CN103480929B - Processing method of three-dimensional microstructure prepared by minute electric sparks based on sheet electrodes - Google Patents
Processing method of three-dimensional microstructure prepared by minute electric sparks based on sheet electrodes Download PDFInfo
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Abstract
The invention relates to a processing method of a three-dimensional microstructure prepared by minute electric sparks based on sheet electrodes. The processing method includes establishing three-dimensional microstructure CAD (computer-aided design) geometric models first, establishing three-dimensional minute electric spark electrode CAD geometric models corresponding to the established three-dimensional microstructure CAD geometric models, slicing the three-dimensional minute electric spark electrode CAD geometric models in dispersedness, transforming disperse slices geometric models into a group of slice electrode data models in mutually parallel, slicing corresponding slice electrodes on a slice electrode material one by one by a slice slicing system according to the slice electrode data models in a computer to acquire a group of slice electrode array, and performing minute electric spark machining. With the manufacturing method, electric discharge machining via large-size scanning and milling by layers of cylindrical microelectrodes is avoided when two-dimensional slice electrodes perform electric discharge machining, and an up and down type moving electric discharge mode can effectively increase machining efficiency and reduce microelectrode loss.
Description
Technical field
The processing method of a kind of three-dimensional microstructures that the present invention relates to, especially a kind of fine electric spark based on thin electrode prepares the processing method of three-dimensional microstructures.
Background technology
Usually, micro-structural is defined as: at least on bidimensional yardstick, and the product with submillimeter or micron order micro-feature structure is called micro-(structure) part.
Preparing three-dimensional microstructures by the micro EDM of micro-electrode is one of main flow manufacturing process preparing three-dimensional microstructures at present.The main method using the micro EDM of micro-electrode to prepare three-dimensional microstructures has:
(1) undertaken connecting thus superposing simulating three-dimensional micro-electrode by some layers of two-dimensional slice electrode, and use this three-dimensional micro-electrode carry out electric discharge processing thus obtain three-dimensional microstructures.In the art, three-dimensional micro-electrode is obtained by the superposition matching of some layers of two-dimensional slice electrode, and the technical process therefore preparing three-dimensional micro-electrode is comparatively complicated; In the process preparing three-dimensional micro-electrode, the lamination Accuracy of two-dimensional slice electrode the formed precision of three-diemsnional electrode, and then can to process preparation the precision of three-dimensional microstructures have an impact, therefore the lamination required precision of this technology to two-dimensional slice electrode is high.
(2) make the tiny two-dimentional semi-cylindrical microelectrode of diameter by various processing method, then process by the milling of the scanning layer by layer electric discharge of microelectrode thus obtain three-dimensional microstructures.But, because cylindrical microelectrode diameter dimension is very fine relative to scan area, make working (machining) efficiency very low.And discharge in the process of processing in the milling that scans layer by layer of microelectrode, microelectrode loss is very serious, is difficult to normal for a long time work.
Summary of the invention
In view of above-mentioned condition, be necessary to provide a kind of processing method that effectively can improve the three-dimensional microstructures of working (machining) efficiency and the loss of reduction microelectrode.
For solving the problems of the technologies described above, providing a kind of fine electric spark based on thin electrode to prepare the processing method of three-dimensional microstructures, including following steps:
1) by three-dimensional computer Computer Aided Design CAD software systems, CAD geometrical model is set up to needing the three-dimensional microstructures of rapidoprint;
2) the CAD geometrical model of corresponding three-dimensional fine electric spark electrode is set up according to the three-dimensional microstructures CAD geometrical model set up;
3) again along a direction, discrete slices is carried out to the CAD geometrical model of the three-dimensional fine electric spark electrode set up, obtain discrete slices geometrical model;
4) the discrete slices geometrical model of three-dimensional fine electric spark electrode is converted into the one group of thin electrode data model be parallel to each other;
5) on a slice thin electrode material, corresponding thin electrode is cut according to the thin electrode data model in computer one by one by thin slice diced system, the centre-to-centre spacing of each thin electrode is identical, obtain the thin electrode array of a group after removing waste material, be respectively 1-N thin electrode;
6) the one group of thin electrode array above-mentioned cutting completed carries out micro EDM to the rapidoprint of three-dimensional microstructures.
The micro EDM of step 6) is also comprised the steps:
1) first, No. 1 thin electrode is aimed at rapidoprint and is carried out micro EDM, and other thin electrode is unsettled; By the micro EDM of No. 1 thin electrode formula up and down, rapidoprint just can process the micro-structural corresponding to No. 1 thin electrode;
2) when after No. 1 thin electrode completion of processing, motion platform moves forward and backward an electrode centers distance, a mobile electric discharge processing thickness, thus makes the Working position of No. 2 thin electrodes and the cutter trade alignment of No. 1 thin electrode;
3) again on the position that the cutter trade of No. 1 thin electrode aligns, No. 2 thin electrodes carry out the micro EDM of formula up and down, rapidoprint can process equally the micro-structural corresponding to No. 2 thin electrodes;
4) by above-mentioned 1)-3) in step, complete 3 to N thin electrode carries out fine electric spark processing to rapidoprint, finally this group thin electrode array cutter trade on rapidoprint just can simulate three-dimensional microstructures finished product.
The preparation method of this thin electrode array can be laser cutting, Linear cut or spark machined.
This thin electrode material can be copper coin, tungsten plate, graphite cake, nickel plate, molybdenum plate or steel plate.
This thin electrode material thickness size≤1.0mm.
The above-mentioned fine electric spark based on thin electrode prepares the processing method of three-dimensional microstructures, the three-dimensional microstructures obtained by the micro EDM of thin electrode array, and its beneficial effect be compared with the prior art is:
1) three-dimensional micro-electrode of the three-dimensional microstructures for the preparation of complexity is separated into one group of two-dimensional slice electrod-array by this technology, and carrys out approach three-dimensional structure approx by the cutter trade of this group two-dimensional slice electrod-array.In principle, the thickness of thin electrode is thinner, and approach precision is higher.
2), compared with preparing three-dimensional microstructures with the fine electric spark of three-dimensional micro-electrode, can be avoided connection and the superposition of some layers of two-dimensional slice electrode by the electric discharge processing of two-dimensional slice electrod-array, forming process is simple.
3) by two-dimensional slice electrode carry out discharging add can avoid man-hour the large area of cylindrical microelectrode scan layer by layer milling discharge processing, only adopt simple upper and lower reciprocation type to move discharge mode, effectively can improve working (machining) efficiency and reduce microelectrode loss.
Accompanying drawing explanation
Fig. 1 is the cad model schematic diagram of three-dimensional microstructures of the present invention.
Fig. 2 is the cad model schematic diagram of the three-dimensional fine electric spark electrode corresponding with the cad model of Fig. 1 three-dimensional microstructures.
Fig. 3 is the thin electrode data model schematic diagram of three-dimensional fine electric spark electrode of the present invention.
Fig. 4 is the schematic diagram that three-dimensional fine electric spark electrode of the present invention is separated into thin electrode array.
Fig. 5 is the micro EDM schematic diagram of embodiment of the present invention thin electrode array.
Fig. 6 is the three-dimensional microstructures that the embodiment of the present invention is obtained by the micro EDM of thin electrode array.
Wherein: 10, three-dimensional microstructures; 12, three-dimensional microstructures finished product; 20, three-dimensional fine electric spark electrode; 30, thin electrode.
Detailed description of the invention
Below in conjunction with drawings and Examples, the processing method that the fine electric spark based on thin electrode of the present invention prepares three-dimensional microstructures is described in further detail.
Refer to Fig. 1 to Fig. 6, a kind of fine electric spark based on thin electrode of the embodiment of the present invention prepares the processing method of three-dimensional microstructures, includes following steps:
1) by three-dimensional computer Computer Aided Design CAD software systems, CAD geometrical model is set up to needing the three-dimensional microstructures 10 of rapidoprint;
2) the CAD geometrical model of corresponding three-dimensional fine electric spark electrode 20 is set up according to the three-dimensional microstructures CAD geometrical model set up;
3) again along a direction, discrete slices is carried out to the CAD geometrical model of the three-dimensional fine electric spark electrode 20 set up, obtain discrete slices geometrical model;
4) the discrete slices geometrical model of three-dimensional fine electric spark electrode is converted into one group of thin electrode 30 data model be parallel to each other;
5) on a slice thin electrode 30 material, corresponding thin electrode 30 is cut according to thin electrode 30 data model in computer one by one by thin slice diced system, the centre-to-centre spacing of each thin electrode 30 is identical, obtain the thin electrode array of a group after removing waste material, be respectively 1-N thin electrode 30; The preparation method of this thin electrode array can be laser cutting, Linear cut or spark machined.
6) the one group of thin electrode array as shown in Figure 4, Figure 5, above-mentioned cutting completed carries out micro EDM to the rapidoprint of three-dimensional microstructures 10.
The micro EDM of step 6) is also comprised the steps:
1) first, the rapidoprint that No. 1 thin electrode 30 aims at three-dimensional microstructures 10 carries out micro EDM, and other thin electrode 30 is unsettled; By the micro EDM of No. 1 thin electrode 30 formula up and down, rapidoprint just can process the micro-structural corresponding to No. 1 thin electrode 30;
2) when after No. 1 thin electrode 30 completion of processing, motion platform moves forward and backward an electrode centers distance, a mobile electric discharge processing thickness, thus makes the Working position of No. 2 thin electrodes 30 and the cutter trade alignment of No. 1 thin electrode 30;
3) again on the position that the cutter trade of No. 1 thin electrode 30 aligns, No. 2 thin electrodes 30 carry out the micro EDM of formula up and down, the rapidoprint of three-dimensional microstructures 10 can process equally the micro-structural corresponding to No. 2 thin electrodes 30;
4) by above-mentioned 1)-3) in step, complete the processing that 3 to N thin electrode, 30 pairs of three-dimensional microstructures 10 rapidoprints carry out fine electric spark, finally the cutter trade of this group thin electrode array on rapidoprint just can simulate three-dimensional microstructures finished product 12.
This thin electrode 30 material can be copper coin, tungsten plate, graphite cake, nickel plate, molybdenum plate or steel plate; This thin electrode 30 material thickness size≤1.0mm.
The fine electric spark that the present invention is based on thin electrode prepares the processing method of three-dimensional microstructures, its three-dimensional fine electric spark electrode 20 prepares three-dimensional microstructures finished product 12, can be avoided connection and the superposition of some layers of two-dimensional slice electrode 30 by the electric discharge processing of two-dimensional slice electrod-array, forming process is simple; Being undertaken discharging adding by two-dimensional slice electrode 30 to avoid the large area of cylindrical microelectrode to scan milling electric discharge processing layer by layer man-hour, only adopts simple upper and lower reciprocation type to move discharge mode, effectively can improve working (machining) efficiency and reduce microelectrode loss.
specific embodiment
Embodiment 1
As shown in Figures 1 to 4, take electrode sheet material as the Copper Foil that 0.02mm is thick be example, the concrete processing method making Copper Foil three-dimensional microstructures comprises the following steps:
1) first, by three-dimensional computer Computer Aided Design CAD software systems, CAD geometrical model is set up to needing the three-dimensional microstructures of rapidoprint;
2) set up the CAD geometrical model of corresponding three-dimensional fine electric spark electrode according to the three-dimensional microstructures CAD geometrical model set up, and this three-dimensional micro-electrode is carried out discrete slices, obtain discrete slices geometrical model;
3) the discrete slices geometrical model of three-dimensional micro-electrode is converted into the one group of thin electrode data model be parallel to each other;
4) by laser cutting system according to the thin electrode data model in computer at a slice thickness be 0.02mm Copper Foil on cut corresponding thin electrode one by one, the centre-to-centre spacing of each thin electrode is 4mm, obtains the thin electrode array of a group after removing waste material;
5) as shown in Figure 4, Figure 5, the thin electrode array that above-mentioned cutting completes is carried out micro EDM.The main process of processing is as follows:
When a) carrying out micro EDM, No. 1 thin electrode aims at rapidoprint, and other thin electrode is unsettled.By the micro EDM of No. 1 thin electrode formula up and down, rapidoprint just can process the micro-structural corresponding to No. 1 thin electrode;
B) after No. 1 thin electrode completion of processing, motion platform moves forward and backward 0.02mm, moves left and right 4mm, thus makes the Working position of No. 2 thin electrodes and the cutter trade alignment of No. 1 thin electrode;
C) again on the position that the cutter trade of No. 1 thin electrode aligns, No. 2 thin electrodes carry out the micro EDM of formula up and down, the rapidoprint of three-dimensional microstructures can process equally the micro-structural corresponding to No. 2 thin electrodes;
D) by above-mentioned a)-c) in step, complete 3 to N thin electrode carries out fine electric spark processing to three-dimensional microstructures rapidoprint, finally the cutter trade of this group thin electrode array on rapidoprint just can simulate three-dimensional microstructures finished product.
The above, it is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be do not depart from technical solution of the present invention content, according to any simple modification that technical spirit of the present invention is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (5)
1. prepare a processing method for three-dimensional microstructures based on the fine electric spark of thin electrode, it is characterized in that: include following steps:
1) by three-dimensional computer Computer Aided Design CAD software systems, CAD geometrical model is set up to needing the three-dimensional microstructures of rapidoprint;
2) the CAD geometrical model of corresponding three-dimensional fine electric spark electrode is set up according to the three-dimensional microstructures CAD geometrical model set up;
3) again along a direction, discrete slices is carried out to the CAD geometrical model of the three-dimensional fine electric spark electrode set up, obtain discrete slices geometrical model;
4) the discrete slices geometrical model of three-dimensional fine electric spark electrode is converted into the one group of thin electrode data model be parallel to each other;
5) on a slice thin electrode material, corresponding thin electrode is cut according to the thin electrode data model in computer one by one by thin slice diced system, the centre-to-centre spacing of each thin electrode is identical, obtain the thin electrode array of a group after removing waste material, be respectively 1-N thin electrode;
6) the one group of thin electrode array above-mentioned cutting completed carries out micro EDM to the rapidoprint of three-dimensional microstructures.
2. the fine electric spark based on thin electrode as claimed in claim 1 prepares the processing method of three-dimensional microstructures, it is characterized in that: also comprise the steps: the micro EDM of step 6)
1) first, No. 1 thin electrode is aimed at rapidoprint and is carried out micro EDM, and other thin electrode is unsettled; By the micro EDM of No. 1 thin electrode formula up and down, rapidoprint just can process the micro-structural corresponding to No. 1 thin electrode;
2) when after No. 1 thin electrode completion of processing, motion platform moves forward and backward an electrode centers distance, a mobile electric discharge processing thickness, thus makes the Working position of No. 2 thin electrodes and the cutter trade alignment of No. 1 thin electrode;
3) again on the position that the cutter trade of No. 1 thin electrode aligns, No. 2 thin electrodes carry out the micro EDM of formula up and down, rapidoprint can process equally the micro-structural corresponding to No. 2 thin electrodes;
4) by above-mentioned 1)-3) in step, complete 3 to N thin electrode carries out fine electric spark processing to rapidoprint, finally this group thin electrode array cutter trade on rapidoprint just can simulate three-dimensional microstructures finished product.
3. the fine electric spark based on thin electrode as claimed in claim 1 prepares the processing method of three-dimensional microstructures, it is characterized in that: the preparation method of this thin electrode array can be laser cutting, Linear cut or spark machined.
4. the fine electric spark based on thin electrode as claimed in claim 1 prepares the processing method of three-dimensional microstructures, it is characterized in that: this thin electrode material can be copper coin, tungsten plate, graphite cake, nickel plate, molybdenum plate or steel plate.
5. the fine electric spark based on thin electrode as claimed in claim 4 prepares the processing method of three-dimensional microstructures, it is characterized in that: this thin electrode material thickness size≤1.0mm.
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| CN105537703A (en) * | 2016-01-12 | 2016-05-04 | 深圳大学 | Laminated fitting preparing method for three-dimensional microelectrode |
| CN105537709B (en) * | 2016-01-28 | 2017-12-08 | 深圳大学 | A kind of three-dimensional microstructures processing method based on the superposition of two-way three-dimensional feature |
| CN107243679B (en) * | 2017-05-16 | 2019-04-26 | 深圳大学 | Thin slice queue microelectrode micro EDM method and device |
| CN107081491B (en) * | 2017-05-16 | 2020-06-02 | 深圳大学 | Novel sheet array microelectrode |
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| CN109300193B (en) * | 2018-09-21 | 2023-11-24 | 深圳大学 | Processing method of three-dimensional microstructure |
| CN110216342B (en) * | 2019-06-11 | 2021-06-29 | 深圳大学 | Microelectrode preparation method and microelectrode |
| CN110238469A (en) * | 2019-07-22 | 2019-09-17 | 北京理工大学 | A kind of electric discharge machining method of combination electrode and big aspect ratio multistage microstructural |
| CN110722230B (en) * | 2019-10-29 | 2020-10-09 | 深圳大学 | Part machining method based on electric spark machining |
| CN111058083B (en) * | 2019-11-29 | 2021-07-06 | 深圳大学 | Micro-cavity structure electric machining method and device based on double machining stations |
| CN111037015B (en) * | 2019-12-20 | 2021-04-16 | 深圳大学 | Three-dimensional microstructure processing method and three-dimensional microstructure |
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| JP2002066844A (en) * | 2000-08-31 | 2002-03-05 | Oki Electric Ind Co Ltd | Method of manufacturing discharge machining electrode using metal powder sintering type laminated molding |
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