CN102438399B - Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof - Google Patents
Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof Download PDFInfo
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- CN102438399B CN102438399B CN201110293166.3A CN201110293166A CN102438399B CN 102438399 B CN102438399 B CN 102438399B CN 201110293166 A CN201110293166 A CN 201110293166A CN 102438399 B CN102438399 B CN 102438399B
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Abstract
The invention discloses a metal PCB (Printed Circuit Board) space-free jointed board and a cutting method thereof. The metal PCB space-free jointed board comprises a metal PCB and a plurality of finished product units which are formed on the metal PCB, the upper surface of the metal PCB is a circuit surface, the lower surface of the metal PCB is a metal base surface, and the connection positions of the finished product units have no spaces. According to the invention, by adopting the method that the metal PCB is cut simultaneously through an upper V-cut cutter and a lower V-cut cutter, the undesirable phenomena that during the board punching and shaping production processes, when the spaces among the units are reduced, the flashing, the board breaking and the like are produced can be avoided, the scrap edges produced in the production process are reduced, the cost of the board is reduced, and the utilization rate of the board is improved.
Description
Technical field
The present invention relates to Metal Substrate pcb board field, relate in particular to a kind of Metal Substrate pcb board continuously apart from jigsaw and cutting method thereof.
Background technology
Metal current base PCB jigsaw in process of production as shown in Figure 1, needs to give certain unit interval 110 between adjacent twenty percent article unit 100, as the buffer area that becomes article unit 100 in the time that molding procedure is divided plate.This unit interval 110 is indispensable in the time of punching moulding, lacks this unit interval 110 and will produce the bad phenomenon such as burr, sheet material crackle in punching moulding production process.
In Metal Substrate PCB produces, along with constantly riseing of Metal Substrate sheet material price, the proportion that board cost accounts for total cost is more and more large.Unit interval 110 is avoided the production technology side crops of removing as the method that there is no at present, caused great waste to Metal Substrate PCB manufacturer.
In view of this, how to improve availability ratio of the armor plate, saving board cost becomes current problem demanding prompt solution.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of Metal Substrate pcb board continuously apart from jigsaw and cutting method thereof, be intended to solve the problem that in current pcb board production process, waste of material is large, cost is high.
Technical scheme of the present invention is as follows:
A kind of Metal Substrate pcb board, continuously apart from jigsaw, comprises Metal Substrate pcb board and takes shape in multiple one-tenth article units of Metal Substrate pcb board, and described Metal Substrate pcb board upper surface is circuit surface, and lower surface is metal basal plane, wherein, and described one-tenth article unit junction distance continuously.
A kind of Metal Substrate pcb board is continuously apart from jigsaw cutting method, and wherein, described cutting method is for adopting upper and lower V-cut cutting knife Co-cleavage mode, and it comprises the following steps:
The upper surface of V-cut cutting knife cutting metal base pcb board in S01, use;
The lower surface of S02, the lower V-cut cutting knife cutting metal base pcb board of use.
Described Metal Substrate pcb board is continuously apart from jigsaw cutting method, and wherein, described upper and lower V-cut cutting knife angle is 30 degree.
Described Metal Substrate pcb board is continuously apart from jigsaw cutting method, and wherein, the upper and lower side-play amount of described upper and lower V-cut cutting knife is less than 0.005mm.
Described Metal Substrate pcb board is continuously apart from jigsaw cutting method, and wherein, described cutting step S02 also comprises afterwards:
S03, use lower V-cut cutting knife repeatedly the lower surface of cutting metal base pcb board to cutting into article unit.
Described Metal Substrate pcb board is continuously apart from jigsaw cutting method, and wherein, in described cutting step S01, depth of cut is 0.1mm-0.2mm.
Described Metal Substrate pcb board is continuously apart from jigsaw cutting method, and wherein, in described cutting step S03, depth of cut is 0.3mm for the first time, rear last time depth of cut intensification 0.3mm of depth of cut ratio.
Beneficial effect: the invention provides a kind of Metal Substrate pcb board continuously apart from jigsaw and cutting method thereof, make close-packed arrays between the one-tenth article unit on pcb board, stock utilization improves 20-30%, has reduced material cost.Than common jigsaw punching molding technology thereof, continuously apart from board-splicing process by using without opening punching mould, saved die cost.And continuously can not produce as the bad phenomenon such as aluminium bits, burr in common jigsaw technology apart from board-splicing process by using.
Brief description of the drawings
Fig. 1 is Metal Substrate pcb board jigsaw structural representation in prior art.
Fig. 2 is that Metal Substrate pcb board of the present invention is continuously apart from the structural representation of jigsaw.
Fig. 3 is that Metal Substrate pcb board of the present invention is continuously apart from the schematic cross-section of jigsaw.
Fig. 4 is the schematic cross-section on line of cut road surface in the embodiment of the present invention.
Fig. 5 is the schematic cross-section of cutting metal basal plane for the first time in another embodiment of the present invention.
Fig. 6 is the schematic cross-section of cutting metal basal plane for the second time in another embodiment of the present invention.
Fig. 7 is the schematic cross-section of last cutting metal basal plane in another embodiment of the present invention.
Embodiment
The invention provides a kind of Metal Substrate pcb board continuously apart from jigsaw and cutting method thereof, for making object of the present invention, technical scheme and effect clearer, clear and definite, below the present invention is described in more detail.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Metal Substrate pcb board of the present invention is continuously apart from the embodiment of jigsaw, as shown in Figures 2 and 3, comprise Metal Substrate pcb board and take shape in multiple one-tenth article units 100 of Metal Substrate pcb board, described Metal Substrate pcb board upper surface is circuit surface 120, lower surface is metal basal plane 130, wherein, described one-tenth article unit 100 junctions distance continuously, i.e. close-packed arrays between two adjacent finished product unit 100, remove the unit interval 110 between adjacent one-tenth article unit 100, this structure decrease Waste rim charge, availability ratio of the armor plate has improved 20-30%, thereby reduce the cost of Metal Substrate sheet material, and with respect to common jigsaw punching molding technology thereof, continuously apart from jigsaw moulding process without opening punching mould, save die cost, Metal Substrate pcb board of the present invention simple in structure apart from jigsaw continuously, low processing cost, be applicable to large-scale industrial application.
Metal Substrate pcb board of the present invention passes through V-cut cutting mode apart from jigsaw continuously, one block of metal base pcb board is cut off and is divided into the single finished product unit that can be directly used in one by one paster assembling, wherein, V-cut also claims that V cuts, and is to use V-cut cutting knife sheet material to be cut to a kind of cutting mode that forms V-notch.The concrete technological process of production of the present invention is: sawing sheet → pasting protective film → boring → dry film → etching → erosion inspection → welding resistance → character → V-cut → on off test → Hi-pot test (power panel) → OSP → FQC → FQA → packaging.
Metal Substrate pcb board of the present invention is continuously apart from jigsaw cutting method, as shown in Figure 3, described cutting method is on adopting, lower V-cut cutting knife Co-cleavage mode, by upper, thereby the Co-cleavage of lower V-cut cutting knife cuts into article unit junction and obtains complete one-tenth article unit, wherein, upper V-cut cutting knife is circuit surface for the upper surface of cutting metal base pcb board, circuit surface forms a v-notch 140, lower V-cut cutting knife is metal basal plane for the lower surface of cutting metal base pcb board, metal basal plane forms a v-notch 150, adopt above-mentioned on, lower V-cut cutting knife Co-cleavage mode can not produce the problem occurring in the time lacking finished product unit interval in similar common jigsaw punching moulding production process, as burr, the bad phenomenon such as sheet material crackle, thereby improve the quality that becomes article unit.
Consideration for user to Metal Substrate pcb board V-cut angle Selection and availability ratio of the armor plate aspect, upper and lower V-cut cutting knife angle in the embodiment of the present invention is preferably 30 degree, V-cut cutting knife angle is less, the cutting output that uses V-cut cutting knife to produce is just less, therefore, in the thick situation of same metal base pcb board, to obtain identical remaining thick V-cut, use 30 degree V-cut cutting knife cutting outputs more much smaller than 60 degree V-cut cuttves, therefore, continuously select the upper and lower V-cut cutting knife of 30 degree can better control PCS size apart from jigsaw.
Metal Substrate pcb board has residual limit after using V-cut cutting knife to fracture, residual limit general control is in ± 0.2mm left and right, what some precision were higher be controlled at ± 0.15mm left and right, if residual limit is too large, become article unit to have when mounted problem, and there is the off normal problem of upper and lower cutter while using upper and lower V-cut cutting knife Co-cleavage, so require residual limit general control in ± 0.1mm, for better ensureing the required precision of PCS overall dimension, the upper and lower V-cut cutter of embodiments of the invention side-play amount is less than 0.005mm, thereby reaches the high-precision requirement that residual limit is less than 0.1mm.
Metal Substrate pcb board of the present invention is continuously apart from an embodiment of jigsaw cutting method, as shown in Figure 3, adopt upper and lower V-cut cutting knife Co-cleavage mode, comprise that the upper surface that uses upper V-cut cutting knife only to cut a Metal Substrate pcb board is circuit surface 120, obtain a v-notch 140 in circuit surface 120 incision, as shown in Figure 4, because of circuit surface 120 generally thinner, depth of cut is preferably 0.1-0.2mm, be as the criterion to be slightly larger than the circuit surface degree of depth, reach the object of disposable cut-out Metal Substrate pcb board circuit surface; Using lower V-cut cutting knife can select disposable cut-out Metal Substrate pcb board lower surface is metal basal plane 130, obtain a v-notch 150 in metal basal plane incision, be that depth of cut is darker, the degree of depth that now selection descends the degree of depth of V-cut cutting knife to be slightly larger than Metal Substrate pcb board lower surface is as the criterion, to reach the object of cutting off Metal Substrate pcb board lower surface, while adopting this disposable cut-out Metal Substrate pcb board lower surface, cutting speed is fast, and technical process is simple.
Above-mentioned Metal Substrate pcb board is continuously in another preferred embodiment of jigsaw cutting method, and it is circuit surface 120 with the upper surface of the same mode cutting metal base pcb board of above-described embodiment that upper V-cut cutting knife is selected, as shown in Figure 4, it is that metal basal plane obtains into article unit that lower V-cut cutting knife is selected the final lower surface that cuts off Metal Substrate pcb board of repeatedly cutting, adopt while cutting in this way, depth of cut is preferably 0.3mm for the first time, then each depth of cut adds 0.3mm, while cutting the last time, depth of cut is as the criterion with the lower surface that reaches cut-out Metal Substrate pcb board, when i.e. last cutting, depth of cut is slightly larger than the Metal Substrate lower surface degree of depth, adopt this repeatedly cutting mode to cut off the lower surface of Metal Substrate pcb board, can more accurate cutting metal base pcb board, to reach the object of controlling better PCS size.Metal Substrate pcb board of the present invention carries out 3 cuttings apart from V-cut cutting knife under concrete choice for use in the embodiment of jigsaw cutting method to the lower surface of Metal Substrate pcb board continuously, as shown in Fig. 5-7, depth of cut is 0.3mm for the first time, in a front depth of cut, to add 0.3mm be that depth of cut is 0.6mm to depth of cut for the second time, depth of cut is as the criterion with the lower surface that cuts off Metal Substrate pcb board for the third time, and depth of cut is slightly larger than the metal lower surface degree of depth.
The method of above-mentioned upper and lower V-cut cutting knife Co-cleavage Metal Substrate pcb board has been avoided the bad phenomenon such as burr, sheet material crackle producing in the time lacking unit interval in the production process of punching moulding in the past, not only reduce production technology side crops, reduce the cost of sheet material, also improved the utilance of sheet material.
In sum, Metal Substrate pcb board provided by the invention has adopted continuously apart from jigsaw structure, each become distance continuously between article unit, this structure makes availability ratio of the armor plate improve 20-30%, and without opening punching mould, save die cost, the cutting method of upper and lower V-cut cutting knife Co-cleavage Metal Substrate pcb board provided by the invention, avoid the bad phenomenon such as burr, sheet material crackle producing in the production process of punching moulding in the past in the time lacking unit interval, thereby improved the quality that becomes article unit.
Should be understood that, application of the present invention is not limited to above-mentioned giving an example, and for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection range of claims of the present invention.
Claims (1)
1. Metal Substrate pcb board, continuously apart from a jigsaw cutting method, is characterized in that, described cutting method is for adopting upper and lower V-cut cutting knife Co-cleavage mode, and it comprises the following steps:
The upper surface of V-cut cutting knife cutting metal base pcb board in S01, use;
The lower surface of S02, the lower V-cut cutting knife cutting metal base pcb board of use;
Wherein, in after described cutting step S02, also comprise:
Use lower V-cut cutting knife to carry out 3 cuttings to the lower surface of Metal Substrate pcb board, depth of cut is 0.3mm for the first time, in a front depth of cut, to add 0.3mm be that depth of cut is 0.6mm to depth of cut for the second time, depth of cut is as the criterion with the lower surface that cuts off Metal Substrate pcb board for the third time, and depth of cut is slightly larger than the metal lower surface degree of depth;
Upper and lower V-cut cutter side-play amount is less than 0.005mm, thereby reaches the required precision that residual limit is less than 0.1mm;
In use, when the upper surface of V-cut cutting knife cutting metal base pcb board, depth of cut is preferably 0.1-0.2mm, is as the criterion to be slightly larger than the circuit surface degree of depth, reaches the object of disposable cut-out Metal Substrate pcb board circuit surface;
Upper and lower V-cut cutting knife angle is 30 degree, and V-cut cutting knife angle is less, and the cutting output that uses V-cut cutting knife to produce is just less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201110293166.3A CN102438399B (en) | 2011-09-30 | 2011-09-30 | Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110293166.3A CN102438399B (en) | 2011-09-30 | 2011-09-30 | Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof |
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| CN102438399A CN102438399A (en) | 2012-05-02 |
| CN102438399B true CN102438399B (en) | 2014-08-06 |
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| CN103009432B (en) * | 2012-12-11 | 2015-07-01 | 四川海英电子科技有限公司 | PCB (printed circuit board) stamping and V-cutting production method |
| CN104625584A (en) * | 2013-11-11 | 2015-05-20 | 江苏苏杭电子有限公司 | Printed circuit board appearance machining method |
| CN104708670A (en) * | 2013-12-27 | 2015-06-17 | 周明 | Dislocation punching technology suitable for back glue product made of electronic materials |
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| CN105338746B (en) * | 2015-11-03 | 2018-01-12 | 胜宏科技（惠州）股份有限公司 | A kind of circuit panel forming method of no positioning hole |
| TWI565377B (en) * | 2015-11-06 | 2017-01-01 | You-Long Weng | Surface metal layer cutting processing equipment for circuit boards |
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| CN108012419B (en) * | 2017-10-31 | 2020-04-03 | 广德博亚新星电子科技有限公司 | Zero-distance V-CUT processing method for PCB |
| CN108668445B (en) * | 2018-06-29 | 2020-02-21 | 奥士康精密电路（惠州）有限公司 | PCB production cutting process for improving utilization rate of plates |
| CN109561592B (en) * | 2018-12-24 | 2021-04-27 | 江苏弘信华印电路科技有限公司 | Zero-clearance jointed board manufacturing process |
| CN110126104A (en) * | 2019-03-25 | 2019-08-16 | 苏州芯海半导体科技有限公司 | A kind of gallium arsenide wafer cutting method |
| CN110022651B (en) * | 2019-05-21 | 2020-09-01 | 安捷利（番禺）电子实业有限公司 | Processing method and equipment for inner layer golden finger of multilayer board |
| DE102019125449B4 (en) * | 2019-09-20 | 2022-06-02 | KSG GmbH | Method of manufacturing a printed circuit board and printed circuit board assembly |
| CN111432563A (en) * | 2020-05-28 | 2020-07-17 | 遂宁市广天电子有限公司 | Method for reducing dimension tolerance of PCB V-cut board |
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| JP2005064420A (en) * | 2003-08-20 | 2005-03-10 | Yaskawa Electric Corp | Printed circuit board |
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| JPH1022630A (en) * | 1996-06-28 | 1998-01-23 | Nippon Seiki Co Ltd | Method for dividing metallic base print board |
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| JP2004034319A (en) * | 2002-06-28 | 2004-02-05 | Uht Corp | Cutting method for laminated sheet and half-cut device used therein |
| JP2005064420A (en) * | 2003-08-20 | 2005-03-10 | Yaskawa Electric Corp | Printed circuit board |
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