JP2006350611A - Ic module for ic card and production method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC module capable of being used by punching out the IC module in a plurality of terminal outer shapes of many sizes when punching out the IC module from a COT, and to provide a production method therefor. <P>SOLUTION: This IC module 1 is punched out from the COT continuously adjacently formed with the IC modules together with a terminal plate 5. In the IC module 1 on a COT face, one IC module terminal plate face is duplicately formed with a first outer shape punching outline shape 6 configuring an outermost shape and a second outer shape punching outline shape 7 inside thereof, and a metal foil layer 12 of both outer shape punching outline shape portions is removed except connection parts 8. Either of the first and second outer shape punching outline shapes can be formed such that it includes contact terminals C1, C2, C3, C4, C5, C6, C7, C8, and the inside of the second outer shape punching outline shape can be formed such that it does not include the terminals C4, C8. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to an IC module for an IC card and a manufacturing method thereof.
Specifically, the present invention relates to a terminal plate surface structure of an IC module used for a contact type or a contact / non-contact type IC card (2 Way card). Such an IC module can be used as an IC module for a normal IC card, but has a feature that can quickly respond to a request for a different IC module terminal shape.

  IC cards in practical use are roughly classified into three types. That is, a contact type in which the external terminal plate is exposed on the card surface, a non-contact type in which the IC chip and the antenna coil for communication are embedded inside the card and no external terminal plate, and an external terminal plate that has both functions. There are three types, a contact / non-contact IC card (2-way card), which is also called a combination type or dual interface type, which is performed by the same IC chip.

  Among these, what is called a combination type or dual interface type has an antenna connection terminal that is electrically connected to a predetermined pad of the IC chip for connecting to the antenna terminal on the back side of the IC module (the opposite side of the contact terminal plate surface). As a non-contact card, this is connected to the antenna terminals (both ends of the antenna coil) exposed in the recesses of the card excavated for mounting the IC module via conductive paste or conductive sheet. It also has functions.

By the way, in recent years, both the contact type IC module and the dual interface type IC module are formed in a flexible tape-like member (COT = Chip On Tape) in consideration of manufacturing cost and mass productivity. It is normal.
FIG. 6 is a diagram showing the external appearance of the COT 2, and the surface of the tape substrate 10 having the feed holes 4 on both outer edges is aligned with the surface of the terminal board 5 of the IC module in one or two rows. An IC chip is fixed and resin-molded on the back surface of the terminal board 5. Such a COT2 is wound around a reel and used when manufacturing an IC card. When the COT 2 is mounted on the IC card, the IC module is punched with a punching blade type while the tape is intermittently fed, and is fixed in the recess for mounting the IC card. Punching is usually performed at the outer periphery of the terminal board 5 and the portion where the metal foil layer is removed. Although there is one blank part in the upper left part of FIG. 6, this part shows a state after the IC module 1 is punched out.

  COT2 uses ordinary semiconductor technology, such as die bonding (mounting an IC chip on a substrate), wire bonding (connecting external connection terminals and IC chip pads with gold wires), resin mold (IC chip). Completed by resin-sealing the wire. Thereafter, a predetermined chip inspection (operation inspection, electrical characteristic inspection, etc.) is performed. During inspection, defective products can be identified by punch holes or marking to identify defective products in the subsequent process (card mounting process). An IC card is completed by inserting and fixing to the IC card base material in which the corresponding mounting recesses are counterbored through an adhesive.

  In the case of a combination type or dual interface type IC card, the antenna connection terminal formed on the back side of the COT and the antenna terminals (both ends of the antenna coil) built into the card exposed by counterboring the card are inserted into the COT. At the time of bonding, both are electrically connected via a conductive adhesive different from the COT fixing adhesive.

  Incidentally, the terminal board position of the IC card IC module is defined by ISO7816 / JISX6303, and is arranged at a predetermined position of the card (see FIG. 7). The functions of each contact terminal are also defined. Each terminal in FIG. 7 has C1 (Vcc: supply voltage), C2 (RST: reset signal), C3 (CLK: clock signal), C5 (GND: ground). , C6 (VPP; variable supply voltage for programs, etc.), C7 (I / O; data input / output), and C4 and C8 (RFU; Reserved for Future Use). Therefore, the lower two terminals (C4 and C8) are not normally used.

  Although the terminal board position is standardized as described above, the shape of the terminal board itself of the IC module can be changed depending on the intended use, and the unused C4 and C8 terminals in the standard are excluded from the module. It is also possible to do. Also, due to the card design, a smaller module shape may be desired, or a larger shape is desired to emphasize that an IC chip is built in when switching from a magnetic card to an IC card. In some cases, it is often required to change its size and shape from conventional products to differentiate it from other companies.

  However, if IC modules with individual shapes are prepared separately to meet such diverse shape needs, the number of IC module types increases, manufacturing efficiency decreases, prices increase, and inventory increases to accommodate multiple types. There is also concern about an increase in design costs, plate making costs, etc. for separate terminal surface design varieties. In addition, for example, it is not impossible to forcibly punch a COT that assumes a predetermined shape of 1 with a punching die having a different shape (for example, a smaller shape), but the terminal surface is usually made of a metal such as copper foil. Since the plating pattern is formed on the foil (usually about 35 to 70 μm thick), when punching the area, a large shear load is applied to the punching die, and the life of the die is significantly shortened (experimental) In this case, there is a problem that the finish around the contour portion when punching is not clean, the phenomenon of sagging of the end of the metal foil occurs, and the appearance quality is not preferable. .

In addition, there is a method in which the terminal area is formed in a small shape in advance, and this is punched into two types of large and small shapes. There is a problem that the advantage of increasing the punching shape is lost because the width becomes narrower according to the small shape.
The following prior patent documents exist for the terminal board surface shape and the like of the IC card IC module, but a technique directly related to the present application cannot be found.

JP-A-2-25400 Japanese Unexamined Patent Publication No. 4-182198 JP-A-5-262081 JP 7-314963 A

  Therefore, in order to meet various needs of the shape and application of the IC module, the present application can be used for as many types as possible and at least two types of applications, and for IC cards that do not cause problems in appearance quality at the time of punching. It was researched to complete the IC module.

  The first of the gist of the present invention for solving the above problems is for an IC card on a COT surface on which an IC module is punched out together with a terminal plate from a COT in which IC modules for an IC card are connected. In the IC module, on the surface of the one IC module terminal plate, the first outer punching contour shape constituting the outermost shape of the contact terminal plate and the second outer punching contour shape inside thereof are overlapped. Both of the outer punching contour shapes are formed so as to include the contact terminals of C1, C2, C3, C4, C5, C6, C7, and C8 defined by ISO7816 / JISX6303. An IC module for an IC card, wherein the metal foil layer in the outer shape of the outer shape is removed except for the connecting portion.

  The second of the gist of the present invention for solving the above problems is for an IC card on a COT surface on which an IC module is punched out together with a terminal plate from a COT in which IC modules for an IC card are connected. In the IC module, on the surface of the one IC module terminal plate, the first outer shape punching contour shape constituting the outermost shape of the contact terminal plate and the second outer shape punching contour shape inside thereof are overlapped. The first outer punching contour shape is formed so as to include the contact terminals of C1, C2, C3, C4, C5, C6, C7, and C8 defined by ISO7816 / JISX6303. The punching outline shape includes only the contact terminals of C1, C2, C3, C5, C6, and C7 specified by ISO7816 / JISX6303. Are formed on, and the metal foil layer of the outer punching contour portion of the both are in the IC module, an IC card, characterized in that it is removed except for the connection portion.

  In the above, the IC module for IC card may be used for a contact type IC card or may be used for a contact / non-contact type IC card.

A third aspect of the present invention for solving the above problems is a method for manufacturing an IC module for an IC card on a COT surface in which an IC module is punched together with a terminal plate, and (1) an IC module base Forming a wire bonding pad opening in the material;
(2) Laminating a metal foil on one side of the base material, (3) Photoetching the surface side terminal plate and the second outer shape punching outline inside the surface side terminal plate outer shape on the metal foil. (4) a step of die bonding the IC chip, (5) a step of wire bonding each pad of the IC chip and a metal foil of each terminal of the wire bonding pad, and (6) an IC chip and a wire. And a step of resin-sealing the entire bonding part.

A fourth aspect of the present invention for solving the above-described problems is a method for manufacturing an IC card IC module on a COT surface in which an IC module is punched together with a terminal plate, and includes (1) an IC module substrate. Forming a wire bonding pad opening in the material;
(2) A step of laminating a metal foil on both surfaces of the base material, (3) a surface-side terminal plate on the metal foil, a second outer shape punching outline inside the surface-side terminal plate, A step of photo-etching the antenna connection terminal, (4) a step of die-bonding the IC chip, and (5) wire-bonding each pad of the IC chip and a metal foil of each terminal of the wire-bonding pad. And (6) a step of wire bonding the IC chip and the antenna connection terminal, and (7) a step of resin-sealing the entire IC chip and the wire bonding portion. Manufacturing method.

  In the manufacturing method described above, the contour shape is set so that all the contact terminals of C1, C2, C3, C4, C5, C6, C7, and C8 defined by ISO7816 / JISX6303 are included in the second outer shape punching contour shape. Photoetching may be performed, and only the contact terminals of C1, C2, C3, C5, C6, and C7 defined by ISO7816 / JISX6303 are included in the second outer punching outline shape, excluding the C4 and C8 terminals. The contour shape may be photo-etched to include.

(1) As described above, the IC module for an IC card of the present invention has a plurality of external punching outlines formed on the IC module terminal board for the IC card on the COT surface, and the metal foil of the outline part. Since the layer is removed, it is possible to punch out with a desired external shape according to the use application of the IC module. Further, since the metal foil is not deformed even if punched from any outer contour shape, the appearance is excellent.
(2) Since the metal foil layer in the contour portion is removed, the life of the punching blade mold is not significantly shortened.

(3) The IC card IC module of the present invention is different from the IC module for a plurality of IC cards in one type without shortening the life of the punching die or reducing the appearance quality such as sagging of the edge portion. Since it is possible to cope with COT, it is possible to reduce COT manufacturing cost, increase efficiency, reduce COT inventory, and speed up the handling of multiple shapes.
(4) According to the IC card IC module manufacturing method of the present invention, the IC card IC module of the present invention can be manufactured by the same manufacturing process and apparatus as the COT manufacturing of a normal terminal board design. The production load is not increased.

The IC card IC module of the present invention will be described below with reference to the drawings.
FIG. 1 is a diagram showing an IC card IC module of the present invention and an IC card having the IC module mounted thereon, FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1A, and FIG. FIG. 4 is a diagram illustrating another example of the manufacturing process of an IC card IC module, and FIG. 5 is a diagram illustrating a conventional IC card IC module and an IC card having the IC card mounted thereon.

1A and 1B are views showing an IC card IC module of the present invention and an IC card having the IC card mounted thereon, in which FIG. 1A is an IC card IC module, FIG. 1 (C) and (D) are each a plan view showing an outline punching outline shape.
As shown in FIG. 1A, the terminal board surface shape of the IC module 1 for IC card of the present invention is the second IC board terminal board surrounded by the first outer punching outline shape 6. There exists the characteristic in which the external shape punching outline shape 7 is formed.
FIG. 1B shows a state in which the IC module 1 of FIG. 1A is mounted on the IC card 100. Of course, the IC module 1 can be used as a normal IC card 100 in this state. In the case of FIG. 1, the first and second outer punching contours are formed so as to include all terminals C1, C2, C3, C4, C5, C6, C7, and C8. However, the C1, C4, C5, and C8 terminals in the second outer shape punching outline are somewhat narrowed. The terminals are separated by a narrow groove 9 as usual.

A broken line on the outer periphery in FIG. 1C indicates a first outer punching contour shape 6, and the maximum shape of the terminal board 5 is punched out. Here, the terminal plate 5 refers to the entire metal plate portion on the surface of the IC module 1, and each terminal refers to eight terminals in a small area separated by the grooves 9. The inner dashed line in FIG. 1 (D) indicates the second outer punching contour shape 7, and the terminal board 5 is punched in a shape that is smaller than that in FIG. 1 (C).
The width of the contour line of the second outer punching contour shape 7 is set to be about 0.1 mm to 0.5 mm. If the width of the contour line is increased too much, the contact pin diameter on the reader / writer side (usually about 0.5 to 1.5 mm) will be exceeded, and contact failure may occur depending on the contact position of the contact pin. Because there is. The first outer punching contour shape 6 is an outer peripheral region of the terminal board 5, and the contour line width is not particularly defined, but is usually punched out so as to leave a periphery of about 0.2 mm around the metal foil layer. Of course, the IC module 1 punched with the second outer punching contour 7 can also be used for a normal IC card.
In addition, although copper, aluminum, silver, etc. are used for metal foil, although it does not specifically limit, it demonstrates below taking the various copper foil as an example.

  The IC card IC module 1 of the present invention is characterized in that the IC module 1 has a second outer shape punching outline shape 7 inside the maximum outer shape terminal plate, and a minimum required copper foil layer of the outline shape portion is required. The connection portion 8 is removed. The connection portion 8 electrically connects the first and second outer shapes, and when there is a pad connected to the IC chip 3 only on the back surface of each terminal in the second outer shape punching contour shape 7, It is for securing electrical connection with the outer shape part of 1 and needs to be provided for each terminal. Thereby, the reader / writer side contact pin contactable area | region of the 1st external shape part can be expanded, and the tolerance | permissible_range with respect to the position shift of a contact pin can be expanded. Furthermore, it also serves as a lead wire when the terminal plate 5 is plated with nickel or gold.

  FIG. 5 (A) shows a conventional IC module 1j, and FIG. 5 (B) shows an IC card 100j on which it is mounted. As described above, the terminals C1, C2, C3, C4, C5, C6, C7, and C8 are formed on the terminal plate surface. Except that there is no second punching shape in the terminal board, it is the same as the IC module 1 in FIG.

FIG. 2 is a schematic cross-sectional view taken along the line AA in FIG. As shown in FIG. 2, the IC chip 3 is mounted on the back surface of the terminal plate 5 of the IC module substrate 10, and a gold wire is provided between the IC chip 3 and the wire bonding pad 16 and between the antenna connection terminals 14. Connected. The IC chip 3 and the gold wire 15 are sealed with a mold resin 17.
These configurations are the same as those of a normal IC module, but have a second outer punching contour shape 7 and the copper foil layer 12 in the contour shape portion is removed. When the antenna connection terminal 14 is provided on the IC chip 3 side, the antenna connection terminal 14 is not cut by the punching of the second outer punching outline 7. However, if the length that can be connected to the antenna terminal in the card remains, even if it is cut, it may be formed longer.

  FIG. 3 shows another example, in which FIG. 3A shows an IC module for an IC card, FIG. 3B shows an installed IC card, and FIGS. 3C and 3D show an outline punching outline shape, It is each top view shown. The terminal board surface shape of the IC card IC module 1 of this example is the same as that of FIG. 1, in which the second external punching outline shape 7 is formed in the normal IC module terminal board 5. Of course, it can be used as a normal IC card 100 as shown in FIG.

FIG. 3C shows a first outer punching contour shape 6 in which the maximum shape of the terminal board 5 is punched. FIG. 3 (D) shows a second outer punching contour shape 7, and the terminal board 5 is punched in a reduced shape as compared with FIG. 3 (C). Even if it is mounted on the IC card in this state, it can be used as a normal IC card 100.
In the case of FIG. 2, the first outer shape is formed so as to include all terminals of C1, C2, C3, C4, C5, C6, C7, and C8, but the second outer shape includes C4 and C8 terminals. It is not included. Therefore, the lower edge of the second outer punching contour 7 is formed along the groove 9 between the C3 and C7 terminals and the C4 and C8 terminals. This is because the C4 and C8 terminals are RFUs as described above and are not normally used. Although the cross section of FIG. 3 is not shown, it appears as in FIG.

As described above, if the first and second outer punching outlines are formed on the surface of the terminal plate 5 of the IC module 1 so as to have one type of COT, two types of terminal plates are provided. It is possible to meet the demand for the shape, and it is possible to avoid the burden of the IC card manufacturer in stocking various types of COTs corresponding to various types.
Although not shown, it is obvious that the examples of FIGS. 1 and 3 can be combined to support three types of terminal board shapes with one type of COT. Although this is not described in the claims, it can be applied to at least two types of shapes, and is clearly included in the technical scope of claim 1 or claim 2 of the present application.

  Next, with reference to FIG. 4, the manufacturing method of the IC module for IC cards of this invention is demonstrated. The COT is formed on the continuous tape-like substrate surface, but in the case of FIG. 4, only a single IC module is shown.

First, as shown in FIG. 4A, an IC module substrate 10 is prepared. The base material 10 for IC module uses materials, such as glass epoxy, for example. The thickness is suitably from 70 μm to 160 μm, and is usually about 120 μm. A necessary number of openings 13 are formed in the base material 10 by punching or the like in advance so that a gold wire can be connected to the copper foil 12 surface of each terminal. When the adhesive layer or the adhesive sheet 11 is used, the opening 13 is formed together with the adhesive sheet 11 and the like. The opening 13 serves as a wire bonding pad.
The opening 13 is a position that does not reach the second outline punching outline 7 and is formed in an inner region (side closer to the IC chip 3) of the second outline punching outline 7. However, in the embodiment of claim 2, the C4 and C8 terminals are not left in the second outer punching outline 7. However, since the C4 and C8 terminals are not used, it is not necessary to connect the gold wire, and the opening is not required. unnecessary. The size of the opening 13 may be about 0.5 to 1.5 mm in diameter. In addition to a circle, an oval, an ellipse, or a rectangle may be used.

  Next, as shown in FIG. 4B, the copper foil 12 is laminated on one side or both sides of the base material 10. In the case of FIG. 4, the contact / non-contact IC module is used, and copper foil 12 is laminated on both sides. The copper foil on the IC chip 3 side is used for the antenna connection terminal 14. Therefore, when the IC module is a contact type IC module and no circuit is formed on the IC chip 3 side, the copper foil on the IC chip 3 side need not be laminated. The copper foil 12 has a thickness of about 15 μm to 100 μm, usually 35 μm.

[Contact IC card]
As shown in FIG. 4C, the shape of the surface-side terminal plate 5 and the shape of the second outer punching contour are photoetched to form a non-copper foil portion. At that time, it is necessary to ensure electrical continuity between the inner side and the outer side partial copper foil of the second outer shape punching contour shape 7. Therefore, the minimum connection part 8 (refer FIG. 1, FIG. 3) is formed for every terminal. The width of the connecting portion 8 is about 0.05 to 1.0 mm. By minimizing the width of the connection portion 8, the second outer shape can be easily punched and the appearance after punching can be improved.

[Contact / non-contact IC card]
Copper foil is pasted on both surfaces of the glass epoxy base material, the shape of the front-side terminal board 5, the shape of the antenna connection terminals (2 to several places) 14 on the back side, and the lead part electrically connected to the connection terminal The second outer punching contour 7 is formed by photoetching (to hit a gold wire somewhere). As in the case of the contact IC card, the minimum connection portion 8 that ensures electrical continuity between the inner side and the outer side portion of the second outer punching contour shape 7 is formed.

  The first outer punching contour shape 6 portion is the outermost periphery of the terminal board 5 and is therefore a portion where the copper foil is originally removed by etching. However, for the purpose of conduction during nickel or gold plating, it is normal to leave a thin line connection for each terminal. The connecting portion 8 is also necessary for this plating lead. However, it is not necessary for electroless plating.

  After photoetching, nickel plating with a thickness of about 1 μm to 5 μm and gold plating with a thickness of about 0.1 μm to 5 μm are applied to prevent oxidation of the copper foil surface and improve durability. Since these plating patterns are formed on the copper foil pattern by electrolytic plating or electroless plating, they are naturally formed in the same pattern.

Finally, as shown in FIG. 4D, the IC chip 3 is mounted via an adhesive, and the adhesive is cured at a high temperature. Next, the connection between each pad of the IC chip 3 and the wire bond pad 16 of the surface side terminal plate 5 is made conductive by bonding a gold wire through the opening 13.
The connection between the IC chip 3 and the antenna connection terminal 14 is similarly performed by gold wire bonding between the lead portion drawn from the terminal and the pad of the IC chip.
Finally, the entire IC chip 3 and the wire bonding portion are resin-sealed with the mold resin 17. Resin sealing is performed by a transfer mold method, a potting method, a printing method, or the like. Thereby, the IC card IC module 1 of the present invention is completed.

  After the thermosetting adhesive sheet 11 is bonded to both sides of the glass epoxy substrate 10 having a thickness of 120 μm, the C1, C2, C3, C5, and C7 terminals inside the predetermined position (inside the second outer punching outline 7) An opening 13 for forming a wire bonding pad was formed in a circular shape with a diameter of 0.8 mm.

  Next, after laminating a copper foil 12 having a thickness of 35 μm on both surfaces of the adhesive sheet 11 of the base material 10, the outer shape of the terminal board 5 and the second outer punching contour shape 7 on the front surface side, and two antennas on the back surface side The connection terminals 14 and the lead portions were formed by photoetching. Thereafter, nickel plating and gold plating were performed.

  The plate surface shape of the terminal plate 5 was as shown in FIG. 1A, and the size of the terminal plate 5 was 11.5 mm long × 12.5 mm wide. The second outer punching outline shape 7 is such that the size of the terminal board 5 is reduced to approximately 4/5 in both length and width. The groove 9 that separates the terminals has a width of 0.2 mm, the width of the contour line of the contour shape 7 is 0.4 mm, and the width of the connection portion 8 is 0.2 mm. As shown in FIG. 1A, the connecting portion 8 is provided with one C2, C3, C6, and C7 terminals and two C1, C4, C5, and C8 terminals.

The IC chip 3 was adhered to the substrate 10 using a thermosetting die paste and cured by heating. Thereafter, between each pad of the IC chip 3 and the wire bonding pad 16 of the module substrate 10 and between the lead portion connected to the antenna connection terminal and the non-contact interface pad of the IC chip 3 with a gold wire having a diameter of 25 μm, Wire bonding was performed using a wire bonder combined with ultrasonic waves. Furthermore, the resin chip was sealed by potting a mold resin 17 mainly composed of a thermosetting epoxy resin on the entire IC chip 3 and the wire bonding part.
Thus, the IC card IC module 1 of the present invention was completed.
It was also confirmed that the IC module 1 can be mounted on the IC card 100 by punching with a dedicated blade shape along the first or second outer punching contour shape.

It is a figure which shows the IC module for IC cards of this invention, and the IC card equipped with it. It is AA sectional view taken on the line of FIG. It is a figure which shows the other example of IC module for IC cards. It is a figure explaining the manufacturing process of IC module for IC cards. It is a figure which shows the IC module for conventional IC cards, and the IC card with which it was mounted | worn. FIG. 6 is a diagram showing the appearance of the COT. It is a figure which shows the terminal board position prescribed | regulated to ISO.

Explanation of symbols

1 IC module for IC card 2 COT
DESCRIPTION OF SYMBOLS 3 IC chip 4 Feeding hole 5 Terminal board 6 1st external shape outline shape 7 2nd external shape outline shape 8 Connection part 9 Groove between terminals 10 IC module base material 11 Adhesive sheet 12 Metal foil, copper foil, copper Foil layer 13 Opening 14 Antenna connection terminal 15 Gold wire 16 Wire bonding pad 17 Mold resin 100 IC card

Claims (8)

In the IC card IC module on the COT surface on which the IC module is punched out together with the terminal plate from the COT provided with the IC card IC modules connected to each other, the one IC module terminal plate surface includes The first outer punching contour shape constituting the outermost shape of the contact terminal plate and the second outer punching contour shape inside thereof are formed overlappingly, and both of the outer punching contour shapes of both are ISO7816 / It is formed to include C1, C2, C3, C4, C5, C6, C7, and C8 contact terminals specified in JIS X6303, and the metal foil layers of both of the outer punched contour portions exclude the connecting portion. An IC module for an IC card, wherein the IC module is removed. In the IC card IC module on the COT surface on which the IC module is punched out together with the terminal plate from the COT provided with the IC card IC modules connected to each other, the one IC module terminal plate surface includes The first outer punching contour shape constituting the outermost shape of the contact terminal plate and the second outer punching contour shape inside thereof are overlapped, and the first outer punching contour shape is ISO7816 / JISX6303. C1, C2, C3, C4, C5, C6, C7, and C8 are defined so as to include the contact terminals, and the second outer punching contour shape is C1, C2 defined by ISO7816 / JISX6303. , C3, C5, C6, and C7, and is formed so as to include only the contact terminals of both. IC module for an IC card, wherein a metal foil layer of the punching contour portion is removed except for the connection portion. The IC module for an IC card according to claim 1 or 2, wherein the IC module for an IC card is used for a contact type IC card. 3. The IC card IC module according to claim 1, wherein the IC card IC module is used for a contact / non-contact IC card. A method of manufacturing an IC card IC module on a COT surface that is punched together with a terminal board, wherein: (1) a step of forming an opening of a wire bonding pad on an IC module substrate; 2) A step of laminating a metal foil on one side of the base material, (3) Photo-etching the surface-side terminal plate and the second outer shape punching outline inside the surface-side terminal plate outer shape on the metal foil. (4) die bonding of the IC chip, (5) wire bonding of each pad of the IC chip and the metal foil of each terminal of the wire bonding pad, (6) IC chip and wire bonding And a step of resin-sealing the entire portion. A method for manufacturing an IC card IC module. A method of manufacturing an IC card IC module on a COT surface that is punched together with a terminal board, wherein: (1) a step of forming an opening of a wire bonding pad on an IC module substrate; 2) Step of laminating metal foil on both sides of the base material, (3) Surface side terminal plate on the metal foil, second outer shape punching outline inside the surface side terminal plate, and antenna on the back side A step of photo-etching the connection terminals, (4) a step of die-bonding the IC chip, and (5) a step of wire-bonding each pad of the IC chip and the metal foil of each terminal of the wire-bonding pad. (6) Step of wire bonding the IC chip and the antenna connection terminal, (7) Resin covering the entire IC chip and the wire bonding portion A step of stopping, the production method of the IC card IC module characterized by having a city. Photoetching the contour shape so as to include the contact terminals of C1, C2, C3, C4, C5, C6, C7, and C8 defined in ISO7816 / JISX6303 in the second contour shape The manufacturing method of the IC module for IC cards of Claim 5 or Claim 6 to do. The contour shape is photo-etched so as to include only the contact terminals of C1, C2, C3, C5, C6, and C7 defined by ISO7816 / JISX6303 in the second contour shape. A method for producing an IC module for an IC card according to claim 5 or 6.

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