CN111231358A - Copper foil conductive adhesive tape multilayer material composite assembly and pasting process - Google Patents
Copper foil conductive adhesive tape multilayer material composite assembly and pasting process Download PDFInfo
- Publication number
- CN111231358A CN111231358A CN202010141239.6A CN202010141239A CN111231358A CN 111231358 A CN111231358 A CN 111231358A CN 202010141239 A CN202010141239 A CN 202010141239A CN 111231358 A CN111231358 A CN 111231358A
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- China
- Prior art keywords
- die
- copper foil
- protective film
- cut piece
- piece
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
- B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
- B29L2009/003—Layered products comprising a metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a composite assembly and pasting process of a copper foil conductive adhesive tape multilayer material, which comprises the following steps: preparing a square bottom protective film with a positioning hole for later use; preparing a die-cut piece A comprising a plurality of silica gel protective films and a release film conductive adhesive composite piece; preparing a die-cut piece B comprising a plurality of copper foil graphite composite pieces; preparing a die-cut piece C comprising a plurality of conductive films and a single-sided adhesive tape; and respectively and correspondingly laminating the die-cut piece A, the die-cut piece B and the die-cut piece C in sequence through the positioning holes to obtain a die-cut combined piece, and punching and forming the die-cut combined piece to obtain the copper foil conductive adhesive tape which can be applied to electronic products. According to the copper foil conductive adhesive tape multi-layer material composite assembly and pasting process, the bottom layer protective film is used as a carrier, assembly and pasting of a plurality of products are achieved at one time, the whole assembly and pasting process is mechanically operated, the positioning accuracy among the multi-layer materials is greatly improved, the stability of the products is guaranteed, the yield is improved, and the production cost is reduced.
Description
Technical Field
The invention relates to the technical field of conductive adhesive tape production, in particular to a copper foil conductive adhesive tape multi-layer material composite assembly and pasting process.
Background
The copper foil conductive adhesive tape is a metal adhesive tape, is widely applied to electronic products and plays a role in electromagnetic shielding. The copper foil conductive adhesive tape is generally formed by compounding multiple layers of materials, and generally comprises a silica gel protective film, a copper foil graphite composite part, a conductive adhesive sheet, a release film conductive adhesive composite part and a single-sided adhesive tape shown in figures 1-2.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a composite assembly and bonding process for a copper foil conductive adhesive tape and a multilayer material, which integrates the production process of a single material into the assembly and bonding of the multilayer material, can realize large-scale automatic production, and greatly improves the yield and the production efficiency of products.
In order to achieve the purpose, the invention adopts the following technical scheme:
a copper foil conductive tape multilayer material composite assembly process comprises the following steps:
step S1, performing die cutting and stamping and die punching molding on the multiple protective films to prepare multiple square bottom protective films with positioning holes at four corners for later use;
step S2, taking a first bottom layer protective film, respectively attaching a plurality of silica gel protective films and a corresponding number of release film conductive adhesive composite pieces to the same side of the first bottom layer protective film according to a set arrangement, and punching and forming to obtain a die-cut piece A; when the release film conductive adhesive composite piece is attached, one side of the release film is contacted with the first bottom layer protective film;
step S3, taking a second bottom layer protective film, attaching a plurality of copper foil graphite composite pieces to the second bottom layer protective film according to a set arrangement, and punching and forming to obtain a die-cut piece B;
step S4, taking a third bottom layer protective film, respectively pasting a plurality of conductive films and a corresponding number of single-sided adhesive tapes on the same side of the third bottom layer protective film according to a set arrangement, and punching and forming to obtain a die-cut piece C; when the single-sided adhesive tape is attached, the insulating surface of the single-sided adhesive tape is in contact with the third bottom layer protective film;
and S5, sequentially and correspondingly laminating the die-cut piece A, the die-cut piece B and the die-cut piece C through the positioning holes in the bottom protective film to obtain a die-cut combined piece, and performing die-cutting forming on the die-cut combined piece to obtain the copper foil conductive adhesive tape which can be applied to electronic products.
Further, the die-cut piece A, the die-cut piece B and the die-cut piece C can be prepared simultaneously.
Further, in step S3, the copper foil-graphite composite part includes two layers of copper foils and a graphite layer located between the two layers of copper foils, and the copper foils and the graphite layer are fixedly bonded through a conductive adhesive.
Furthermore, the number of the silica gel protective films on the first bottom protective film, the number of the copper foil graphite composite parts on the second bottom protective film and the number of the conductive adhesives on the third bottom protective film are the same.
Furthermore, the attaching shape of the single-sided adhesive tape and the conductive film on the third bottom layer protective film is the same as that of the copper foil graphite composite piece.
Compared with the prior art, the invention has the beneficial technical effects that: according to the copper foil conductive adhesive tape multilayer material composite assembly and pasting process, the traditional assembly and pasting mode is changed, the bottom layer protective film is used as a carrier, the assembly and pasting of a plurality of products are achieved at one time, the mechanical operation in the whole assembly and pasting process is achieved, the positioning accuracy among the multilayer materials is greatly improved, the stability of the products is guaranteed, the yield is improved, and the production cost is reduced.
Drawings
FIG. 1 is a schematic view of the front and back sides of a copper foil conductive tape;
FIG. 2 is a schematic view of the structure of each component material of the copper foil conductive tape;
FIG. 3 is a schematic diagram of a combined structure of a die-cut part A according to an embodiment of the invention;
FIG. 4 is a schematic diagram of a combined structure of a die-cut piece B in the embodiment of the invention;
FIG. 5 is a schematic diagram of a combined structure of a die-cut piece C according to an embodiment of the invention;
FIG. 6 is a schematic diagram of a die-cutting assembly according to an embodiment of the present invention.
In the figure: 1-silica gel protective film, 2-copper foil graphite composite part, 3-conductive film, 4-release film conductive adhesive composite part, 5-single-sided adhesive tape, 6-bottom layer protective film and 7-positioning hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
The technical scheme of the invention is further explained in detail by combining the drawings in the specification.
As shown in fig. 1, a composite assembly process of a copper foil conductive tape multi-layer material comprises the following steps:
step S1, performing die cutting and stamping and die punching molding on the multiple protective films to prepare multiple square bottom protective films with positioning holes at four corners for later use;
step S2, taking a first bottom layer protective film, respectively attaching a plurality of silica gel protective films and a corresponding number of release film conductive adhesive composite pieces to the same side of the first bottom layer protective film according to a set arrangement, and punching and forming to obtain a die-cut piece A shown in figure 3; as can be seen from fig. 2, the finished product of the copper foil conductive tape comprises one silica gel protective film and two release film conductive adhesive composite pieces, so that one silica gel protective film corresponds to two release film conductive adhesive composite pieces in one die-cut piece a, thereby ensuring full utilization of raw materials and reducing production cost; when the release film conductive adhesive composite piece is attached, one side of the release film is contacted with the first bottom layer protective film;
step S3, taking a second bottom layer protective film, attaching a plurality of copper foil graphite composite pieces to the second bottom layer protective film according to a set arrangement, and punching and forming to obtain a die-cut piece B shown in figure 4;
step S4, taking a third bottom layer protective film, respectively pasting a plurality of conductive films and a corresponding number of single-sided adhesive tapes on the same side of the third bottom layer protective film according to a set arrangement, and punching and forming to obtain a die-cut piece C shown in figure 5; as can be seen from fig. 2, the finished product of the copper foil conductive adhesive tape comprises a conductive film and two single-sided adhesive tapes, so that one conductive film corresponds to two single-sided adhesive tapes in one die-cut piece C; when the single-sided adhesive tape is attached, the insulating surface of the single-sided adhesive tape is in contact with the third bottom layer protective film;
step S5, positioning and attaching the die-cut piece A and the die-cut piece B through a positioning hole, removing a second bottom layer protective film on the die-cut piece B, then attaching the die-cut piece C to the die-cut piece B through the positioning hole to obtain a die-cut assembly shown in figure 6, and punching and forming the die-cut assembly to obtain the copper foil conductive adhesive tape which can be applied to electronic products;
the locating hole not only can accurately position each single material when cross cutting piece A, B, C final laminating, can also accurately position the bottom protection film on die-cut equipment at cross cutting piece A, B, C preparation in-process separately, makes each single material arrange accurately on corresponding bottom protection film, ensures follow-up group and pastes the quality, has effectively reduced the defective rate of product, has improved work efficiency.
The die-cutting piece A, the die-cutting piece B and the die-cutting piece C can be prepared simultaneously, the problem of low efficiency caused by sequential lamination of the traditional group pastes is solved, the working efficiency is greatly improved, and the production cost is reduced.
In step S3, the copper foil-graphite composite member includes two layers of copper foils and a graphite layer located between the two layers of copper foils, and the copper foils and the graphite layer are fixedly bonded by a conductive adhesive.
The number of the silica gel protective films on the first bottom protective film, the number of the copper foil graphite composite parts on the second bottom protective film and the number of the conductive adhesives on the third bottom protective film are the same, so that the single materials borne by the three bottom protective films can be assembled into a plurality of complete copper foil conductive adhesive tapes, and material waste is effectively prevented.
The shape of the single-sided adhesive tape and the conductive film attached to the third bottom layer protective film is the same as that of the copper foil graphite composite piece.
According to the copper foil conductive adhesive tape multilayer material composite assembly and pasting process, the traditional assembly and pasting mode is changed, the bottom layer protective film is used as a carrier, the assembly and pasting of a plurality of products are achieved at one time, the mechanical operation in the whole assembly and pasting process is achieved, the positioning accuracy among the multilayer materials is greatly improved, the stability of the products is guaranteed, the yield is improved, and the production cost is reduced.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (5)
1. The composite assembling and pasting process of the copper foil conductive adhesive tape multilayer material is characterized by comprising the following steps of:
step S1, performing die cutting and stamping and die punching molding on the multiple protective films to prepare multiple square bottom protective films with positioning holes at four corners for later use;
step S2, taking a first bottom layer protective film, respectively attaching a plurality of silica gel protective films and a corresponding number of release film conductive adhesive composite pieces to the same side of the first bottom layer protective film according to a set arrangement, and punching and forming to obtain a die-cut piece A; when the release film conductive adhesive composite piece is attached, one side of the release film is contacted with the first bottom layer protective film;
step S3, taking a second bottom layer protective film, attaching a plurality of copper foil graphite composite pieces to the second bottom layer protective film according to a set arrangement, and punching and forming to obtain a die-cut piece B;
step S4, taking a third bottom layer protective film, respectively pasting a plurality of conductive films and a corresponding number of single-sided adhesive tapes on the same side of the third bottom layer protective film according to a set arrangement, and punching and forming to obtain a die-cut piece C; when the single-sided adhesive tape is attached, the insulating surface of the single-sided adhesive tape is in contact with the third bottom layer protective film;
and S5, sequentially and correspondingly laminating the die-cut piece A, the die-cut piece B and the die-cut piece C through the positioning holes in the bottom protective film to obtain a die-cut combined piece, and performing die-cutting forming on the die-cut combined piece to obtain the copper foil conductive adhesive tape which can be applied to electronic products.
2. The process for composite assembly of the copper foil conductive tape multi-layer material according to claim 1, wherein the die-cut piece A, the die-cut piece B and the die-cut piece C are prepared simultaneously.
3. The process of claim 1, wherein in step S3, the copper foil-graphite composite member comprises two copper foils and a graphite layer disposed between the two copper foils, and the copper foils and the graphite layer are fixedly bonded to each other by the conductive adhesive.
4. The process for composite assembly and pasting of the copper foil conductive tape multi-layer material according to claim 1, wherein the number of the silica gel protective films on the first bottom protective film, the number of the copper foil graphite composite pieces on the second bottom protective film and the number of the conductive adhesives on the third bottom protective film are the same.
5. The process for laminating the copper foil conductive tape multi-layer material composite according to claim 1, wherein the shape of the single-sided tape and the conductive film on the third bottom protective film is the same as the shape of the copper foil graphite composite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010141239.6A CN111231358A (en) | 2020-03-04 | 2020-03-04 | Copper foil conductive adhesive tape multilayer material composite assembly and pasting process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010141239.6A CN111231358A (en) | 2020-03-04 | 2020-03-04 | Copper foil conductive adhesive tape multilayer material composite assembly and pasting process |
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| CN111231358A true CN111231358A (en) | 2020-06-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010141239.6A Pending CN111231358A (en) | 2020-03-04 | 2020-03-04 | Copper foil conductive adhesive tape multilayer material composite assembly and pasting process |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112848624A (en) * | 2020-12-17 | 2021-05-28 | 东莞六淳智能科技股份有限公司 | Conductive adhesive multilayer material assembling and pasting process |
| CN114479711A (en) * | 2022-03-24 | 2022-05-13 | 苏州益邦电子材料有限公司 | Dustproof buffering wave-absorbing material convenient to it is high-efficient synchronous attached and coil stock thereof |
| CN115260937A (en) * | 2022-07-21 | 2022-11-01 | 苏州伟铂瑞信电子科技有限公司 | Copper foil die-cutting processing method with anti-wrinkle function |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112848624A (en) * | 2020-12-17 | 2021-05-28 | 东莞六淳智能科技股份有限公司 | Conductive adhesive multilayer material assembling and pasting process |
| CN114479711A (en) * | 2022-03-24 | 2022-05-13 | 苏州益邦电子材料有限公司 | Dustproof buffering wave-absorbing material convenient to it is high-efficient synchronous attached and coil stock thereof |
| CN115260937A (en) * | 2022-07-21 | 2022-11-01 | 苏州伟铂瑞信电子科技有限公司 | Copper foil die-cutting processing method with anti-wrinkle function |
| CN115260937B (en) * | 2022-07-21 | 2023-12-05 | 苏州伟铂瑞信电子科技有限公司 | Copper foil die cutting processing method with anti-wrinkling function |
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Application publication date: 20200605 |