CN110944455B

CN110944455B - Positioning hole-free routing method, printed circuit single board and connecting board

Info

Publication number: CN110944455B
Application number: CN201911340577.6A
Authority: CN
Inventors: 赵南清; 孟昭光; 张伟峰
Original assignee: Dongguan Wuzhu Technology Co ltd
Current assignee: Dongguan Wuzhu Technology Co ltd
Priority date: 2019-12-23
Filing date: 2019-12-23
Publication date: 2021-11-02
Anticipated expiration: 2039-12-23
Also published as: CN110944455A

Abstract

The invention discloses a positioning hole-free routing method, a printed circuit single board and a connecting board, which comprise the following steps: carrying out depth control routing on a first surface of a board to be processed according to a preset path, wherein the routing depth of the first surface is smaller than the thickness of the board to be processed; pressing a protective film on the first surface of the board to be processed, wherein the protective film is used for fixedly connecting the area to be routed and the remaining area of the board to be processed; and carrying out depth control routing on the second surface of the board to be processed according to the preset path, routing the area to be routed, wherein the routing depth of the second surface is smaller than the thickness of the board to be processed. According to the positioning-hole-free routing method, the printed circuit single board and the connecting board, provided by the embodiment of the invention, the depth control routing and the protection film fixing are combined, so that the edge of the formed board can be prevented from generating edges and corners, the depth control routing can be carried out on the whole board during routing, and the production and processing efficiency is improved.

Description

Positioning hole-free routing method, printed circuit single board and connecting board

Technical Field

The invention belongs to the technical field of PCB manufacturing, and particularly relates to a positioning hole-free board routing method, a printed circuit single board and a connecting board.

Background

With the development of electronic technology, the PCB has replaced the connection mode of the traditional electronic components and is widely applied to electronic products.

At present, in the PCB processing industry, in order to facilitate mass production and improve production efficiency, it is often necessary to first manufacture a whole PCB (also called a whole printed circuit board) including a plurality of PCB single boards (also called single PCS boards or printed circuit single boards); then, the whole PCB is processed to form a plurality of single PCB boards and/or a PCB connecting board (also called a printed circuit connecting board) which is convenient for board division.

The method for processing the appearance of the whole PCB mainly comprises V-CUT, beer board and gong board.

The V-CUT is to CUT out the straight line shallow slot of V-shape in the position that the monoblock PCB board needs to divide the board, can break off the PCB single-board with the help of the shallow slot of V-shape with the help of saving effort, the disadvantage of this method is that only can process the rectangular PCB single-board, and the edge of the board after dividing is comparatively rough.

The beer board is also called as punching type, which is to punch a PCB connecting board or a plurality of PCB single boards by a punch press, and the required shape can be punched by the method, and the method is suitable for mass production. The beer board has the defects that the mould opening is needed, the time and the labor are wasted, the edge roughness of the board after the board separation is larger, and the board scraps are more.

The routing is to use a routing machine to route a preset shape on the whole PCB so as to form a PCB or a plurality of PCB single boards. The milling machine is a milling machine capable of processing the shape of the PCB, and the milling machine does not distinguish milling.

Because the PCB produced by adopting the routing mode has smooth edge and accurate size, the time and the cost can be greatly saved in the aspects of small batch and sample plate output. Therefore, routing is the preferred mode of the PCB outline processing technology.

At the in-process of gong board, in order to ensure size precision, need fix monoblock PCB board. In general, a method of forming positioning holes (also referred to as PIN holes) in four board edges (also referred to as SET edges) of a whole PCB and fixing the board edges with positioning PINs (also referred to as PIN nails) is adopted. However, when the PCB is required to be produced in a large scale, in order to improve the layout utilization rate and reduce the cost of the PCB, the edge of the PCB is not always left in the design process, so that the positioning hole or the PIN cannot be formed in the edge of the whole PCB.

In the prior art, the fixing is performed by a method of sticking adhesive paper. When the method is adopted for routing the boards, only single PCS boards can be processed one by one, the production efficiency is low, the last cutting feed is easy to loosen due to the fact that the connecting position is reduced, and edges of the formed boards can generate edges.

Disclosure of Invention

The invention aims to provide a positioning hole-free routing method, a printed circuit single board and a connecting board, and aims to solve the problems of low production efficiency and corner generation caused by a routing method of fixing a whole PCB by using adhesive paper.

In order to achieve the purpose, the invention adopts the following technical scheme:

in a first aspect, the invention provides a positioning hole-free routing method, which includes:

carrying out depth control routing on a first surface of a board to be processed according to a preset path, wherein the routing depth of the first surface is smaller than the thickness of the board to be processed;

pressing a protective film on the first surface of the board to be processed, wherein the protective film is used for fixedly connecting the area to be routed and the remaining area of the board to be processed;

and carrying out depth control routing on the second surface of the board to be processed according to the preset path, routing the area to be routed, wherein the routing depth of the second surface is smaller than the thickness of the board to be processed.

Optionally, the preset path obtaining method includes:

acquiring graphic design data of the board to be processed;

and obtaining the preset path according to the graphic design data.

Optionally, pressing a protection film on the first surface of the plate to be processed specifically includes:

pressing the protective film on the first surface of the board to be processed through a film pressing machine, so that the protective film is used for bonding and fixing the area to be milled and the residual area.

Optionally, the protective membrane area is larger than the plate area to be processed.

Optionally, the protective film is a high temperature glue.

Optionally, the first face milling depth is equal to half of the thickness of the board to be processed, and the second face milling depth is equal to half of the thickness of the board to be processed plus a compensation thickness.

Optionally, according to treating the first face of processing board according to predetermineeing the route and controlling deeply the gong, include:

the board to be processed comprises a plurality of printed circuit single boards, and depth control gonging is carried out on the first surfaces of all the printed circuit single boards.

the board to be processed comprises a plurality of printed circuit connecting boards, and depth control gong is carried out on the first surfaces of all the printed circuit connecting boards.

In a second aspect, the invention provides a printed circuit single board, which is formed by the method for routing boards without positioning holes.

In a third aspect, the invention provides a printed circuit connecting board, which is formed by adopting the positioning hole-free routing method.

Compared with the prior art, the embodiment of the invention has the following beneficial effects:

treat the first face of processing board according to predetermineeing the route and control dark gong, then press a protection film on first face for fixed connection treats gong region and surplus region, controls dark gong to the second face again, and the gong removes treats gong region. Because only gong removes a part when gong first face, the connection position can not be very little, owing to gong second face has the protection film to fix the gong region of treating the processing board again, does not have not become flexible problem, therefore shaping back plate edge can not produce edges and corners. According to the positioning-hole-free routing method, the printed circuit single board and the connecting board, provided by the embodiment of the invention, the depth control routing and the protection film fixing are combined, so that the edge of the formed board can be prevented from generating edges and corners, the depth control routing can be carried out on the whole board during routing, and the production and processing efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope covered by the contents disclosed in the present invention.

Fig. 1 is a flowchart of a method for routing boards without positioning holes according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a depth control gong of a first side of a board to be processed;

FIG. 3 is a schematic view of a plate to be processed pressed with a protective film on a first surface thereof.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example one

Please refer to fig. 1 to 3.

The embodiment provides a positioning hole-free routing method, which can be applied to a printed circuit board forming procedure of a board to be processed without a positioning hole, is suitable for processing a single PCS (printed circuit board), and is also suitable for processing a whole PCB containing a plurality of PCBs (printed circuit boards).

In the printed circuit board forming process, a board to be processed is usually required to be subjected to routing processing so as to form a plurality of printed circuit single boards or a printed circuit connecting board convenient to divide the board.

When the board is milled, the area to be milled of the board to be processed is determined according to the graphic design data of the board to be processed. Therefore, the path of the milling cutter can be set in advance.

The positioning hole-free routing method comprises the following steps:

and S1, controlling the depth of the first surface of the board to be processed, specifically placing the board to be processed on a processing platform, and controlling the depth of the first surface of the area to be processed according to a preset path in the graphic design data. The milling depth is smaller than the thickness of the plate to be processed, so that the connection position is prevented from being reduced when the milling depth is too large.

And step S2, pressing a protective film on the first surface of the board to be processed.

And turning over the board to be processed to prepare for controlling the depth of the second surface of the gong.

The region to be milled and the remaining region are mutually fixed on the processing platform through the protective film, so that the problem that the region to be milled moves and the connection position is reduced when the second surface is milled is solved.

And S3, performing depth control gong on the second surface of the board to be processed, specifically performing depth control gong on the second surface of the area to be gong according to the preset path of the graphic design data, so as to gong and remove the area to be gong. The gong board degree of depth is less than and treats processing board thickness, prevents too big gong board degree of depth and leads to gong to the protection film.

It should be noted that when the depth is controlled to gong the first surface and the second surface of the board to be processed, the coordinate data in the graphic design data can be utilized to realize accurate positioning and accurate gong.

According to the positioning hole-free routing method, when routing is carried out on a first face and a second face, routing can be carried out on the whole first face, namely, after depth control routing is carried out on all units (such as printed circuit board veneers and/or printed circuit board connecting plates) on the first face of the whole first face, and then depth control routing is carried out on all units on the second face. Compared with the single PCS plate one-by-one processing in the prior art, the plate milling efficiency of the positioning hole-free plate milling method is higher.

Furthermore, because the deep gong of accuse has been carried out during the gong first face, does not have the very little problem in connection position, has the protection film fixed to wait the gong region during the gong second face again, does not have not become flexible problem, therefore shaping back plate edge can not produce edges and corners.

The positioning hole-free routing method can further comprise the following steps: and establishing graphic design data of the board to be processed. The step is performed before step S1, where the graphic design data includes the default path information of the area to be routed.

The embodiment further discloses a specific film pressing mode, which is applied to step S2, and specifically includes:

and pressing the protective film on the first surface of the plate to be processed by a film pressing machine.

Furthermore, the area of the protective film is larger than that of the plate to be processed, so that the protective film can be conveniently fixed on the processing platform.

Further, the protection film can be selected for use high temperature to glue, and the laminator is glued the high temperature through the mode of hot pressing and is pressed on waiting to process the first face of board.

As an optional mode of this embodiment, the milling depth of the first surface is equal to half of the thickness of the board to be processed, and the milling depth of the second surface is equal to half of the thickness of the board to be processed plus a compensation thickness. The effect of compensating the thickness is: after the deep gong is controlled through the second surface, the gong removal of the gong area to be treated can be ensured, and the situation that the gong removal is not completed due to errors is prevented.

As an alternative of this embodiment, step S1 includes: and carrying out depth control gong on the first surfaces of all the printed circuit single boards. Accordingly, step S3 includes: and carrying out depth control gong on the second surfaces of all the printed circuit single boards. In this embodiment, the board to be processed includes a plurality of printed circuit boards, and the positioning hole-free board routing method can form the printed circuit boards in batches.

As an alternative of this embodiment, step S1 includes: and carrying out depth control routing on the first surfaces of all printed circuit connecting plates. Accordingly, step S3 includes: and carrying out depth control gong on the second surfaces of all the printed circuit connecting plates. In the embodiment, the board to be processed comprises a plurality of printed circuit connecting boards, and the positioning-hole-free board milling method can be used for forming the printed circuit connecting boards in batches.

Example two

The embodiment provides a printed circuit single board, which is formed by the positioning hole-free routing method.

EXAMPLE III

The embodiment provides a printed circuit connecting board, which is formed by adopting the positioning hole-free board milling method.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are intended to be inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed and illustrated, unless explicitly indicated as an order of performance. It should also be understood that additional or alternative steps may be employed.

When an element or layer is referred to as being "on" … … "," engaged with "… …", "connected to" or "coupled to" another element or layer, it can be directly on, engaged with, connected to or coupled to the other element or layer, or intervening elements or layers may also be present. In contrast, when an element or layer is referred to as being "directly on … …," "directly engaged with … …," "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship of elements should be interpreted in a similar manner (e.g., "between … …" and "directly between … …", "adjacent" and "directly adjacent", etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region or section from another element, component, region or section. Unless clearly indicated by the context, use of terms such as the terms "first," "second," and other numerical values herein does not imply a sequence or order. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

Spatially relative terms, such as "inner," "outer," "below," "… …," "lower," "above," "upper," and the like, may be used herein for ease of description to describe a relationship between one element or feature and one or more other elements or features as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below … …" can encompass both an orientation of facing upward and downward. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. The method for routing the positioning holes is characterized by comprising the following steps:

carrying out depth control routing on a second surface of the board to be processed according to the preset path, and routing the area to be routed, wherein the routing depth of the second surface is smaller than the thickness of the board to be processed;

the press on treat the first face of processing board and press a protection film, specifically include:

pressing the protective film on the first surface of the board to be processed through a film pressing machine, so that the protective film bonds and fixes the area to be milled and the residual area;

the protective film is high-temperature glue.

2. The method for routing holes without positioning holes according to claim 1, wherein the method for obtaining the preset path comprises:

acquiring graphic design data of the board to be processed;

and obtaining the preset path according to the graphic design data.

3. The method for routing boards without positioning holes of claim 1, wherein the area of the protective film is larger than the area of the board to be processed.

4. The method of claim 1, wherein the depth of the first panel is equal to half of the thickness of the panel to be processed, and the depth of the second panel is equal to half of the thickness of the panel to be processed plus a compensation thickness.

5. The method for routing holes without positioning holes in a board according to claim 1, wherein the depth control routing of the first surface of the board to be processed according to the preset path comprises:

6. The method for routing holes without positioning holes in a board according to claim 1, wherein the depth control routing of the first surface of the board to be processed according to the preset path comprises:

7. A printed circuit single board, characterized in that, the board is formed by the method of routing without positioning holes as claimed in any one of claims 1 to 6.

8. A printed circuit connecting board is characterized by being formed by the method for routing boards without positioning holes according to any one of claims 1 to 6.