JP3502203B2 - Electronic component punching device and punching method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component punching apparatus and a punching method for punching a film carrier to which a chip is bonded to obtain an electronic component.

[0002]

2. Description of the Related Art As a method of manufacturing electronic parts, a film carrier to which chips are bonded at a pitch is carried by a carrying means such as a sprocket and punched by a punching part provided in a carrying path to produce electronic parts. It is known how to get.

In this case, it is necessary to punch the film carrier after accurately aligning it with the punching portion. For this reason, conventionally, a light-emitting element and a light-receiving element are incorporated in the upper die and the lower die, respectively, which form the punching section, and the light-emitting element and the light-receiving element form pin holes punched at a small pitch in the film carrier. The position was detected and aligned with the punching portion of the film carrier.

[0004]

However, in the conventional means, since the light emitting element and the light receiving element and the electric wiring thereof have to be incorporated inside the upper mold and the lower mold, the structure of the punching part becomes complicated. There was a problem.

In the conventional means, the light emitting element and the light receiving element detect the pin holes punched in the film carrier at a small pitch. In this case, it is unclear which pin hole is detected. Even if a wrong pin hole is detected, it is erroneously recognized as a correct pin hole, and as a result, the punching position of the film carrier is greatly deviated.

Therefore, it is an object of the present invention to provide an electronic component punching apparatus and a punching method capable of properly punching a film carrier to obtain an electronic component.

[0007]

To this end, the present invention provides a plurality of electronic parts in which chips are bonded at a pitch.
One of the plurality of electronic components , a conveying means for feeding a film carrier, in which the products are provided at a pitch, by pitch.
And a punching section for punching one from the film carrier to obtain an electronic component, and a punching section of the plurality of electronic components at the punching section.
A detecting means for detecting a positional deviation in the conveying direction of the electronic components of the plurality of pitches upstream of the electronic component wither, the detecting means of the electronic components present in the section up to the punching position by the punching recessed portions from the position displacement detection position A film that includes a memory that stores the positional deviation detected by the sensor, and a control unit that reads the positional deviation of the electronic component that has reached the punching position from the memory and controls the transport unit to correct the positional deviation. When the carrier is sent by one pitch, the memory storing the positional deviation of each chip is updated.

Further, while feeding the film carrier in which the chips are bonded at a pitch and a plurality of electronic parts are provided at a pitch toward the punching section by the conveying means, the film carrier at the upstream side of the punching section is formed. a step of detecting the positional deviation in the conveying direction of the electronic component storing the positional deviation in the memory by the detection means provided in the positional deviation detection position, the transportable
Displacement by the detection means due to pitch feeding by the feeding means
When the detected electronic component reaches the punching position by the punching unit, the position of the subsequent electronic component that reaches the detection position is detected.
Detect misalignment and store it in the memory,
The step of reading the positional deviation of the electronic component located in the punching section, correcting the positional deviation by the conveying means, and punching the electronic section by the punching section to obtain the electronic component, the film carrier is fed by one pitch. Then, the memory that stores the displacement of each chip is updated.

[0009]

According to the above structure, the position of the electronic component can be detected at a position upstream of the punching portion, and the film carrier can be accurately punched based on the detection result to obtain the electronic component.

[0010]

Embodiments of the present invention will now be described with reference to the drawings. 1 is an overall configuration diagram of an electronic component punching system according to an embodiment of the present invention, FIG. 2 is a plan view of the film carrier, FIG. 3 is a partially enlarged plan view of the film carrier, and FIG. 4 is a punching of the electronic component. FIG. 5 and FIG. 6 are flowcharts of the punching operation of the electronic component.

First, the overall structure of the punching system for the film carrier will be described. In FIG. 1, reference numeral 1 is a film carrier, and chips are bonded on the upper surface thereof with a pitch P. The film carrier 1 is made of polyimide resin or the like.

The film carrier 1 includes a sprocket 1
Pitch feed in a horizontal position by 1 and 12 and reel 1
It is wound up in 4. Reference numeral 13 is a first motor for rotating the sprocket 12, and includes the sprockets 11, 12 and the first motor.
The motor 13 constitutes a conveying means of the film carrier 1.

Next, the structure of the film carrier 1 will be described. 2 and 3, pin holes 3 are punched on both sides of the film carrier 1 at a small pitch. The sprockets 11 and 12 have their pins engaged with the pin holes 3 to feed the film carrier 1 at a pitch. An electronic component 4 is punched by a punching portion (described later), and is composed of a chip 2 and leads 5 and 6 wired on both sides of the chip 2 at a narrow pitch. The first alignment mark M1 (hereinafter,
A first mark) and a second alignment mark M2 (hereinafter referred to as the second mark) are formed in a cross shape. As will be described later, the first mark M1 and the second mark M2 are observed by a camera to detect the positional deviation of the electronic component 4.

In FIG. 1, 20 is a punching portion of the film carrier. This punching section 20 is a film carrier 1
It is composed of an upper mold 21 and a lower mold 22 which are arranged so as to be sandwiched from above and below, and the film carrier 1 is punched by causing the upper mold 21 to move up and down by a cylinder 23. In FIG. 2, the broken line indicates the position of the punching section 20, and 7 indicates the punching hole formed in the film carrier 1 by punching the electronic component 4 in the punching section 20.

In FIG. 1, a camera 30 is provided below the film carrier 1 upstream of the punching section 20. The camera 30 is held by a bracket 31. The bracket 31 is coupled to the nut 32, and the nut 32 is screwed to the feed screw 33. A second motor 34 rotates the feed screw 33. Bracket 3
A slider 35 is provided on the back surface of 1. The slider 35 is fitted on a guide rail in the same direction as the feed screw 33. The guide rail 36 is attached to a bracket 37, and a nut 38 is coupled to the lower surface of the bracket 37. A feed screw 39 is screwed onto the nut 38. 40 is a third motor for rotating the feed screw 39.

When the second motor 34 is driven to rotate the feed screw 33, the nut 32 moves along the feed screw 33 and the camera 30 moves in the width direction of the film carrier 1. When the third motor 40 drives and the feed screw 39 rotates, the nut 38 and the bracket 37 move in the longitudinal direction of the film carrier 1, and the camera 30 also moves in the same direction. By moving the camera 30 in the horizontal direction in this manner, the first mark M1 and the second mark M2 are captured in the visual field of the camera 30.

Next, the control system will be described. 41 is a motor drive circuit, which includes a first motor 13, a second motor 34, and a third motor
The motor 40 is driven. A recognition unit 42 is connected to the camera 30. The motor drive path 41 and the recognition unit 42 are connected to a CPU 43 that controls the entire apparatus. 44 is C
The storage unit is connected to the PU 43 and stores necessary data. 44 a is a memory of the storage unit 44.

An input / output control unit 45 is connected to a cylinder drive circuit 46, a start switch 47 for starting the operation, and a notification unit 48. The cylinder drive circuit 46 drives the cylinder 23 of the punching section 20. The notification unit 48 of the present embodiment is a buzzer and provides the operator with necessary notification.

The electronic component punching system is configured as described above, and the overall operation will be described with reference to the process chart of FIG. 4 and the flowchart of FIG. A of FIG.
Is the initial state. In this state, the first chip 4a
Is in the punching section 20. There are four electronic components 4a, 4b, 4c, 4d in the section between the camera 30 and the punching section 20, and electronic components of 4e or less follow. In FIG. 4A, P is a distance of the ideal pitch of the electronic component 4. When the start switch 47 is turned on, the program operates (step 1 in FIG. 5). Then, the film carrier 1 is reversely fed and the first electronic component 4a moves to the visual field of the camera 30 (B in FIG. 4 and step 2 in FIG. 5). Therefore, the first electronic component 4 by the camera 30
The position shift a of a is detected, and the memory H [3] of the storage unit 44 is detected.
(Step 3).

Next, the film carrier 1 is fed toward the punching section 20 by one pitch (distance P) (C in FIG. 4 and step 4). Then, in step 5, the memory is updated, and a previously stored in the memory H [3] is transferred to the memory H [2]. Along with this, the second electronic component 4
The displacement b of b is detected by the camera 30, and the memory H
It is stored in [3].

In the same manner, the film carrier 1 is pitch-fed, the position deviation 4c of the third electronic component 4c is detected, and H is stored in each memory.

[0] = a, H [1] = b, H
It is stored as [2] = c (D in FIG. 4 and step 5).

When the first electronic component 4a reaches the punching position (step 6), the positional deviation d of the fourth electronic component 4d is detected and stored in the memory [i] (step 7). ). Then, in step 8, the memory H

This positional deviation a is corrected by reading the positional deviation a of the first electronic component 4a stored in [0] and driving the first motor 13 to move the film carrier 1 in its longitudinal direction. , The electronic component 4a is punched (E in FIG. 4 and step 9). If the first electronic component 4a is punched out as described above, the distance (P) obtained by adding the correction (-a) in the opposite direction to the correction (correction amount + a) previously added to the distance P for one pitch is obtained. The film carrier 1 is pitch-fed by (-a) (step 10), and the value of the memory is updated at the same time (step 11). The above operation is repeated until the end of production.

[0023]

According to the present invention, even if the pitch of the electronic parts of the film carrier varies, the positional deviation can be corrected and the electronic parts can be punched correctly in the punching section to obtain the electronic parts. And in this case, the film carrier
Stores the misalignment of each chip when sent one pitch
The memory of the film is updated.
Each chip bonded to the rear with a pitch
Correct the misalignment of the
Can be pulled out. Further, since the camera for recognizing the positional deviation of the electronic parts is provided upstream of the punching section, separately from the punching section, the punching section can be provided more easily than the conventional punching section incorporating a light emitting element or a light receiving element. The structure can be simplified.

[Brief description of drawings]

FIG. 1 is an overall configuration diagram of an electronic component punching system according to an embodiment of the present invention.

FIG. 2 is a plan view of a film carrier according to an embodiment of the present invention.

FIG. 3 is a partially enlarged plan view of a film carrier according to an embodiment of the present invention.

FIG. 4 is a punching process diagram of an electronic component according to an embodiment of the present invention.

FIG. 5 is a flowchart of a punching operation of an electronic component according to an embodiment of the present invention.

FIG. 6 is a flowchart of a punching operation of an electronic component according to an embodiment of the present invention.

[Explanation of symbols]

1 film carrier 2 chips 4 electronic components 11, 12 sprockets 13 First motor 20 punching section 30 cameras 34 Second motor 40 Third motor

─────────────────────────────────────────────────── ───Continued from the front page (56) References JP-A-1-277226 (JP, A) JP-A-2-218536 (JP, A) JP-A-6-326157 (JP, A) Actual development Sho-61- 187697 (JP, U) Actual flat 7-31299 (JP, U) Actual flat 5-24254 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) B26F 1/38 B26D 7 / 01 H01L 21/60

Claims (2)

(57) [Claims] 1. Chips are bonded at a pitch.
Conveying means for feeding pitch of the film carrier which is provided at a pitch multiple electronic components Te, the plurality of electronic
A punching section for punching one of the components from the film carrier to obtain an electronic component; and a front portion of the plurality of electronic components.
A detecting means for detecting a positional deviation in the conveying direction of the electronic components of the plurality of pitches upstream of the electronic component to be punched in serial punching recessed portions,
A memory for storing the positional deviation detected by the detection means of the electronic component existing in the section from the positional deviation detection position to the punching position by the punching unit and the positional deviation of the electronic component reaching the punching position are stored. And a control unit that controls the transport unit so as to correct the positional deviation by reading from the memory, and when the film carrier is fed by one pitch,
A punching device for electronic parts, characterized in that the memory for storing the displacement of each chip is updated. 2. Chips are bonded at a pitch.
While feeding the film carrier in which a plurality of electronic components are provided at a pitch to the punching section by the conveying means, the electronic means is detected by the detecting means provided at the position shift detection position upstream of the punching section. and storing the positional deviation in the memory by detecting the positional deviation in the conveying direction of the components, the conveyance hand
Positional deviation can be detected by the detection means by pitch feed by steps.
When the ejected electronic component reaches the punching position by the punching unit, the position of the subsequent electronic component that reaches the detection position is not adjusted.
By detecting the record stored in said memory, said from said memory
The step of reading the positional deviation of the electronic component located in the punching section, correcting the positional deviation by the conveying means, and punching the electronic section in the punching section to obtain the electronic component, the film carrier is fed by one pitch. And a method for punching an electronic component, characterized in that the memory storing the displacement of each chip is updated.