CN114536468A - XY two-direction synchronous material-saving processing method - Google Patents

XY two-direction synchronous material-saving processing method Download PDF

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Publication number
CN114536468A
CN114536468A CN202210112448.7A CN202210112448A CN114536468A CN 114536468 A CN114536468 A CN 114536468A CN 202210112448 A CN202210112448 A CN 202210112448A CN 114536468 A CN114536468 A CN 114536468A
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semi
finished product
die
cutting
section
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CN202210112448.7A
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CN114536468B (en
Inventor
马涛
黄军政
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Zhengzhou Triumphlead Technology Co ltd
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Zhengzhou Triumphlead Technology Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/27—Means for performing other operations combined with cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Sawing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The invention discloses an XY two-direction synchronous material-saving processing method, which meets the conventional processing interval in the Y direction by transversely cutting raw materials, and meets the conventional processing interval in the X direction by longitudinally cutting, so that each semi-finished product obtained by cutting by the method can meet the conventional processing requirement, and a plurality of products are obtained. Compared with conventional processing, the method can realize multiple raw material utilization rate, effectively save resources, and greatly reduce production cost and improve market competitiveness especially for some raw materials with higher cost.

Description

XY two-direction synchronous material-saving processing method
Technical Field
The invention relates to the field of die cutting processing, in particular to an XY two-direction synchronous material-saving processing method.
Background
The die cutting processing is a common production processing method, the feeding of the die cutting processing in the past is mostly realized by manpower, but in order to improve the production automation and the production efficiency and reduce the labor intensity of workers, the automatic feeding mode is gradually adopted in the die cutting processing at present.
Because the volume and the area that needs the activity of during actual processing, be restricted to fixture or processing agency etc. are restricted, in order to avoid taking place the interference, can process in the automation material loading and can have certain interval between the product that obtains, this can lead to being located the raw and other materials in the interval between two products and can be wasted uselessly, the low utilization ratio of material, especially to some higher raw and other materials of cost, such as copper foil, aluminium foil etc. raw and other materials, this waste often can't be neglected, it can lead to the rise of manufacturing cost by a wide margin.
Disclosure of Invention
The invention aims to provide an XY two-direction synchronous material-saving processing method, which can solve one or more of the problems.
According to one aspect of the invention, an XY two-direction synchronous material-saving processing method is provided, which comprises the following steps:
step 1, taking a raw material, wherein one raw material can be processed conventionally to obtain n rows of products, n is an integer not less than 1, the length of the product in the Y direction is a, the length of the product in the X direction is b, the conventional processing interval of two adjacent products in the Y direction on the raw material is c, the conventional processing interval in the X direction is d, and the unilateral processing allowance requirement t of the product is determined,
step 2, calculating the allowable quantity e of the products which can be accommodated in the conventional processing interval of two adjacent products on the raw material in the Y direction according to the following first formula: e ═ c ÷ (a + t × 2) ] -1, note: [] In order to round the symbol, the symbol is rounded,
the actual Y-direction machining interval Y0 is calculated according to the following second formula: y0 ═ c/(e +1),
calculating the allowable row number f of the product on the raw material according to the following third formula: f ═ n (e +1),
calculating an allowable number g of products that can be accommodated in a regular processing interval of two adjacent products in the X direction on the raw material according to the following fourth formula: g ═ d ÷ (b + t × 2) ] -1, note: [] In order to round the symbol, the symbol is rounded,
the actual X-direction machining interval X0 is calculated according to the following fifth formula: x0 ═ d/(g +1),
step 3, compounding a protective film at the bottom of the raw material, then cutting the raw material for f times along the X direction to cut the raw material into f sections, wherein the cutting depth is the thickness of the raw material, the interval between adjacent cutting cuts is y0, and obtaining a first semi-finished product,
step 4, compounding a new protective film on the surface of the first semi-finished product, drawing the 1 st section, the 1 st plus (e +1) th section, the 1+2 th (e +1) th section, the 1+3 th (e +1) th section … … and the 1 st plus (n-1) th (e +1) th section, and winding the sections together with the new protective film to obtain a second semi-finished product;
compounding a new protective film on the surface of the remaining first semi-finished product, drawing the 2 nd section, the 2+ (e +1) th section, the 2+2 (e +1) th section, the 2+3 (e +1) th section … … and the 2+ (n-1) th (e +1) th section from the remaining first semi-finished product, and winding the sections together with the new protective film to obtain another second semi-finished product;
repeating the above operations until only the (e +1) th section, the (e + 2) th section, the (e +1) th section, the (e + 3) th section … … and the (e +1) th section, the (n-1) th section, the (e +1) th section and the (e +1) th section are left on the first semi-finished product, and rolling the first semi-finished product and the protective film which are positioned on the bottom composite, and finally obtaining (e +1) second semi-finished products,
step 5, enabling the protective film on each second semi-finished product to be positioned below the raw material, and respectively compounding high adhesive films at the bottoms of the protective films of the second semi-finished products to obtain a third semi-finished product,
step 6, performing die cutting on each third semi-finished product along the Y direction by using a plurality of die cutting dies, wherein each die cutting die is provided with two cutting parts, the distance between the two cutting parts is x0, the distance between two adjacent die cutting dies is x0, the die cutting depth of each die cutting die is the total thickness of the protective film and the raw material, the raw material and the protective film between the two cutting parts in each die cutting die are fixed by the die cutting dies after die cutting, the high-viscosity film is separated, the raw material and the protective film which are not fixed by the die cutting dies are separated along with the high-viscosity film, and a fourth semi-finished product consisting of the raw material and the protective film which are fixed by the plurality of die cutting dies and a fifth semi-finished product consisting of the raw material and the protective film which are fixed by the high-viscosity film are obtained from each third semi-finished product,
and 7, performing finish machining on the fourth semi-finished product to obtain a product, and performing finish machining on the fifth semi-finished product to obtain a product.
The invention has the beneficial effects that: and calculating the implemented step 3 and the step 4 according to the step 2, so that a plurality of second semi-finished products can be obtained, the distance between the raw material sections in each second semi-finished product in the Y direction is the same as the distance required by the conventional machining in the Y direction, the machining requirement of each second semi-finished product in the Y direction is met, and after the subsequent machining in the steps 5 and 6, the raw materials on the fourth semi-finished product and the fifth semi-finished product can meet the conventional machining requirement in the Y direction and the conventional machining requirement in the X direction at the same time, so that the fine machining can be conveniently carried out on the raw materials, and the raw materials on the fourth semi-finished product and the fifth semi-finished product can be correspondingly machined to obtain products. Therefore, compared with the conventional processing, the method can realize ((e +1) × (g +1)) times of the utilization rate of raw materials, save resources, and particularly can greatly reduce the production cost and improve the market competitiveness of some raw materials with higher cost.
In some embodiments, the one-sided process margin requirement t of the product is not less than 0.3 mm.
In some embodiments, in step 3, a plurality of positioning holes are die-cut on the first semi-finished product, the depth of the positioning holes die-cut on the first semi-finished product is the total thickness of the raw material and the protective film, and the interval between adjacent positioning holes in the X direction is X0. The positioning holes can facilitate the subsequent positioning of the second semi-finished product in the X-direction die cutting process, and the subsequent processing efficiency and the subsequent processing precision are improved.
In some embodiments, in step 4, after each new protective film is laminated on the first semi-finished product, a plurality of new positioning holes are die-cut on the new protective film, the depth of the new positioning hole obtained by each die-cutting is the total thickness of the new protective film and the first semi-finished product, and the spacing between the positioning holes obtained by each die-cutting in the X direction is X0. Therefore, each obtained second semi-finished product can be ensured to have a corresponding positioning hole, so that each second semi-finished product can be conveniently positioned in the subsequent die cutting process, and the processing efficiency and the processing precision are ensured.
In some embodiments, the bottom supporting low adhesive film is placed before the die cutting of the positioning hole is performed, and the bottom supporting low adhesive film is removed after the die cutting of the positioning hole is finished. The waste materials generated in the process of die-cutting positioning holes can be conveniently received by the aid of the bottom supporting low-adhesive film, and the waste materials can be conveniently discharged.
In some embodiments, the die-cutting die is provided with a die positioning pin, and the die positioning pin is matched with the positioning hole. Therefore, the die cutting processing in the step 6 can be conveniently positioned, and the die cutting precision and the die cutting efficiency are improved.
In some embodiments, step 7 includes configuring a finishing die comprising a plurality of finishing pilot holes that match the pilot holes. Therefore, the finish machining positioning hole can facilitate the positioning of the finish machining die, and the finish machining precision and the machining efficiency are improved.
In some embodiments, in step 4, after a new protective film is laminated on the first semi-finished product each time, a number is cut on the corresponding protective film on the first semi-finished product to be removed. The number can facilitate the user to distinguish the original material section which needs to be taken out, so as to ensure the processing reliability.
Drawings
Fig. 1 is an exploded view of a schematic diagram of a product processed by the XY two-way synchronous material-saving processing method according to an embodiment of the present invention.
FIG. 2 is a schematic diagram of a conventional work product layout in one embodiment.
Fig. 3 is a schematic diagram of a first semi-finished product in step 3 of the XY two-direction synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 4 is a schematic view of the processing depth in step 3 of the XY bidirectional synchronous material-saving processing method according to the embodiment of the present invention.
Fig. 5 is a schematic diagram of the first and second semi-finished products obtained in step 4 of the XY two-directional synchronous material-saving processing method according to the embodiment of the present invention.
Fig. 6 is a schematic diagram of a second semi-finished product obtained in step 4 of the XY two-direction synchronous material-saving processing method according to the embodiment of the present invention.
Fig. 7 is a schematic diagram of a third semi-finished product obtained in step 4 of the XY two-direction synchronous material-saving processing method according to the embodiment of the present invention.
Fig. 8 is a schematic view of the processing depth in step 4 of the XY two-direction synchronous material-saving processing method according to the embodiment of the present invention.
Fig. 9 is a schematic view of a first die-cutting die of the XY bi-directional synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 10 is a schematic diagram of the first fourth semi-finished product and the first fifth semi-finished product obtained in step 5 of the XY two-way synchronous material-saving processing method according to the embodiment of the invention.
Fig. 11 is a schematic view of a second die cutting die of the XY two-direction synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 12 is a schematic diagram of a second fourth semi-finished product and a second fifth semi-finished product obtained in step 5 of the XY two-directional synchronous material-saving processing method according to the embodiment of the invention.
Fig. 13 is a schematic view of a third die-cutting die of the XY two-direction synchronous material-saving processing method according to the embodiment of the present invention.
Fig. 14 is a schematic diagram of a third, fourth and fifth semi-finished products obtained in step 5 of the XY two-way synchronous material-saving processing method according to the embodiment of the invention.
Fig. 15 is a schematic view of the processing depth in step 5 of the XY two-direction synchronous material-saving processing method according to the embodiment of the present invention.
Fig. 16 is a schematic view of a finishing mold in the XY two-direction synchronous material-saving processing method according to the embodiment of the present invention.
Fig. 17 shows the processing depth of the second intermediate product of the double faced adhesive tape obtained by the XY two-direction synchronous material-saving processing method according to the embodiment of the present invention.
Fig. 18 is a schematic view of a first jig of the XY two-direction synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 19 is a schematic view of a second jig of the XY two-direction synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 20 is a schematic view of a third jig of the XY two-directional synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 21 is a diagram illustrating a fourth jig of the XY two-directional synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 22 is a schematic view of a sheathing mold of the XY two-direction synchronous material-saving processing method according to an embodiment of the present invention.
Fig. 23 is a schematic view of the machining depth of the sheathing machining in the XY two-direction synchronous material-saving machining method according to the embodiment of the present invention.
Fig. 24 is a schematic view of the sleeving process of the XY two-direction synchronous material-saving process according to the embodiment of the present invention.
In the figure: 10. the manufacturing method comprises the following steps of raw materials, 20, products, 30, a protective film, 40, a bottom supporting low adhesive, 50, a high adhesive film, 60, a first die cutting die, 70, a second die cutting die, 80, a third die cutting die, 90, a sleeving die, 61, a first die positioning pin, 71, a second die positioning pin, 81, a third die positioning pin, 100, a first semi-finished product, a fourth semi-finished product, 200, a first semi-finished product, 300, a second semi-finished product, 400, a second semi-finished product, 500, a third semi-finished product, 600, a third semi-finished product, 601, a cutting part, 602, a hole die cutting part, 101, a first positioning hole, 102, a second positioning hole, 103, a third positioning hole, 104, a fourth positioning hole, 201, a main material, 202, a first double-sided adhesive, 203, a second double-sided adhesive, 204, PC, 205, a release film, 206, a bottom supporting film, 207, a face paper, 301, a first finish machining positioning hole, 302, a second finish machining positioning hole, 302, a second finish machining positioning hole, 201, a second positioning hole, a third machining hole, a second machining hole, a third machining hole, a fourth machining hole, a second machining hole, a third machining hole, a fourth machining hole, a second machining hole, a third machining hole, a fourth machining hole, a second machining hole, a third machining hole, a second machining hole, 303. The positioning device comprises a third finish machining positioning hole, 304, a fourth finish machining positioning hole, 305, a fool-proof hole, 306, a material hole, 1, a first positioning pin, 11, a first jig, 2, a second positioning pin, 12, a second jig, 3, a third positioning pin, 13, a third jig, 4, a fourth positioning pin, 14 and a fourth jig.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1 to 24, the XY two-directional synchronous material-saving processing method of the present embodiment is used for producing a product 20, wherein the product 20 includes a main material 201, a first double-sided adhesive 202, a second double-sided adhesive 203 and a PC 204, wherein the PC 201 is connected to a top surface of the main material 201 through the first double-sided adhesive 203, the second double-sided adhesive 203 is connected to a bottom surface of the main material 201, and the material of the main material 201 is the raw material of the present embodiment.
The XY two-direction synchronous material-saving processing method comprises the following steps:
step 1, taking a raw material, wherein one raw material can be conventionally used for processing to obtain n rows of products 20, wherein n is the conventional row number of the products 20 on the raw material and is an integer not less than 1. And the length of the product 20 in the Y direction is a, the length of the product in the X direction is b, the conventional processing interval of two adjacent products 20 in the Y direction on the raw material is c, the conventional processing interval in the X direction is d, the one-sided allowance requirement of the product 20 is determined to be t, and the one-sided allowance requirement of the product 20 should not be less than 0.3 mm.
In this embodiment, n is preferably 8, the length a of the product 20 in the Y direction is preferably 1.84mm, the length b of the product 20 in the X direction is preferably 2.22mm, the regular processing interval c of two adjacent products 20 in the Y direction on the raw material is preferably 8.5mm, the regular processing interval d in the X direction is preferably 6.8mm, and the one-sided allowance requirement t of the product 20 is preferably 0.3 mm.
Step 2, calculating the allowable quantity e of the products which can be accommodated in the conventional processing interval of two adjacent products on the raw material in the Y direction according to the following first formula: e ═ c ÷ (a + t × 2) ] -1, where [ ] is the rounded symbol.
In this example, c is 8.5mm, a is 1.84mm, and t is 0.3mm, and e is calculated to be 2.
The actual Y-direction machining interval Y0 is calculated according to the following second formula: y0 ═ c/(e + 1).
In this example, c is 8.5mm and e is 2, and y0 is calculated to be about 2.83 mm.
Calculating the allowable row number f of the product on the raw material according to the following third formula: f ═ n ═ e + 1.
In this embodiment, n is 8, e is 2, and f is 24 lines.
Calculating an allowable number g of products that can be accommodated in a regular processing interval of two adjacent products in the X direction on the raw material according to the following fourth formula: g [ ] is the rounded symbol, [.
In this example, d is 6.8mm, b is 2.22mm, and t is 0.3mm, and g is calculated to be 1.
The actual X-direction machining interval X0 is calculated according to the following fifth formula: x0 ═ d/(g + 1).
In this example, d is 6.8mm and g is 1, and x0 is calculated to be about 3.4 mm.
Step 3, compounding a protective film 30 at the bottom of the raw material, placing a bottom supporting low-adhesive glue 40 below the protective film 30, cutting the raw material for 24 times along the X direction by using a circular cutter according to the calculated value 24 of f, so that the raw material is cut into 24 sections, the cutting depth is the thickness of the raw material, obtaining a first semi-finished product, the interval of adjacent cutting cuts is y0, namely 2.83mm, and for convenience of subsequent processing, a die cutting positioning hole is also formed in the first semi-finished product, for convenience of recording, the positioning hole is marked as a first positioning hole 101 on the first semi-finished product, the die cutting depth is the total thickness of the raw material and the protective film 30, the diameter of the first positioning hole 101 is preferably 4mm, and after the first positioning hole 101 is die-cut, the bottom supporting low-adhesive glue 40 is taken away to take away waste materials generated by the first positioning hole 101 through die cutting.
And 4, compounding a new protective film 30 on the surface of the first semi-finished product, performing die cutting on the protective film corresponding to the 1 st section, the 1+ (e +1) th section, the 1+2 (e +1) th section, the 1+3 (e +1) th section … … and the 1+ (n-1) th section (e +1) of the first semi-finished product to be drawn away by a number 1, and then drawing the 1 st section, the 1+ (e +1) th section, the 1+2 (e +1) th section, the 1+3 (e +1) th section … … and the 1+ (n-1) th section (e +1) th section correspondingly and winding the protective film together to obtain a second semi-finished product.
And compounding a new protective film 30 on the surface of the remaining first semi-finished product, and performing die cutting on the corresponding protective film on the 2 nd section, the 2+ (e +1) section, the 2+2 (e +1) section, the 2+3 (e +1) section … … and the 2+ (n-1) section of the remaining first semi-finished product to be drawn away, so as to form a number 2, and drawing away the 2 nd section, the 2+ (e +1) section, the 2+2 (e +1) section, the 2+3 (e +1) section … … and the 2+ (n-1) section (e +1) and winding up the new protective film to obtain another second semi-finished product.
Repeating the above operations until only the (e +1) th section, the (e + 2) th section, the (e +1) th section, the (e + 3) th section … … and the (e +1) th section, the (n-1) th section, the (e +1) th section and the (e +1) th section are left on the first semi-finished product, and rolling the first semi-finished product and the protective film 30 which is compounded at the bottom in the step 3, and finally obtaining (e +1) second semi-finished products.
In this embodiment, since e is 2 and n is 8, 3 second semi-finished products are finally obtained, where the 3 second semi-finished products are the first second semi-finished product, the second semi-finished product, and the third second semi-finished product, respectively. The first and second semi-finished products comprise the 1 st, 4 th, 7 th, 10 th, 13 th, 16 th, 19 th and 22 th sections of the first semi-finished product, the second semi-finished product comprises the 2 nd, 5 th, 8 th, 11 th, 14 th, 17 th, 20 th and 23 th sections of the first semi-finished product, and the third semi-finished product comprises the 3 rd, 6 th, 9 th, 12 th, 15 th, 18 th, 21 st and 24 th sections of the first semi-finished product.
In addition, in order to facilitate positioning in subsequent processing, after a new protective film 30 is combined on the first semi-finished product each time, the bottom-supporting low-adhesive film 40 is placed at the same time on the bottom of the first semi-finished product, and then a plurality of new positioning holes are die-cut on the new protective film 30, in this embodiment, for convenience of description, the positioning holes are marked as second positioning holes 102 on the first semi-finished product, and the positioning holes are marked as third positioning holes 103 on the second semi-finished product, wherein the die-cutting depth of the second positioning holes 102 and the third positioning holes 103 is the total thickness of the first semi-finished product and the new protective film, the third semi-finished product can simultaneously include the first positioning holes 101, the second positioning holes 102 and the third positioning holes 103, and the diameter size of the second positioning holes 102 is preferably 2mm, and the diameter size of the third positioning holes 103 is preferably 3 mm. In addition, each time a locating hole is die-cut, the bottom-supporting low-adhesive glue 40 is taken away to take away waste materials generated by the die-cutting locating hole.
And 5, all the obtained second semi-finished products comprise protective films and raw materials, the protective films on the second semi-finished products are positioned below the raw materials, and the high-adhesive films 50 are compounded at the bottoms of the protective films of the second semi-finished products respectively to obtain third semi-finished products, so that in the embodiment, the first semi-finished product can correspondingly obtain a first third semi-finished product, the second semi-finished product can correspondingly obtain a second third semi-finished product, and the third semi-finished product can correspondingly obtain a third semi-finished product.
Step 6, performing die cutting on each third semi-finished product along the Y direction by using a plurality of die cutting dies arranged side by side, specifically in this embodiment, the first semi-finished product is subjected to die cutting along the Y direction by using a plurality of first die cutting dies arranged side by side, the second semi-finished product is subjected to die cutting along the Y direction by using a plurality of second die cutting dies arranged side by side, and the third semi-finished product is subjected to die cutting along the Y direction by using a plurality of third die cutting dies arranged side by side.
The first die cutting die 60, the second die cutting die 70 and the third die cutting die 80 are each provided with two cutting portions 601, a distance between the two cutting portions 601 is x0, that is, 3.4mm, and a distance between two adjacent die cutting dies is also x0, that is, 3.4 mm. The first die-cutting die 60, the second die-cutting die 70 and the third die-cutting die 80 are different mainly in that die positioning pins with different sizes and positions are arranged on the first die-cutting die 60, specifically, a first die positioning pin 61 matched with the size and position of a second positioning hole 102 is arranged on the first die-cutting die 60, a second die positioning pin 71 matched with the size and position of a third positioning hole 103 is arranged on the second die-cutting die 70, a third die positioning pin 81 matched with the size and position of a first positioning hole 101 is arranged on the third die-cutting die 80, when die-cutting is performed, the first die positioning pin 61 can be arranged in the second positioning hole 102 to facilitate the positioning of the first die-cutting die 60 on the first and third semi-finished products, the second die positioning pin 71 can be arranged in the third positioning hole 103 to facilitate the positioning of the second die-cutting die 70 on the second and third semi-finished products, the third die positioning pin 81 can be disposed in the first positioning hole 101 to facilitate the positioning of the third die-cutting die 80 during the die-cutting of the third semi-finished product, thereby ensuring the accuracy and efficiency of each die-cutting.
And the raw material and the protective film 30 between the two cutting portions 601 in the first die-cutting die 60 can be fixed by the first die-cutting die 60 after the die-cutting, and the first semi-finished product 200 composed of the raw material and the protective film fixed by the plurality of first die-cutting dies 60 and the first semi-finished product composed of the raw material and the protective film fixed by the highly adhesive film can be obtained from the first semi-finished product by separating the highly adhesive film 50 compounded by the first semi-finished product 60 so that the raw material and the protective film not fixed by the first die-cutting die 60 can be separated along with the highly adhesive film 50. And the die cutting depths of the first die-cutting die 60, the second die-cutting die 70 and the third die-cutting die 80 are all the total thickness of the raw material and the protective film.
And the raw material and the protective film 30 between the two cutting portions 601 in the second die-cutting mold 70 can be fixed by the second die-cutting mold 70 after the die-cutting, and the raw material and the protective film that are not fixed by the second die-cutting mold 70 can be separated along with the high-adhesive film 50 by separating the high-adhesive film 50 compounded by the second third semi-finished product, so that the second fourth semi-finished product 300 composed of the raw materials and the protective film fixed by the plurality of second die-cutting molds 70 and the fifth semi-finished product 400 composed of the raw materials and the protective film fixed by the high-adhesive film can be obtained from the second third semi-finished product.
And the raw material and the protective film 30 between the two cutting portions 601 in the third die-cutting die 80 can be fixed by the third die-cutting die 80 after the die-cutting, and the third semi-finished product 600 composed of the raw material and the protective film fixed by the high-viscosity film 50 and the third semi-finished product 500 can be obtained from the third semi-finished product by separating the high-viscosity film 50 compounded by the third semi-finished product so that the raw material and the protective film which are not fixed by the third die-cutting die 80 can be separated along with the high-viscosity film 50.
On the other hand, in order to facilitate the processing and positioning of the subsequent finishing, the first die-cutting die 60, the second die-cutting die 70 and the third die-cutting die 80 are further provided with hole die-cutting portions 602, so that when the first die-cutting die 60, the second die-cutting die 70 and the third die-cutting die 80 perform die-cutting, the hole die-cutting portions 602 can also cut the fourth positioning holes 104 on the first semi-finished product, the second semi-finished product and the third semi-finished product, the depth of the fourth positioning holes 104 can be such that the fourth positioning holes penetrate through the high adhesive film 50, and waste materials thereof can be directly removed.
And 7, respectively finishing the obtained first fourth semi-finished product 100, first fifth semi-finished product 200, second fourth semi-finished product 300, second fifth semi-finished product 400, third fourth semi-finished product 500 and third fifth semi-finished product 600.
The finish machining in the embodiment includes setting finish machining molds which can be respectively used for the first fourth semi-finished product 100, the first fifth semi-finished product 200, the second fourth semi-finished product 300, the second fifth semi-finished product 400, the third fourth semi-finished product 500 and the third fifth semi-finished product 600, specifically, the bottom supporting film 206, the release film 205, the second double faced adhesive 203 and the facial tissue 207 are sequentially compounded from bottom to top, then the facial tissue is punched by using a mold with a shape matched with an inner hole of the second double faced adhesive 203, the punching depth is through the bottom supporting film 206, waste materials are directly discharged and discarded, the second double faced adhesive semi-finished product is obtained by rolling, and the second double faced adhesive semi-finished product is arranged in the finish machining mold.
The finishing die is internally provided with a first finishing positioning hole 301, a second finishing positioning hole 302, a third finishing positioning hole 303 and a fourth finishing positioning hole 304 which are matched with the first positioning hole 101, the second positioning hole 102, the third positioning hole 103 and the fourth positioning hole 104 respectively in position and size, so that the finishing die is convenient to finish and use on the first fourth semi-finished product 100, the first fifth semi-finished product 200, the second fourth semi-finished product 300, the second fifth semi-finished product 400, the third fourth semi-finished product 500 and the third fifth semi-finished product 600 respectively. In addition, a fool-proof hole 305 and a material hole 306 of a material belt connected with the release film are also arranged in the finishing die.
The first finish machining positioning hole 301 and the first positioning hole 101 are positioned through the first positioning needle 1 on the first jig with the first positioning needle 1, the size and the setting position of the first positioning needle 1 are matched with the first finish machining positioning hole 301 and the first positioning hole 101, so that the third half-finished product 600 can be fixed with the finish machining mold through the first jig 11, and the second double-faced adhesive half-finished product is assembled on the raw material of the third half-finished product 600.
The second finish machining positioning hole 302 and the second positioning hole 102 are positioned through the second positioning pin 2 on the second jig 12 with the second positioning pin 2, and the size and the setting position of the second positioning pin 2 are matched with the first finish machining positioning hole 302 and the second positioning hole 102, so that the second fifth semi-finished product 400 can be fixed with the finish machining mold through the second jig 12, and the second double-faced adhesive semi-finished product is assembled on the raw material of the second fifth semi-finished product 400.
The third finish machining positioning hole 303 and the third positioning hole 103 are positioned by the third positioning pin 3 on the third jig 13 with the third positioning pin 3, and the size and the setting position of the third positioning pin 3 are matched with the third finish machining positioning hole 303 and the third positioning hole 103, so that the third fifth semi-finished product 200 can be fixed with the finish machining mold by the third jig 13, and the second double-faced adhesive semi-finished product is assembled on the raw material of the third fifth semi-finished product 200.
The fourth finish machining positioning hole 304 and the fourth positioning hole 104 are positioned by the fourth positioning pin 4 on the fourth jig 14 with the fourth positioning pin 4, so that the first fourth semi-finished product 100, the second fourth semi-finished product 300 and the third fourth semi-finished product 500 can be respectively fixed with the finish machining mold by the fourth jig 14, and the second double faced adhesive semi-finished product is respectively assembled on the raw materials of the first fourth semi-finished product 100, the second fourth semi-finished product 300 and the third fourth semi-finished product 500.
Thereafter, the protective films 30 on the first, fourth and third half- finished products 100, 300 and 500 on which the second double sided adhesive half-finished products are assembled are removed, and the protective films 30 and the high adhesive films 50 on the first, fifth and third half- finished products 200, 400 and 600 on which the second double sided adhesive half-finished products are assembled are removed.
Then, the prepared PC 204 and the first double faced adhesive 202 are respectively assembled on the first fourth semi-finished product 100, the first fifth semi-finished product 200, the second fourth semi-finished product 300, the second fifth semi-finished product 400, the third fourth semi-finished product 500 and the third fifth semi-finished product 600 which are assembled with the second double faced adhesive semi-finished product, and then, the sleeve cutting dies 90 are respectively used for sleeve cutting to obtain outer frames, the sleeve cutting depth can be the thickness of the product 20, and the sleeve waste materials can be taken away when the release film 205 and the carrier film 206 are removed, so that the finish machining is completed, and the product 20 is obtained.
Therefore, in this embodiment, the utilization rate of the raw material 10 is improved by 3 × 2 to 6 times, the utilization rate of the raw material 10 is greatly improved, the production cost is reduced, and the market competitiveness is improved.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.

Claims (8)

  1. An XY two-direction synchronous material-saving processing method is characterized by comprising the following steps:
    step 1, taking a raw material, wherein one raw material can be processed conventionally to obtain n rows of products, n is an integer not less than 1, the length of the product in the Y direction is a, the length of the product in the X direction is b, the conventional processing interval of two adjacent products in the Y direction on the raw material is c, the conventional processing interval in the X direction is d, and the unilateral processing allowance requirement t of the product is determined,
    step 2, calculating the allowable quantity e of the products which can be accommodated in the conventional processing interval of two adjacent products on the raw material in the Y direction according to the following first formula: e ═ c ÷ (a + t × 2) ] -1,
    the actual Y-direction machining interval Y0 is calculated according to the following second formula: y0 ═ c/(e +1),
    calculating the allowable row number f of the product on the raw material according to the following third formula: f ═ n (e +1),
    calculating an allowable number g of products that can be accommodated in a regular processing interval of two adjacent products in the X direction on the raw material according to the following fourth formula: g ═ d ÷ (b + t × 2) ] -1,
    the actual X-direction machining interval X0 is calculated according to the following fifth formula: x0 ═ d/(g +1),
    step 3, compounding a protective film at the bottom of the raw material, then cutting the raw material for f times along the X direction to cut the raw material into f sections, wherein the cutting depth is the thickness of the raw material, the interval between adjacent cutting cuts is y0, and obtaining a first semi-finished product,
    step 4, compounding a new protective film on the surface of the first semi-finished product, drawing the 1 st section, the 1 st plus (e +1) th section, the 1+2 th (e +1) th section, the 1+3 th (e +1) th section … … and the 1 st plus (n-1) th (e +1) th section, and winding the sections together with the new protective film to obtain a second semi-finished product;
    compounding a new protective film on the surface of the remaining first semi-finished product, drawing the 2 nd section, the 2+ (e +1) th section, the 2+2 (e +1) th section, the 2+3 (e +1) th section … … and the 2+ (n-1) th (e +1) th section from the remaining first semi-finished product, and winding the sections together with the new protective film to obtain another second semi-finished product;
    repeating the above operations until only the (e +1) th section, the (e + 2) th section, the (e +1) th section, the (e + 3) th section … … and the (e +1) th section, the (n-1) th section, the (e +1) th section and the (e +1) th section are left on the first semi-finished product, and rolling the first semi-finished product and the protective film which are positioned on the bottom composite, and finally obtaining (e +1) second semi-finished products,
    step 5, enabling the protective film on each second semi-finished product to be positioned below the raw material, and respectively compounding high adhesive films at the bottoms of the protective films of the second semi-finished products to obtain a third semi-finished product,
    step 6, carrying out die cutting on each third semi-finished product along the Y direction by using a plurality of die cutting dies, wherein each die cutting die is provided with two cutting parts, the distance between the two cutting parts is x0, the distance between two adjacent die cutting dies is x0, the raw material and the protective film between the two cutting parts in each die cutting die are fixed by the die cutting dies after the die cutting, the die cutting depth of each die cutting die is the total thickness of the protective film and the raw material, the high-viscosity film is separated, the raw material and the protective film which are not fixed by the die cutting dies are separated along with the high-viscosity film, and a fourth semi-finished product consisting of the raw material and the protective film which are fixed by the plurality of die cutting dies and a fifth semi-finished product consisting of the raw material and the protective film which are fixed by the high-viscosity film are obtained from each third semi-finished product,
    and 7, performing finish machining on the fourth semi-finished product to obtain a product, and performing finish machining on the fifth semi-finished product to obtain a product.
  2. 2. The XY two-way synchronous material-saving processing method according to claim 1, wherein the one-side process allowance requirement t of the product is not less than 0.3 mm.
  3. 3. The XY two-way synchronous material saving processing method according to claim 1, wherein in the step 3, a plurality of positioning holes are die-cut on the first semi-finished product, the depth of the positioning holes is the total thickness of the raw material and the protective film, and the interval between the adjacent positioning holes in the X direction is X0.
  4. 4. The XY two-way synchronous material-saving processing method according to claim 3, wherein in step 4, after each new protective film is laminated on the first semi-finished product, a plurality of new positioning holes are die-cut on the new protective film, the depth of the new positioning hole obtained by each die-cutting is the total thickness of the new protective film and the first semi-finished product, and the spacing between the positioning holes obtained by each die-cutting in the X direction is X0.
  5. 5. The XY two-directional synchronous material-saving processing method according to claim 3 or 4, wherein the bottom supporting low adhesive film is placed before the first semi-finished product is subjected to die cutting of the positioning hole, and the bottom supporting low adhesive film is removed after the die cutting of the positioning hole is finished.
  6. 6. The XY two-direction synchronous material-saving processing method according to claim 4, wherein the die cutting die is provided with a die positioning pin, and the die positioning pin is matched with the positioning hole.
  7. 7. The XY two-directional synchronous material-saving machining method according to claim 4, wherein the step 7 comprises configuring a finishing die, the finishing die comprising a plurality of finishing locating holes, and the finishing locating holes are matched with the locating holes.
  8. 8. The XY two-directional synchronous material-saving processing method according to claim 1, wherein in the step 4, after a new protective film is compounded on the first semi-finished product each time, a number is cut on the corresponding protective film on the first semi-finished product to be removed.
CN202210112448.7A 2022-01-29 2022-01-29 XY bidirectional synchronous material-saving processing method Active CN114536468B (en)

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CN112077936A (en) * 2020-09-10 2020-12-15 昆山尚为新材料有限公司 Asynchronous die cutting method for strip-shaped product and product
CN113733244A (en) * 2021-09-18 2021-12-03 苏州安洁科技股份有限公司 Material-saving method for die cutting of strip adhesive tape
WO2022016723A1 (en) * 2020-07-22 2022-01-27 太仓展新胶粘材料股份有限公司 Preparation method for optically clear adhesive (oca) having round hole with light-shading black edge, and die-cutting apparatus therefor
CN113977699A (en) * 2020-07-26 2022-01-28 昊佰电子科技（上海）有限公司 Punching method and punching device for square frame type foam product

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108858443A (en) * 2018-05-04 2018-11-23 深圳市佰瑞兴实业有限公司 Material reuses die-cutting process
CN109623944A (en) * 2018-10-29 2019-04-16 郑州领胜科技有限公司 A kind of universal flat bed die material-saving technique
CN109677089A (en) * 2019-01-25 2019-04-26 山东昶正智能科技有限公司 A kind of camera head protecting film, die-cutting production technique and device
CN211053875U (en) * 2019-09-16 2020-07-21 深圳市领略数控设备有限公司 Die-cutting opposite-inserting arrangement Y-direction pulling material-saving device
WO2022016723A1 (en) * 2020-07-22 2022-01-27 太仓展新胶粘材料股份有限公司 Preparation method for optically clear adhesive (oca) having round hole with light-shading black edge, and die-cutting apparatus therefor
CN113977699A (en) * 2020-07-26 2022-01-28 昊佰电子科技（上海）有限公司 Punching method and punching device for square frame type foam product
CN112077936A (en) * 2020-09-10 2020-12-15 昆山尚为新材料有限公司 Asynchronous die cutting method for strip-shaped product and product
CN113733244A (en) * 2021-09-18 2021-12-03 苏州安洁科技股份有限公司 Material-saving method for die cutting of strip adhesive tape

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