CN108617074A - A kind of flexible circuitry board machining process - Google Patents
A kind of flexible circuitry board machining process Download PDFInfo
- Publication number
- CN108617074A CN108617074A CN201810281650.6A CN201810281650A CN108617074A CN 108617074 A CN108617074 A CN 108617074A CN 201810281650 A CN201810281650 A CN 201810281650A CN 108617074 A CN108617074 A CN 108617074A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- stiffening plate
- cutter
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of flexible circuitry board machining process, include the following steps：S1 non-reinforcement region and tie point position on stiffening plate rush half slot；S2 reinforcing plates in flexible circuit board, are press-fitted together as one；S3 carries out roughing by cutter to flexible circuit board and stiffening plate；S4 finishes flexible circuit board and stiffening plate by cutter；The flexible circuit board and stiffening plate that S5 cleanings pass through cutter cutting completion.Pass through the jointing plate in flexible circuit board, flexible circuit board to being fitted with stiffening plate carries out roughing and finishing by cutter, pass through laser processing and Punching Technology compared to traditional, technical scheme of the present invention processes the simple making requirement at low cost, can meeting large scale flexible circuit board of the flexible circuitry sheet processing mode to be formed, and processing effect has obtained great promotion.
Description
Technical field
The invention belongs to the processing technique field of wiring board, specially a kind of processing method of flexible circuit board.
Background technology
The processing of flexible circuit board is mainly the following mode now, the first is that flexible circuitry board mold is punched into
Type is more than the molding dimensional accuracy of the flexible circuit board of 300mm and the making precision of mold for single product appearance and size
It can no longer meet, FPC flexible circuit board appearance and sizes are bigger, and die cutting accuracy is lower, and refinement is wanted with to product design
Spend higher and higher, the precision of existing die cutting die can no longer meet large-sized punching requirement, and a single set of big mold
Cost of manufacture it is very high, the shape equipment of rushing corresponding to big mold is also required to do and updates, and complicated for operation, of high cost, the period is long.
Second for using laser cutting, using dedicated for the involved laser-processing system of flexible circuit board cutting,
Realize shape cutting and the cover film windowing cutting processing application of flexible circuit board, but using of high cost, the efficiency of laser cutting
Low, outline edge is susceptible to the problem of carbonization blacks after cutting.
A kind of novel flexible circuit board processing method is thus needed to solve the above problems.
Invention content
The technical problem to be solved by the present invention is to：A kind of flexible circuitry board machining process is provided.
The present invention is to solve a kind of technical solution that its technical problem provides to be：
A kind of flexible circuitry board machining process, includes the following steps：
S1 non-reinforcement region and tie point position on stiffening plate rush half slot；
S2 reinforcing plates in flexible circuit board, are press-fitted together as one；
S3 carries out roughing by cutter to flexible circuit board and stiffening plate；
S4 finishes flexible circuit board and stiffening plate by cutter；
The flexible circuit board and stiffening plate that S5 cleanings pass through cutter cutting completion.
As the improvement of said program, before carrying out roughing to flexible circuit board, by flexible circuit board upper slitter road
Copper sheet etches away.
As being further improved for said program, etches away distance outside the outside to cutter of the cutter track of copper sheet and be more than etc.
In 0.5mm.
As the improvement of said program, after etching away the copper sheet in cutter track, it is coated with and hinders in cutter track path position silk-screen
Solder paste is black, and the distance outside the outside to cutter of the solder mask is more than or equal to 0.5mm.
As the improvement of said program, filled with real copper between supporting board for single flexible circuit before carrying out roughing, other
It is filled with grid copper at position.
As the improvement of said program, the stiffening plate fix a cutting tool by path on be additionally provided with Stress decomposition hole.
As the improvement of said program, it is 0.9mm~1.15mm to carry out rough machined cutter diameter.
As the improvement of said program, the cutter diameter finished is 0.95mm~1.2mm.
As the improvement of said program, before being processed to flexible circuit board and stiffening plate, stacked multilayer is fitted in one
The flexible circuit board and stiffening plate risen, upward, the one of stiffening plate is face-down, in the flexibility of one piece of one for the one side of flexible circuit board
Between wiring board and stiffening plate and the flexible circuit board and stiffening plate of another piece of adjacent one, it is equipped with backing plate.
As being further improved for said program, backing plate is hard ox-hide.
The method have the benefit that：By the jointing plate in flexible circuit board, to being fitted with the flexibility of stiffening plate
Wiring board carries out roughing and finishing by cutter, of the invention compared to traditional by laser processing and Punching Technology
Technical solution is processed the simple making at low cost, can meeting large scale flexible circuit board of the flexible circuitry sheet processing mode to be formed and is wanted
It asks, and processing effect has obtained great promotion.
Description of the drawings
It is required in being described below to embodiment to make for the clearer technical solution illustrated in the embodiment of the present invention
Attached drawing briefly describes.
Fig. 1 is a kind of flow chart of embodiment of flexible circuitry board machining process of the present invention.
Specific implementation mode
With reference to embodiments with attached drawing to the technique effect of design, concrete structure and the generation of the present invention carry out it is clear,
It is fully described by, to fully understand the purpose of the present invention, scheme and effect.It should be noted that in the absence of conflict originally
The feature in embodiment and embodiment in application can be combined with each other.In addition the upper and lower, left and right etc. used in the present invention
It describes in only opposite figure for each component part mutual alignment relation of the present invention.
Fig. 1 is a kind of flow chart of embodiment of flexible circuitry board machining process of the present invention, with reference to figure 1, flexible circuit board
It is comprised the following processes during cutting processing：
S1 gets out stiffening plate, and non-reinforcement region and tie point position rush half slot on stiffening plate, to mitigate stiffening plate
Weight, to mitigate the weight of entire flexible circuit board.
Flexible circuit board is mounted on stiffening plate by S2, and pressing forms integral structure so that flexible circuit board and reinforcement
Plate tightly fits together, and is supported well to flexible circuit board.
S3 carries out roughing to flexible circuit board and stiffening plate by cutter and is etched away preferably before carrying out roughing
The copper sheet of flexible circuit board upper slitter road, to reduce the abrasion during cutter reprocessing, further prevented also from cutting
Excessive copper scale is generated during cutting flexible circuit board, while can also accelerate the cutting speed of flexible circuit board, is promoted flexible
The processing efficiency of wiring board further after etching away the copper sheet on circuit board road, only need to use general cutter
It is processed, without using the cutter of cutting metal to be processed, reduces the heat generated in process, ensure flexible wires
The stability and reliability of road plate.More, the distance outside the outside to cutter of the cutter track of copper sheet is etched away to be more than or equal to
0.5mm can effectively avoid flexible circuit board and harmomegathus occur in process, lead to the outer back gauge for the cutter track for etching away copper sheet
Less than the diameter of cutter, reduces cutter life, influences the problem of processing efficiency；It also can avoid cutting in progress flexible circuit board
The problem of copper is cut occurs during cutting, and generate wire drawing in stiffening plate layer to influence the aesthetics of flexible circuit board notch, pole
The big reliability and stability improved in flexible circuit board cutting process.
Preferably after etching away the copper sheet in cutter track, solder mask, the resistance are coated in cutter track path position silk-screen
Distance outside the outside to cutter of solder paste ink is more than or equal to 0.5mm so that non-processing position has fine in flexible circuit board
Insulation effect, while silk-screen coating solder mask also can avoid when being cut to flexible circuit board, due to fever so that
There is wire drawing in the stiffening plate layer of flexible circuit board, influences the aesthetics of notch, causes the problem that product yield is low, further carries
Stability and reliability in high flexibility wiring board cutting process.
Preferably in order to increase the hardness of flexible circuit board and reduce product harmomegathus, used between supporting board for single flexible circuit product
Real copper filling, other regions are filled using grid copper.
Further, stiffening plate for flexible circuit board fix a cutting tool by path on setting Stress decomposition hole so that into
The heated stress influence of flexible circuit board and stiffening plate is decomposed in row cutting process and generates deformation, ensures the reliable of processing cutting
Property.A diameter of 0.45mm in preferred Stress decomposition hole, Stress decomposition hole are located at the centre position of cutter track, Stress decomposition hole with answer
Centre-to-centre spacing between power resolving aperture is 6.0mm~8.0mm.
Roughing is carried out to flexible circuit board and stiffening plate by cutter, the cutter path along setting carries out cutting operation,
Complete the roughing of flexible circuit board and stiffening plate.Preferably before carrying out roughing S4, by the flexible circuitry of multiple integral types
Plate and stiffening plate are stacked together, and backing plate, backing plate preferably is arranged between the adjacent flexible circuit board and stiffening plate of one
Thickness for hard ox-hide material, preferred backing plate is 0.1mm~0.15mm；The flexible circuitry of integral type is pressed and stiffening plate, soft
Property wiring board one down, the one side of stiffening plate upward, can effectively protect flexible circuit board from stack when extruding knock
It touches, causes the damage of flexible circuit board.
In one embodiment, when carrying out roughing, when process groove width be 1.0mm when, select a diameter of 0.9mm~
The cutter of 0.95mm carries out cutting operation and to form preliminary trench structure in flexible circuit board and stiffening plate, works as processing groove
When width is 1.2mm, selects the cutter of a diameter of 1.1mm~1.15mm to carry out cutting operation and make in flexible circuit board and stiffening plate
Form preliminary trench structure.
S4 when being 1.0mm for processing groove width, uses the cutter of a diameter of 0.95mm~1.0mm after roughing
It is finished；When being 1.2mm for processing groove width, finished using the cutter of a diameter of 1.15mm~1.2mm, finishing
The effect of work is to clear up the dust and lousiness generated when first time roughing so that notch is beautiful, ensures cut quality.
Multiple roughing and/or finishing can preferably be carried out as needed in actual mechanical process to ensure flexibility
The kerf quality of wiring board, to formed one kind can meet large scale flexible circuit board make, efficient, trimming without lousiness, plus
Strong plate is without whitening, the flexible circuitry board machining process of good cutting effect.
Although specifically showing and describing the present invention in conjunction with preferred embodiment, those skilled in the art should be bright
In vain, it is not departing from the spirit and scope of the present invention defined by described claims, it in the form and details can be right
The present invention makes a variety of changes, and is protection scope of the present invention.
Claims (10)
1. a kind of flexible circuitry board machining process, includes the following steps：
S1 non-reinforcement region and tie point position on stiffening plate rush half slot；
S2 reinforcing plates in flexible circuit board, are press-fitted together as one；
S3 carries out roughing by cutter to flexible circuit board and stiffening plate；
S4 finishes flexible circuit board and stiffening plate by cutter；
The flexible circuit board and stiffening plate that S5 cleanings pass through cutter cutting completion.
2. flexible circuitry board machining process according to claim 1 will be flexible before carrying out roughing to flexible circuit board
The copper sheet of wiring board upper slitter road etches away.
3. flexible circuitry board machining process according to claim 2, it is characterised in that：Etch away the cutter track of copper sheet
Distance outside outside to cutter is more than or equal to 0.5mm.
4. flexible circuitry board machining process according to claim 2, after etching away the copper sheet in the cutter track, in institute
The path position silk-screen coating solder mask of cutter track is stated, the distance outside the outside to cutter of the solder mask is more than or equal to
0.5mm。
5. flexible circuitry board machining process according to claim 1, before carrying out roughing between supporting board for single flexible circuit
It is filled with real copper, other positions are filled with grid copper.
6. flexible circuitry board machining process according to claim 1, it is characterised in that：The stiffening plate fix a cutting tool by
Stress decomposition hole is additionally provided on path.
7. flexible circuitry board machining process according to claim 1, it is characterised in that：Carrying out rough machined cutter diameter is
0.9mm~1.15mm.
8. flexible circuitry board machining process according to claim 1, it is characterised in that：The cutter diameter finished is
0.95mm~1.2mm.
9. flexible circuitry board machining process according to claim 1, before being processed to flexible circuit board and stiffening plate,
The flexible circuit board and stiffening plate that stacked multilayer fits together, upward, the one of stiffening plate is face-down for the one side of flexible circuit board,
Between the flexible circuit board and stiffening plate and the flexible circuit board and stiffening plate of another piece of adjacent one of one piece of one, if
There is backing plate.
10. flexible circuitry board machining process according to claim 7, it is characterised in that：Backing plate is hard ox-hide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810281650.6A CN108617074A (en) | 2018-04-02 | 2018-04-02 | A kind of flexible circuitry board machining process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810281650.6A CN108617074A (en) | 2018-04-02 | 2018-04-02 | A kind of flexible circuitry board machining process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108617074A true CN108617074A (en) | 2018-10-02 |
Family
ID=63659460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810281650.6A Pending CN108617074A (en) | 2018-04-02 | 2018-04-02 | A kind of flexible circuitry board machining process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108617074A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548297A (en) * | 2018-12-29 | 2019-03-29 | 瑞华高科技电子工业园(厦门)有限公司 | A kind of flexible circuit board layout processing method |
| CN110012603A (en) * | 2018-12-27 | 2019-07-12 | 瑞声科技(新加坡)有限公司 | The method for die cutting and flexible circuit board of flexible circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006019315A (en) * | 2004-06-30 | 2006-01-19 | Sumitomo Electric Ind Ltd | Structure for mounting flexible printed circuit board and optical module |
| CN101175375A (en) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | Production method of flexible circuit board |
| CN101815406A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | Process for cutting printed circuit board |
| CN103929886A (en) * | 2014-03-10 | 2014-07-16 | 淳华科技(昆山)有限公司 | Corrugated edge and copper scale preventing method suitable for divided cutting of flexible printed circuit board |
| CN104540335A (en) * | 2014-12-25 | 2015-04-22 | 胜宏科技（惠州）股份有限公司 | Method for routing golden finger area in circuit board |
-
2018
- 2018-04-02 CN CN201810281650.6A patent/CN108617074A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006019315A (en) * | 2004-06-30 | 2006-01-19 | Sumitomo Electric Ind Ltd | Structure for mounting flexible printed circuit board and optical module |
| CN101175375A (en) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | Production method of flexible circuit board |
| CN101815406A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | Process for cutting printed circuit board |
| CN103929886A (en) * | 2014-03-10 | 2014-07-16 | 淳华科技(昆山)有限公司 | Corrugated edge and copper scale preventing method suitable for divided cutting of flexible printed circuit board |
| CN104540335A (en) * | 2014-12-25 | 2015-04-22 | 胜宏科技（惠州）股份有限公司 | Method for routing golden finger area in circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110012603A (en) * | 2018-12-27 | 2019-07-12 | 瑞声科技(新加坡)有限公司 | The method for die cutting and flexible circuit board of flexible circuit board |
| CN109548297A (en) * | 2018-12-29 | 2019-03-29 | 瑞华高科技电子工业园(厦门)有限公司 | A kind of flexible circuit board layout processing method |
| CN109548297B (en) * | 2018-12-29 | 2020-03-24 | 瑞华高科技电子工业园(厦门)有限公司 | Flexible circuit board makeup processing method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181002 |