JPH10203064A - Film carrier tape and carrying device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film carrier tape for positioning automatically and accurately the processing position including the initial processing position of a module by a simple process and also providing a carrier device for positioning accurately by the simple constitution of a device using the film carrier tape. SOLUTION: A film carrier tape 1 is provided with a plurality of IC chips 13 on module-cutting out areas 3 in the length direction and used for manufacturing IC modules to be cutout at every module-cutting out area and built in an IC card, and positioning holes 4 are formed on the given positions other than the module-cutting out areas 3 at the ratio of one hole or more on one module- cutting out area 3 or on a line of module-cutting out areas 3 in the width direction of the film carrier tape 1. The positioning holes 4 are sensed by a photosensor of the carrying device to stop the carrying operation on the given processing position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a film carrier tape for manufacturing an IC module built in an IC card and a device for transporting the film carrier tape.

[0002]

2. Description of the Related Art In an IC card having external connection terminals, for example, an IC card conforming to ISO, eight terminals C1 to C8 are defined on the front surface or the back surface of the card as shown in FIG. There is an IC card having such terminals in a form composed of an IC module 10 and a card base 20 having an IC module concave portion 21 in which the IC module 10 is mounted.

In the IC module 10, for example, as shown in FIG. 5, the above eight external connection terminals 12 formed by patterning a copper foil or the like are formed on the front surface of a module substrate 11,
An IC chip 13 is provided at a substantially central portion
The IC chip 13 and the external connection terminals 12 are connected by wire bonding 15 through bonding holes 14 formed in the module substrate 11. The IC chip 13 and the wires 15 are protected by a sealing resin 16 such as an epoxy resin.

[0004] As shown in FIG. 4, such an IC module is bonded to an IC module concave portion 21 formed in the card base 3 using an adhesive to manufacture an IC card having the external connection terminals 12. Such an IC module 1
No. 0 is usually manufactured using a film carrier tape 100 as shown in FIG. 6 and in a process as shown in FIG. That is, a substrate film 11 of polyimide, glass epoxy, etc.
, A sprocket hole 101 and a bonding hole (not shown) are punched, a copper foil is laminated on the front surface, the copper foil is patterned by a photoresist, and further plated with gold or the like to produce a film carrier tape 100. Is done. Then, an IC chip is bonded (die-bonded) to the module removal area 102 of the film carrier tape, and wire bonding is performed.
After resin encapsulation, it is inspected and punched and manufactured for each IC module.

[0005] In each of the die bonding, wire bonding, resin sealing, and punching steps, it is necessary to accurately position the film carrier tape 100, and the following positioning method is usually employed. The sprocket roller is driven to rotate by a stepping motor, a servo motor, or a normal DC or AC motor, and the sprocket roller is inserted into the sprocket hole 101 to feed the sprocket roller a fixed distance. This sprocket hole 101 is a normal COT
(Chip On Tape) Square holes for feeding the sprockets at both ends, which are opened at equal pitch (4.75 mm). There are various standards for this specification, but there are substantial industry standards. Depending on the size of the module, one or more modules are arranged in parallel in the width direction, and two or three sprocket holes are usually arranged in the flow direction in a module pitch. Therefore, by sending a certain number of sprockets, it is possible to stop at a predetermined position for each predetermined IC module without detecting or correcting the position of the module.

A sprocket or a nip roller is rotated by a stepping motor or a servo motor or a normal DC or AC motor, and at the same time, a sprocket hole is detected by a transmission type or reflection type photoelectric sensor, and the number of passages of the sprocket hole is counted to a predetermined value. Count,
For example, if there are three module pitches, three passes,
Stop at the edge of the hole. In combination with or, after rotating the sprocket roller for a fixed distance until immediately before two or three sprockets, continue rotating at low speed and stop the third sprocket hole at the edge of the hole detected by the sensor. It is also possible.

[0007] The sprocket or nip roller is rotated by a stepping motor or a servo motor or an ordinary DC or AC motor, and at the same time, the module pattern and other characteristic points are detected by an optical sensor such as a CCD camera, and the amount of displacement is corrected. Either shift the tape position or shift the processing position by software.

[0008]

However, in the above method, since there is no correction, if the count of the number of pulses is erroneously counted depending on the set value of the motor pulse or due to some noise on the circuit of the pulse encoder. The difference between the theoretical feed amount and the actual feed amount accumulates and may gradually deviate from the allowable range.In addition, the intended position requires another means such as setting by a human, There is a problem that work cannot be automated.

[0009] Similarly, in the method described above, it is still necessary for a human to set an intended position. If the sensor cannot read one sprocket hole for some reason, the sprocket hole is machined with a long shift. There is also a risk that they will be lost. This is because all the sprocket holes have the same shape and it is not known where the sprocket holes represent the reference position for processing.

[0010] The most effective of these is that it is easy to automatically specify the desired position of the processing and to correct the feed each time by the pattern extraction technique. However, expensive cameras and image processing apparatuses, There are many disadvantages, such as the necessity of processing software, and the necessity of switching the setting of the reference pattern when changing the layout of the board, such as switching of items.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a film carrier tape capable of automatically and accurately positioning a processing position including an initial processing position of a module by a simple process, and a simple method using the film carrier tape. It is an object of the present invention to provide a transfer device capable of accurately positioning with a simple device configuration.

[0012]

In order to achieve the above object, a film carrier tape according to the present invention has a plurality of IC chips mounted in a module cutout area in a length direction and cuts out for each module cutout area. I built in
A film carrier tape for manufacturing a C module, wherein one or more positioning holes are formed at predetermined positions outside the module removal region with respect to one or one row of module removal regions in the width direction of the film carrier tape. It is characterized by having been done.

In order to achieve the above object, the transport device of the present invention has one or more positioning holes in the film width direction or one or more positioning holes per row in the film width direction. Using a film carrier tape formed at a predetermined position outside the module removal area,
Conveying means for running the film carrier tape, light emitting means for projecting light to the positioning holes of the film carrier tape, and light receiving means for receiving light reflected from the positioning holes or transmitted through the positioning holes. ,
Control means for controlling the transport means based on the amount of light received by the light receiving means to stop the film carrier tape at a predetermined position.

In the film carrier tape of the present invention, in addition to a conventional hole such as a sprocket hole, a module removal area in which positioning holes are one or one row of IC chip mounting areas in the width direction of the film carrier tape. Are provided at predetermined positions.

When the transport device according to the present invention is used by using such a film carrier tape, the light from the light emitting means is transmitted or reflected to the positioning hole, and the transmitted or reflected light is received by the light receiving device. The running of the film carrier tape is controlled by the control means based on the amount of light received by the light receiving means, and the film carrier tape can be stopped at a predetermined processing position.

In the film carrier tape of the present invention, since at least one positioning hole is provided in one or a row of module removal areas in the film width direction,
The initial processing position of the module at the tip can be automatically and accurately positioned. Since the positioning hole can be punched in the same process as the sprocket hole, accurate position accuracy is guaranteed, and accurate module positioning can be performed each time. Moreover, there is no need to detect any other information, and a simple device configuration in which one photoelectric sensor is installed,
It can be realized by software.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below, but the present invention is not limited to the following embodiments. FIG. 1 is a plan view showing one embodiment of the film carrier tape of the present invention. In this film carrier tape 1, sprocket holes 2 for transporting the film are formed by punching at both ends in the width direction of a substrate film (module substrate) 11 made of, for example, polyimide, glass epoxy, or the like. This film carrier tape 1 has a structure in which two module removal areas 3 for mounting IC chips are arranged in parallel in the width direction. A square hole positioning hole 4 used to stop the film 1 at a predetermined position is provided between a pair of module removal regions 3 at a central portion in the film width direction for each of a pair of module removal regions 3 in the film width direction. One is drilled in the same punching process as the sprocket punching. Two sides of the square hole of the positioning hole are formed parallel to the width direction of the film carrier tape 1. This film carrier tape 1 is provided with three sprocket holes 2 per pair of parallel chips. Therefore,
One positioning hole 4 is also provided for every three sprocket holes 2.

Although not shown, eight bonding holes penetrating the substrate film 11 are formed in the module punching area 3 by the same punching process as the sprocket hole 2. As described above, for example, a copper foil is laminated on the front side of the film carrier tape 1 and then patterned by lithography to form the external connection terminals 12 (FIG. 5). Thereafter, a gold plating process is performed. Then, as shown in FIG. 5, the IC chip 13 is bonded to the module removal area 3 with an adhesive,
The chip 13 and the external connection terminal 12 are connected by wire bonding 15 through the bonding hole 14 and
The C chip 13 and the bonding wires 15 are sealed with a resin such as epoxy resin, and the module removal area 3 is punched.
From the film carrier tape 1 to obtain an IC module.

In the above steps, the film carrier tape 1 must be accurately positioned in each of the steps of die bonding, wire bonding, resin sealing, and punching. Since the film carrier tape 1 of the present invention is provided with the positioning holes 4, the positioning can be easily performed.

Next, a description will be given, with reference to FIG. 2, of a transporting device for positioning at a predetermined processing position using such a film carrier tape. FIG. 2 is a schematic diagram showing the configuration of the film carrier tape transport device according to the present invention. The transport device 30 includes a transport unit 31 such as a sprocket or a nip roller for transporting the film carrier tape 1, a driving unit 32 such as a step motor or a servo motor for driving the transport unit 31, and a positioning device for the film carrier tape 1. A light emitting means 33 for projecting light toward the hole 4, a light receiving means 34 for receiving light emitted from the light emitting means 33 and passing through the positioning hole 4 of the film carrier tape 1, and a light receiving amount received by the light receiving means 34. Control means 3 for controlling the driving means 32 based on the
5 is provided.

The transport device 30 causes the transport means 31 to feed the film carrier tape 1 from a reel (not shown) at a predetermined speed and to run the same. At the same time, light is emitted from the light emitting means 33 toward the center in the width direction of the film carrier tape 1. I do. When the positioning hole 4 comes to a position where the light from the light emitting unit 33 is received, a part of the irradiation light passes through the positioning hole 34 and reaches the light receiving unit 34. Light receiving means 3
The signal of the amount of received light from 4 is sent to control means 35, which detects whether or not positioning hole 4 has reached a predetermined position based on the received light signal. Specifically, for example, by comparing a set predetermined threshold value and a light receiving signal,
If the received light signal exceeds a predetermined threshold value or falls below a predetermined threshold value, the positioning hole 4
Is determined to be at a predetermined position. When it is determined that the positioning hole 4 is at a predetermined position, the driving unit 32 is controlled to stop the running of the film carrier tape 1.

Since the positioning holes 4 of the film carrier tape 1 as described above are punched in the same process as the sprocket holes 2 and the bonding holes,
Accurate position accuracy is guaranteed. Since the two sides of the quadrangular positioning hole 4 are parallel to the width direction of the film carrier tape, by detecting a steep rise or fall of the amount of received light due to the side (edge) of the positioning hole, The positioning of the module position for each module becomes possible. In addition, since the edges of the positioning holes 4 are parallel to the width direction of the tape, the film carrier tape 1 runs slightly meandering in the width direction or slightly between the sprocket hole 2 and the sprocket. , And even if the relative position between the film carrier tape 1 and the sensor 34 is slightly shifted in the tape width direction, the positional accuracy is not affected.

From such a viewpoint, the form of the positioning hole is not limited to the quadrilateral as described above. As shown in FIG. 3, a triangle shown in FIG. 3A, a rectangle shown in FIG. A shape such as a race track shape or a notched circle shape shown in FIG. In this case, it is preferable that there is at least one straight side parallel to the width direction of the film carrier tape 1 for the above reason. As for the length of this straight piece, the play of the sprocket hole and the sprocket is about 0.05 mm, the sprocket hole position accuracy with respect to the tape is about 0.05 mm,
By setting the thickness to 0.2 mm or more in consideration of the deflection of the tape and the like, it is possible to secure positional accuracy with respect to meandering and play of the sprocket. If the length of the straight piece is too long, the tape may be cracked at the time of module punching, resulting in poor punching.
m is preferable.

Even if the detection of the positioning hole fails, if the feed distance and time can be calculated, an error or a redo command can be issued by software. In the worst case, one positioning hole is skipped. Since it is possible to stop at the next positioning hole, there is no possibility that the processing will proceed with the displacement, and it is possible to prevent the defective product from being mixed.

Therefore, the positioning hole 4 formed in the film carrier tape 1 and the photoelectric sensors 33 and 34 for detecting the hole can be obtained without using an expensive optical sensor, image processing device, and image processing software. Just by attaching the control device 35, accurate positioning of the tape can be performed, and as a result, product quality and yield can be improved, and automation of the device can be facilitated.

It is to be noted that a so-called lead cut hole is formed in the existing film carrier tape, and this may be used also as a positioning hole. However, this lead cut hole, after copper foil lamination,
After etching to a predetermined pattern, nickel plating and gold plating are cut out of the wiring connecting each module to form a module carrier and electrically separated from each other. Has poor position accuracy with respect to the sprocket hole, and it is impossible to use this as a positioning hole.

In the above embodiment, the transmitted light through the optical sensor arrangement determining hole is measured, but the reflected light may be measured. In this case, the light receiving device is installed on the same side as the light irradiation device. Further, the positioning hole is not limited to the center in the width direction of the film carrier tape, and can be formed at a portion outside the module removal region that does not affect the manufacture of the module.

Further, the light emitting means is provided with a condensing lens 33a, and the light projected from the light emitting means is focused on the positioning hole, so that the rising or falling of the received light amount can be made steeper.

[0029]

The film carrier tape of the present invention can be reliably positioned with a simple device configuration. Further, the transfer device of the present invention can reliably perform the positioning required for the steps of IC chip bonding, wire bonding, resin sealing, and the like using the film carrier tape with a simple device configuration.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a film carrier tape of the present invention.

FIG. 2 is a configuration diagram showing a device configuration of a transport device according to the present invention.

FIGS. 3A to 3D are conceptual views showing various forms of positioning holes provided in the film carrier tape of the present invention.

FIG. 4 is a perspective view showing a configuration of one embodiment of an IC card according to the present invention.

FIG. 5 is a cross-sectional view showing one embodiment of an IC module used for the IC card according to the present invention.

FIG. 6 is a plan view showing one form of a conventional film carrier tape.

FIG. 7 is a flowchart showing a manufacturing process of an IC module for an IC card.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Film carrier tape, 2 ... Sprocket hole, 3 ... Module removal area, 4 ... Positioning hole,
DESCRIPTION OF SYMBOLS 11 ... Substrate film (module board), 12 ... External electrode, 13 ... IC chip, 16 ... Sealing resin, 31 ... Conveying means, 32 ... Drive means, 33 ... Light emitting means, 34 ... Light receiving means, 35 ... Control means

Claims (5)

[Claims] 1. A film carrier tape for manufacturing an IC module built in an IC card by mounting a plurality of IC chips in a module cutting area in a length direction and cutting out each module cutting area. A film carrier tape characterized in that at least one positioning hole is formed at a predetermined position outside the module removal area with respect to one or one row of module removal areas in the tape width direction. 2. The film carrier tape according to claim 1, wherein the positioning holes have sides parallel to the width direction of the film carrier tape. 3. The film carrier tape according to claim 1, wherein the positioning holes are formed simultaneously with sprocket holes of the film carrier tape. 4. An IC chip is mounted on the back side, and external connection terminals formed on the front side are connected to the IC chip by bonding through bonding holes penetrating a film carrier. 2. The film carrier tape according to claim 1, wherein an IC module having a structure sealed by the method is manufactured. 5. A film in which one or more positioning holes are formed at predetermined positions outside the IC module removal region in the width direction of the module in which one or more module removal regions on which the IC chip is mounted are mounted in one row or in one row. Using a carrier tape, conveying means for running the film carrier tape, light emitting means for projecting light to the positioning hole of the film carrier tape, and light reflected from the positioning hole or transmitted through the positioning hole. A film carrier comprising: light receiving means for receiving light; and control means for controlling the transport means based on the amount of light received by the light receiving means to stop the film carrier tape at a predetermined position. Tape transport device.