone drills；If deviation, boring target drone will get on another copper coin after the controlled depth milling positioning hole of a copper coin is drilled, and lead
Cause is difficult to continue to drill；So as to which can verifies whether contraposition has deviation.
In a kind of embodiment, in order to control etch depth, avoid controlled depth milling from hurting insulating barrier, etching step it
Before, the step groove that can be 0.5mm in the etching corner controlled depth milling depth of copper coin, the non-step surface of step groove is covered with dry film,
Only expose step groove.During etching, it is only necessary to monitor whether the copper in step groove etches totally, you can know that first time one side etches
Copper thickness depth whether in 0.5+/- 0.075mm（0.075mm is controlled depth milling precision）In the range of.By above-mentioned technique, not only
It is easy to control etch depth, moreover it is possible to which the lower knife depth for the other face of controlled depth milling after lamination provides preferable foundation and reference value.With
Avoid controlled depth milling depth excessive, milling cutter causes too deep injury to the resin of insulating barrier, it also avoid starved and layering after lamination.
To sum up, the embodiments of the invention provide a kind of processing method of heavy copper circuit board, this method to be etched using one side, separately
The simultaneously technical scheme of controlled depth milling, the fine and closely woven circuit with enough accuracy can be produced, prior art is solved and is difficult in thickness
The technical problem of fine-line is made on copper circuit board.And further solves figure pair in heavy copper circuit board manufacturing process
Position is inaccurate, the technical barrier of burr, starved and layering.
Relative to customary etch line pattern technique, etch depth can reduce about half in the present embodiment, therefore, can be with
The influence of lateral erosion is greatly decreased, avoids excessive erosion or owes corrosion, be able to produce the fine and closely woven circuit with enough accuracy.
Relative to conventional controlled depth milling processing line graphics art, controlled depth milling depth reduces about half in the present embodiment, and by
It is very slow in controlled depth milling speed, therefore, processing efficiency can be greatly improved；And it is possible to avoid because controlled depth milling precision is not high, easily
Because depth crosses major injury layer insulation medium, the problem of pressure-resistant is influenceed.
Relative to two-sided controlled depth milling technique, the present embodiment technical scheme reduces a controlled depth milling, therefore can reduce hair
Thorn problem, processing efficiency can be improved；Also, controlled depth milling depth is controlled by processing step groove, can avoid injuring insulating barrier,
And avoid starved and lamination problem.
Relative to double-sided etching process, the present embodiment technical scheme reduces the influence for owing corrosion or excessive erosion, can make
Make the smaller fine-line of outlet spacing.
In addition, Double Milling and two-sided etching are required for carrying out two-sided contraposition using target patterns, still, copper coin is thicker for example
More than 12OZ or even 20OZ（Ounce, thickness unit, 1OZ are approximately equal to 0.035mm）When, bore and mark machine is difficult to penetrate thick copper coin identification
It target patterns, can lead to not align, the present embodiment technical scheme, then by processing three kinds of positioning holes, realize accurate contraposition.
Embodiment two,
Fig. 5 is refer to, the embodiment of the present invention provides a kind of processing method of heavy copper circuit board, including：
510th, as shown in fig. 6, in the first face of the first copper coin 310, line pattern need not formed using etch process
Region etch the first groove 3101；And in the first face of the second copper coin 320, line need not formed using etch process
The region of road figure etches the second groove 3201；
520th, as shown in Figure 7, there is provided insulating barrier 330, by first copper coin 310 and the insulating barrier 330 and described
The lamination of second copper coin 330 is integrated, and makes the first face of the copper coin 320 of the first copper coin 310 and second towards the insulating barrier
330；
530th, as shown in figure 8, in second face relative with the first face of first copper coin 310, using controlled depth milling technique
The 3rd groove 3102 of first groove 3101 is connected in the region processing that need not form line pattern, so as to form first
Line pattern 3103；And in second face relative with the first face of second copper coin 320, using controlled depth milling technique not
Need to form the 4th groove 3202 that the region processing of line pattern connects second groove 3201, so as to form the second circuit
Figure 3203.
Optionally, the present embodiment method can also include：Locating and machining hole, institute on first and second copper coin in advance
Stating positioning hole includes double rivet positioning holes, and inner figure makes positioning hole and controlled depth milling positioning hole；Accordingly, the etching step
Positioning hole being made using the inner figure to be positioned, the lamination step is positioned using double rivet positioning holes,
The controlled depth milling step is positioned using the controlled depth milling positioning hole.
Optionally, the thickness of first copper coin and the second copper coin is between 1-1.2 millimeters；The etching step
In, etch the first groove and the second groove that depth is 0.4-0.6 millimeters；Accordingly, in the controlled depth milling step, process
Depth is not less than 0.6 millimeter of the 3rd groove and the 4th groove.
Optionally, in the controlled depth milling step, using the small 0.1-0.3 millimeters of the spacing than the line pattern as diameter criteria
Select milling cutter.
To sum up, the embodiments of the invention provide a kind of processing method of heavy copper circuit board, this method to be etched using one side, separately
The simultaneously technical scheme of controlled depth milling, the fine and closely woven circuit with enough accuracy can be produced, prior art is solved and is difficult in thickness
The technical problem of fine-line is made on copper circuit board.On the more detailed description of the present embodiment method, embodiment refer to
Description in one.
The processing method of the heavy copper circuit board provided above the embodiment of the present invention is described in detail, but real above
The explanation for applying example is only intended to help the method and its core concept for understanding the present invention, should not be construed as limiting the invention.
Those skilled in the art the invention discloses technical scope in, the change or replacement that can readily occur in should all be covered
Within protection scope of the present invention.
Claims (6)
- A kind of 1. processing method of heavy copper circuit board, it is characterised in that including：In the first face of copper coin, the first groove is etched in the region that need not form line pattern using etch process；Insulating barrier is pressed in the first surface layer of the copper coin；In second face relative with the first face of the copper coin, the region of line pattern need not formed using controlled depth milling technique Processing connects the second groove of first groove, so as to form line pattern；The locating and machining hole on the copper coin in advance, the positioning hole include double rivet positioning holes, and inner figure makes positioning hole With controlled depth milling positioning hole；Accordingly, the etching step makes positioning hole using the inner figure and positioned, and the lamination step uses institute State double rivet positioning holes to be positioned, the controlled depth milling step is positioned using the controlled depth milling positioning hole.
- 2. according to the method for claim 1, it is characterised in that：The thickness of the copper coin is between 1-1.2 millimeters；In the etching step, the first groove that depth is 0.4-0.6 millimeters is etched；Accordingly, in the controlled depth milling step, the second groove that depth is not less than 0.6 millimeter is processed.
- 3. according to the method for claim 1, it is characterised in that：In the controlled depth milling step, the diameter 0.1-0.3 millimeters smaller than the spacing of the line pattern of milling cutter.
- A kind of 4. processing method of heavy copper circuit board, it is characterised in that including：In the first face of the first copper coin, the first groove is etched in the region that need not form line pattern using etch process；With And in the first face of the second copper coin, the second groove is etched in the region that need not forming line pattern using etch process；Insulating barrier is provided, first copper coin and the insulating barrier and second copper plate layer pressed integral and described First face of the first copper coin and the second copper coin is towards the insulating barrier；In second face relative with the first face of first copper coin, line pattern need not formed using controlled depth milling technique Region processing connects the 3rd groove of first groove, so as to form first line figure；And in second copper coin Second face relative with the first face, described second is connected in the region processing that need not form line pattern using controlled depth milling technique 4th groove of groove, so as to form the second line pattern；The locating and machining hole on first and second copper coin in advance, the positioning hole include double rivet positioning holes, inner figure Make positioning hole and controlled depth milling positioning hole；Accordingly, the etching step makes positioning hole using the inner figure and positioned, and the lamination step uses institute State double rivet positioning holes to be positioned, the controlled depth milling step is positioned using the controlled depth milling positioning hole.
- 5. according to the method for claim 4, it is characterised in that：The thickness of first copper coin and the second copper coin is between 1-1.2 millimeters；In the etching step, the first groove and the second groove that depth is 0.4-0.6 millimeters are etched；Accordingly, in the controlled depth milling step, the 3rd groove and the 4th groove that depth is not less than 0.6 millimeter are processed.
- 6. according to the method for claim 4, it is characterised in that：In the controlled depth milling step, the diameter 0.1-0.3 millimeters smaller than the spacing of the line pattern of milling cutter.
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| CN201310493292.2A CN104582292B (en) | 2013-10-18 | 2013-10-18 | A kind of processing method of heavy copper circuit board |
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| CN104582292B true CN104582292B (en) | 2018-01-26 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105188269B (en) * | 2015-10-28 | 2018-03-13 | 广州杰赛科技股份有限公司 | Super thick copper circuit board and preparation method thereof |
| CN105430925B (en) * | 2015-12-21 | 2018-06-01 | 深圳市迅捷兴科技股份有限公司 | Thick copper circuit board manufacturing method |
| CN105960102B (en) * | 2016-05-31 | 2019-03-29 | 安捷利（番禺）电子实业有限公司 | A kind of preparation method of high-copper thicker printed circuit board |
| CN110087397A (en) * | 2019-03-28 | 2019-08-02 | 深圳市众阳电路科技有限公司 | A kind of PCB thickness copper sheet segmentation etch method |
| CN110944455B (en) * | 2019-12-23 | 2021-11-02 | 东莞市五株电子科技有限公司 | Positioning hole-free routing method, printed circuit single board and connecting board |
| CN111479401B (en) * | 2020-04-28 | 2022-12-02 | 景德镇市宏亿电子科技有限公司 | Manufacturing method of thick copper printed circuit board |
| CN113692124B (en) * | 2021-07-21 | 2022-08-02 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board), manufacturing method thereof and electronic equipment |
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|---|---|---|---|---|
| US7008549B2 (en) * | 2003-03-26 | 2006-03-07 | Dowa Mining Co., Ltd. | Circuit board, process for producing the same and a power module employing the same |
| CN103188875A (en) * | 2011-12-29 | 2013-07-03 | 深南电路有限公司 | Super-thick copper diagram manufacturing method and printed circuit board (PCB) provided with super-thick copper diagram |
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- 2013-10-18 CN CN201310493292.2A patent/CN104582292B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7008549B2 (en) * | 2003-03-26 | 2006-03-07 | Dowa Mining Co., Ltd. | Circuit board, process for producing the same and a power module employing the same |
| CN103188875A (en) * | 2011-12-29 | 2013-07-03 | 深南电路有限公司 | Super-thick copper diagram manufacturing method and printed circuit board (PCB) provided with super-thick copper diagram |
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