CN114536468B - XY bidirectional synchronous material-saving processing method - Google Patents
XY bidirectional synchronous material-saving processing method Download PDFInfo
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- CN114536468B CN114536468B CN202210112448.7A CN202210112448A CN114536468B CN 114536468 B CN114536468 B CN 114536468B CN 202210112448 A CN202210112448 A CN 202210112448A CN 114536468 B CN114536468 B CN 114536468B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The invention discloses an XY two-way synchronous material-saving processing method, which comprises the steps of firstly transversely cutting raw materials to meet the conventional processing interval in the Y direction, and then longitudinally cutting to meet the conventional processing interval in the X direction, so that each semi-finished product obtained by cutting through the method can meet the conventional processing requirement, and a plurality of products are obtained. Compared with the conventional processing, the method can realize multiple raw material utilization rates, effectively save resources, and particularly can greatly reduce the production cost and improve the market competitiveness for some raw materials with higher cost.
Description
Technical Field
The invention relates to the field of die cutting processing, in particular to an XY bidirectional synchronous material-saving processing method.
Background
The die cutting processing is a common production processing method, and the feeding of the die cutting processing in the past is mostly realized manually, but in order to improve the production automation and the production efficiency and reduce the labor intensity of workers, the die cutting processing in the prior art adopts an automatic feeding mode.
Because the actual processing is limited by the volume and the required active area of the clamping mechanism or the processing mechanism, a certain interval exists between products which can be processed and obtained in automatic feeding in order to avoid interference, raw materials positioned in the interval between two products can be wasted, the utilization rate of the materials is low, and especially for some raw materials with higher cost, such as copper foil, aluminum foil and the like, the waste is often not ignored, and the production cost can be greatly increased.
Disclosure of Invention
The invention aims to provide an XY two-way synchronous material-saving processing method which can solve one or more of the problems.
According to one aspect of the invention, there is provided an XY two-way synchronous material saving processing method, comprising the steps of:
step 1, taking a raw material, wherein one raw material can be processed conventionally to obtain n rows of products, n is an integer not less than 1, the length of the product in the Y direction is a, the length of the product in the X direction is b, the conventional processing interval of two adjacent products in the Y direction on the raw material is c, the conventional processing interval in the X direction is d, the unilateral processing allowance requirement t of the product is determined,
step 2, calculating the allowable quantity e of the products in the conventional processing interval of two adjacent products in the Y direction on the raw material according to the following first formula: e= [ c ≡ (a+t+2) ] -1, note: [] In order to round the symbol in its entirety,
calculating an actual Y-direction machining interval Y0 according to the following second formula: y0=c/(e+1),
calculating the allowable number f of lines of the product in the raw material according to the following third formula: f=n (e+1),
calculating the allowable number g of products which can be accommodated in the regular processing interval of two adjacent products in the X direction on the raw material according to the following fourth formula: g= [ d ≡ (b+t+2) ] -1, note: [] In order to round the symbol in its entirety,
the actual X-direction machining interval X0 is calculated according to the following fifth formula: x0=d/(g+1),
step 3, compounding a protective film at the bottom of the raw material, then cutting the raw material for f times along the X direction to ensure that the raw material is cut into f sections, the cutting depth is the thickness of the raw material, the interval between adjacent cutting cuts is y0, a first semi-finished product is obtained,
step 4, compounding a new protective film on the surface of the first semi-finished product, pumping out the 1 st section, the 1 st+ (e+1) section, the 1+2 (e+1) section, the 1+3 (e+1) section … … and the 1 st+ (n-1) section and rolling up the first semi-finished product together with the new protective film to obtain a second semi-finished product;
compounding a new protective film on the surface of the rest first semi-finished product, pumping out a 2 nd section, a 2 < + > (e+1) section, a 2+2 (e+1) section, a 2+3 (e+1) section … … and a 2 < + > (n-1) section (e+1) from the rest first semi-finished product, and rolling the rest first semi-finished product together with the new protective film to obtain another second semi-finished product;
repeating the above operation until only the (e+1) th segment, the (e+1) + (e+1) th segment, the (e+1) +2 (e+1) th segment, the (e+1) +3 (e+1) th segment … … and the (e+1) + (n-1) th segment (e+1) are left on the first semi-finished product, winding the first semi-finished product together with the protective film at the bottom, and finally obtaining (e+1) second semi-finished products,
step 5, the protective film on each second semi-finished product is positioned below the raw material, and high mucous membrane is respectively compounded at the bottom of the protective film of each second semi-finished product to obtain a third semi-finished product,
step 6, die-cutting each third semi-finished product along the Y direction by using a plurality of die-cutting dies, wherein the die-cutting dies are provided with two cutting parts, the interval between the two cutting parts is x0, the interval between two adjacent die-cutting dies is x0, the die-cutting depth of the die-cutting dies is the total thickness of the protective film and the raw material, the raw material and the protective film between the two cutting parts in each die-cutting die are fixed by the die-cutting dies after die-cutting, the high-mucosa is separated, the raw material and the protective film which are not fixed by the die-cutting dies are separated along with the high-mucosa, a fourth semi-finished product composed of the raw material and the protective film fixed by the plurality of die-cutting dies and a fifth semi-finished product composed of the raw material and the protective film fixed by the high-mucosa are obtained from each third semi-finished product,
and 7, carrying out finish machining on the fourth semi-finished product to obtain a product, and carrying out finish machining on the fifth semi-finished product to obtain the product.
The beneficial effects of the invention are as follows: according to the steps 3 and 4 which are calculated and implemented in the step 2, a plurality of second semi-finished products can be obtained, so that the distance between the raw material sections in each second semi-finished product in the Y direction is the same as the distance required by conventional processing in the Y direction, the processing requirement of each second semi-finished product in the Y direction is met, and after the subsequent processing in the steps 5 and 6, the raw materials on the fourth semi-finished product and the fifth semi-finished product can meet the distance required by conventional processing in the Y direction and the distance required by conventional processing in the X direction, thereby facilitating the finish processing of the raw materials on the fourth semi-finished product and the fifth semi-finished product, and the raw materials on the fourth semi-finished product and the fifth semi-finished product can be correspondingly processed to obtain products. Compared with the conventional processing, the method can realize the utilization rate of the raw materials ((e+1) × (g+1)) times, saves resources, and particularly can greatly reduce the production cost and improve the market competitiveness for some raw materials with higher cost.
In some embodiments, the product has a single sided tooling allowance requirement t of no less than 0.3mm.
In some embodiments, in the step 3, a plurality of positioning holes are die-cut on the first semi-finished product, the depth of the die-cut positioning holes on the first semi-finished product is the total thickness of the raw material and the protective film, and the interval between adjacent positioning holes in the X direction is X0. The positioning holes can facilitate the subsequent positioning of the second semi-finished product when die cutting is performed in the X direction, and the subsequent processing efficiency and processing precision are improved.
In some embodiments, in the step 4, after a new protective film is compounded on the first semi-finished product each time, a plurality of new positioning holes are die-cut on the new protective film, the depth of each new positioning hole obtained by die-cutting is the total thickness of the new protective film and the first semi-finished product, and the interval between the positioning holes obtained by die-cutting each time in the X direction is X0. Therefore, each obtained second semi-finished product can be guaranteed to have a corresponding positioning hole, positioning of each second semi-finished product in the subsequent die cutting process is facilitated, and processing efficiency and processing precision are guaranteed.
In some embodiments, the low adhesive film is placed on the bottom of the first semi-finished product before die cutting the positioning holes, and the low adhesive film is removed after die cutting the positioning holes. The setting of the low mucosa of support bottom can conveniently accept the waste material that produces when cutting the locating hole to can conveniently discharge these waste materials.
In some embodiments, the die cutting die is provided with die positioning pins which are matched with the positioning holes. Therefore, the die cutting processing in the step 6 can be conveniently positioned, and the die cutting precision and the die cutting efficiency are improved.
In some embodiments, the step 7 includes configuring a finishing die that includes a plurality of finishing locating holes that mate with the locating holes. Therefore, the finish machining positioning hole can facilitate positioning of the finish machining die, and finish machining precision and machining efficiency are improved.
In some embodiments, in step 4, after a new protective film is compounded on the first semi-finished product each time, a number is die-cut on the corresponding protective film on the first semi-finished product to be drawn away. The number can facilitate the user to distinguish the raw material section needing to be pumped away so as to ensure the processing reliability.
Drawings
Fig. 1 is an exploded view of a schematic diagram of a product obtained by an XY two-way synchronous material-saving processing method according to an embodiment of the present invention.
FIG. 2 is a schematic diagram of a conventional work-in-process product layout in one embodiment.
Fig. 3 is a schematic diagram of a first semi-finished product of step 3 of an XY two-way synchronous material saving processing method according to an embodiment of the present invention.
Fig. 4 is a schematic view of the processing depth of step 3 of the XY two-way synchronous material saving processing method according to an embodiment of the present invention.
Fig. 5 is a schematic diagram of a first and second semi-finished product obtained in step 4 of an XY two-way synchronous material saving processing method according to an embodiment of the present invention.
Fig. 6 is a schematic diagram of a second semi-finished product obtained in step 4 of the XY two-way synchronous material saving processing method according to an embodiment of the present invention.
Fig. 7 is a schematic diagram of a third second semi-finished product obtained in step 4 of the XY two-way synchronous material saving processing method according to an embodiment of the present invention.
Fig. 8 is a schematic view of the processing depth of step 4 of the XY two-way synchronous material saving processing method according to an embodiment of the present invention.
Fig. 9 is a schematic diagram of a first die-cutting die of an XY two-way synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 10 is a schematic diagram of a first, fourth and fifth semi-finished products obtained in step 5 of an XY two-way synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 11 is a schematic diagram of a second die-cutting die of an XY two-way synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 12 is a schematic diagram of a second, fourth and fifth semi-finished product obtained in step 5 of an XY two-way synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 13 is a schematic view of a third die-cutting die of an XY two-way synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 14 is a schematic diagram of a third, fourth and fifth semi-finished product obtained in step 5 of an XY two-way synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 15 is a schematic view of the processing depth of step 5 of the XY two-way synchronous material saving processing method according to an embodiment of the present invention.
Fig. 16 is a schematic view of a finishing die of an XY two-way synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 17 shows a processing depth of a second double-sided tape semi-finished product obtained by processing by the XY two-way synchronous material saving processing method according to an embodiment of the present invention.
Fig. 18 is a schematic diagram of a first jig of an XY two-way synchronous material-saving processing method according to an embodiment of the invention.
Fig. 19 is a schematic diagram of a second jig of an XY two-way synchronous material-saving processing method according to an embodiment of the invention.
Fig. 20 is a schematic diagram of a third tool of an XY two-way synchronous material-saving processing method according to an embodiment of the invention.
Fig. 21 is a schematic diagram of a fourth tool of an XY two-way synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 22 is a schematic diagram of a sheathing die of an XY two-way synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 23 is a schematic view of processing depth of the nesting processing of the XY two-way synchronous material saving processing method according to an embodiment of the present invention.
Fig. 24 is a schematic diagram of sleeving processing of the XY two-way synchronous material saving processing method according to an embodiment of the present invention.
In the figure: 10. raw material, 20, product, 30, protective film, 40, low adhesive on the backing, 50, high adhesive film, 60, first die-cutting die, 70, second die-cutting die, 80, third die-cutting die, 90, sleeved die, 61, first die locating pin, 71, second die locating pin, 81, third die locating pin, 100, first fourth semi-finished product, 200, first fifth semi-finished product, 300, second fourth semi-finished product, 400, second fifth semi-finished product, 500, third fourth semi-finished product, 600, third fifth semi-finished product, 601, cut portion, 602, hole die-cutting portion, 101, first locating hole, 102, second locating hole, third semi-finished product, and fourth semi-finished product. 103, third positioning hole, 104, fourth positioning, 201, main material, 202, first double-sided adhesive tape, 203, second double-sided adhesive tape, 204, PC, 205, release film, 206, backing film, 207, facial tissue, 301, first finishing positioning hole, 302, second finishing positioning hole, 303, third finishing positioning hole, 304, fourth finishing positioning hole, 305, fool-proof hole, 306, material hole, 1, first positioning needle, 11, first jig, 2, second positioning needle, 12, second jig, 3, third positioning needle, 13, third jig, 4, fourth positioning needle, 14, fourth jig.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings.
Referring to fig. 1 to 24, an XY two-way synchronous material saving processing method of the present embodiment is used for producing a product 20, wherein the product 20 includes a main material 201, a first double sided tape 202, a second double sided tape 203 and a PC 204, wherein the PC 201 is connected to the top surface of the main material 201 through the first double sided tape 203, the second double sided tape 203 is connected to the bottom surface of the main material 201, and the material of the main material 201 is the raw material of the present embodiment.
The XY two-way synchronous material-saving processing method comprises the following steps:
step 1, a raw material is taken, and one raw material can be used for processing to obtain n rows of products 20, wherein n is the conventional number of rows of the products 20 on the raw material, and is an integer not less than 1. And the length of the product 20 in the Y direction is a, the length of the product in the X direction is b, the regular processing interval of two adjacent products 20 in the Y direction on the raw material is c, the regular processing interval in the X direction is d, the single-side processing allowance requirement of the product 20 is determined to be t, and the single-side processing allowance requirement of the product 20 is not less than 0.3mm.
In this embodiment, n is preferably 8, the length a of the product 20 in the Y direction is preferably 1.84mm, the length b of the product 20 in the X direction is preferably 2.22mm, the regular machining interval c of two adjacent products 20 in the Y direction on the raw material is preferably 8.5mm, the regular machining interval d in the X direction is preferably 6.8mm, and the single-side machining allowance requirement t of the product 20 is preferably 0.3mm.
Step 2, calculating the allowable quantity e of the products in the conventional processing interval of two adjacent products in the Y direction on the raw material according to the following first formula: e= [ c ≡ (a+t × 2) ] -1, wherein [ ] is a rounded sign.
In this example, c=8.5 mm, a=1.84 mm, t=0.3 mm, and e=2 is calculated.
Calculating an actual Y-direction machining interval Y0 according to the following second formula: y0=c/(e+1).
In this example, c=8.5 mm, e=2, and y0 is calculated to be about 2.83mm.
Calculating the allowable number f of lines of the product in the raw material according to the following third formula: f=n (e+1).
In this embodiment, n= 8,e =2, and f=24 lines are calculated.
Calculating the allowable number g of products which can be accommodated in the regular processing interval of two adjacent products in the X direction on the raw material according to the following fourth formula: g= [ d ].
In this example, d=6.8 mm, b=2.22 mm, t=0.3 mm, and g=1 is calculated.
The actual X-direction machining interval X0 is calculated according to the following fifth formula: x0=d/(g+1).
In this example, d=6.8 mm and g=1, and x0 is calculated to be about 3.4mm.
And 3, compounding a protective film 30 at the bottom of the raw material, placing a bottom-supporting low-viscosity adhesive 40 below the protective film 30, cutting the raw material for 24 times along the X direction by using a circular knife according to the calculated value 24 of f, so that the raw material is cut into 24 sections, the cutting depth is the thickness of the raw material, a first semi-finished product is obtained, the interval between adjacent cutting cuts is y0, namely 2.83mm, positioning holes are also die-cut on the first semi-finished product for facilitating subsequent processing, the first semi-finished product is marked with a first positioning hole 101 for facilitating recording, the die-cutting depth is the total thickness of the raw material and the protective film 30, the diameter of the first positioning hole 101 is preferably 4mm, and the bottom-supporting low-viscosity adhesive 40 is taken away after the first positioning hole 101 is die-cut to take away waste materials generated by die-cutting the first positioning hole 101.
And 4, compounding a new protective film 30 on the surface of the first semi-finished product, and carrying out die cutting on the protective film corresponding to the 1 st segment, the 1 st+ (e+1) segment, the 1+2 st (e+1) segment, the 1+3 st (e+1) segment … … and the 1 st+ (n-1) segment on the corresponding protective film, and then correspondingly drawing the 1 st segment, the 1 st+ (e+1) segment, the 1 st+2 nd (e+1) segment, the 1+3 st (e+1) segment … … and the 1 st+ (n-1) segment and rolling the protective film together with the new protective film to obtain a second semi-finished product.
And (3) compounding a new protective film 30 on the surface of the remaining first semi-finished product, and carrying out die cutting on the protective film corresponding to the 2 nd segment, the 2 (e+1) segment, the 2+2 (e+1) segment, the 2+3 (e+1) segment … … and the 2 (n-1) segment on the 2 nd segment of the remaining first semi-finished product, and carrying out die cutting on the protective film corresponding to the 2 nd segment, the 2 (e+1) segment, the 2+2 (e+1) segment, the 2+3 (e+1) segment … … and the 2 (n-1) segment of the remaining first semi-finished product and carrying out rolling together with the new protective film to obtain another second semi-finished product.
Repeating the above operation until only the (e+1) th segment, the (e+1) + (e+1) th segment, the (e+1) +2 (e+1) th segment, the (e+1) +3 (e+1) th segment … … and the (e+1) + (n-1) th segment (e+1) are left on the first semi-finished product, and winding the first semi-finished product together with the protective film 30 compounded at the bottom in the step 3, thereby obtaining (e+1) second semi-finished products.
In this embodiment, since e is 2 and n is 8, 3 second semi-finished products are finally obtained, and the 3 second semi-finished products are respectively a first second semi-finished product, a second semi-finished product and a third second semi-finished product. The first semi-finished product comprises a 1 st section, a 4 th section, a 7 th section, a 10 th section, a 13 th section, a 16 th section, a 19 th section and a 22 th section in the first semi-finished product, the second semi-finished product comprises a 2 nd section, a 5 th section, an 8 th section, an 11 th section, a 14 th section, a 17 th section, a 20 th section and a 23 th section in the first semi-finished product, and the third semi-finished product comprises a 3 rd section, a 6 th section, a 9 th section, a 12 th section, a 15 th section, an 18 th section, a 21 st section and a 24 th section in the first semi-finished product.
In addition, in order to facilitate positioning in subsequent processing, after a new protective film 30 is compounded on the first semi-finished product each time, a backing low-viscosity film 40 is placed at the bottom of the first semi-finished product at the same time, and then a plurality of new positioning holes are die-cut on the new protective film 30, in this embodiment, for convenience of description, the positioning holes are marked as second positioning holes 102 on the first semi-finished product, the positioning holes are marked as third positioning holes 103 on the second semi-finished product, wherein the die-cutting depth of the second positioning holes 102 and the third positioning holes 103 is the total thickness of the first semi-finished product plus the new protective film, then the third semi-finished product can simultaneously contain the first positioning holes 101, the second positioning holes 102 and the third positioning holes 103, and the diameter of the second positioning holes 102 is preferably 2mm, and the diameter of the third positioning holes 103 is preferably 3mm. In addition, each time after the locating holes are die cut, the backing low-adhesion glue 40 is removed to carry away the waste material generated by die cutting the locating holes.
And 5, all the obtained second semi-finished products comprise protective films and raw materials, the protective films on the second semi-finished products are positioned below the raw materials, and the high mucosa 50 is respectively compounded at the bottoms of the protective films of the second semi-finished products to obtain third semi-finished products, so that in the embodiment, the first second semi-finished products can correspondingly obtain first third semi-finished products, the second semi-finished products can correspondingly obtain second third semi-finished products and the third second semi-finished products can correspondingly obtain third semi-finished products.
Step 6, die cutting is performed on each third semi-finished product along the Y direction by using a plurality of die cutting dies arranged side by side, specifically in this embodiment, the first third semi-finished product is die cut along the Y direction by using a plurality of first die cutting dies arranged side by side, the second third semi-finished product is die cut along the Y direction by using a plurality of second die cutting dies arranged side by side, and the third semi-finished product is die cut along the Y direction by using a plurality of third die cutting dies arranged side by side.
The first, second and third die-cutting dies 60, 70 and 80 are each provided with two cut portions 601, the spacing between the two cut portions 601 being x0, i.e. 3.4mm, and the spacing between two adjacent die-cutting dies also being x0, i.e. 3.4mm. The first die-cutting die 60, the second die-cutting die 70 and the third die-cutting die 80 are mainly distinguished in that die positioning pins with different sizes and positions are arranged on the first die-cutting die 60, specifically, a first die positioning pin 61 matched with the second positioning hole 102 in size and position is arranged on the first die-cutting die 60, a second die positioning pin 71 matched with the third positioning hole 103 in size and position is arranged on the second die-cutting die 70, a third die positioning pin 81 matched with the first positioning hole 101 in size and position is arranged on the third die-cutting die 80, and when in die-cutting, the first die positioning pin 61 can be arranged in the second positioning hole 102 to facilitate the positioning of the first die-cutting die 60 when die-cutting is performed on the first and third semi-finished products, the second die positioning pin 71 can be arranged in the third positioning hole 103 to facilitate the positioning of the second die-cutting die 70 when die-cutting is performed on the second and third semi-finished products, and the third die positioning pin 81 can be arranged in the first positioning hole 101 to facilitate the positioning of the third die-cutting die 80 when die-cutting is performed on the third and the third semi-finished products, so that the die-cutting accuracy and the die-cutting accuracy can be ensured.
And the raw material and the protective film 30 between the two cut parts 601 in the first die-cutting die 60 can be fixed by the first die-cutting die 60 after die-cutting, and by separating the high adhesive film 50 compounded by the first and third semi-finished products, so that the raw material and the protective film not fixed by the first die-cutting die 60 can be separated along with the high adhesive film 50, the first and fourth semi-finished products 100 composed of the raw material and the protective film fixed by the plurality of first die-cutting dies 60 and the first and fifth semi-finished products 200 composed of the raw material and the protective film fixed by the high adhesive film can be obtained from the first and third semi-finished products. And the die cutting depths of the first, second and third die cutting molds 60, 70 and 80 are the total thickness of the raw material and the protective film.
And the raw material and the protective film 30 between the two cut portions 601 in the second die-cutting die 70 can be fixed by the second die-cutting die 70 after die-cutting, and by separating the high adhesive film 50 compounded by the second and third semi-finished products, so that the raw material and the protective film not fixed by the second die-cutting die 70 can be separated along with the high adhesive film 50, the second and fourth semi-finished products 300 composed of the raw material and the protective film fixed by the plurality of second die-cutting dies 70 and the second and fifth semi-finished products 400 composed of the raw material and the protective film fixed by the high adhesive film can be obtained from the second and third semi-finished products.
And the raw material and the protective film 30 between the two cut parts 601 in the third die-cutting die 80 can be fixed by the third die-cutting die 80 after die-cutting, and by separating the high adhesive film 50 compounded by the third semi-finished product, so that the raw material and the protective film not fixed by the third die-cutting die 80 can be separated along with the high adhesive film 50, the third and fourth semi-finished products 500 composed of the raw material and the protective film fixed by the plurality of third die-cutting dies 80 and the third and fifth semi-finished products 600 composed of the raw material and the protective film fixed by the high adhesive film 50 can be obtained from the third semi-finished product.
On the other hand, in order to facilitate the processing positioning of the subsequent finish machining, the first die-cutting die 60, the second die-cutting die 70 and the third die-cutting die 80 are further provided with hole die-cutting portions 602, so that when the first die-cutting die 60, the second die-cutting die 70 and the third die-cutting die 80 perform die-cutting, the hole die-cutting portions 602 can also die-cut fourth positioning holes 104 on the first, second and third semi-finished products, and the depth of the fourth positioning holes 104 can be the depth penetrating the high-viscosity film 50, and the waste materials thereof can be directly discharged.
Step 7, finishing the obtained first, second, third and third semi-finished products 100, 200, 300, 400, 500 and 600 respectively.
The finishing in this embodiment includes setting finishing dies that can be used for the first fourth semi-finished product 100, the first fifth semi-finished product 200, the second fourth semi-finished product 300, the second fifth semi-finished product 400, the third fourth semi-finished product 500, and the third fifth semi-finished product 600, specifically, first compounding the backing film 206, the release film 205, the second double sided adhesive 203, and the face paper 207 in sequence from bottom to top, then punching the face paper with a die having a shape matching with the inner hole of the second double sided adhesive 203, wherein the punching depth is a through backing film 206, directly discharging the waste material and discarding the cotton paper, winding to obtain a second double sided adhesive semi-finished product, and setting the second double sided adhesive semi-finished product in the finishing die.
The finishing die is internally provided with a first finishing positioning hole 301, a second finishing positioning hole 302, a third finishing positioning hole 303 and a fourth finishing positioning hole 304 which are respectively matched with the positions and the sizes of the first positioning hole 101, the second positioning hole 102, the third positioning hole 103 and the fourth positioning hole 104, so that the finishing die is convenient to finish and use on the first fourth semi-finished product 100, the first fifth semi-finished product 200, the second fourth semi-finished product 300, the second fifth semi-finished product 400, the third fourth semi-finished product 500 and the third fifth semi-finished product 600. In addition, a fool-proof hole 305 and a material hole 306 of a material belt connected with the release film are also arranged in the finishing die.
The first finish machining positioning hole 301 and the first positioning hole 101 are positioned through the first positioning needle 1 on the first jig with the first positioning needle 1, and the size and the setting position of the first positioning needle 1 are matched with those of the first finish machining positioning hole 301 and the first positioning hole 101, so that the third and fifth semi-finished products 600 can be fixed with the finish machining die through the first jig 11, and the second double-sided adhesive semi-finished products are assembled on raw materials of the third and fifth semi-finished products 600.
The second finish machining positioning hole 302 and the second positioning hole 102 are positioned through the second positioning pin 2 on the second jig 12 with the second positioning pin 2, and the size and the setting position of the second positioning pin 2 are matched with those of the first second finish machining positioning hole 302 and the second positioning hole 102, so that the second fifth semi-finished product 400 can be fixed with the finish machining die through the second jig 12, and the second double-sided adhesive semi-finished product is assembled on the raw material of the second fifth semi-finished product 400.
The third finishing locating hole 303 and the third locating hole 103 are located through the third locating pin 3 on the third jig 13 with the third locating pin 3, the size and the setting position of the third locating pin 3 are matched with those of the third finishing locating hole 303 and the third locating hole 103, the third and fifth semi-finished products 200 can be fixed with the finishing die through the third jig 13, and therefore the second double-sided adhesive semi-finished products are assembled on raw materials of the third and fifth semi-finished products 200.
The fourth finishing positioning hole 304 and the fourth positioning hole 104 are positioned by the fourth positioning pin 4 on the fourth jig 14 with the fourth positioning pin 4, so that the first fourth semi-finished product 100, the second fourth semi-finished product 300 and the third fourth semi-finished product 500 can be respectively fixed with the finishing mold by the fourth jig 14, and the second double-sided adhesive semi-finished product is respectively assembled on the raw materials of the first fourth semi-finished product 100, the second fourth semi-finished product 300 and the third fourth semi-finished product 500.
Thereafter, the protective film 30 on the first, second and third fourth semi-finished products 100, 300 and 500, on which the second double-sided adhesive semi-finished product is assembled, is removed, and the protective film 30 and the high-viscosity film 50 on the first, second and third fifth semi-finished products 200, 400 and 600, on which the second double-sided adhesive semi-finished product is assembled, are removed.
And then the prepared PC 204 and the first double-sided tape 202 are respectively assembled on the first and fourth semi-finished products 100, 200, 300, 400, 500 and 600 assembled with the second double-sided tape semi-finished product, and then the outer frames are respectively obtained by cutting with a cutting die 90, wherein the cutting depth can be the thickness of the product 20, and the waste materials can be taken away when the release film 205 and the backing film 206 are removed, so that the product 20 is obtained.
Thus, the raw material 10 in this embodiment achieves an improvement in the utilization ratio of 3*2 =6 times, greatly improves the utilization ratio of the raw material 10, reduces the production cost, and improves the market competitiveness.
What has been described above is merely some embodiments of the present invention. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the invention.
Claims (8)
1. The XY two-way synchronous material-saving processing method is characterized by comprising the following steps of:
step 1, taking a raw material, wherein one raw material can be processed conventionally to obtain n rows of products, n is an integer not less than 1, the length of the product in the Y direction is a, the length of the product in the X direction is b, the conventional processing interval of two adjacent products in the Y direction on the raw material is c, the conventional processing interval in the X direction is d, the unilateral processing allowance requirement t of the product is determined,
step 2, calculating the allowable quantity e of the products in the conventional processing interval of two adjacent products in the Y direction on the raw material according to the following first formula: e= [ c ],
calculating an actual Y-direction machining interval Y0 according to the following second formula: y0=c/(e+1),
calculating the allowable number f of lines of the product in the raw material according to the following third formula: f=n (e+1),
calculating the allowable number g of products which can be accommodated in the regular processing interval of two adjacent products in the X direction on the raw material according to the following fourth formula: g= [ d ],
the actual X-direction machining interval X0 is calculated according to the following fifth formula: x0=d/(g+1),
step 3, compounding a protective film at the bottom of the raw material, then cutting the raw material for f times along the X direction to ensure that the raw material is cut into f sections, the cutting depth is the thickness of the raw material, the interval between adjacent cutting cuts is y0, a first semi-finished product is obtained,
step 4, compounding a new protective film on the surface of the first semi-finished product, pumping out the 1 st section, the 1 st+ (e+1) section, the 1+2 (e+1) section, the 1+3 (e+1) section … … and the 1 st+ (n-1) section and rolling up the first semi-finished product together with the new protective film to obtain a second semi-finished product;
compounding a new protective film on the surface of the rest first semi-finished product, pumping out a 2 nd section, a 2 < + > (e+1) section, a 2+2 (e+1) section, a 2+3 (e+1) section … … and a 2 < + > (n-1) section (e+1) from the rest first semi-finished product, and rolling the rest first semi-finished product together with the new protective film to obtain another second semi-finished product;
repeating the above operation until only the (e+1) th segment, the (e+1) + (e+1) th segment, the (e+1) +2 (e+1) th segment, the (e+1) +3 (e+1) th segment … … and the (e+1) + (n-1) th segment (e+1) are left on the first semi-finished product, winding the first semi-finished product together with the protective film at the bottom, and finally obtaining (e+1) second semi-finished products,
step 5, the protective film on each second semi-finished product is positioned below the raw material, and high mucous membrane is respectively compounded at the bottom of the protective film of each second semi-finished product to obtain a third semi-finished product,
step 6, die-cutting is carried out on each third semi-finished product along the Y direction by using a plurality of die-cutting dies, the die-cutting dies are provided with two cutting parts, the interval between the two cutting parts is x0, the interval between two adjacent die-cutting dies is x0, the raw materials and the protective films between the two cutting parts in each die-cutting die are fixed by the die-cutting dies after die-cutting, the die-cutting depth of the die-cutting dies is the total thickness of the protective films and the raw materials, the high-viscosity film is separated, the raw materials and the protective films which are not fixed by the die-cutting dies are separated along with the high-viscosity film, a fourth semi-finished product composed of the raw materials and the protective films fixed by the plurality of die-cutting dies and a fifth semi-finished product composed of the raw materials and the protective films fixed by the high-viscosity film are obtained from each third semi-finished product,
and 7, carrying out finish machining on the fourth semi-finished product to obtain a product, and carrying out finish machining on the fifth semi-finished product to obtain the product.
2. The XY two-way synchronous material saving processing method according to claim 1, wherein the single-sided machining allowance requirement t of the product is not less than 0.3mm.
3. The XY two-way synchronous material saving processing method according to claim 1, wherein in the step 3, a plurality of positioning holes are die-cut on the first semi-finished product, the depth of each positioning hole is the total thickness of the raw material and the protective film, and the interval between adjacent positioning holes in the X direction is X0.
4. The XY two-way synchronous material saving processing method according to claim 3, wherein in the step 4, after a new protective film is compounded on the first semi-finished product each time, a plurality of new positioning holes are die-cut on the new protective film, the depth of each new positioning hole obtained by die-cutting is the total thickness of the new protective film and the first semi-finished product, and the interval between the positioning holes obtained by die-cutting each time in the X direction is X0.
5. The XY two-way synchronous material saving processing method according to claim 3 or 4, wherein the low-adhesive film of the support base is placed at the bottom of the first semi-finished product before the positioning hole is die-cut, and the low-adhesive film of the support base is removed after the positioning hole is die-cut.
6. The XY two-way synchronous material saving processing method according to claim 4, wherein the die cutting die is provided with a die positioning pin, and the die positioning pin is matched with the positioning hole.
7. The XY two-way synchronous material saving machining method according to claim 4, wherein the step 7 comprises configuring a finishing die comprising a plurality of finishing locating holes, wherein the finishing locating holes are matched with the locating holes.
8. The XY two-way synchronous material saving processing method according to claim 1, wherein in the step 4, after a new protective film is compounded on the first semi-finished product each time, a number is die-cut on the corresponding protective film on the first semi-finished product to be drawn.
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