CN105611733A - Control method for forming size of printed circuit board (PCB) - Google Patents
Control method for forming size of printed circuit board (PCB) Download PDFInfo
- Publication number
- CN105611733A CN105611733A CN201610099138.0A CN201610099138A CN105611733A CN 105611733 A CN105611733 A CN 105611733A CN 201610099138 A CN201610099138 A CN 201610099138A CN 105611733 A CN105611733 A CN 105611733A
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- CN
- China
- Prior art keywords
- cutter
- control method
- pcb
- slightly
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a control method for a forming size of a printed circuit board (PCB). The control method comprises the following steps of (1) roughly trimming, in which cutting is carried out along a center of a slot forming line on the PCB by a rough trimming cutter at one time to remove a large waste block and give out a rough profile of a slot; and (2) finely trimming, in which cutting is accurately carried out along the periphery of the slot forming line on the PCB by a fine trimming cutter at one time to remove residual small waste blocks and give out an accurate shape of the slot. Compared with the prior art, the control method has the advantages that the cutting forming precision of the PCB is remarkably improved, and the board edge of the PCB cut and formed by using the method is more smooth and flat.
Description
Technical field
The present invention relates to the excision forming field of pcb board, be specifically related to a kind of control of pcb board compact dimensionsMethod.
Background technology
Numerical control cutting device (as CNC milling machine) employing diameter only has the cutting tool of several millimeters along pcb boardUpper prefabricated form wire is by unnecessary waste material excision, to realize the excision forming of pcb board.
In prior art, the general excision forming method that adopts " one-pass ", as shown in Figure 1, the partyMethod is walked a cutter along the center of the slotted eye form wire on pcb board and completes the moulding of slotted eye. In order to ensure moulding essenceDegree, Numerical control cutting Array selection is installed pocket knife footpath (diameter of cutting knife) cutter and is cut, and according to parameterTable is set the radius compensation of cutter. At present, the dimensional accuracy that " one-pass " excision forming method can reachBe about 0.1mm, use the pcb board of the method excision forming easily to occur zigzag edges of boards.
Summary of the invention
The present invention is directed to the problems referred to above, a kind of control method of pcb board compact dimensions is provided, this controlling partyMethod adopts the excision forming mode of twice feed, to improve the excision forming precision of pcb board, its concrete technologyScheme is as follows:
A control method for pcb board compact dimensions, is characterized in that: described control method successively adopts thickDrag for cutter, essence is dragged for the each feed of cutter once, it comprises the steps: (1), slightly drags for: use and slightly drag for cutter edgeThe center of the slotted eye form wire on pcb board and walk cutter No. one time, to remove large scrap, provide the large of slotted eyeCause profile; (2), essence is dragged for: use essence to drag for cutter and accurately walk one along the periphery of the slotted eye form wire on pcb boardInferior cutter, to remove remaining little scrap, provides the accurate shape of slotted eye.
Further, slightly drag in step described, the described diameter that slightly drags for cutter is less than the width of described slotted eye.
Further, slightly drag in step described, the described radius compensation that slightly drags for cutter is set to describedly slightly drag forThe radius of cutter.
Further, drag in step in described essence, the radius compensation that described essence is dragged for cutter is set to described essence and drags forThe radius of cutter deducts 0.025mm.
Compared with prior art, technique effect of the present invention is: the excision forming that has significantly improved pcb boardPrecision, the dimensional accuracy of its excision forming reaches 0.05mm, uses the edges of boards of the pcb board of the method productionPaint Gloss smooth.
Brief description of the drawings
Fig. 1 is the schematic diagram of " one-pass " of the prior art;
Fig. 2 is feed schematic diagram of the present invention.
Detailed description of the invention
For making above-mentioned purpose of the present invention, feature and advantage, can more becoming apparent, below in conjunction with accompanying drawingThe present invention is further detailed explanation with detailed description of the invention.
In a specific embodiment, the present invention adopts CNC milling machine to complete the excision forming of pcb board, described inCNC milling machine automatically completes excision forming process under the control of the program data writing in advance.
As shown in Figure 2, the control method of pcb board compact dimensions of the present invention successively adopts and slightly drags for cutter, essenceDrag for the each feed of cutter once, to complete the excision forming of pcb board, specific as follows:
(1), slightly drag for: use and slightly drag for cutter and walk cutter No. one time along the center of the slotted eye form wire on pcb board,To remove large scrap, provide the general profile of slotted eye. The described diameter that slightly drags for cutter is less than described slotted eyeWidth, the described radius compensation that slightly drags for cutter is set to the described radius that slightly drags for cutter.
(2), essence is dragged for: use essence to drag for cutter and accurately walk once along the periphery of the slotted eye form wire on pcb boardCutter, to remove remaining little scrap, provides the accurate shape of slotted eye. Described essence is dragged for the radius of cutter and is mendedRepay and be set to described essence and drag for the radius of cutter and deduct 0.025mm.
The dimensional accuracy of the excision forming that can reach of the present invention reaches 0.05mm.
Compared with prior art, the present invention has significantly improved the excision forming precision of pcb board, uses the methodThe edges of boards of the pcb board of producing are Paint Gloss smooth.
The present invention is carried out to the enough detailed description with certain particularity above. Under general in fieldLogical technical staff should be appreciated that, the description in embodiment is only exemplary, do not depart from of the present invention trueUnder the prerequisite of real spirit and scope, make change and all should belong to protection scope of the present invention. Institute of the present inventionClaimed scope is to be limited by described claims, instead of above-mentioned by embodimentDescription limits.
Claims (4)
1. a control method for pcb board compact dimensions, is characterized in that: described control method successively adopts and slightly drags forCutter, essence are dragged for the each feed of cutter once, and it comprises the steps:
(1), slightly drag for: use and slightly drag for cutter and walk cutter No. one time along the center of the slotted eye form wire on pcb board, withRemove large scrap, provide the general profile of slotted eye;
(2), essence drags for: use essence to drag for cutter and accurately walk cutter No. one time along the periphery of the slotted eye form wire on pcb board,To remove remaining little scrap, provide the accurate shape of slotted eye.
2. the control method of pcb board compact dimensions as claimed in claim 1, is characterized in that: slightly drag for describedIn step, the described diameter that slightly drags for cutter is less than the width of described slotted eye.
3. the control method of pcb board compact dimensions as claimed in claim 2, is characterized in that: slightly drag for describedIn step, the described radius compensation that slightly drags for cutter is set to the described radius that slightly drags for cutter.
4. the control method of pcb board compact dimensions as claimed in claim 1, is characterized in that: drag in described essenceIn step, the radius compensation that described essence is dragged for cutter is set to described essence and drags for the radius of cutter and deduct 0.025mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610099138.0A CN105611733A (en) | 2016-02-23 | 2016-02-23 | Control method for forming size of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610099138.0A CN105611733A (en) | 2016-02-23 | 2016-02-23 | Control method for forming size of printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105611733A true CN105611733A (en) | 2016-05-25 |
Family
ID=55991181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610099138.0A Pending CN105611733A (en) | 2016-02-23 | 2016-02-23 | Control method for forming size of printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105611733A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106879175A (en) * | 2017-02-15 | 2017-06-20 | 深圳市景旺电子股份有限公司 | A kind of forming method of pcb board |
| CN106984999A (en) * | 2017-05-05 | 2017-07-28 | 昆山弗莱吉电子科技有限公司 | A kind of pcb board method for processing forming compensated based on milling cutter knife footpath |
| CN106998623A (en) * | 2017-02-15 | 2017-08-01 | 江苏博敏电子有限公司 | The making excision forming method of printed wiring board lamp plate |
| CN110666230A (en) * | 2019-09-20 | 2020-01-10 | 深南电路股份有限公司 | Inner contour groove milling method |
| CN111586982A (en) * | 2020-05-28 | 2020-08-25 | 遂宁市广天电子有限公司 | Processing method for reducing PCB (printed Circuit Board) out-of-tolerance phenomenon |
| CN111654974A (en) * | 2019-03-04 | 2020-09-11 | 北大方正集团有限公司 | Cutting method and system for flexible substrate PCB |
| CN112616258A (en) * | 2021-01-12 | 2021-04-06 | 广东世运电路科技股份有限公司 | Circuit board negative film and processing method thereof |
| CN113438812A (en) * | 2021-06-15 | 2021-09-24 | 江西景旺精密电路有限公司 | Processing method for forming multiple parallel overlong grooves of PCB |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101219513A (en) * | 2007-01-09 | 2008-07-16 | 鸿富锦精密工业（深圳）有限公司 | Housing and manufacturing method thereof |
| CN102387668A (en) * | 2011-10-26 | 2012-03-21 | 高德（无锡）电子有限公司 | Cutting machining technology for semi-hole plate provided with copper plating holes at plate edges |
| CN103052260A (en) * | 2011-10-14 | 2013-04-17 | 北大方正集团有限公司 | Golden finger processing method, printed circuit board manufacturing method, golden finger and printed circuit board |
| CN104640358A (en) * | 2014-12-17 | 2015-05-20 | 江苏博敏电子有限公司 | Half-hole plate manufacturing method |
-
2016
- 2016-02-23 CN CN201610099138.0A patent/CN105611733A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101219513A (en) * | 2007-01-09 | 2008-07-16 | 鸿富锦精密工业（深圳）有限公司 | Housing and manufacturing method thereof |
| CN103052260A (en) * | 2011-10-14 | 2013-04-17 | 北大方正集团有限公司 | Golden finger processing method, printed circuit board manufacturing method, golden finger and printed circuit board |
| CN102387668A (en) * | 2011-10-26 | 2012-03-21 | 高德（无锡）电子有限公司 | Cutting machining technology for semi-hole plate provided with copper plating holes at plate edges |
| CN104640358A (en) * | 2014-12-17 | 2015-05-20 | 江苏博敏电子有限公司 | Half-hole plate manufacturing method |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106879175A (en) * | 2017-02-15 | 2017-06-20 | 深圳市景旺电子股份有限公司 | A kind of forming method of pcb board |
| CN106998623A (en) * | 2017-02-15 | 2017-08-01 | 江苏博敏电子有限公司 | The making excision forming method of printed wiring board lamp plate |
| CN106984999A (en) * | 2017-05-05 | 2017-07-28 | 昆山弗莱吉电子科技有限公司 | A kind of pcb board method for processing forming compensated based on milling cutter knife footpath |
| CN111654974A (en) * | 2019-03-04 | 2020-09-11 | 北大方正集团有限公司 | Cutting method and system for flexible substrate PCB |
| CN110666230A (en) * | 2019-09-20 | 2020-01-10 | 深南电路股份有限公司 | Inner contour groove milling method |
| CN111586982A (en) * | 2020-05-28 | 2020-08-25 | 遂宁市广天电子有限公司 | Processing method for reducing PCB (printed Circuit Board) out-of-tolerance phenomenon |
| CN112616258A (en) * | 2021-01-12 | 2021-04-06 | 广东世运电路科技股份有限公司 | Circuit board negative film and processing method thereof |
| CN113438812A (en) * | 2021-06-15 | 2021-09-24 | 江西景旺精密电路有限公司 | Processing method for forming multiple parallel overlong grooves of PCB |
| CN113438812B (en) * | 2021-06-15 | 2022-11-11 | 江西景旺精密电路有限公司 | Processing method for forming multiple parallel overlong grooves of PCB |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 224100 No. 9, Yong Sheng Road, Dafeng Development Zone, Yancheng City, Jiangsu. Applicant after: JIANGSU BOMIN ELECTRONICS CO., LTD. Address before: 224100 Electronic Information Industry Park, Yancheng City, Jiangsu. Applicant before: JIANGSU BOMIN ELECTRONICS CO., LTD. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160525 |