CN106998623A - The making excision forming method of printed wiring board lamp plate - Google Patents
The making excision forming method of printed wiring board lamp plate Download PDFInfo
- Publication number
- CN106998623A CN106998623A CN201710080166.2A CN201710080166A CN106998623A CN 106998623 A CN106998623 A CN 106998623A CN 201710080166 A CN201710080166 A CN 201710080166A CN 106998623 A CN106998623 A CN 106998623A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- printed wiring
- outer layer
- cut
- layer pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The present invention discloses a kind of making excision forming method of printed wiring board lamp plate, comprises the following steps：Prepare printed wiring board to be cut；Cut for the first time：The centre distance of the outer layer PAD of the printed wiring board to edges of boards is H, and error is h, according to H+2h size cutting to the printed wiring board lamp plate；Printed wiring board is cut into nine operation units；Second of cutting：Measure the measured hole of each operation unit to outer layer PAD distance and outer layer PAD to edges of boards distance, measured hole is not more than error h to the error amount of outer layer PAD distances, and in point unilateral be no more than h/2, be molded formula be outer layer PAD to edges of boards line of cut=measured hole to outer layer PAD distance average value+H, according to it is described be molded formula the printed wiring board is cut.The present invention improves process capability, and fraction defective is reduced to 0.3% from 70%.
Description
Technical field
The invention belongs to a kind of forming method, a kind of forming method of printed wiring board lamp plate is more particularly to.
Background technology
Super large display is made up of LED lamp panel splicing, and the requirement of LED board size is very strict, outer layer PAD to plate
Side apart from size Control in ± 0.05mm.The required distance of outer layer PAD to form wire is strict, such as 10mm ± 0.05mm.Lamp plate
When piece splices with lamp plate piece, difference, which crosses conference, causes lamp plate stitching portion to have aberration, influences whole structure, normal to make because plank is deposited
In harmomegathus, the standard that shaping off normal lamp exceedes client causes the set on exception, such as plank harmomegathus 0.15mm, most side just to influence
0.075mm exceeds customer requirement, and middle influence is small.Traditional shaping cutting, shaping formula is made as seeing line of cut to origin
The distance of positioning hole, cut lengths are 1:1 makes.With the development of lamp plate, future size may require that stricter.It is traditional into
Type cuts preparation method:Shaping is cut according to shaping formula path, and shaping makes according to customer requirement；Cut lengths are
Meet client's matching requirements, carry out cutting according to the drawing requirement that client provides and actual measure confirms；Compact dimensions are molded
The part of cutting is 1:1 is cut, and capacity of equipment is ± 0.1mm, can meet the requirement of client's edge to edge；Lamp plate client will
It is outer layer PAD to the distance for being molded side to ask control, is not the capability problemses for being molded single processing procedure, can also be because of plank harmomegathus, outside
It is abnormal that the position of layer off normal causes the distance of outer layer PAD to form wire to occur, edge to edge shaping cutting, but plank has harmomegathus
0.15mm, unilateral influence 0.075mm require the ± 0.05mm of control tolerance beyond consumer product, cause outer layer PAD
Certainly exist exception to edges of boards, as long as therefore there is obvious harmomegathus in traditional operating type product, making is easy for breaking down, nothing
Method meets the making requirement of plate lamp, and the harmomegathus of product is certainly existed.Therefore the traditional shaping cutting technique of printed wiring board
The making requirement of lamp plate can not be met, cause the every plank of plank produced stays side not of uniform size, i.e. outer layer PAD into
The size on template side is abnormal, and Yin Liubian is not of uniform size causes stitching portion image with board memory obvious between every when lamp plate splices
Aberration.
The content of the invention
Cut in two times it is an object of the invention to provide a kind of, go harmomegathus, the printed wiring board that cutting accuracy is higher
A kind of forming method that lamp plate lamp plate makes.
According to an aspect of the invention, there is provided a kind of making excision forming method of printed wiring board lamp plate lamp plate,
Comprise the following steps：
Prepare printed wiring board to be cut；
Cut for the first time：The centre distance of the outer layer PAD of the printed wiring board to edges of boards is H, and error is h, according to H+
2h size is cut to the printed wiring board lamp plate；
Printed wiring board is cut into nine operation units；
Second of cutting：Measure the measured hole of each operation unit to outer layer PAD distance and outer layer PAD to edges of boards away from
Be not more than error h from, measured hole to the error amount of outer layer PAD distances, and in it is point unilateral be no more than h/2,
Be molded formula be outer layer PAD to edges of boards line of cut=measured hole to the average value+H of outer layer PAD distance, press
The printed wiring board is cut according to the shaping formula.
The forming method that a kind of printed wiring board lamp plate makes, comprises the following steps：
Prepare printed wiring board to be cut；
Cut for the first time：The predetermined distance of the outer layer PAD of the printed wiring board to edges of boards is 10mm, and error is
0.05mm, according to outer layer PAD to edges of boards 10.1mm size cutting to the printed wiring board lamp plate；
Printed wiring board is cut into nine operation units；
Second of cutting：Measure the measured hole of each operation unit to outer layer PAD distance and outer layer PAD to edges of boards away from
Be not more than error 0.05mm from, measured hole to the error amount of outer layer PAD distances, and in it is point unilateral be no more than 0.025mm, calculate and make
The measured hole of industry unit to outer layer PAD distance average value be 90.025mm
Be molded formula be outer layer PAD to edges of boards line of cut=measured hole to outer layer PAD distance average value+10mm
=90.025mm+10mm=100.025mm, cuts according to the shaping formula to the printed wiring board.
In some embodiments, measure the measured hole of each operation unit to the distance of edges of boards, it is necessary to cut away away from
With a distance from average distance-form wire range measurement hole of=measured hole to edges of boards.
In some embodiments, refine is carried out to the printed wiring board after cutting, the refine uses 0.8mm
Thin milling cutter, the lower knife speed of the thin milling cutter uses 10-15mm/sec, and the knife speed of returning of the thin milling cutter uses 400-
600mm/sec, the length of cut of the thin milling cutter is 6-8m.
Its advantage is：This patent cuts for client's fitted position according to original mode, for customer requirement outer layer
To the part of edges of boards distance, tolerance is gone in the formula design in first time cutting to PAD, and cut for the second time, is cut for the second time
The situation of Shi Yizhao actual products, actual measurement data makes shaping formula, while making the mode for being molded formula and traditional
Mode is changed, the preparation method of second of excision forming formula, is carried out with the predetermined distance of outer graphics to side client anti-
It is estimated as the making that the empty distance to side be molded formula, meets customer requirement successively.
The present invention improves process capability, the abilities of outer layer PAD distance shaping edges of boards from ± 0.125 lifting to ±
In 0.05mm, fraction defective is reduced to 0.3% from 70%.
The present invention is according to plank actual 1:1 size conversion carries out 1 to be molded after formula after progress：1 cutting, can avoid because
The outer layer PAD that product harmomegathus is brought and the deviation problem on shaping side；And small pieces formed precision is higher；It is molded formula=measured hole
The centre distance of (zero point) to outer layer PAD average value+outer layer PAD to edges of boards.
Embodiment
1-1：Cut for the first time：
A. client's fitted position：It is required that be the larger size in limit of power of size or dimensional tolerance of edge to edge, according to
Normal operation is carried out according to customer drawings.
B. customer requirement is strictly beyond the size of process capability requirement, customer requirement outer layer PAD to edges of boards centre distance
For 10mm, error is ± 0.05mm, arranges cutting twice, when cutting for the first time, cut lengths control bigger than normal such as design shaping journey
Formula and size Control walk the upper limit control 10mm+0.1mm=10.1mm control, it is to avoid once cut after plank directly beyond 10mm ±
0.05mm lower limit specification, corresponding measured hole to edges of boards also can accordingly be done greatly.
C. plank typesetting is that 1 sheet has 9 operation units, and 1 sheet is cut into 9 operation units.
Operation unit mark is added when d. designing on plank, using circuit etching or printing text mode, 9 works
Industry unit is numbered in design, and respectively 1-9 is arranged according to order.
E. cutting other parts carry out operation with reference to normal mode for the first time
1-2：Second of cutting：
A. customer requirement outer layer PAD to shaping side size 10mm ± 0.05mm.
B. plank has 9 operation units (Set) design, when small pieces only have 1/9 big cutting of sheet formed precision more preferably, simultaneously
The very short distance of outer layer PAD to edges of boards is 10mm, and precision controlling can reach ± 0.025mm
C. second of shaping formula makes：Operation unit according to printed wiring board is numbered, and carries out cutting for the first time
Operation unit plate, each numbering takes 1-5 operation units to carry out metric data, and data need correspondence operation unit numbering, measure and survey
Metering-orifice (zero point) arrive edges of boards distance, measured hole (zero point) arrive outer layer PAD, outer layer PAD to edges of boards distance (finished product 10 ±
At 0.05mm), data summarization is carried out after measurement and calculates zero point to the distance (shaping formula) of the line of cut on side and calculates
Cutting quantity.
After data summarization confirm measured hole (zero point) may not exceed 0.05mm to outer layer PAD error amount (R values), in divide after
It is unilateral otherwise to carry out a point heap according to operation unit numbering no more than 0.025mm, while when customer requirement is tightened up or during initial workpiece NG
A point heap can be carried out according to operation unit, it is ensured that meet customer requirement.
Requirement according to Customer Standard outer layer PAD to 10 ± 0.05mm of edges of boards carries out confirmation and the shaping formula of cutting path
Making：Outer layer PAD to edges of boards, the average value of line of cut (shaping formula)=measurement hole (zero point) of edges of boards to outer layer PAD+
Outer layer PAD carries out making shaping formula to the centre distance of the customer specifications of edges of boards.
Size after first time cuts is as follows：
Table one
The average value in the line of cut (shaping formula) of edges of boards=measurement hole to outer layer PAD distance is 90.025mm+ outer layers
Centre distance 10mm=100.025mms of the PAD to edges of boards.
Table two
As can be seen from Table II, above-mentioned actual outer layer PAD to the distance of edges of boards within error amount.
Cut and carry out refine after being cut to printed wiring board to printed wiring board, the refine uses 0.8mm thin milling cutter,
The lower knife speed of the thin milling cutter uses 10-15mm/sec, and the knife speed of returning of the thin milling cutter uses 400-600mm/sec, institute
The length of cut for stating thin milling cutter is 6-8m.
Above-described is only some embodiments of the present invention, for those skilled in the art, is not departing from this
On the premise of innovation and creation are conceived, various modifications and improvements can be made.
Claims (4)
1. the making excision forming method of printed wiring board lamp plate, it is characterised in that comprise the following steps：
Prepare printed wiring board to be cut；
Cut for the first time：The centre distance of the outer layer PAD of the printed wiring board to edges of boards is H, and error is h, according to H+2h's
Size is cut to the printed wiring board lamp plate；
Printed wiring board is cut into nine operation units；
Second of cutting：Measure the measured hole of each operation unit to outer layer PAD distance and outer layer PAD to edges of boards distance,
Measured hole is not more than error h to the error amount of outer layer PAD distances, and in it is point unilateral be no more than h/2,
Be molded formula be outer layer PAD to edges of boards line of cut=measured hole to outer layer PAD distance average value+H, according to described
Shaping formula is cut to the printed wiring board.
2. the forming method that printed wiring board lamp plate according to claim 1 makes, it is characterised in that
Prepare printed wiring board to be cut；
Cut for the first time：The predetermined distance of the outer layer PAD of the printed wiring board to edges of boards is 10mm, and error is 0.05mm, is pressed
According to outer layer PAD to edges of boards 10.1mm size cutting to the printed wiring board lamp plate；
Printed wiring board is cut into nine operation units；
Second of cutting：Measure the measured hole of each operation unit to outer layer PAD distance and outer layer PAD to edges of boards distance,
Measured hole is not more than error 0.05mm to the error amount of outer layer PAD distances, and in it is point unilateral be no more than 0.025mm, calculate operation
The measured hole of unit is that 90.025mm shaping formulas are lines of cut of the outer layer PAD to edges of boards to the average value of outer layer PAD distance
=measured hole to outer layer PAD distance average value+10mm=90.025mm+10mm=100.025mm, according to the shaping journey
Formula is cut to the printed wiring board.
3. the making excision forming method of printed wiring board lamp plate according to claim 1, it is characterised in that measure each
The measured hole of operation unit to edges of boards distance, it is necessary to the distance=measured hole cut away to edges of boards distance-form wire to survey
The distance of metering-orifice.
4. the making excision forming method of printed wiring board lamp plate according to claim 1, it is characterised in that after cutting
Refine is carried out to the printed wiring board, the refine uses 0.8mm thin milling cutter, and the lower knife speed of the thin milling cutter is used
10-15mm/sec, the knife speed of returning of the thin milling cutter uses 400-600mm/sec, and the length of cut of the thin milling cutter is 6-8m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710080166.2A CN106998623A (en) | 2017-02-15 | 2017-02-15 | The making excision forming method of printed wiring board lamp plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710080166.2A CN106998623A (en) | 2017-02-15 | 2017-02-15 | The making excision forming method of printed wiring board lamp plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106998623A true CN106998623A (en) | 2017-08-01 |
Family
ID=59430990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710080166.2A Pending CN106998623A (en) | 2017-02-15 | 2017-02-15 | The making excision forming method of printed wiring board lamp plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106998623A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801306A (en) * | 2017-10-31 | 2018-03-13 | 广德博亚新星电子科技有限公司 | Pcb board V CUT maloperation rectification technique methods and pcb board processing technology |
| CN109283728A (en) * | 2018-11-12 | 2019-01-29 | 成都中电熊猫显示科技有限公司 | Cut correction method, device and storage medium |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102638934A (en) * | 2011-12-28 | 2012-08-15 | 胜宏科技（惠州）股份有限公司 | Forming method for light bar circuit board |
| CN105611733A (en) * | 2016-02-23 | 2016-05-25 | 江苏博敏电子有限公司 | Control method for forming size of printed circuit board (PCB) |
| CN205793604U (en) * | 2016-05-25 | 2016-12-07 | 竞华电子(深圳)有限公司 | A kind of circuit board for making LED lamp panel |
-
2017
- 2017-02-15 CN CN201710080166.2A patent/CN106998623A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102638934A (en) * | 2011-12-28 | 2012-08-15 | 胜宏科技（惠州）股份有限公司 | Forming method for light bar circuit board |
| CN105611733A (en) * | 2016-02-23 | 2016-05-25 | 江苏博敏电子有限公司 | Control method for forming size of printed circuit board (PCB) |
| CN205793604U (en) * | 2016-05-25 | 2016-12-07 | 竞华电子(深圳)有限公司 | A kind of circuit board for making LED lamp panel |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801306A (en) * | 2017-10-31 | 2018-03-13 | 广德博亚新星电子科技有限公司 | Pcb board V CUT maloperation rectification technique methods and pcb board processing technology |
| CN107801306B (en) * | 2017-10-31 | 2020-10-30 | 广德博亚新星电子科技有限公司 | PCB V-CUT misoperation correcting process method and PCB machining process method |
| CN109283728A (en) * | 2018-11-12 | 2019-01-29 | 成都中电熊猫显示科技有限公司 | Cut correction method, device and storage medium |
| CN109283728B (en) * | 2018-11-12 | 2022-07-05 | 成都中电熊猫显示科技有限公司 | Cutting correction method, device and storage medium |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 224100 No. 9, Yong Sheng Road, Dafeng Development Zone, Yancheng City, Jiangsu. Applicant after: JIANGSU BOMIN ELECTRONICS CO., LTD. Address before: 224100 Electronic Information Industry Park, Yancheng City, Jiangsu. Applicant before: JIANGSU BOMIN ELECTRONICS CO., LTD. |
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| CB02 | Change of applicant information | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170801 |
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| WD01 | Invention patent application deemed withdrawn after publication |