JP3232980B2 - How to punch electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for punching an electronic component to obtain an electronic component by punching a film carrier to which a chip is bonded.

[0002]

2. Description of the Related Art As a method of manufacturing an electronic component, a film carrier on which chips are bonded at a pitch is conveyed by a conveyer such as a sprocket, and is punched by a punching section provided on a conveying path. Is known.

In this case, it is necessary to perform punching after accurately aligning the film carrier with the punching section. For this reason, conventionally, the light emitting element and the light receiving element are respectively incorporated in the upper mold and the lower mold that constitute the punching part, and the light emitting element and the light receiving element form a pin hole formed at a small pitch in the film carrier. Upon detection, the film carrier is aligned with the punched portion.

[0004]

However, in the conventional means, since the light emitting element, the light receiving element, and the electric wiring thereof must be incorporated in the upper mold and the lower mold, the structure of the punching portion is complicated. There was a problem.

[0005] In the conventional means, a pin hole drilled at a small pitch in a film carrier is detected by a light emitting element and a light receiving element. In this case, it is unclear which pin hole was detected. Even when a different pin hole is detected, it is erroneously recognized that a correct pin hole has been detected, and as a result, there has been a problem that the punching position of the film carrier is greatly changed.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for punching an electronic component that can obtain an electronic component by correctly punching a film carrier.

[0007]

For this purpose, the present invention relates to an electronic component in which a chip is punched by a punching section to obtain an electronic component while a film carrier having chips bonded at a pitch is fed by a conveying means at a pitch. In the punching method, a characteristic portion of the electronic component is observed by a camera provided upstream of the punching unit, and a displacement of the electronic component in a transport direction of the transport unit is detected. The position shift is corrected by adjusting the feed amount of the film carrier by the transfer means based on the position shift, and the punching unit punches.

The characteristic portion is a positioning mark formed on the electronic component, and the positioning mark is observed by the camera to detect the position shift. Also, there are a plurality of the alignment marks, and the first
If the observation of the second alignment mark is unsuccessful, the second
Observe the second alignment mark. If all of the plurality of alignment marks have not been successfully observed by the camera, the notification unit notifies the user of the failure.

[0009]

According to the above construction, the position of the electronic component is detected at a position upstream of the punching portion, and the electronic component can be obtained by accurately punching the film carrier based on the detection result.

[0010]

Next, embodiments of the present invention will be described with reference to the drawings. 1 is an overall configuration diagram of an electronic component punching system according to an embodiment of the present invention, FIG. 2 is a plan view of the film carrier, FIG. 3 is a partially enlarged plan view of the film carrier, and FIG. It is a flowchart of an operation.

First, the overall configuration of the film carrier punching system will be described. In FIG. 1, reference numeral 1 denotes a film carrier on which chips are bonded at a pitch P. The film carrier 1 is made of a polyimide resin or the like.

The film carrier 1 includes a sprocket 1
The pitch is fed in a horizontal position by reels 1 and 12, and reel 1
4 Reference numeral 13 denotes a first motor for rotating the sprocket 12, and the sprockets 11, 12 and the first motor
The motor 13 constitutes a transport unit for the film carrier 1.

Next, the structure of the film carrier 1 will be described. 2 and 3, pin holes 3 are formed on both sides of the film carrier 1 at a small pitch. The sprockets 11 and 12 engage their pins with the pin holes 3 to feed the film carrier 1 at a pitch. Reference numeral 4 denotes an electronic component to be punched by a punching section (described later), which comprises a chip 2 and leads 5 and 6 wired on both sides of the chip 2 at a narrow pitch. On both sides of one lead 6, a first alignment mark M1 (hereinafter, referred to as a first alignment mark M1) is provided.
A first alignment mark) and a second alignment mark M2 (hereinafter, a second mark) are formed in a cross shape. As will be described later, the first mark M1 and the second mark M2 are observed by a camera to detect a displacement of the electronic component 4.

In FIG. 1, reference numeral 20 denotes a punch portion of a film carrier. The punching section 20 is used to
The upper and lower molds 21 and 22 are disposed so as to sandwich the film carrier 1 from above and below, and the film carrier 1 is punched by causing the upper mold 21 to move up and down by the cylinder 23. In FIG. 2, a broken line indicates the position of the punching portion 20, and reference numeral 7 indicates a punching hole formed in the film carrier by punching the electronic component 4 at the punching portion 20.

In FIG. 1, a camera 30 is provided below the film carrier 1 upstream of the punching section 20. The camera 30 is held on a bracket 31. The bracket 31 is connected to a nut 32, and the nut 32 is screwed to a feed screw 33. Reference numeral 34 denotes a second motor for rotating the feed screw 33. Bracket 3
A slider 35 is provided on the back surface of 1. The slider 35 is fitted on a guide rail 36 in the same direction as the feed screw 33. The guide rail 36 is mounted on a bracket 37, and a nut 38 is coupled to a lower surface of the bracket 37. A feed screw 39 is screwed to the nut 38. Reference numeral 40 denotes a third motor for rotating the feed screw 39.

When the second motor 34 is driven to rotate the feed screw 33, the nut 32 moves along the feed screw 33, and the camera 30 moves in the width direction of the film carrier 1. When the third motor 40 is driven to rotate the feed screw 39, the nut 38 and the bracket 37 move in the longitudinal direction of the film carrier 1, and the camera 30 also moves in the same direction. By moving the camera 30 in the horizontal direction in this manner, the first mark M1 and the second mark M2 are captured in the field of view of the camera 30.

Next, the control system will be described. In FIG. 1, 4
Reference numeral 1 denotes a motor drive circuit, which drives the first motor 13, the second motor 34, and the third motor 40. 42 is camera 3
The recognition unit is connected to 0. The motor drive circuit 41 and the recognition unit 42 are connected to a CPU 43 that controls the entire apparatus. 44 is a storage unit connected to the CPU 43,
Store necessary data. Reference numeral 45 denotes an input / output control unit to which a cylinder drive circuit 46, a start switch 47 for starting operation, and a notification unit 48 are connected. The cylinder drive circuit 46 drives the cylinder 23 of the punching section 20. The notification unit 48 includes a buzzer or the like, and provides necessary notification to the operator.

This electronic component punching system is configured as described above. Next, the overall operation will be described with reference to the flowchart of FIG. First, the first motor 13 is driven to feed the film carrier 1 at a pitch, and the first mark M
1 is located in the field of view of the camera 30 and recognized (step 1). Since recognition of the first mark M1 may be unsuccessful due to dirt or chipping, it is determined in step 2 whether or not the recognition is OK. If it is NG, the second motor 34 is driven to move the camera 30 in the width direction of the film carrier 1, and the second mark M2 is recognized in the field of view of the camera 30 (step 3). In step 4, if the observation of the second mark M2 is also unsuccessful and the result is NG, there is a possibility that the film carrier 1 is out of stock, so the notifying unit 48 is driven to notify the operator of that (step 9). Therefore, the operator checks whether or not the film carrier 1 is out of stock.

If the answer is OK in step 2 or step 4,
If a positional shift a (FIG. 1) of the first mark M1 or the second mark M2 in the transport direction is detected, the first motor 13 is driven to punch out the electronic component 4 recognized as described above. The pitch is fed between the upper die 21 and the lower die 22 of the part 20 and stopped there (step 5). In this case, the feed amount of the film carrier 1 by driving the first motor 13 (the distance from the recognition position of the camera 30 to the punching position by the punching unit 20) is adjusted so as to correct the positional deviation a.

When the pitch feed of the film carrier 1 is stopped after correcting the displacement a, the cylinder 23
Is driven to punch out the film carrier 1 to obtain the electronic component 4 (step 6). The electronic component 4 on the lower mold 22 obtained by punching is picked up by a pickup head (not shown) and transferred to a predetermined position. Next, the film carrier 1 is fed by one pitch (step 7), and it is determined whether or not the production has ended (step 8). If No, the process returns to step 1 to repeat the above operation, and if Yes, the process ends.

[0021]

According to the present invention, it is possible to obtain an electronic component by correcting the displacement of the electronic component and then correctly punching the punched portion. In addition, the camera for recognizing the displacement of electronic components is provided separately from the punching section and upstream of the punching section. The structure can be simplified. In addition, the film carrier is easily soiled, and the recognition of the alignment mark is unsuccessful in such a case. However, in such a case, the present invention can detect the misalignment of the electronic component by recognizing other alignment marks. Furthermore, by recognizing the plurality of alignment marks, the out-of-stock of the film carrier can be detected and the operator can be notified.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram of an electronic component punching system according to an embodiment of the present invention.

FIG. 2 is a plan view of a film carrier according to one embodiment of the present invention.

FIG. 3 is a partially enlarged plan view of a film carrier according to one embodiment of the present invention.

FIG. 4 is a flowchart of an electronic component punching operation according to an embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 film carrier 2 chip 4 electronic component 11, 12 sprocket 13 first motor 20 punching unit 30 camera 34 second motor 40 third motor M1 first alignment mark M2 second alignment mark

Claims (4)

(57) [Claims] 1. A method for punching an electronic component, wherein a chip is punched by a punching section to obtain an electronic component while feeding a film carrier on which a chip is bonded at a pitch by a conveying means at a pitch. The characteristic part of the electronic component is observed by a camera provided upstream of the electronic component, and the displacement of the electronic component in the transport direction of the transport unit is detected. Based on the detected positional shift, the film by the transport unit is used. A method for punching an electronic component, wherein the position shift is corrected by adjusting a feed amount of a carrier, and punching is performed by the punching unit. 2. The electronic device according to claim 1, wherein said characteristic portion is a positioning mark formed on said electronic component, and said positioning mark is observed by said camera to detect said position shift. How to punch parts. 3. The method according to claim 2, wherein the plurality of alignment marks are provided, and if the observation of the first alignment mark by the camera is unsuccessful, the second alignment mark is observed. The method of punching the electronic component described. 4. The method according to claim 3, wherein if all of the plurality of alignment marks are unsuccessfully observed by the camera, the information is notified by a notification unit.