CN103480929A - Processing method of three-dimensional microstructure prepared by minute electric sparks based on sheet electrodes - Google Patents
Processing method of three-dimensional microstructure prepared by minute electric sparks based on sheet electrodes Download PDFInfo
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Abstract
The invention relates to a processing method of a three-dimensional microstructure prepared by minute electric sparks based on sheet electrodes. The processing method includes establishing three-dimensional microstructure CAD (computer-aided design) geometric models first, establishing three-dimensional minute electric spark electrode CAD geometric models corresponding to the established three-dimensional microstructure CAD geometric models, slicing the three-dimensional minute electric spark electrode CAD geometric models in dispersedness, transforming disperse slices geometric models into a group of slice electrode data models in mutually parallel, slicing corresponding slice electrodes on a slice electrode material one by one by a slice slicing system according to the slice electrode data models in a computer to acquire a group of slice electrode array, and performing minute electric spark machining. With the manufacturing method, electric discharge machining via large-size scanning and milling by layers of cylindrical microelectrodes is avoided when two-dimensional slice electrodes perform electric discharge machining, and an up and down type moving electric discharge mode can effectively increase machining efficiency and reduce microelectrode loss.
Description
Technical field
The processing method of a kind of three-dimensional microstructures the present invention relates to, especially a kind of fine electric spark based on thin electrode prepares the processing method of three-dimensional microstructures.
Background technology
Usually, micro-structural is defined as: at least, on the bidimensional yardstick, the product with submillimeter or the micro-feature structure of micron order is called micro-(structure) part.
It is one of main flow manufacturing process prepared at present three-dimensional microstructures that fine electric spark processing by micro-electrode prepares three-dimensional microstructures.The main method that the fine electric spark processing of use micro-electrode prepares three-dimensional microstructures has:
(1) thus being connected stack by some layers of two-dimensional slices electrode simulates three-dimensional micro-electrode, thereby and use this three-dimensional micro-electrode processing acquisition three-dimensional microstructures that discharge.In this technology, three-dimensional micro-electrode is that the stack matching by some layers of two-dimensional slices electrode obtains, and the technical process that therefore prepares three-dimensional micro-electrode is comparatively complicated; In preparing the process of three-dimensional micro-electrode, the lamination Accuracy of two-dimensional slices electrode the formed precision of three-diemsnional electrode, and then can the precision of the process three-dimensional microstructures prepared be exerted an influence, so this technology is high to the lamination required precision of two-dimensional slices electrode.
(2) make by various processing methods the half-cylindrical microelectrode of two dimension that diameter is tiny, thereby then by the milling of the scanning layer by layer electric discharge of microelectrode, process and obtain three-dimensional microstructures.But, because cylindrical microelectrode diameter dimension is very fine with respect to scan area, make working (machining) efficiency very low.And, in the process that scans layer by layer milling electric discharge processing of microelectrode, the microelectrode loss is very serious, is difficult to long-time normal operation.
Summary of the invention
In view of above-mentioned condition, be necessary to provide a kind of processing method that can effectively improve working (machining) efficiency and reduce the three-dimensional microstructures of microelectrode loss.
For solving the problems of the technologies described above, provide a kind of fine electric spark based on thin electrode to prepare the processing method of three-dimensional microstructures, include following steps:
1) by three-dimensional computer Computer Aided Design CAD software systems, the three-dimensional microstructures that needs rapidoprint is set up to the CAD geometrical model;
2) set up the CAD geometrical model of corresponding three-dimensional fine electric spark electrode according to the three-dimensional microstructures CAD geometrical model of setting up;
3) again the CAD geometrical model of the three-dimensional fine electric spark electrode set up is carried out to discrete slices along a direction, obtain the discrete slices geometrical model;
4) the discrete slices geometrical model of three-dimensional fine electric spark electrode is converted into to the one group of thin electrode data model be parallel to each other;
5) cut one by one corresponding thin electrode according to the thin electrode data model in computer by the thin slice diced system on a slice thin electrode material, the centre-to-centre spacing of each thin electrode is identical, obtain the thin electrode array of a group after removing waste material, be respectively the 1-N thin electrode;
6) the one group of thin electrode array above-mentioned cutting completed carries out fine electric spark processing to the rapidoprint of three-dimensional microstructures.
Fine electric spark processing to step 6) also comprises the steps:
1) at first, No. 1 thin electrode is aimed at rapidoprint and is carried out fine electric spark processing, and other thin electrode is unsettled; By No. 1 thin electrode fine electric spark processing of formula up and down, on rapidoprint, just can process the micro-structural corresponding to No. 1 thin electrode;
2), after No. 1 thin electrode completion of processing, motion platform moves forward and backward an electrode centers distance, a mobile electric discharge processing thickness, thus the Working position of No. 2 thin electrodes and the cutter trade of No. 1 thin electrode are alignd;
3), again on the position of the cutter trade of No. 1 thin electrode alignment, No. 2 thin electrodes carry out the fine electric spark processing of formula up and down, on rapidoprint, can process the micro-structural corresponding to No. 2 thin electrodes equally;
4) by above-mentioned 1)-3) in step, complete 3 to N thin electrodes and rapidoprint carried out to the processing of fine electric spark, finally this group thin electrode array cutter trade on rapidoprint just can simulate the three-dimensional microstructures finished product.
The preparation method of this thin electrode array can be laser cutting, line cutting or spark machined.
This thin electrode material can be copper coin, tungsten plate, graphite cake, nickel plate, molybdenum plate or steel plate.
This thin electrode material thickness size≤1.0mm.
The above-mentioned fine electric spark based on thin electrode prepares the processing method of three-dimensional microstructures, by the fine electric spark of thin electrode array, processes the three-dimensional microstructures obtained, and its beneficial effect be compared with the prior art is:
1) present technique will be separated into for the preparation of the three-dimensional micro-electrode of complicated three-dimensional microstructures one group of two-dimensional slices electrod-array, and carry out approach three-dimensional structure approx by the cutter trade of this group two-dimensional slices electrod-array.On principle, the thickness of thin electrode is thinner, and the approach precision is higher.
2) prepare three-dimensional microstructures with the fine electric spark of three-dimensional micro-electrode and compare, can avoid connection and the stack of some layers of two-dimensional slices electrode by the electric discharge processing of two-dimensional slices electrod-array, forming process is simple.
3) discharge and add the large tracts of land that can avoid cylindrical microelectrode man-hour and scan layer by layer milling electric discharge processing by the two-dimensional slices electrode, only adopt simple upper and lower reciprocation type to move discharge mode, can effectively improve working (machining) efficiency and reduce the microelectrode loss.
The accompanying drawing explanation
Fig. 1 is the cad model schematic diagram of three-dimensional microstructures of the present invention.
Fig. 2 is the cad model schematic diagram of the three-dimensional fine electric spark electrode corresponding with the cad model of Fig. 1 three-dimensional microstructures.
Fig. 3 is the thin electrode data model schematic diagram of three-dimensional fine electric spark electrode of the present invention.
Fig. 4 is the schematic diagram that three-dimensional fine electric spark electrode of the present invention is separated into the thin electrode array.
Fig. 5 is the fine electric spark machining sketch chart of embodiment of the present invention thin electrode array.
Fig. 6 is the three-dimensional microstructures that the embodiment of the present invention is passed through the fine electric spark processing acquisition of thin electrode array.
Wherein: 10, three-dimensional microstructures; 12, three-dimensional microstructures finished product; 20, three-dimensional fine electric spark electrode; 30, thin electrode.
The specific embodiment
The processing method that fine electric spark based on thin electrode of the present invention is prepared to three-dimensional microstructures below in conjunction with drawings and Examples is described in further detail.
Refer to Fig. 1 to Fig. 6, a kind of fine electric spark based on thin electrode of the embodiment of the present invention prepares the processing method of three-dimensional microstructures, includes following steps:
1) by three-dimensional computer Computer Aided Design CAD software systems, the three-dimensional microstructures 10 that needs rapidoprint is set up to the CAD geometrical model;
2) set up the CAD geometrical model of corresponding three-dimensional fine electric spark electrode 20 according to the three-dimensional microstructures CAD geometrical model of setting up;
3) again the CAD geometrical model of the three-dimensional fine electric spark electrode 20 set up is carried out to discrete slices along a direction, obtain the discrete slices geometrical model;
4) the discrete slices geometrical model of three-dimensional fine electric spark electrode is converted into to one group of thin electrode 30 data model be parallel to each other;
5) cut one by one corresponding thin electrode 30 according to thin electrode 30 data models in computer by the thin slice diced system on a slice thin electrode 30 materials, the centre-to-centre spacing of each thin electrode 30 is identical, obtain the thin electrode array of a group after removing waste material, be respectively 1-N thin electrode 30; The preparation method of this thin electrode array can be laser cutting, line cutting or spark machined.
6) the one group of thin electrode array as shown in Figure 4, Figure 5, above-mentioned cutting completed carries out fine electric spark processing to the rapidoprint of three-dimensional microstructures 10.
Fine electric spark processing to step 6) also comprises the steps:
1) at first, the rapidoprint of No. 1 thin electrode 30 aligning three-dimensional microstructures 10 carries out fine electric spark processing, and other thin electrode 30 is unsettled; By No. 1 thin electrode 30 fine electric spark processing of formula up and down, on rapidoprint, just can process the micro-structural corresponding to No. 1 thin electrode 30;
2), after No. 1 thin electrode 30 completion of processing, motion platform moves forward and backward an electrode centers distance, a mobile electric discharge processing thickness, thus the Working position of No. 2 thin electrodes 30 and the cutter trade of No. 1 thin electrode 30 are alignd;
3), again on the position of the cutter trade of No. 1 thin electrode 30 alignment, No. 2 thin electrodes 30 carry out the fine electric spark processing of formula up and down, on the rapidoprint of three-dimensional microstructures 10, can process the micro-structural corresponding to No. 2 thin electrodes 30 equally;
4) by above-mentioned 1)-3) in step, complete 30 pairs of three-dimensional microstructures 10 rapidoprints of 3 to N thin electrode and carry out the processing of fine electric spark, finally the cutter trade of this group thin electrode array on rapidoprint just can simulate three-dimensional microstructures finished product 12.
These thin electrode 30 materials can be copper coin, tungsten plate, graphite cake, nickel plate, molybdenum plate or steel plate; This thin electrode 30 material thickness size≤1.0mm.
The fine electric spark that the present invention is based on thin electrode prepares the processing method of three-dimensional microstructures, its three-dimensional fine electric spark electrode 20 prepares three-dimensional microstructures finished product 12, can avoid connection and the stack of some layers of two-dimensional slices electrode 30 by the electric discharge processing of two-dimensional slices electrod-array, forming process is simple; Discharge and add the large tracts of land that can avoid cylindrical microelectrode man-hour and scan layer by layer milling electric discharge processing by two-dimensional slices electrode 30, only adopt simple upper and lower reciprocation type to move discharge mode, can effectively improve working (machining) efficiency and reduce the microelectrode loss.
specific embodiment
Embodiment 1
As shown in Figures 1 to 4, take electrode sheet material as the thick Copper Foil of 0.02mm be example, the concrete processing method of making the Copper Foil three-dimensional microstructures comprises the following steps:
1) at first,, by three-dimensional computer Computer Aided Design CAD software systems, the three-dimensional microstructures that needs rapidoprint is set up to the CAD geometrical model;
2) set up the CAD geometrical model of corresponding three-dimensional fine electric spark electrode according to the three-dimensional microstructures CAD geometrical model of setting up, and this three-dimensional micro-electrode is carried out to discrete slices, obtain the discrete slices geometrical model;
3) the discrete slices geometrical model of three-dimensional micro-electrode is converted into to the one group of thin electrode data model be parallel to each other;
4) on the Copper Foil that is 0.02mm according to the thin electrode data model in computer at a slice thickness by laser cutting system, cut one by one corresponding thin electrode, the centre-to-centre spacing of each thin electrode is 4mm, after the removal waste material, obtains the thin electrode array of a group;
5) the thin electrode array as shown in Figure 4, Figure 5, above-mentioned cutting completed carries out fine electric spark processing.The main process of processing is as follows:
A) carry out fine electric spark and add man-hour, No. 1 thin electrode is aimed at rapidoprint, and other thin electrode is unsettled.By No. 1 thin electrode fine electric spark processing of formula up and down, on rapidoprint, just can process the micro-structural corresponding to No. 1 thin electrode;
B) after No. 1 thin electrode completion of processing, motion platform moves forward and backward 0.02mm, moves left and right 4mm, thereby makes the cutter trade alignment of Working position and No. 1 thin electrode of No. 2 thin electrodes;
C), again on the position of the cutter trade of No. 1 thin electrode alignment, No. 2 thin electrodes carry out the fine electric spark processing of formula up and down, on the rapidoprint of three-dimensional microstructures, can process the micro-structural corresponding to No. 2 thin electrodes equally;
D) by above-mentioned a)-c) in step, complete 3 to N thin electrodes and the three-dimensional microstructures rapidoprint is carried out to the processing of fine electric spark, finally the cutter trade of this group thin electrode array on rapidoprint just can simulate the three-dimensional microstructures finished product.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet not in order to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (5)
1. the fine electric spark based on thin electrode prepares the processing method of three-dimensional microstructures, it is characterized in that: include following steps:
1) by three-dimensional computer Computer Aided Design CAD software systems, the three-dimensional microstructures that needs rapidoprint is set up to the CAD geometrical model;
2) set up the CAD geometrical model of corresponding three-dimensional fine electric spark electrode according to the three-dimensional microstructures CAD geometrical model of setting up;
3) again the CAD geometrical model of the three-dimensional fine electric spark electrode set up is carried out to discrete slices along a direction, obtain the discrete slices geometrical model;
4) the discrete slices geometrical model of three-dimensional fine electric spark electrode is converted into to the one group of thin electrode data model be parallel to each other;
5) cut one by one corresponding thin electrode according to the thin electrode data model in computer by the thin slice diced system on a slice thin electrode material, the centre-to-centre spacing of each thin electrode is identical, obtain the thin electrode array of a group after removing waste material, be respectively the 1-N thin electrode;
6) the one group of thin electrode array above-mentioned cutting completed carries out fine electric spark processing to the rapidoprint of three-dimensional microstructures.
2. the fine electric spark based on thin electrode as claimed in claim 1 prepares the processing method of three-dimensional microstructures, it is characterized in that: the fine electric spark processing to step 6) also comprises the steps:
1) at first, No. 1 thin electrode is aimed at rapidoprint and is carried out fine electric spark processing, and other thin electrode is unsettled; By No. 1 thin electrode fine electric spark processing of formula up and down, on rapidoprint, just can process the micro-structural corresponding to No. 1 thin electrode;
2), after No. 1 thin electrode completion of processing, motion platform moves forward and backward an electrode centers distance, a mobile electric discharge processing thickness, thus the Working position of No. 2 thin electrodes and the cutter trade of No. 1 thin electrode are alignd;
3), again on the position of the cutter trade of No. 1 thin electrode alignment, No. 2 thin electrodes carry out the fine electric spark processing of formula up and down, on rapidoprint, can process the micro-structural corresponding to No. 2 thin electrodes equally;
4) by above-mentioned 1)-3) in step, complete 3 to N thin electrodes and rapidoprint carried out to the processing of fine electric spark, finally this group thin electrode array cutter trade on rapidoprint just can simulate the three-dimensional microstructures finished product.
3. the fine electric spark based on thin electrode as claimed in claim 1 prepares the processing method of three-dimensional microstructures, it is characterized in that: the preparation method of this thin electrode array can be laser cutting, line cutting or spark machined.
4. the fine electric spark based on thin electrode as claimed in claim 1 prepares the processing method of three-dimensional microstructures, it is characterized in that: this thin electrode material can be copper coin, tungsten plate, graphite cake, nickel plate, molybdenum plate or steel plate.
5. the fine electric spark based on thin electrode as claimed in claim 4 prepares the processing method of three-dimensional microstructures, it is characterized in that: this thin electrode material thickness size≤1.0mm.
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| CN105537703A (en) * | 2016-01-12 | 2016-05-04 | 深圳大学 | Laminated fitting preparing method for three-dimensional microelectrode |
| CN105537709A (en) * | 2016-01-28 | 2016-05-04 | 深圳大学 | Three-dimensional microstructure processing method based on bidirectional three-dimensional feature stacking |
| CN107081491A (en) * | 2017-05-16 | 2017-08-22 | 深圳大学 | New thin slice queue microelectrode |
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| CN105537709B (en) * | 2016-01-28 | 2017-12-08 | 深圳大学 | A kind of three-dimensional microstructures processing method based on the superposition of two-way three-dimensional feature |
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| CN107931753A (en) * | 2017-11-14 | 2018-04-20 | 深圳大学 | The method for processing micro- rotary structure |
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| CN109300193A (en) * | 2018-09-21 | 2019-02-01 | 深圳大学 | A kind of processing method of three-dimensional microstructures |
| CN109300193B (en) * | 2018-09-21 | 2023-11-24 | 深圳大学 | Processing method of three-dimensional microstructure |
| CN110216342A (en) * | 2019-06-11 | 2019-09-10 | 深圳大学 | A kind of microelectrode preparation method and microelectrode |
| CN110238469A (en) * | 2019-07-22 | 2019-09-17 | 北京理工大学 | A kind of electric discharge machining method of combination electrode and big aspect ratio multistage microstructural |
| CN110722230A (en) * | 2019-10-29 | 2020-01-24 | 深圳大学 | Part machining method based on electric spark machining |
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| CN111037015A (en) * | 2019-12-20 | 2020-04-21 | 深圳大学 | Three-dimensional microstructure processing method and three-dimensional microstructure |
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Effective date of registration: 20170621 Address after: Longgang District of Shenzhen City, Guangdong province 518000 Ping Street six community senior Road No. 81 Patentee after: Shenzhen Da Da polymer Mstar Technology Ltd Address before: 518000, South District Electrical machinery building, 3688 Nanhai Road, Shenzhen, Guangdong, Nanshan District 518 Patentee before: Shenzhen University |
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