CN109300193A - A kind of processing method of three-dimensional microstructures - Google Patents
A kind of processing method of three-dimensional microstructures Download PDFInfo
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- CN109300193A CN109300193A CN201811109883.4A CN201811109883A CN109300193A CN 109300193 A CN109300193 A CN 109300193A CN 201811109883 A CN201811109883 A CN 201811109883A CN 109300193 A CN109300193 A CN 109300193A
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- 238000003672 processing method Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 45
- 238000003754 machining Methods 0.000 claims abstract description 28
- 238000012545 processing Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims description 29
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 239000010937 tungsten Substances 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- 238000013519 translation Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002679 ablation Methods 0.000 description 2
- 230000000181 anti-adherent effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 241000446313 Lamella Species 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011960 computer-aided design Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010892 electric spark Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/10—Geometric CAD
- G06F30/17—Mechanical parametric or variational design
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Present invention discloses a kind of processing methods of three-dimensional microstructures, it is characterized in that, comprising steps of along pre-established three-dimensional structure CAD geometrical model perpendicular to center line direction, discrete slices are carried out to the CAD geometrical model of the three-dimensional structure, obtain the three-dimensional microstructures discrete slices of preset quantity；Convert the three-dimensional microstructures discrete slices of the preset quantity to the geometric data of corresponding preset quantity；It is successively cut on the electrode plate of specified parameter by preset order according to the geometric data, obtains the micro structure array on electrode plate, the three-dimensional microstructures discrete slices of the micro-structure on the micro structure array and the preset quantity correspond；Electric machining is carried out to default rapidoprint according to predetermined process using the electrode plate, obtains three-dimensional microstructures.It can be realized stable process, the factor of machining accuracy be transformed into the kinematic accuracy on vertical direction, to improve processing efficiency.
Description
Technical field
A kind of processing method of three-dimensional microstructures of the present invention, especially a kind of three-dimensional microstructures based on electric machining
Processing method.
Background technique
Preparing three-dimensional microstructures by the EDM micro elements of micro-electrode is the mainstream processing for preparing three-dimensional microstructures at present
One of means.EDM micro elements include micro EDM and electrochemical micromachining.With the three-dimensional micro- knot of micro EDM
For structure, main processes are as follows: the tiny micro- columnar electrode of diameter are made by various processing methods, then by micro-
The electro-discharge machining of scanning layer by layer of electrode obtains three-dimensional microstructures.But since microtrabeculae shape electrode size is relative to scan area ten
It is point fine, so that processing efficiency is very low.This disadvantage constrains the technology in the extensive use of industrial circle.
In addition, may be based on the fine electric spark preparation three-dimensional structure processing of thin electrode, but this method is in the mistake of implementation
Have the following problems in journey: the machining accuracy of three-dimensional microstructures is closely related with gauge of sheet, and lamella thickness is smaller, three-dimensional micro-
Structure machining accuracy is higher.But thin plate is thinner, it is inadequate to will lead to thin electrode rigidity, and three-dimensional microstructures process is unstable
It is fixed.
Summary of the invention
The main object of the present invention is to provide a kind of micro- knot of the three-dimensional that can effectively improve processing efficiency and machining accuracy
Structure processing method.
To achieve the above object, the application provides a kind of processing method of three-dimensional microstructures, comprising steps of
Along pre-established three-dimensional structure CAD geometrical model perpendicular to center line direction, to the CAD of the three-dimensional structure
Geometrical model carries out discrete slices, obtains the three-dimensional microstructures discrete slices of preset quantity；
Convert the three-dimensional microstructures discrete slices of the preset quantity to the geometric data of corresponding preset quantity；
It successively cuts, obtains on electrode plate by preset order on the electrode plate of specified parameter according to the geometric data
The three-dimensional microstructures discrete slices one of micro structure array, micro-structure and the preset quantity on the micro structure array are a pair of
It answers；
Electric machining is carried out to default rapidoprint according to predetermined process using the electrode plate, obtains three-dimensional microstructures.
Further, the CAD geometrical model along pre-established three-dimensional structure perpendicular to center line direction, to described
Before the step of CAD geometrical model of three-dimensional structure carries out discrete slices, obtains the three-dimensional microstructures discrete slices of preset quantity,
Include:
Judge the CAD geometrical model for the three-dimensional microstructures for whether having to be processed in database；
If there being the CAD geometrical model of three-dimensional microstructures to be processed in database, the CAD of the three-dimensional microstructures is called
Geometrical model；
If not having the CAD geometrical model of three-dimensional microstructures to be processed in database, according to the three-dimensional microstructures
Working process parameter establishes the CAD geometrical model of the three-dimensional microstructures.
Further, if not having the CAD geometrical model of three-dimensional microstructures to be processed in the database, according to described
The working process parameter of three-dimensional microstructures was established after the step of CAD geometrical model of the three-dimensional microstructures, comprising:
In the database by the CAD geometrical model storage of the three-dimensional microstructures.
Further, the CAD geometrical model along pre-established three-dimensional structure perpendicular to center line direction, to described
After the step of CAD geometrical model of three-dimensional structure carries out discrete slices, obtains the three-dimensional microstructures discrete slices of preset quantity,
Include:
The three-dimensional microstructures discrete slices of the preset quantity are successively arranged in parallel by preset order.
Further, which is characterized in that it include at least two micro-structures on the electrode plate, it is described to utilize the electrode plate
The step of is carried out by electric machining, obtains three-dimensional microstructures for default rapidoprint according to given process, comprising:
The micro-structure center for being parallel to first size on the electrode plate of material platform is directed at the default rapidoprint, according to
First given process processes the default rapidoprint along the direction perpendicular to the material platform, adds in described preset
The micro-structure of first size is obtained on work material；
Coordination electrode plate makes the micro- of the second size on electrode plate along the direction translation designated displacement for being parallel to the material platform
Structure centre is directed at the default rapidoprint, adds along the direction perpendicular to the material platform to default according to the second given process
Work material is processed, and the micro-structure of the second size is obtained on the default rapidoprint, and the designated displacement is the first ruler
Very little micro-structure center is at a distance from the micro-structure center of the second size；
The process of micro-structure according to second size, the direction that control motor is parallel to the material platform are mobile
And all micro-structure centers on electrode plate is made to be respectively aligned to the default rapidoprint successively to carry out to default processing technology
Processing, obtains the three-dimensional microstructures.
Further, the center of each adjacent microstructures in the micro structure array is away from equal.
It is further, described successively to be cut on the electrode plate of specified parameter by preset order according to the geometric data,
Obtain the micro structure array on electrode plate, the three-dimensional microstructures of the micro-structure on the micro structure array and the preset quantity from
Dissipate the step of slice corresponds, comprising:
It is successively cut by laser on the electrode plate of specified parameter or wire cutting, obtains by preset order according to the geometric data
The three-dimensional microstructures of micro structure array on to electrode plate, micro-structure and the preset quantity on the micro structure array are discrete
Slice corresponds.
Further, the electrode plate includes copper sheet, tungsten plate, copper tungsten plate, graphite plate, nickel plate, molybdenum plate or steel plate.
Further, the thickness range of the electrode plate includes: greater than 0.1 and to be less than three-dimensional structure CAD geometry mould
The size of type.
Further, the material of the electrode plate is set as tungsten-copper alloy, thickness 0.2mm.
A kind of processing method of three-dimensional microstructures of the invention has the advantage that as by three-dimensional microstructures
CAD geometrical model carries out the data obtained after the discrete slices on assigned direction, and micro- knot is directly cut on compared with thick sheet metal
Structure array, and the mode of electric machining is carried out to default rapidoprint, can be realized stable process, by machining accuracy because
Element is transformed into the kinematic accuracy on vertical direction, to improve processing efficiency.
Detailed description of the invention
Fig. 1 is electrode plate micro structure array and corresponding discrete slices model schematic in one embodiment of the invention；
Fig. 2 is the CAD geometrical model schematic diagram of three-dimensional microstructures in one embodiment of the invention；
Fig. 3 is the discrete slices geometrical model schematic diagram of three-dimensional microstructures in one embodiment of the invention；
Fig. 4 is the machining sketch chart of three-dimensional microstructures in one embodiment of the invention.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
As shown in Figs 1-4, the invention proposes a kind of processing methods of three-dimensional microstructures, comprising steps of
S1, along pre-established three-dimensional structure CAD geometrical model 1 perpendicular to center line direction, to the CAD of three-dimensional structure
Geometrical model 1 carries out discrete slices, obtains the three-dimensional microstructures discrete slices of preset quantity；
In the present embodiment, by calling the CAD geometrical model 1 of pre-established three-dimensional structure, three-dimensional knot in systems
The CAD geometrical model 1 of structure is a hemisphere, and the central axis of hemisphere is in hemisphere section, along half perpendicular to hemisphere center line
The cutting of ball cross-wise direction, obtains the discrete slices of specified quantity, depending on the specified quantity is according to the geometric parameter of hemisphere, hemisphere
Geometric parameter is bigger, and the quantity of discrete slices is more, and the thickness of discrete slices is within the scope of 0-2mm.
S2 converts the three-dimensional microstructures discrete slices of preset quantity to the geometric data of corresponding preset quantity；
In the present embodiment, hemisphere is sliced hemisphere along vertical center line direction, obtains various sizes of disc,
Depending on the shape of discrete slices geometrical model 2 is according to the CAD geometrical model 1 of three-dimensional structure, the discrete slices in other embodiments
Geometrical model 2 can be other shapes, each slice geometric dimension that the CAD geometrical model discrete slices of three-dimensional structure obtain
It can be the same or different.Corresponding geometry number is converted by the discrete slices that the CAD geometrical model 1 of three-dimensional structure obtains
According to the geometric data includes the geometric dimension and geometry of the CAD geometrical model discrete slices of the three-dimensional structure.
S3 is successively cut by preset order on the electrode plate 3 of specified parameter according to geometric data, is obtained on electrode plate 3
Micro structure array, the three-dimensional microstructures discrete slices geometrical model 2 of micro-structure and preset quantity on micro structure array is one by one
It is corresponding；
In the present embodiment, the discrete slices of the CAD geometrical model 1 of the three-dimensional structure are suitable according to the time order and function of cutting
Sequence is arranged according to the geometry sizes of discrete slices, by the discrete slices of the CAD geometrical model 1 of three-dimensional structure according to above-mentioned
Preset order is arranged successively, and is successively cut to electrode plate 3 according to above-mentioned preset order, be cut on electrode plate 3 with
The discrete slices geometrical model 3 of the CAD geometrical model 1 of the identical micro structure array of preset order, the micro-structure and three-dimensional structure
It corresponds.
S4 carries out electric machining to default rapidoprint according to predetermined process using electrode plate 3, obtains three-dimensional microstructures 6.
In the present embodiment, CAD geometrical model 1 is carried out to hemisphere three-dimensional structure, in the Vertical Square of the center line along hemisphere
It is sliced to hemisphere, electrode plate 3 is cut according to discrete slices geometrical model 2, is cut into a series of sizes gradually
The electrode plate 3 of well cutting is mounted on process equipment by reduced circular hole, carries out electricity to default rapidoprint according to given process
Processing, which refers to moves back and forth electrode plate along the vertical direction, so that the hole of electrode plate 3 is directed at rapidoprint, this is default
Material can be more different stress intensity specifically design.
In the present embodiment, along the CAD geometrical model 1 of pre-established three-dimensional structure perpendicular to the direction of center line, to three
Before the step of CAD geometrical model 1 of dimension structure carries out discrete slices, obtains the three-dimensional microstructures discrete slices of preset quantity,
Include:
S5 judges the CAD geometrical model 1 for whether having three-dimensional microstructures to be processed in database；
S51 calls three-dimensional microstructures if there being the CAD geometrical model 1 of three-dimensional microstructures to be processed in database
CAD geometrical model 1；
S52, if not having the CAD geometrical model 1 of three-dimensional microstructures to be processed in database, according to three-dimensional microstructures 6
Working process parameter establish the CAD geometrical models 1 of three-dimensional microstructures.
The CAD geometrical model 1 for whether having three-dimensional microstructures to be processed in database is judged, if having needed in database
The CAD geometrical model 1 of the three-dimensional microstructures of processing, then the CAD geometrical model of the three-dimensional microstructures to be processed in calling system
Data are carried out discrete slices using the data, are being cut using discrete slices to electrode plate, finally in default rapidoprint
On process three-dimensional microstructures 6.
In the present embodiment, if not having the CAD geometrical model 1 of three-dimensional microstructures to be processed in database, according to three
After the step of working process parameter of dimension micro-structure establishes the CAD geometrical model 1 of three-dimensional microstructures, comprising:
S521 stores the CAD geometrical model 1 of three-dimensional microstructures in the database.
If the CAD geometrical model 1 of three-dimensional microstructures to be processed is not present in system, according to adding for three-dimensional microstructures 6
Work technological parameter establishes the CAD geometrical model 1 of three-dimensional microstructures, and the geometrical model parameter is stored in system database.
In the present embodiment, along the CAD geometrical model 1 of pre-established three-dimensional structure perpendicular to the direction of center line, to three
After the step of CAD geometrical model of dimension structure carries out discrete slices, obtains the three-dimensional microstructures discrete slices of preset quantity, packet
It includes:
S6, the three-dimensional microstructures discrete slices of preset quantity are successively arranged in parallel by preset order.
The preset order refers to the size order of chronological order or value chip formation by slice.
It in the present embodiment, include at least two micro-structures on electrode plate 3, using electrode plate 3 according to given process to pre-
The step of if rapidoprint carries out electric machining, obtains three-dimensional microstructures 6, comprising:
S401,4 center of first size micro-structure on the electrode plate 3 of material platform that will be parallel to are directed at default rapidoprint, press
According to the first given process along the direction perpendicular to material platform, default rapidoprint is processed, on default rapidoprint
To first size micro-structure 4；
The present embodiment selects material of the copper tungsten plate 3 with a thickness of 0.1mm as electrode plate, so that electrode plate 3 is provided with copper
Electric conductivity, and have the characteristics that high rigidity, high-melting-point, the anti-adhesive of tungsten, tungsten-copper alloy can high temperature resistant and arc ablation resistance,
Have the characteristics that intensity height and heavy, there is stronger electric conductivity and thermal conductivity, be easy to machining.It is cut in copper tungsten plate 3
Cut out a series of micro structure array, the center of each micro-structure makes the first size micro-structure 4 on the electrode plate 3 away from for 4mm
Center is directed at rapidoprint, and other micro-structures on electrode plate are hanging, by first size micro-structure 4 to rapidoprint above and below
The micro EDM of reciprocation type, rapidoprint will process the geometry corresponding to first size micro-structure 4.
S402, coordination electrode plate 3 translate designated displacement along the direction for being parallel to material platform, make the second size on electrode plate 3
5 center of micro-structure is directed at default rapidoprint, according to the second given process along the direction perpendicular to material platform to default processing material
Material is processed, and the second size microstructures 5 are obtained on default rapidoprint, and designated displacement is the micro-structure center of first size
At a distance from 5 center of the second size microstructures；
After the present embodiment processes the geometry of micro-structure 4 of corresponding first size in corresponding rapidoprint, movement
Platform is moved forward and backward 0.1mm, 4mm is moved left and right, to make the Working position of the micro-structure of the second size and the micro- knot of first size
The cutter trade of structure 4 is aligned；
S403, according to the process of the second size microstructures 5, control motor is parallel to the direction movement of material platform and makes
All micro-structure centers on electrode plate 3 are respectively aligned to default rapidoprint successively to process to default processing technology, obtain
To three-dimensional microstructures.
Pass through the process that second size microstructures of repetition 5 are processed in the present embodiment, successively mobile electrode plate 3 is horizontal respectively
The position in direction, moves 4mm every time, so that each size microstructures is directed at the trace of upper size microstructures processing, passes through electrode
Plate carries out the micro EDM of formula up and down to rapidoprint, this final electrode plate 3 with micro structure array exists
Cutter trade on rapidoprint will fit three-dimensional microstructures 6.
In the present embodiment, the center of each adjacent microstructures in micro structure array is away from equal.The micro-structure of the present embodiment
The center of each adjacent microstructures is away from being 4mm in array.
In the present embodiment, it successively cuts, obtains by preset order on the electrode plate 3 of specified parameter according to geometric data
Micro structure array on electrode plate 3, the three-dimensional microstructures discrete slices of micro-structure and preset quantity on micro structure array are one by one
Corresponding step, comprising:
S301, foundation geometric data is successively cut by laser on the electrode plate 3 of specified parameter by preset order or wire cutting,
The micro structure array on electrode plate 3 is obtained, the three-dimensional microstructures discrete slices of micro-structure and preset quantity on micro structure array
It corresponds.
Electrode plate 3 in the present embodiment is set as the copper tungsten plate of 0.1mm, cutter trade of the discrete topology on rapidoprint
Three-dimensional microstructures finished product can be fitted.
In the present embodiment, electrode plate 3 includes copper sheet, tungsten plate, copper tungsten plate, graphite plate, nickel plate, molybdenum plate or steel plate.
Metal plate copper sheet, tungsten plate, nickel plate, molybdenum plate or the steel plate that the present embodiment uses have stronger electric conductivity, tungsten copper
The electric conductivity of the existing copper of plate, and have the characteristics that high rigidity, high-melting-point, the anti-adhesive of tungsten, tungsten-copper alloy being capable of high temperature resistants and resistance to
Arc erosion has the characteristics that intensity height and heavy, has stronger electric conductivity and thermal conductivity, is easy to machining, graphite
Plate is light-weight, and specific gravity is the 1/5 of copper sheet, and the biggish electrode plate of suitable dimensions, machinability is good, high temperature resistant, the coefficient of expansion
It is low, it is not easy temperature distortion, process velocity is fast.
In the present embodiment, the thickness range of electrode plate 3 includes: greater than 0.1mm and to be less than three-dimensional structure CAD geometry
The size of model 1.
In the present embodiment, the material of electrode plate 3 is set as tungsten-copper alloy, thickness 0.2mm.
As shown in Fig. 2, being established by three-dimensional computer Computer Aided Design CAD software system to the hemisphere for needing rapidoprint
CAD geometrical model 1；
As shown in figure 3, carrying out discrete slices along the direction that hemisphere CAD geometrical model 1 is parallel to hemisphere section, hemisphere is obtained
The discrete slices geometrical model 2 of structure, each layer of geometry that hemisphere obtains after being sliced are circle；By being parallel to hemisphere
Discrete slices are carried out to hemisphere in the plane of section, the slice geometric parameter of hemisphere CAD geometrical model 1 can be directly obtained, fastly
The data by every a piece of slice of speed are transferred to diced system, keep diced system accurate on the comparable metal plate 1 of one piece of thickness
The micro structure array for being cut into hemisphere.The time of processing can effectively be shortened, and lay the basis for stablizing processing.
As shown in Figure 1, obtaining the geometry and process data of each layer scattering slice of hemisphere by Quick-forming software；
As shown in figure 4, the geometry and process data that are sliced by diced system according to each layer scattering, in one piece of thickness
To be cut into corresponding circle one by one in the copper tungsten plate 3 of 1.22mm, circle and each layer of hemisphere of discrete slices that this is cut into
Round that size is identical, the center of each micro-structure circular obtains one group of micro structure array after removing waste material, selects away from identical
Material of the copper tungsten plate 3 as electrode plate so that electrode plate is provided with the electric conductivity of copper, and has the high rigidity of tungsten, high-melting-point, resists
The characteristics of adherency, tungsten-copper alloy can high temperature resistant and arc ablation resistance, have the characteristics that intensity height and heavy, have stronger
Electric conductivity and thermal conductivity, are easy to machining.
First size micro-structure 4 is directed at rapidoprint and carries out electric machining, other micro-structures are hanging；Pass through the micro- knot of first size
Structure 4 descends the electric machining of reciprocation type in the vertical direction, and micro- knot of corresponding first size micro-structure 4 will be processed on rapidoprint
Structure；
After first size 4 completion of processing of micro-structure, motion platform is moved forward and backward a micro-structure center away from one mobile
Electro-discharge machining thickness, so that 5 Working position of the second size microstructures and the cutter trade of first size micro-structure 4 be made to be aligned；
Again on the position that the cutter trade of first size micro-structure 4 is aligned, the second size microstructures 5 are carried out up and down
The micro-structure electric machining of formula can equally process the micro-structure corresponding to the second size microstructures 5 on rapidoprint；
By repeating above-mentioned step, completes micro structure array and electric machining, final this group of micro-structure are carried out to rapidoprint
Cutter trade of the array on rapidoprint will fit the finished product of three-dimensional microstructures 6；
Previous preparation precision depends on the thickness of electrode plate 3, and the thickness of electrode plate 3 is thinner, and approach precision is higher.
In contrast, precision of the invention is not influenced by 3 thickness of electrode plate, and 3 thickness of electrode plate is thicker, and rigidity is better, three-dimensional
Micro-structure process is more stable, and the influence factor of machining accuracy is changed into kinematic accuracy, the kinematic accuracy of up and down direction
Higher, the machining accuracy of three-dimensional microstructures is higher.Therefore, this process can effectively improve the processing essence of three-dimensional microstructures
Degree.
A kind of method and device thereof of display motion profile of the invention, pass through the CAD geometrical model 1 to three-dimensional microstructures
The data obtained after the discrete slices on assigned direction are carried out, micro structure array are directly cut on compared with thick electrode plate 3, and right
Default rapidoprint carries out the mode of electric machining, can be realized stable process, the factor of machining accuracy is transformed into perpendicular
The upward kinematic accuracy of histogram, to improve processing efficiency.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all utilizations
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content is applied directly or indirectly in other correlations
Technical field, be included within the scope of the present invention.
Claims (10)
1. a kind of processing method of three-dimensional microstructures, which is characterized in that comprising steps of
Along pre-established three-dimensional structure CAD geometrical model perpendicular to center line direction, to the CAD geometry of the three-dimensional structure
Model carries out discrete slices, obtains the three-dimensional microstructures discrete slices of preset quantity；
Convert the three-dimensional microstructures discrete slices of the preset quantity to the geometric data of corresponding preset quantity；
It is successively cut on the electrode plate of specified parameter by preset order according to the geometric data, obtains micro- knot on electrode plate
The three-dimensional microstructures discrete slices of structure array, micro-structure and the preset quantity on the micro structure array correspond；
Electric machining is carried out to default rapidoprint according to predetermined process using the electrode plate, obtains three-dimensional microstructures.
2. a kind of processing method of three-dimensional microstructures according to claim 1, which is characterized in that described along pre-established three
Direction of the CAD geometrical model perpendicular to center line for tieing up structure carries out discrete cut to the CAD geometrical model of the three-dimensional structure
Piece, before the step of obtaining the three-dimensional microstructures discrete slices of preset quantity, comprising:
Judge the CAD geometrical model for the three-dimensional microstructures for whether having to be processed in database；
If there being the CAD geometrical model of three-dimensional microstructures to be processed in database, the CAD geometry of the three-dimensional microstructures is called
Model；
If not having the CAD geometrical model of three-dimensional microstructures to be processed in database, according to the processing of the three-dimensional microstructures
Technological parameter establishes the CAD geometrical model of the three-dimensional microstructures.
3. a kind of processing method of three-dimensional microstructures according to claim 2, which is characterized in that if in the database not
There is the CAD geometrical model of three-dimensional microstructures to be processed, then described in the working process parameter foundation according to the three-dimensional microstructures
After the step of CAD geometrical model of three-dimensional microstructures, comprising:
In the database by the CAD geometrical model storage of the three-dimensional microstructures.
4. a kind of processing method of three-dimensional microstructures according to claim 1, which is characterized in that described along pre-established three
Direction of the CAD geometrical model perpendicular to center line for tieing up structure carries out discrete cut to the CAD geometrical model of the three-dimensional structure
Piece, after the step of obtaining the three-dimensional microstructures discrete slices of preset quantity, comprising:
The three-dimensional microstructures discrete slices of the preset quantity are successively arranged in parallel by preset order.
5. a kind of processing method of three-dimensional microstructures according to claim 1, which is characterized in that include on the electrode plate
At least two micro-structures, it is described that electric machining is carried out to default rapidoprint according to given process using the electrode plate, obtain three
The step of tieing up micro-structure, comprising:
The micro-structure center for being parallel to first size on the electrode plate of material platform is directed at the default rapidoprint, according to first
Given process processes the default rapidoprint, along the direction perpendicular to the material platform in the default processing material
The micro-structure of first size is obtained on material；
Coordination electrode plate makes the micro-structure of the second size on electrode plate along the direction translation designated displacement for being parallel to the material platform
Center is directed at the default rapidoprint, according to the second given process along the direction perpendicular to the material platform to default processing material
Material is processed, and the micro-structure of the second size is obtained on the default rapidoprint, and the designated displacement is first size
Micro-structure center is at a distance from the micro-structure center of the second size；
The process of micro-structure according to second size, control motor are parallel to the direction movement of the material platform and make
All micro-structure centers on electrode plate are respectively aligned to the default rapidoprint successively to process to default processing technology,
Obtain the three-dimensional microstructures.
6. a kind of processing method of three-dimensional microstructures according to claim 1, which is characterized in that in the micro structure array
Each adjacent microstructures center away from equal.
7. a kind of processing method of three-dimensional microstructures according to claim 1, which is characterized in that described according to the geometry
Data are successively cut on the electrode plate of specified parameter by preset order, and the micro structure array on electrode plate, micro- knot are obtained
The step of three-dimensional microstructures discrete slices of micro-structure and the preset quantity on structure array correspond, comprising:
It is successively cut by laser by preset order on the electrode plate of specified parameter according to the geometric data or wire cutting, obtains electricity
Micro structure array on pole plate, the three-dimensional microstructures discrete slices of micro-structure and the preset quantity on the micro structure array
It corresponds.
8. a kind of processing method of three-dimensional microstructures according to the claims 1, which is characterized in that the electrode plate packet
Include copper sheet, tungsten plate, copper tungsten plate, graphite plate, nickel plate, molybdenum plate or steel plate.
9. a kind of processing method of three-dimensional microstructures according to the claims 1, which is characterized in that the electrode plate
Thickness range includes: the size greater than 0.1 and less than three-dimensional structure CAD geometrical model.
10. a kind of processing method of three-dimensional microstructures according to the claims 1, which is characterized in that the electrode plate
Material be set as tungsten-copper alloy, thickness 0.2mm.
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